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WO/2018/220320A1 |
Heating device (10) suitable for heating at least one solder spot positioned between an electronic component (8) including at least one first pad (8_1) and a printed circuit board (4), the solder spot both rigidly connecting the electron...
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WO/2018/219661A1 |
Method for brazing or refilling a part with micro-interstices, and heat exchanger obtained with such a method. The invention relates to a brazing or refilling method comprising the following steps: - providing at least one part (51) cont...
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WO/2018/220112A1 |
The invention relates to a method for producing a heat exchanger (1) comprising: a bundle (2) of tubes comprising a plurality of tubes (20) arranged in parallel and spacers (21) arranged between said tubes (20); and a collector plate (4)...
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WO/2018/221492A1 |
[Problem] To provide a ceramic circuit board having excellent heat cycle resistance characteristics. [Solution] Provided is a ceramic circuit board characterized in that: a metal plate is joined by means of a joining brazing material to ...
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WO/2018/216076A1 |
The present invention provides a board working machine, which can change an operation when separating molten solder from a board or a lead and which can improve soldering quality. According to the present invention, a control device has:...
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WO/2018/217051A1 |
The present invention relates to a method for manufacturing a device for cooling an electric car battery and, more particularly, to a method for manufacturing an electric car battery cooling device wherein a flux is applied to an upper c...
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WO/2018/217213A1 |
System (10) and methods (1000) for structural braze repair of high gamma prime nickel base gas turbine components (1). The system may include a controller (200) operably connected to a heating system (100), e.g., a vacuum furnace, for co...
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WO/2018/216771A1 |
Provided is a brazing method for an aluminum alloy brazing sheet provided with a core material and a brazing material in which the Si content of the brazing material is denoted by CSi, the Bi content of the brazing material is denoted by...
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WO/2018/215856A1 |
An ignition device for welding equipment includes a capacitor, a transformer, a high voltage output circuit connected to a secondary winding of the transformer, a discharging switch enabling discharge of the capacitor to a primary windin...
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WO/2018/216719A1 |
Provided is a shower head processing tool which can inhibit pins from falling off due to ultrasonic vibrations. A horn (10) comprising a base (12) and pins (14) that are inserted and fitted into holes (12a) provided in one main surface o...
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WO/2018/210844A1 |
The invention relates to an assembly (100) for applying solder in the form of solder balls (12) to a substrate (104), the assembly containing a reservoir (14) comprising a plurality of solder balls (12); a discharge opening (26) for disc...
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WO/2018/210884A2 |
A wire automatic soldering system includes: a carrier adapted to load an electrical product to be soldered; a robot adapted to grip and move the carrier on which the electrical product is loaded; a solder paste container configured to co...
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WO/2018/208095A1 |
Provided is a laser machining apparatus comprising: a head part for emitting an inspection light to an object; and a control part for matching surface information of a pre-inputted area to be soldered and surface information acquired by ...
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WO/2018/206982A1 |
There is provided a method of joining a first member made of a niobium titanium alloy to a second member. The method comprises abutting a respective surface of each of the first member and the second member together to form an interface ...
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WO/2018/208097A1 |
Provided is a laser processing method capable of: loading an object on a jig; detecting and pre-inspecting an alignment state including the rotation and the arrangement of the object loaded on the jig; moving the jig to a soldering locat...
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WO/2018/208096A1 |
Provided is a jig assembly comprising: a jig having a mounting part on which an object can be mounted; and a close attachment part coupled to the jig, and maintaining the object so as to be fixed in the mounting part, wherein the jig and...
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WO/2018/202920A1 |
The invention relates to a soldering device (50) for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B),...
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WO/2018/202997A1 |
The present invention relates to a heat exchanger (1) comprising a bundle of flat tubes (2), said bundle of flat tubes (2) comprising: ◦ a multitude of flat tubes (2) arranged parallel to one another and in a row, said flat tubes (2) i...
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WO/2018/202919A1 |
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber sealed from the surroundings, by heating and melting solder material (16) which is arranged between the...
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WO/2018/204561A1 |
Apparatuses and a method for cleaning a nozzle by removing an accumulation of material from the surface of a nozzle are disclosed. The apparatus includes a dispenser (50) for dispensing a length of wire and a gantry configured to bring t...
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WO/2018/199259A1 |
A bonding material that contains first particles containing a first metal, second particles containing a second metal that has a lower melting point than the first metal, and a filling resin is supplied onto one of a semiconductor elemen...
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WO/2018/198455A1 |
This junction structure, which includes a Cu-based joined material (1) joined via a Zn-based brazing material (2), is provided with a junction part, including a first alloy phase (3), a second alloy phase (4), and a third alloy phase (5)...
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WO/2018/196432A1 |
A method for manufacturing a brazed honeycomb panel, comprising the following steps: stretching a composite aluminum foil, which is formed by pre-gumming, stacking, and binding and has a brazing filler metal layer, as a honeycombed alumi...
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WO/2018/198838A1 |
A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquir...
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WO/2018/199394A1 |
The present invention relates to a gold-deposited copper film. The gold-deposited copper film comprises: a metal layer composed of copper; a metal barrier layer positioned on the metal layer and including brass, manganese brass, phosphor...
