Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/095840
Kind Code:
A1
Abstract:
This substrate processing apparatus comprises a processing container, a stage, an edge ring, a lifter, and a control unit. The stage has a first mounting surface and a second mounting surface. The edge ring is mounted on the second mounting surface. The lifter raises and lowers the edge ring with respect to the second mounting surface. In a step a), the control unit performs plasma processing on a substrate mounted on the first mounting surface. Further, in a step b), every time the step a) is executed on a first number of substrates, the control unit controls the lifter to separate the edge ring from the second mounting surface and perform first cleaning in the processing container. Furthermore, in a step c), before performing replacement of the edge ring, the control unit controls the lifter to separate the edge ring from the second mounting surface and perform second cleaning in the processing container.
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Inventors:
ARAMAKI TAKASHI (JP)
LI LIFU (JP)
LI LIFU (JP)
Application Number:
PCT/JP2023/038415
Publication Date:
May 10, 2024
Filing Date:
October 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065
Foreign References:
| JP2021141308A | 2021-09-16 | |||
| JP2014127627A | 2014-07-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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