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WO/2019/035392A1 |
This electronic component module is provided with a substrate, an electronic component, and a connection device. The substrate has an electrode array. The electronic component has an electrode array. The connection device has: a pluralit...
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WO/2019/030212A1 |
The aim of the invention is to develop a method for the resistance butt welding of metals, in the case of which metals at least two butt joint surfaces (8, 16) are pressed against each other and the current can subsequently flow through ...
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WO/2019/026915A1 |
Provided is a method for producing a heat exchanger, capable of securely joining flat tubes and fins by brazing. In a brazed layer-forming step, brazed layers (40) are respectively formed on flat tubes (20). In the following temporary as...
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WO/2019/022133A1 |
[Problem] To provide a ceramic circuit board that has high bonding ability and superior thermal cycle resistance. [Solution] According to the present invention, a circuit pattern is provided on a ceramic substrate via a brazing layer, an...
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WO/2019/022193A1 |
This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, a...
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WO/2019/017093A1 |
This heat exchanger is constituted of fins (2), heat transfer tubes (3), and headers (4). These members are joined with each other by brazing. The fins (2), the heat transfer tubes (3), and the headers (4) are assembled and placed on a c...
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WO/2019/013024A1 |
In the present invention, a plate material constituting a tube body part 50 is bent at one end section of the external air flow direction of a first flat wall section 51 toward one side, and is bent at the other end section of the extern...
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WO/2019/011687A1 |
The invention relates to a soldering system and a method for wave soldering, comprising at least one flux nozzle (16) and a device (10) for monitoring a state of a spray jet (12) of said flux nozzle (16).
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WO/2019/011686A1 |
The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, co...
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WO/2019/008003A1 |
The invention relates to a soldering material (1) for active soldering, in particular for active soldering a support layer (2) comprising a metallization (3) on a ceramic, the soldering material comprises copper and essentially does not ...
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WO/2019/009427A1 |
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least tw...
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WO/2019/007873A1 |
Method for operating a soldering device (100) and a soldering device (100), wherein a graphic representation of at least part of the soldering device (100) is captured (212, 304, 404), wherein an instantaneous operating state of the sold...
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WO/2019/007900A1 |
The invention relates to a method for operating a soldering system for selective wave soldering comprising at least solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump be...
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WO/2019/001783A1 |
The invention relates to a method and a device for producing a wire connection between a first contact surface and at least one further contact surface (42), in which a contact end of a wire is positioned by means of a wire guidance tool...
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WO/2018/229122A1 |
A fixation apparatus includes a base, a wire fixing device and a pressing device. The wire fixing device includes a fixing frame fixedly mounted on the base, and a moving unit received in a receiving chamber of the fixing frame and movab...
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WO/2018/230796A1 |
A battery module according to an embodiment of the present invention comprises: a plurality of battery cells, each having an electrode lead; a bus bar formed by connecting a plurality of lead clips to each other, each of the lead clips h...
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WO/2018/225437A1 |
Provides is a soldering device comprising parallel transfer means, in which, even when one transfer means-side of a reflow furnace body is opened, the inside of the reflow furnace body on the other transfer means-side is not exposed. The...
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WO/2018/225477A1 |
This stacked heat exchanger exchanges heat between a refrigerant and an object (4) with which heat is to be exchanged, the object being disposed between a plurality of mutual flow channel pipes (2, 26, 27) stacked in a stacking direction...
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WO/2018/225809A1 |
[Problem] To obtain a ceramic circuit substrate that is suitable for a silver nanoparticle junction in a semiconductor element and has excellent adhesion to a power module sealing resin. [Solution] Provided is a ceramic circuit substrate...
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WO/2018/226219A1 |
Methods (1000) for structural braze repair of damaged industrial machine components, e.g., gas turbine engine components (10). The method includes the step of placing a bilayer braze material (200) onto a surface (12) of the component. T...
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WO/2018/220320A1 |
Heating device (10) suitable for heating at least one solder spot positioned between an electronic component (8) including at least one first pad (8_1) and a printed circuit board (4), the solder spot both rigidly connecting the electron...
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WO/2018/219661A1 |
Method for brazing or refilling a part with micro-interstices, and heat exchanger obtained with such a method. The invention relates to a brazing or refilling method comprising the following steps: - providing at least one part (51) cont...
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WO/2018/220112A1 |
The invention relates to a method for producing a heat exchanger (1) comprising: a bundle (2) of tubes comprising a plurality of tubes (20) arranged in parallel and spacers (21) arranged between said tubes (20); and a collector plate (4)...
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WO/2018/221492A1 |
[Problem] To provide a ceramic circuit board having excellent heat cycle resistance characteristics. [Solution] Provided is a ceramic circuit board characterized in that: a metal plate is joined by means of a joining brazing material to ...
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WO/2018/216076A1 |
The present invention provides a board working machine, which can change an operation when separating molten solder from a board or a lead and which can improve soldering quality. According to the present invention, a control device has:...
