1 . (Currently Amended) A fluid delivery system for dispensing slurry directly on a semiconductor wafer during chemical mechanical polishing of the semiconductor wafer while the wafer is held securely by a wafer holder, the fluid delivery system comprising: a polishing table with a first opening, a polishing pad with a second opening positioned on the polishing table with the first and second openings being aligned, the wafer holder positioned above the polishing table, and at least one fluid delivery nozzle affixed to the polishing table and disposed inside the first opening of the polishing table, wherein the outlet of the at least one fluid delivery nozzle is substantially coplanar with a top surface of the polishing table, and faces away from the polishing table towards the semiconductor wafer held by the wafer holder above the polishing table, and wherein a mechanism is used to activate and deactivate the fluid delivery nozzle as it enters and exits from under the wafer holder to deliver the slurry directly from the outlet of the at least one fluid delivery nozzle through the polishing pad opening on a surface of the semiconductor wafer.

2. (Original) The fluid delivery system of claim 1 , wherein the at least one fluid delivery nozzle is a low flow fan nozzle.

3. (Original) The fluid delivery system of claim 1 , wherein the at least one fluid delivery nozzle has a plurality of openings in a nozzle head assembly.

4. (Original) The fluid delivery system of claim 3, wherein the nozzle head assembly is an inkjet assembly.

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AMENDED SHEET (ARTICLE 19)

5. (Original) The fluid delivery system of claim 1 , wherein more than one type of fluid delivery nozzles are used.

6. (Original) The fluid delivery system of claim 1 , wherein multiple fluid delivery nozzles are disposed in an arrangement equi-distanced along the circumference at mid radius of the polishing table to supply slurry continuously during the semiconductor wafer polishing process.

7. (Original) The fluid delivery system of claim 1 , wherein the at least one fluid delivery nozzle is placed such that fluid is dispensed normal to the semiconductor wafer surface.

8. (Original) The fluid delivery system of claim 1 , wherein the fluid delivery system comprises a first set of a plurality of fluid delivery nozzles and a second set of a plurality of fluid delivery nozzles, wherein the first set of the plurality of fluid delivery nozzles is configured to deliver a first fluid and the second set of the plurality of fluid delivery nozzles is configured to deliver a second fluid, and wherein the second fluid is different from the first fluid.

9. (Original) The fluid delivery system of claim 8, wherein at least one of the first and second sets of the plurality of fluid delivery nozzles are configured to dispense the first or second fluid respectively at an angle different from normal to the surface of the semiconductor wafer.

10. (Original) The fluid delivery system of claim 1 , wherein a first set of a plurality of fluid delivery nozzles, and a second set of a plurality of fluid delivery nozzles for each of at least two different fluids are placed 120 degrees from each other to provide continuous coverage of the semiconductor wafer surface that is polished during platen rotation.

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AMENDED SHEET (ARTICLE 19)

11 . (Original) An apparatus for chemical mechanical polishing of a semiconductor wafer, the apparatus comprising: a wafer holder configured to hold the semiconductor wafer, rotate the semiconductor wafer and urge it against a polishing pad positioned on a polishing table, the polishing table with the polishing pad positioned on a top surface thereof facing the semiconductor wafer, at least one nozzle assembly comprising a plurality of fluid delivery nozzles, each fluid delivery nozzle having an outlet that is coplanar or substantially coplanar with a top surface of the polishing table, wherein the plurality of the fluid delivery nozzles are positioned below an opening of the polishing pad so that fluid ejected through the plurality of the fluid delivery nozzles reaches the surface of the semiconductor wafer that is being polished.

12. (Original) The apparatus of claim 11 , wherein the nozzle assembly comprises three nozzle assemblies spaced apart at 120 degrees from each other at a circumference having a radius one half the radius of the polishing table so that they supply slurry continuously to the semiconductor surface during the semiconductor wafer polishing process.

13. (Original) The apparatus of claim 11 , wherein the nozzle assembly is positioned within a seat of the table below an opening of the polishing pad so that when fluid is ejected via the plurality of the fluid delivery nozzles the fluid reaches the surface of the semiconductor wafer that is being polished at an angle perpendicular to the surface of the semiconductor wafer.

14. (Original) An apparatus for chemical mechanical polishing of a semiconductor wafer, the apparatus comprising the fluid delivery system of any of the claims 1 to 10.

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AMENDED SHEET (ARTICLE 19)

15. (Currently Amended) A method of polishing a semiconductor wafer, the method comprising: providing the fluid delivery system of claim 1 , placing the semiconductor wafer in the wafer holder, and pressing the wafer against the polishing pad, and the at least one fluid delivery nozzle of the fluid delivery system supplying a fluid slurry through the first and second openings directly on the wafer.

16. (Currently Amended) The method of claim 15, wherein the slurry flow is activated as the at least one fluid delivery nozzle is positioned under the wafer holder and terminated as the at least one delivery nozzle assembly exits from being under the wafer holder.

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AMENDED SHEET (ARTICLE 19)