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WO/2019/156954A1 |
The present application relates to a soldering machine comprising a nozzle (50) having an outer surface defining an opening from which solder is configured to be dispensed; a dispenser (91) having an orifice and a valve (95) that is conf...
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WO/2019/149064A1 |
A process for joining a first metal workpiece (1) and a second metal workpiece (2) by laser brazing for forming a vehicle structure. The process comprises: providing the first metal workpiece (1) and the second metal workpiece (2) in con...
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WO/2019/151315A1 |
A brazing method in which brazing is performed without using flux, wherein the method is characterized in that brazing is performed in an inert gas atmosphere in a state in which: a body to be brazed is covered by a cover member (1) comp...
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WO/2019/152178A1 |
Systems and methods for additively manufacturing or repairing a component from a base material. The system may include an inoculation source to direct inoculation materials and a laser metal deposition (LMD) system to direct laser energy...
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WO/2019/149828A1 |
The invention relates to a method for fastening a contact element (5, 6) in an electrical component (1), wherein a contact element (5, 6) is arranged on a contact surface (3, 4) of a main body (2) of the component (1), and a laser beam (...
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WO/2019/145556A1 |
Heat exchanger (1) plate (2) comprising at least one hole (34), the hole (34) being surrounded by a collar (48), the collar (48) comprising a top (16), characterized in that a first plane (17) in which the top (16) of the collar (48) ext...
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WO/2019/146548A1 |
Provided is a method for measuring a wet state of a brazing material, with which it is possible to measure the wet state of a brazing material being evaluated, in a state in which the brazing material is covered with flux. Using a metal ...
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WO/2019/140846A1 |
A parent-child set of tin tanks comprises a parent tin tank (151), a child tin tank (152) and a lifting device. The parent tin tank has a cavity for accommodating molten tin. The child tin tank is provided inside the cavity and is driven...
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WO/2019/142541A1 |
A heat exchanger (10) for exchanging heat between a heat medium and air is provided with a tube (100) through which the heat medium flows, and a fin (200) which is a member formed by bending a metal plate and which is brazed to a surface...
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WO/2019/142500A1 |
According to the present invention, a temporary fixing structure wherein a first member (15, 16, 70) and a second member (13, 15, 50, 60) are temporarily fixed to each other comprises at least one brazing filler material layer (17, 18) b...
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WO/2019/141701A1 |
A method for producing a brazed plate heat exchanger comprising a stack of heat exchanger plates provided with a pressed pattern adapted to provide contact points between neighboring heat exchanger plates, such that the heat exchanger pl...
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WO/2019/138574A1 |
A brazing device 10 is provided with a brazing device main body 11, a brazing head 12, and a removing laser head 13, and joins a side panel 14 and a roof panel 15 to each other. The brazing device main body 11 is attached to an arm 17a o...
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WO/2019/094241A3 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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WO/2019/108006A8 |
The present invention provides an apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, the apparatus comprising: a terminal to which the solder alloy is attached; a coil unit comprising a ...
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WO/2019/128067A1 |
Disclosed is a vacuum soldering furnace control system, comprising a control module and a carrying mechanism (2). A vacuum soldering furnace comprises a soldering chamber (18), a soldering platform (20) arranged at a lower portion of the...
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WO/2019/131080A1 |
The present invention curbs unsoldered areas by the ample wetting of a molten solder within a through hole of a substrate, even where an electronic component requiring a high heat capacity is being soldered onto the substrate. A jet sold...
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WO/2019/128064A1 |
A vacuum welding furnace, comprising a welding chamber (18), a furnace cover (4), a transportation mechanism (2), and a negative pressure suction module (9) arranged on the furnace cover (4), the furnace cover (4) covering the upper side...
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WO/2019/128068A1 |
Disclosed is a vacuum soldering furnace, comprising a soldering chamber (18), a furnace cover (4) and a carrying mechanism (2), the furnace cover (4) covering an upper side of the soldering chamber (18), a soldering cavity being formed b...
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WO/2019/116910A1 |
A semiconductor device according to the present invention is provided with: an insulating substrate (1) which is obtained by integrating a ceramic base material (1b) and a fin (1a) for cooling with each other; a plate-like wiring member ...
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WO/2019/115104A1 |
The invention relates to a production method for a chiseling tool that provides the following steps: providing a tool tip (2), which is produced from a sintered hard metal and has a bottom side (18); providing a shaft (7), which is produ...
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WO/2019/116399A1 |
The present invention relates to a method for welding tube to tube of different metals/materials. More particularly, the present invention relates to a system and method for friction welding of dissimilar tubes. The system for friction w...
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WO/2019/113208A1 |
Paste compositions comprising 40-70 percent by weight (wt%) of a low melting point (LMP) particle composition comprising Y; 25-65 wt% of a high melting point (HMP) particle composition comprising M; and 1-15 wt% of a fluxing vehicle. The...
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WO/2019/110781A1 |
Compositions for brazing of aluminium and aluminium alloys and their use are described. The compositions comprise a fluoride salt based flux; a solder metal, solder alloy or solder alloy precursor; a binder; and a diester as a solvent.