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WO/2018/216719A4 |
Provided is a shower head processing tool which can inhibit pins from falling off due to ultrasonic vibrations. A horn (10) comprising a base (12) and pins (14) that are inserted and fitted into holes (12a) provided in one main surface o...
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WO/2018/217051A1 |
The present invention relates to a method for manufacturing a device for cooling an electric car battery and, more particularly, to a method for manufacturing an electric car battery cooling device wherein a flux is applied to an upper c...
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WO/2018/217213A1 |
System (10) and methods (1000) for structural braze repair of high gamma prime nickel base gas turbine components (1). The system may include a controller (200) operably connected to a heating system (100), e.g., a vacuum furnace, for co...
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WO/2018/216771A1 |
Provided is a brazing method for an aluminum alloy brazing sheet provided with a core material and a brazing material in which the Si content of the brazing material is denoted by CSi, the Bi content of the brazing material is denoted by...
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WO/2018/215856A1 |
An ignition device for welding equipment includes a capacitor, a transformer, a high voltage output circuit connected to a secondary winding of the transformer, a discharging switch enabling discharge of the capacitor to a primary windin...
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WO/2018/216719A1 |
Provided is a shower head processing tool which can inhibit pins from falling off due to ultrasonic vibrations. A horn (10) comprising a base (12) and pins (14) that are inserted and fitted into holes (12a) provided in one main surface o...
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WO/2018/210844A1 |
The invention relates to an assembly (100) for applying solder in the form of solder balls (12) to a substrate (104), the assembly containing a reservoir (14) comprising a plurality of solder balls (12); a discharge opening (26) for disc...
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WO/2018/210884A3 |
A wire automatic soldering system includes: a carrier (120) adapted to load an electrical product (10) to be soldered; a robot (100) adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container...
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WO/2018/210884A2 |
A wire automatic soldering system includes: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to co...
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WO/2018/208095A1 |
Provided is a laser machining apparatus comprising: a head part for emitting an inspection light to an object; and a control part for matching surface information of a pre-inputted area to be soldered and surface information acquired by ...
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WO/2018/206982A1 |
There is provided a method of joining a first member made of a niobium titanium alloy to a second member. The method comprises abutting a respective surface of each of the first member and the second member together to form an interface ...
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WO/2018/208097A1 |
Provided is a laser processing method capable of: loading an object on a jig; detecting and pre-inspecting an alignment state including the rotation and the arrangement of the object loaded on the jig; moving the jig to a soldering locat...
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WO/2018/208096A1 |
Provided is a jig assembly comprising: a jig having a mounting part on which an object can be mounted; and a close attachment part coupled to the jig, and maintaining the object so as to be fixed in the mounting part, wherein the jig and...
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WO/2018/202920A1 |
The invention relates to a soldering device (50) for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B),...
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WO/2018/202997A1 |
The present invention relates to a heat exchanger (1) comprising a bundle of flat tubes (2), said bundle of flat tubes (2) comprising: ◦ a multitude of flat tubes (2) arranged parallel to one another and in a row, said flat tubes (2) i...
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WO/2018/202919A1 |
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber sealed from the surroundings, by heating and melting solder material (16) which is arranged between the...
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WO/2018/204561A1 |
Apparatuses and a method for cleaning a nozzle by removing an accumulation of material from the surface of a nozzle are disclosed. The apparatus includes a dispenser (50) for dispensing a length of wire and a gantry configured to bring t...
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WO/2018/199259A1 |
A bonding material that contains first particles containing a first metal, second particles containing a second metal that has a lower melting point than the first metal, and a filling resin is supplied onto one of a semiconductor elemen...
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WO/2018/198455A1 |
This junction structure, which includes a Cu-based joined material (1) joined via a Zn-based brazing material (2), is provided with a junction part, including a first alloy phase (3), a second alloy phase (4), and a third alloy phase (5)...
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WO/2018/196432A1 |
A method for manufacturing a brazed honeycomb panel, comprising the following steps: stretching a composite aluminum foil, which is formed by pre-gumming, stacking, and binding and has a brazing filler metal layer, as a honeycombed alumi...
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WO/2018/198838A1 |
A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquir...
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WO/2018/199394A1 |
The present invention relates to a gold-deposited copper film. The gold-deposited copper film comprises: a metal layer composed of copper; a metal barrier layer positioned on the metal layer and including brass, manganese brass, phosphor...
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WO/2018/198906A1 |
Provided is an Ni-Cr based alloy brazing material containing, as % by mass, more than 15% and less than 30% Cr, more than 3% and less than 12% P, less than 8% (including 0%) Si, more than 0.01% and less than 0.06% C, less than 0.1% (incl...
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WO/2018/196524A1 |
Disclosed is a molybdenum alloy fusion welding method based on micro-alloying and synchronized parasitic brazing, the method comprising the following steps: 1) pre-processing a bonding area to be welded of a workpiece to be welded, where...
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WO/2018/199086A1 |
[Problem] To provide a laser soldering technique with which it is possible to prevent scorching, residue, etc., in a substrate or in surrounding heat-sensitive components. [Solution] Provided is an automatic soldering method in which the...
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