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WO/2018/198906A1 |
Provided is an Ni-Cr based alloy brazing material containing, as % by mass, more than 15% and less than 30% Cr, more than 3% and less than 12% P, less than 8% (including 0%) Si, more than 0.01% and less than 0.06% C, less than 0.1% (incl...
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WO/2018/196524A1 |
Disclosed is a molybdenum alloy fusion welding method based on micro-alloying and synchronized parasitic brazing, the method comprising the following steps: 1) pre-processing a bonding area to be welded of a workpiece to be welded, where...
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WO/2018/199086A1 |
[Problem] To provide a laser soldering technique with which it is possible to prevent scorching, residue, etc., in a substrate or in surrounding heat-sensitive components. [Solution] Provided is an automatic soldering method in which the...
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WO/2018/193760A1 |
A semiconductor device comprising an assembly structure in which a semiconductor element (1) is mounted on a laminated substrate. The semiconductor element (1) and an electrode pattern (3) on the laminated substrate are bonded by means o...
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WO/2018/194238A1 |
A battery module, according to one embodiment of the present invention, comprises: a plurality of battery cells having electrode leads; a busbar having a plurality of insertion slots into which the respective electrode leads of the plura...
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WO/2018/194156A1 |
A method for manufacturing a semiconductor device, the method comprising: a step for temporarily crimping a first member having a connection part and a second member having a connection part, with an adhesive agent interposed therebetwee...
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WO/2018/192646A1 |
The invention relates to a laser brazing system (100), comprising a braze tool (110) having a laser (112) configured to emit a laser beam (114) along a radiation path (RP), and a braze wire tool (120) being configured to guide a braze wi...
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WO/2018/189586A2 |
The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the...
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WO/2018/189592A1 |
The present application provides an apparatus for automatically clearing away residual solder paste, comprising a working platform (150) for bearing a solder paste tub accommodating a solder paste nozzle, the solder paste nozzle having a...
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WO/2018/189586A3 |
The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the...
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WO/2018/188398A1 |
A nickel-based material brazing joint component and a method for use in mechanical property homogenization which comprises three homogenization manufacturing steps: step one, assembling a welding sample and then placing the same into a v...
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WO/2018/184806A1 |
The invention relates to an aluminium alloy brazing sheet product comprising a covering aluminium material layer comprising 0.5-5% Zn, an aluminium core material layer, and an Al-Si alloy brazing material layer as an intermediate materia...
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WO/2018/176628A1 |
An ultrasound flux-free aluminium pipe brazing method, comprising: immersing the soldering end of a small pipe (2) to be soldered in a solder bath (3) filled with molten solder; dip-plating a layer of molten solder over the outer surface...
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WO/2018/181000A1 |
Provided are a workpiece processing device that includes a vaporizing device to vaporize a liquid to be vaporized having a comparatively large flow rate without requiring a carrier gas, and a manufacturing method for processed workpieces...
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WO/2018/180545A1 |
The production method for a cylindrical sputtering target according to the present invention comprises: a solder material applying step for forming a solder underlying layer on the inner peripheral surface of a sputtering target material...
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WO/2018/168476A1 |
This method for producing a bonded body comprises: a lamination step for forming a laminate wherein a first member (11) and second members (22, 23) are temporarily bonded to each other by arranging a temporary bonding material (40) that ...
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WO/2018/167672A1 |
A composition includes a hydrofluoroolefin having Structural Formula (I): (I) Rf is a perfluoroalkyl group having 2 - 6 carbon atoms. The composition further includes a free radical scavenger.
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WO/2018/166753A1 |
The invention relates to a method for closing an opening (7) in a turbine blade (1), involving the steps of: - applying, layer by layer, a base material (14) of which the turbine blade (1) is made and a soldering material (15) in order t...
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WO/2018/167232A1 |
The present invention discloses a fixing system comprising a base (1) and at least one set of clamping devices (2) mounted on the base. Each set of clamping devices includes a first fixture (100), in which a first positioning groove (111...
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WO/2018/167216A1 |
An automatic solder paste feeding system includes: a base (10); a container (200) mounted on the base and configured to contain solder paste therein; a syringe (100) mounted on the base and configured to inject the solder paste into the ...
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WO/2018/165640A1 |
A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barr...
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WO/2018/164038A1 |
Provided is a soldering device comprising: a conveyance means 12 that conveys a substrate 11 on which an electronic part C is mounted; and a heating means that melts solder interposed between an electrode 13 and the electronic part to so...
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WO/2018/164520A1 |
A heat pipe module and a manufacturing method therefor are disclosed. According to the present invention, a base plate part has a supporting stepped part such that a cover plate part can be accurately mounted on the base plate part and t...
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WO/2018/164039A1 |
Provided is a soldering device comprising a heating means that solders an electronic part C to an electrode 13, the heating means comprising: a coil 20 having a space on the inside thereof; a plurality of ferrites 30 disposed in the spac...
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WO/2018/165128A1 |
A fusion welding system utilizing a radiant energy heat source such as a laser or electron- beam. The system uses a weld or filler wire having a non-round cross-section shape oriented such that the minor axis of the filler wire is aligne...
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