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WO/2007/097134 |
In the manufacturing of camera module structure (100), while melting a solder at solder joining area (3) by blowing hot air from hot air nozzle (4), hot air in convection toward the side of camera module (2) is suctioned by suction nozzl...
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WO/2007/093388 |
The invention relates to a method for soldering components, in particular heat exchangers, in particular made of aluminium materials, aluminium alloys or wrought alloys, in a soldering furnace, in particular a continuous soldering furnac...
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WO/2007/093388 |
The invention relates to a method for soldering components, in particular heat exchangers, in particular made of aluminium materials, aluminium alloys or wrought alloys, in a soldering furnace, in particular a continuous soldering furnac...
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WO/2007/088695 |
The normal pressure (P) in a reflow chamber (20) is adjusted to a set pressure (P1) (for instance, 0.13Mpa), which is higher than the normal pressure (Po), by introducing a reducing gas into the reflow chamber (20). In the status where t...
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WO/2007/087822 |
A process for making a heat exchanger comprising extruding a number of heat exchanging tubes, connecting the end portions of the heat exchanger tubes with connection elements, and optionally applying fins to the outer surface of the heat...
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WO/2007/085484 |
The invention relates to a method for producing a metal part. Said method comprises the steps of supplying a strand of metal material and applying a coating from a fluxing agent composition to a surface of the strand of material by means...
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WO/2007/085563 |
The invention relates to a method of applying a solder deposit (4) consisting of a solder material (6) containing aluminium to a substrate (8), in which the solder deposit (4) is applied to the substrate (8) by cold gas spraying of the p...
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WO/2007/084888 |
A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate (70), wherein the flux carrier and solder each have a melting temperature with the melting temperature of the solder being higher than t...
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WO/2007/084888 |
A method of dispensing a solder paste comprising at least a flux carrier and solder onto a substrate (70), wherein the flux carrier and solder each have a melting temperature with the melting temperature of the solder being higher than t...
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WO/2007/083615 |
A process for manufacturing an aluminum-made heat exchanger having aluminum alloy tube (3), inner fin (4) inserted in the tube (3) and outer fin (5) provided between aluminum alloy tubes (3), wherein for the heat exchanger constituting p...
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WO/2007/080350 |
In accordance with this welding method, a laser (24) is directed onto an end face (F) of the stack (18) in such a way that the laser (24) heats the stack (18). At least one parameter of the laser (24) is adjusted to a value which is the ...
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WO/2007/080350 |
In accordance with this welding method, a laser (24) is directed onto an end face (F) of the stack (18) in such a way that the laser (24) heats the stack (18). At least one parameter of the laser (24) is adjusted to a value which is the ...
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WO/2007/080068 |
The present invention relates to a method of manufacturing a shaped product by means of brazing, the method comprising the steps of: a. producing an intermediate object of metal by rolling or extrusion and having at least one flat surfac...
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WO/2007/077757 |
A soldering container so constructed as to be carried with a material to be soldered housed in it by means of a carrying mechanism at soldering. The container comprises an enclosable container body housing the material to be soldered. Th...
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WO/2007/077877 |
An object (92) to be soldered is stored in a container (17) which can be hermetically closed. The inner pressure (P) of the container (17) is increased to the normal pressure (Po) or more by supplying the container (17) with a reducing g...
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WO/2007/077688 |
Disclosed is a method for soldering semiconductor elements on bonding sections arranged at a plurality of areas on a circuit board, respectively. The soldering method is provided with a step of arranging the bonding sections in nonlinear...
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WO/2007/077727 |
Provided is a reflow apparatus which can adjust heating temperature and heating time in detail for heating a work for reflow. A work transfer conveyer (12) for transferring a work (W) into a furnace (11) is arranged. Along the work trans...
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WO/2007/073593 |
An assembly (20) that includes two components (22,24) joined by a pre-compressed braze (36) where the compression in the braze is progressively relieved upon relative thermal expansion of the two components (22,24). In one embodiment, th...
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WO/2007/075108 |
The invention relates to hybrid heat treatment of materials by the action of a poly chromatic and coherent radiation and to devices for carrying out said method (variants). The inventive method consists in modifying a heating rate and in...
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WO/2007/074835 |
A soldering method for soldering an electronic component on a circuit board is provided. In the soldering method, a cooling circuit board is used as the circuit board. The cooling circuit board includes an insulating board having a metal...
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WO/2007/070989 |
A method of forming a braze join between two components (10, 20) is disclosed, in which braze material (12) is introduced into a gap (40) between the two components (10, 20) by capillary action. This assists in reducing flooding. Also di...
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WO/2007/069705 |
A soldering apparatus including a vessel (109) containing a molten solder, a casing (106) defining therewithin a soldering chamber (106c) in which a flat overflowing wave of the molten solder is formed, a conveyor (107) physically integr...
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WO/2007/067591 |
Solder is deposited on a heat sink. The solder is first ref lowed at a first temperature that is below about 120° C. The solder is then heat aged at a second temperature that causes the first reflowed solder to have an increased second ...
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WO/2007/067591 |
Solder is deposited on a heat sink. The solder is first ref lowed at a first temperature that is below about 120° C. The solder is then heat aged at a second temperature that causes the first reflowed solder to have an increased second ...
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WO/2007/060101 |
The invention relates to a method of brazing metal components, in which essentially fluxless metal components are brazed in an inert gas atmosphere, and to a corresponding device for brazing metal components in an inert gas atmosphere. T...