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WO/2019/107349A1 |
Provided are a tool for confirming jetting solder height, and a method for handling said tool, with which it is possible to precisely adjust the height of a jetting wave of molten solder. A tool 400 for confirming jetting solder height i...
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WO/2019/108006A1 |
The present invention provides an apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, the apparatus comprising: a terminal to which the solder alloy is attached; a coil unit comprising a ...
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WO/2019/108508A1 |
Methods and apparatus for applying molten solder are disclosed. A system for applying solder to a workpiece includes a conveyor for moving a first workpiece along a machine direction, and a first selective soldering nozzle to apply solde...
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WO/2019/102915A1 |
This aluminum fin is brazed to a tube which is formed of aluminum and is internally provided with a coolant flow path; and this aluminum fin is characterized in that at least one of the front surface and the back surface thereof is provi...
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WO/2019/096539A1 |
Disclosed is a cutting tool (1) comprising a blade portion (4) made of a hard metal that includes hard particles embedded in a ductile metal binder, and a support portion (2) made of a metal material. The blade portion (4) and the suppor...
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WO/2019/099239A1 |
Fuel gas compositions for use in metal fabrication are provided comprising fuel gases comprising a base fuel gas mixed with from about 1% to less than 30% hydrogen.
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WO/2019/098157A1 |
A brazing material (3) is interposed between an aluminium-based material and a Ni-plated iron-based material. The brazing material (3) has a structure in which an Al-Si-Ni-based alloy layer (10) and an Al layer (11) are bonded via a flux...
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WO/2019/094461A1 |
System and methods for solder flux removal from a gas stream is disclosed. In one aspect, the system includes : a scrubber chamber having a gas inlet and a gas outlet through which the gas stream is introduced into and withdrawn from the...
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WO/2019/092947A1 |
[Problem] To provide a car window glass equipped with a lead-free solder joined portion, which passes the VDA test. [Solution] This car window glass comprises: a glass plate having an electrically conductive body layer; a connection term...
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WO/2019/094241A2 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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WO/2019/094036A1 |
A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fractio...
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WO/2019/088222A1 |
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...
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WO/2019/088068A1 |
Provided are: a soldered joint which suppresses detachment between a back metal and a solder alloy during formation of the soldered joint, and which offers higher reliability by suppressing non-wetting of the solder alloy, splashing of m...
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WO/2019/085177A1 |
Disclosed are a method and a system for tin immersion and soldering of a core wire. The method for tin immersion and soldering of a core wire comprises: vertically inserting a core wire bank (40) into molten tin (11) to melt the insulati...
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WO/2019/081690A1 |
Aluminum parts, e.g. parts needed for heat exchangers, are brazed using a low flux load, wherein the flux load on the coated areas of the parts is equal to or greater than 1 g/m2 and equal to or lower than 4.5 g/m2. Preferred fluxes comp...
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WO/2019/081218A1 |
A fine-grained structure can be achieved by using an inoculant during cold metal transfer.
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WO/2019/078021A1 |
A soldering apparatus (1) is provided with a jetting unit (12) and a measuring unit (20). The jetting unit (12) includes a nozzle (12a). The measuring unit (20) is configured so as to measure a first surface shape of a diffuse reflection...
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WO/2019/079372A1 |
A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For exa...
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WO/2019/070852A1 |
The present disclosure provides a potassium aluminum fluoride (KAlF?4#191) flux agent having improved properties such as a lower melting point which allows for the use of solders and alloys with lower melting points. The potassium alumin...
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WO/2019/069368A1 |
In this method for joining metal materials, a member (13) made from copper or from a copper alloy is joined to a steel product (11) by a low-melting-point metal joining material (15). Joining strength is improved and vibration and bendin...
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WO/2019/065511A1 |
In the present invention, a horn (32) of an ultrasonic vibration unit (30) extends in a direction intersecting the jet flow direction of solder flowing inside a jetting nozzle (20). A vibration direction converter (35) is provided at the...
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WO/2019/065065A1 |
Provided are a soldering system and a soldering method, whereby solder can be uniformly spread on a to-be-soldered part without damaging a fine soldering target article, and an excellent solder can be achieved. Even after molten solder a...
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WO/2019/058651A1 |
Provided is a method for joining piping that makes it possible to simplify a work procedure, prevent deformation of piping, and minimize increases in costs at the time of joining. In the method for joining piping, first piping 1 is joine...
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WO/2019/058916A1 |
Provided is a joining process line monitoring system with which it is possible to prevent a deterioration in joining quality and work delays. A joining process line monitoring system 100 is provided with: a joining phenomenon data acquir...
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WO/2019/054291A1 |
An etching liquid for active metal brazing materials, which is used for the purpose of etching an active metal brazing material layer that contains Ag, Cu and an active metal. This etching liquid for active metal brazing materials contai...
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WO/2019/044828A1 |
Provided are an electroconductive member joined body and a joining method, in which: the joined body includes a first electroconductive member (W1) that is configured from a first metal (M1), a second electroconductive member (W2) that i...
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WO/2019/044057A1 |
[Problem] To provide a pipe drilling tool for forming, in a pipe, a hole for introducing a non-oxidizing gas such as nitrogen, when joining pipes such as refrigerant pipes by brazing, wherein the pipe drilling tool has a compact configur...
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