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Patent Searching and Data


Matches 1 - 50 out of 30,336

Document Document Title
WO/2017/065191A1
A brazing method for brazing an aluminum alloy brazing sheet in which one or both of a core member and a brazing member contain one or more X atoms (X: Mg, Li, Be, Ca, Ce, La, Y, and Zr) and in which oxide particles that contain X atoms ...  
WO/2017/065190A1
Provided is an aluminum alloy brazing sheet for use in brazing in an inert-gas atmosphere in which flux is not used, wherein the aluminum alloy brazing sheet is characterized by comprising: an aluminum or aluminum-alloy core member; and ...  
WO/2017/060044A1
The invention relates to a part and to the filling, layer by layer, of a defective spot by means of solder and parent metal. Since a defective spot is filled layer by layer (10', 11', ...), good mechanical properties are obtained for the...  
WO/2017/059952A1
The invention relates to a plate heat exchanger (1) having a plurality of parallel heat exchanger passages (3) which are separated from one another by separating plates (4). Each heat exchanger passage (3) is delimited on at least one si...  
WO/2017/060041A1
Locally applying solder (25) to an area (7) to be repaired and welding filler therearound makes it easier to repair parts having cracks (10).  
WO/2017/060033A1
Combining a precipitation-hardening nickel-base alloy with a steel or titanium substrate makes it very easy to repair parts, the nickel-base alloy having good erosion-resistant properties.  
WO/2017/057651A1
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used toge...  
WO/2017/051798A1
This light-emitting module substrate has a circuit layer to which a light-emitting element is mounted, formed on one surface of an insulation layer. A metal layer comprising Al or an Al alloy and a heat sink are laminated, in order, on t...  
WO/2017/051794A1
This light-emission module having a cooler is characterized by: having a circuit layer to which a light-emitting element is mounted, formed on one surface side of an insulation layer; a metal layer and a cooler being laminated, in order,...  
WO/2017/049511A1
A vacuum reacting force welding method, comprising the following steps: a chip being die-bonded onto a substrate by means of a solder to form a semi-finished product (16); the semi-finished product being placed within a vacuum eutectic c...  
WO/2017/051728A1
This heat exchanger (1) is equipped with: a laminated body (2) which is configured by a plurality of tubes (21) being laminated; and a header tank (4). The header tank has: a plate header (42) to which the end of each of the plurality of...  
WO/2017/047514A1
An aluminum alloy fin material for a heat exchanger, characterized by: comprising an aluminum alloy containing 0.70 to 1.50 mass% of Si, 0.05 to 2.00 mass% of Fe, 1.0 to 2.0 mass% of Mn, 0.5 to 4.0 mass% of Zn, with the remainder being m...  
WO/2017/047293A1
This bonding member (1) is provided with: a base material (2) that contains a low melting point metal and is formed to have a substantially spiral shape as viewed in a cross-section taken in a direction orthogonal to the longitudinal dir...  
WO/2017/036711A1
The invention relates to vacuum interrupters for low voltage systems, medium voltage systems, and high voltage systems having a retaining element receptacle and/or a retaining element, and to a method for producing the same. The retainin...  
WO/2017/038282A1
To provide a heater chip having an iron part with superior conductivity and heat generating properties, said heater chip being capable of performing processing for bonding conduction wires and terminal members efficiently, stably, and re...  
WO/2017/038418A1
This bonding member (1) is provided with: a wire rod (2) which contains a low-melting-point metal and is provided with a hole (4); and metal grains (5) which contain a high-melting-point metal that produces an intermetallic compound havi...  
WO/2017/034172A1
Disclosed is a laser soldering device for performing a soldering process by emitting a laser beam at a soldering process area on a substrate. The disclosed laser soldering device comprises: a laser light source for oscillating a multi-mo...  
WO/2017/026286A1
In the present invention, a circuit pattern including electrodes 21 for mounting a mounting component CP is formed on a flexible substrate 7, a solder paste P is applied to the electrodes 21, and the mounting component CP is mounted on t...  
WO/2017/021595A1
The invention relates to a method which is intended for welding a first steel part (P1) including a peripheral edge (BP) defined by inner (FI) and outer (FE2) end surfaces (FE1) onto a portion (PS) of a second aluminium part (P2). Said m...  
WO/2017/022663A1
A wound multi-ply tube (10) comprises: a tube body (12) formed by winding into a roll-shape a metal plate (13) configured to include a core material layer (18) formed using a metal material, and a brazing material layer (20) formed using...  
WO/2017/021434A1
The present invention concerns a process for the manufacture of flux compositions, flux compositions obtainable by the process according to the invention, aluminum or aluminum alloy parts at least partially coated with the flux compositi...  
WO/2017/018030A1
Provided is a production method by which a strong fillet can be easily formed on both an outer surface and an inner surface of a hollow structure in an aluminum structure comprising the hollow structure and a tubular member. A clad sheet...  
WO/2017/018438A1
The present invention is provided with: a plurality of aluminum heat transfer pipes (11) through which a heat medium flows and which are disposed side by side; a plurality of aluminum connecting pipes (12, 13) through which the heat medi...  
WO/2017/018540A1
The invention addresses the problem of simply and precisely assembling a header plate (3) and a header body (4) and precisely joining the same with brazing for a heat exchanger header tank comprising a header plate (3) into which ends of...  
WO/2017/012156A1
A method for preparing a local soft solder coating on the surfaces of aluminum and an aluminum alloy in an atmospheric environment under the low-temperature condition. The method achieves preparation of a local soft solder coating on the...  
