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WO/2019/212529A1 |
A weld filler is proposed which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt%): 11.2% - 15.6% chromium (Cr), 9.6% - 11.4% cobalt (Co) 2.4% - 5.0%, molybdenum (Mo) ...
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WO/2019/213059A1 |
Systems for soldering a workpiece;(2) using a solder application system. A nozzle (30) includes a plurality of walls (46, 56) and a floor that together define a nozzle (30) reservoir for containing liquid solder. The plurality of walls (...
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WO/2019/211998A1 |
A soldering nozzle (20) is provided with an outer frame (21), a first partition wall (22a), and a second partition wall (22b). The outer frame (21) includes a flow path (21a) having an opening (OP) through which molten solder (2) is jett...
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WO/2019/207823A1 |
The present invention relates to a silver brazing material in which the essential constituent elements are silver, copper, zinc, manganese, nickel, and tin. The silver brazing material comprises 35 to 45 mass% of silver, 18 to 28 mass% o...
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WO/2019/209070A1 |
The present invention particularly relates to an apparatus (1) for thermally coupling a vehicle heat exchanger. The apparatus (1) is provided with a first holding element (2), a second holding element (3) and one or more heat source (7)....
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WO/2019/207996A1 |
A power module 20 comprises: a semiconductor chip 1; a ceramic substrate 3 that supports the semiconductor chip 1 and is provided with a wiring 3e on an upper surface 3a on which the semiconductor chip 1 is mounted; a solder 2 for joinin...
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WO/2019/208039A1 |
This soldering monitoring device monitors soldering for a workpiece to be soldered (10) which is soldered by molten solder jetted from a jet nozzle after preheating. The soldering monitoring device is provided with: a measurement unit wh...
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WO/2019/204623A1 |
The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow...
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WO/2018/057905A8 |
A braze bonded nail head includes a nail head lead having a first end with first and second sides and a braze alloy preform coupled to the first side of the first end of the nail head lead The braze bonded nail head further includes a we...
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WO/2019/196327A1 |
A nickel brazing production line and process for a plate heat exchanger. The nickel brazing production line for a plate heat exchanger sequentially consists of a roll coater (1), a first tunnel oven (2), a comma coater (3), a second tunn...
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WO/2019/195249A1 |
A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion in...
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WO/2019/194071A1 |
A solder jet flow inspection device (1) comprising: a substrate (10) including a first main surface (10p) and a second main surface (10q) on the opposite side to the first main surface (10p); and at least one solder paste (14) arranged u...
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WO/2019/154923A3 |
The invention relates to a method for producing a structural unit (10) which is to be soldered to at least one component by diffusion soldering and is formed independently of the component (38), comprising the following steps: - providin...
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WO/2019/190475A1 |
A system for manufacturing of a sintered wire and in-situ feeding to a laser wire welding system is presented. The system includes a pressure vessel connected to a powder feed system for delivering at least two powders to a powder mixing...
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WO/2019/187767A1 |
The present invention relates to an insulating substrate in which a ceramic substrate, a first copper plate material formed on one surface of the ceramic substrate, and a second copper plate material formed on the other surface of the ce...
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WO/2019/181270A1 |
This heat exchanger (10) is provided with: a first tube (210) through which a first fluid passes; a second tube (220) through which a second fluid passes; and a cladding member (300) that is a plate-like member having brazing material la...
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WO/2019/181846A1 |
The purpose of the present invention is to provide an electronic component module using a busbar, for example, in which the height of a solder mounting surface is aligned between an anode busbar and a cathode busbar that are laminated, t...
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WO/2019/177607A1 |
A method of additively manufacturing or repairing a superalloy component utilizing at least a double solution heat treatment and sub-cooling is presented. The at least double solution heat treatment includes heating the tip of a superall...
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WO/2019/175608A1 |
A method is provided for monitoring the laser annealing of a semiconductor wafer. After annealing, images of many regions of the wafer are captured. The surface brightness of these regions is measured by computer, and statistics of these...
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WO/2019/174929A1 |
The invention relates to a wave-soldering machine (10) comprising a pump (12) for delivering liquid solder in a solder delivery system, comprising at least one solder nozzle (14) into which the liquid solder is delivered in order to prod...
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WO/2019/176380A1 |
With the present invention, it is possible to prevent a joining member from creeping up into a hollow hole of a contact part. A semiconductor device (10) has: a laminated substrate (14) comprising a circuit board (13a) and an insulating ...
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WO/2019/171835A1 |
The problem to be addressed by the present invention is to provide a semiconductor device production method capable of reducing the voids occurring in a solder joining portion when soldering a semiconductor chip. This semiconductor devic...
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WO/2019/170211A1 |
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder...
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WO/2019/170535A1 |
The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and wi...
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WO/2019/172410A1 |
Provided are: a flux which contains no reducing agent or no activator and does not remain on a solder joint; and a solder paste prepared using the flux. The flux according to the present invention contains: a first solvent of which the t...
