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Title:
METHOD AND APPARATUS FOR QUICKLY REMOVING PARTICLES BY USING ORGANIC THIN FILM
Document Type and Number:
WIPO Patent Application WO/2024/087254
Kind Code:
A1
Abstract:
A method and apparatus for quickly removing particles by using an organic thin film. The method comprises: S1, coating an organic solution on the surface of a material substrate containing particles to be removed, wherein the organic solution at least comprises a high-molecular polymer and a solvent; S2, baking the material substrate to make the organic solution viscous so as to wrap the particles, wherein the baking temperature is higher than the glass-transition temperature of the high-molecular polymer; and S3, curing the organic solution in the S2 into an organic thin film after the temperature is decreased, and stripping the organic thin film to remove the particles at the same time. According to the method, the particles on the surface of the material substrate of any thickness and any size can be removed at one time with the high particle removal efficiency and the particle removal rate of 93% or more, a large number of high-purity chemical reagents do not need to be used, and the surface of the material substrate is not damaged. The method can be suitable for removing particles on the surface of a material substrate such as a silicon wafer, a silicon wafer covered by a dielectric and/or a metal and/or a photosensitive material, a silicon wafer containing a graphic structure, and a mask.

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Inventors:
LUO XIANGANG (CN)
LIU LING (CN)
ZHAO ZEYU (CN)
SHEN TAO (CN)
ZHANG DANGLONG (CN)
CHEN LIJUAN (CN)
LI XIACHUQIN (CN)
Application Number:
PCT/CN2022/130812
Publication Date:
May 02, 2024
Filing Date:
November 09, 2022
Export Citation:
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Assignee:
INST OPTICS & ELECTRONICS CAS (CN)
International Classes:
H01L21/304; B08B11/00; G03F1/82
Foreign References:
JPH0774137A1995-03-17
JPH05323579A1993-12-07
JPH09326380A1997-12-16
US6558233B12003-05-06
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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