WO/2017/006531A1
Provided are a joining composition and a joining method using the joining composition in which a joining body having a dense joining layer and high joining strength can be obtained at a relatively low joining temperature without applied ...  
WO/2016/207851A1
A method for driving a first component (11) into a second component (12) by superimposing a mechanical wave of ultrasonic frequency (18) onto the movement (17) of at least one of the components (11, 12). The method comprises a step of ad...  
WO/2016/208581A1
Provided is a flux fluid with which it is possible to improve both the hydrophilicity of a heat exchanger obtained by bonding tubes to fins by brazing and the persistence of the hydrophilicity and to improve the brazeability. The flux fl...  
WO/2016/202463A1
The present invention relates to a hermetic package (40) suitable to be implanted in a body of an animal or a human patient. The housing (40) comprises a base part (50), a cover part (60) suitable to cover the base part (50), and a conne...  
WO/2016/194672A1
The present invention provides an aluminum alloy clad material characterized in being obtained by cladding a pure aluminum surface layer material, in which Mg is limited to less than 0.1% (mass%, same below), on one or both surfaces of a...  
WO/2016/194434A1
A bonding member (1) that is provided with a resin body (2) that has an airtight interior and with a bonding material (3) that is enclosed in the resin body (2). In a pre-heat-treatment state, the bonding material (3) is a mixed powder t...  
WO/2016/194435A1
According to the present invention, a heat-generating element (101), a porous metal body (102), and a metal composition (105) are prepared (preparation step). The heat-generating element (101) is, for example, a power semiconductor that ...  
WO/2016/189902A1
Provided are a soldering device and a flux applying device that use a nut which is configured such that the nut is attached to the soldering device and the flux applying device and a fixed position of the nut can be changed more easily t...  
WO/2016/190199A1
The objective of the present invention is to provide a method of manufacturing an aluminum structure including a hollow structure and a tubular member, with which it is possible for robust fillets to be formed easily on the outer surface...  
WO/2016/187010A1
A liner (92) for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate (94) having a length and a width defining an area. The substrate (94) has a thickness defined by first and second sides. An adh...  
WO/2016/185408A3
The present invention refers to a brazing filler, which fulfil the requirements for fusion nuclear reactors, that comprises a metal mixture consisting of copper powder mixed with titanium powder, or Cu-Ti alloyed powders, wherein the con...  
WO/2016/185407A3
The present invention refers to a brazing filler, which fulfil the requirements for fusion nuclear reactors, that comprises a metal mixture consisting of iron powder mixed with titanium powder, wherein the content of iron is between 80 a...  
WO/2016/186566A1
The present invention relates to an electrical heater assembly (1) for liquid propellant chemical rocket engines, and more particularly to such heater assembly comprising a heating cable (30) and a heater support (10), wherein the heater...  
WO/2016/186528A1
In a method for manufacturing knives for forage harvesters the edges of the extended steel part (1) are machined by performing insert seats (1a) therein for reinforcement. Around these insert seats (1 a) the edges of the extended steel p...  
WO/2016/185149A1
The method for welding with filler material described in the present application is intended to transfer a semi-conductor chip (1) onto a substrate (2). The method involves forming an assembly brick (1, 2, 3) comprising the substrate (2)...  
WO/2016/184639A1
The method functions for producing a shaft-hub connection of workpieces (10, 12) made from the same or different materials, wherein, by means of a suitable material (18) as an intermediate layer between the two workpieces (10, 12) to be ...  
WO/2016/185996A1
Provided are: a solder connection structure for improving the solder wettability; and a film forming method for forming a metal film on an aluminum base. This solder connection structure (50) is to be connected with another member throug...  
WO/2016/185959A1
[Problem] To provide a heat exchanger, and a manufacturing method therefor, that can effectively prevent the clogging of heat-medium communication holes by a solder, even if a solder flow occurs at the outer circumferential surface of a ...  
WO/2016/180505A1
The present invention relates to a joining component (10) having a shank (14) and a flange (16) which extends transversely with respect to the shank (14), wherein the flange (16) comprises a top surface (18) which faces away from the sha...  
WO/2016/177825A1
The invention relates to a method for producing a soldered connection between at least two components (10, 30), in which the components (10, 30) are heated to melt a solder in a solder region (24), wherein the solder region (24 and/or th...  
WO/2016/174584A1
A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt% of a mixture of metal particles comprising 30-70 wt% of a lead-free low melting point (LMP) particle composition compr...  
WO/2016/169551A1
The device according to the invention is used to cool a flat object (2) with a first main surface (200) and a second main surface (202) lying opposite the first main surface in a nonhomogeneous manner. The flat object is cooled from the ...  
WO/2016/171623A1
There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic ...  
WO/2016/169705A1
Joining device and joining method, wherein the joining device (1) is used for laser beam-based joining of at least two components (B1, B2) and comprises a first laser radiation source (10), a first radiation guide (11), which is connecte...  
WO/2016/172674A1
A method for producing an alloy self-brazing strip. In an aspect, a process is used to generate a multi-layer alloy strip made up of at least one base layer of with a least another layer of material, that when both the material and base ...  

Matches 1 - 50 out of 30,336