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WO/2019/170213A1 |
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder...
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WO/2019/170212A1 |
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder...
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WO/2019/167454A1 |
A joint structural body (1) has a first metal base material (11) which is configured from first metal, a second metal base material (12) which is configured from second metal, and a weld metal section (13) which connects the first metal ...
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WO/2019/167254A1 |
A semiconductor device 1 equipped with: a substrate 10 having a semiconductor chip-positioning surface 12; a semiconductor chip 20 which is positioned on the semiconductor chip-positioning surface 12, and has a principal electrode 24 for...
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WO/2019/167218A1 |
A semiconductor device 1 equipped with a semiconductor chip 3 and a lead 4 which includes an electrode-connecting part 41 which is electrically connected to the semiconductor chip 3 by solder 6, and projecting parts 42 which project peri...
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WO/2019/168517A1 |
There is provided a process for repairing a turbine component (15) having a structural defect (36) therein. The process includes applying an amount of a braze material (40) over and/or within the structural defect (36) and subjecting the...
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WO/2019/167273A1 |
This method for producing a semiconductor device involves: a semiconductor chip placement step S3 for placing a semiconductor chip 3 on a base 11; a solder material placement step S4 for placing a solder material 6 on the top surface of ...
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WO/2019/164487A1 |
An apparatus, material and method for forming a brazing sheet has a composite braze liner layer of low melting point aluminum alloy and 4000 series braze liner. The low melting point layer of the composite braze liner facilitates low tem...
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WO/2019/163145A1 |
This semiconductor device production method comprises: an assembled body forming step of disposing, between an electrode 24 and an electrode connection piece 32, a soldering material 44 having a structure including, layered therein, a fi...
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WO/2019/160772A1 |
A method of joining two metal components for forming medical or other devices. The method includes placing a first and second metal component into a sleeve, the first sleeve composed of a nickel titanium alloy and having niobium deposite...
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WO/2019/159858A1 |
The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from...
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WO/2019/156954A1 |
The present application relates to a soldering machine comprising a nozzle (50) having an outer surface defining an opening from which solder is configured to be dispensed; a dispenser (91) having an orifice and a valve (95) that is conf...
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WO/2019/149064A1 |
A process for joining a first metal workpiece (1) and a second metal workpiece (2) by laser brazing for forming a vehicle structure. The process comprises: providing the first metal workpiece (1) and the second metal workpiece (2) in con...
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WO/2019/151315A1 |
A brazing method in which brazing is performed without using flux, wherein the method is characterized in that brazing is performed in an inert gas atmosphere in a state in which: a body to be brazed is covered by a cover member (1) comp...
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WO/2019/152178A1 |
Systems and methods for additively manufacturing or repairing a component from a base material. The system may include an inoculation source to direct inoculation materials and a laser metal deposition (LMD) system to direct laser energy...
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WO/2019/149828A1 |
The invention relates to a method for fastening a contact element (5, 6) in an electrical component (1), wherein a contact element (5, 6) is arranged on a contact surface (3, 4) of a main body (2) of the component (1), and a laser beam (...
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WO/2019/145556A1 |
Heat exchanger (1) plate (2) comprising at least one hole (34), the hole (34) being surrounded by a collar (48), the collar (48) comprising a top (16), characterized in that a first plane (17) in which the top (16) of the collar (48) ext...
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WO/2019/146548A1 |
Provided is a method for measuring a wet state of a brazing material, with which it is possible to measure the wet state of a brazing material being evaluated, in a state in which the brazing material is covered with flux. Using a metal ...
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WO/2019/140846A1 |
A parent-child set of tin tanks comprises a parent tin tank (151), a child tin tank (152) and a lifting device. The parent tin tank has a cavity for accommodating molten tin. The child tin tank is provided inside the cavity and is driven...
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WO/2019/142541A1 |
A heat exchanger (10) for exchanging heat between a heat medium and air is provided with a tube (100) through which the heat medium flows, and a fin (200) which is a member formed by bending a metal plate and which is brazed to a surface...
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WO/2019/142500A1 |
According to the present invention, a temporary fixing structure wherein a first member (15, 16, 70) and a second member (13, 15, 50, 60) are temporarily fixed to each other comprises at least one brazing filler material layer (17, 18) b...
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WO/2019/141701A1 |
A method for producing a brazed plate heat exchanger comprising a stack of heat exchanger plates provided with a pressed pattern adapted to provide contact points between neighboring heat exchanger plates, such that the heat exchanger pl...
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WO/2019/138574A1 |
A brazing device 10 is provided with a brazing device main body 11, a brazing head 12, and a removing laser head 13, and joins a side panel 14 and a roof panel 15 to each other. The brazing device main body 11 is attached to an arm 17a o...
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WO/2019/094241A3 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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WO/2019/108006A8 |
The present invention provides an apparatus for soldering a terminal to which a solder alloy is attached on window glass for a vehicle, the apparatus comprising: a terminal to which the solder alloy is attached; a coil unit comprising a ...
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