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Patent Searching and Data


Title:
WATER-FILLED CAPSULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/096059
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a water-filled seamless capsule technology that can encapsulate and retain the moisture of a content liquid in a capsule over a long period of time. A water-filled capsule comprising a water-containing core and an encapsulating layer disposed outside the water-containing core, wherein the encapsulating layer is made of a lipophilic composition having a specific gravity adjusted within a specific range, and the film thickness of the encapsulating layer is maintained at a specific film thickness or more so that the moisture of the water-containing core can be encapsulated and retained in the capsule over a long period of time.

Inventors:
MASUDA KOJI (JP)
KONDO YOSUKE (JP)
GOTO SHUNGO (JP)
Application Number:
PCT/JP2023/039428
Publication Date:
May 10, 2024
Filing Date:
November 01, 2023
Export Citation:
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Assignee:
FUJI CAPSULE CO LTD (JP)
International Classes:
A61K9/48; A23L5/00; A23P10/35; A24D3/06; A61J3/07; A61K8/11; A61K8/31; A61K8/37; A61K8/73; A61K8/92; A61K9/56; A61K47/06; A61K47/14; A61K47/36; A61K47/44; A61Q19/00; A61Q90/00; B01J13/22
Foreign References:
JPH11188079A1999-07-13
JP7122495B12022-08-19
JP6250211B12017-12-20
Attorney, Agent or Firm:
HIROTA, Masanori (JP)
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