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WO/2007/060936 |
A soldering apparatus is provided with a container that receives and encloses hermetically a circuit board, a weight set immediately above a semiconductor element to press the same against the circuit board, and a high frequency heating ...
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WO/2007/056997 |
The invention relates to a method for producing a contact arrangement (10) between a microelectronic component (11) and a supporting substrate (12) as well as a component unit (24) produced by said method. According to the invention, the...
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WO/2007/058969 |
A flux coated brazing material wherein the flux coating composition is suitable for continuously coating a continuous length of brazing material. Aspects include a flux coating composition for coating or coring a brazing material useful ...
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WO/2007/056334 |
A system and method for maintaining a substantially constant gap between a horn and an anvil includes the act of positioning a horn proximal an anvil, so that a gap is established between the horn and the anvil. An alternating current (A...
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WO/2007/055149 |
[PROBLEMS] To provide a work holding vessel and a work dismounting method for containing a liquid member and dismounting a work without breaking the work. [MEANS FOR SOLVING PROBLEMS] A work holding vessel (10) can contain a liquid solde...
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WO/2007/056222 |
A device for monitoring the voltage or current applied to sensitive components on a circuit board by an assembly tool protects the sensitive components from damage caused by the voltage or current applied to the circuit board.
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WO/2007/054331 |
Honeycomb (1) for an exhaust treatment unit (2) having at least one honeycomb structure (3) and a least one housing (4), which at least partially surrounds the at least one honeycomb structure (3), at least one region (5) between the hon...
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WO/2007/054306 |
The invention relates to a soldering method for joining different basic metallic materials at least at one soldering point with the aid of solder which is fused on using thermal energy. In order to simplify the production of heat exchang...
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WO/2007/048698 |
The invention relates to a method for cleaning components that comprise cracks that are polluted with oxides, in particular gas turbine parts. In said method, the components to be cleaned are exposed in a cleaning chamber at high tempera...
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WO/2007/034121 |
The invention concerns a method for assembling two components, the first component (1) comprising at least 85% of aluminum and the second component (2) comprising at least 80% of magnesium. The method consists in assembling the two compo...
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WO/2007/034439 |
A soldering iron (100) includes a head (118) defining a cavity (120) shaped and dimensioned to receive an electric light bulb (16) operable to heat the head (118).
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WO/2007/031331 |
The invention relates to a device and a method for applying hard solder (1) to an at least partially structured metal foil (2), comprising at least the following steps: a) provision of at least one flat metal foil (2), b) shaping of the ...
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WO/2007/030516 |
Method for controlling the deposition of solder on a heat spreader or heat sink is disclosed. The method comprises applying an attaching flux and finishing flux to a heat spreader, placing a preform thereon and subjecting the same to ref...
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WO/2007/026481 |
The invention provides a clad plate excellent in strength and brazability and a process for the production thereof, specifically, a clad plate (1) comprising a core sheet (10), an outer skin layer (11) provided on one side of the sheet (...
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WO/2007/023604 |
[PROBLEMS] To solve problems in a conventional reflow furnace having a large number of discharge ports and suction ports formed near the discharge ports wherein tall parts are thermally damaged and printed circuit boards are nonuniformly...
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WO/2007/021492 |
High strength, reliable bulk metallic glass (BMG) solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes. BMG solder materials are stronger and have a higher elastic modulus than, and therefore are...
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WO/2007/022349 |
A dispensing assembly dispenses a colloidal mixture onto a part at a weld position. The dispensing assembly includes a supply reservoir for holding the colloidal mixture therein. The dispensing assembly also includes an inline mixer in f...
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WO/2007/018288 |
A solder paste is composed of a solder alloy powder and a flux. The solder alloy has a volume expansion coefficient of 0.5% or less when melted, and the flux includes a bisphenol A epoxy resin and a curing agent selected from a carboxyli...
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WO/2007/017413 |
The invention is directed to a method for arc or beam brazing/welding of workpieces (A) made of steel, cast iron, nickel, cadmium, beryllium, titanium, molybdenum, magnesium, aluminum, copper, lead, zinc, tin, hard metal and alloys there...
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WO/2007/015700 |
A method for stabilizing, in correctness, the transverse cross section of the end of an elongate structural beam during weld attachment to that end of a beam-end mounting component. This method includes the steps of (a) configurationally...
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WO/2007/015031 |
The heat exchanger is characterised in comprising two fluid-passage tube bundles curved at each end thereof, said tube bundles being intertwined in the mid-section (lc-2c), parallel to each other without making contact, the ends (1a-1b) ...
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WO/2007/012434 |
The invention relates to a surface of an object, especially a heat exchanger, e.g. a lateral part, a wavy rib, or a tube of a heat exchanger, which is to be soldered by means of a flux layer (2). In order to improve the properties of the...
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WO/2007/012803 |
Apparatus for use in a refrigeration unit (101) comprising: a first tube (207) of a first metal and having a first end (301) and a second end (304); and a capillary tube (209) formed from a different second metal. The capillary tube is j...
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WO/2007/014191 |
A solid weld-metal-producing material is formed by agglomerating weld metal material powder. An igniter may be integrally formed in or on the agglomerated weld metal material. In addition to typical components of a weld metal material mi...
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WO/2007/012338 |
In a repair method according to the invention for repairing components (1) comprising a base material with a directed microstructure, the repair is performed in such a way that the repaired location (3) correspondingly has a directed mic...
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