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WO/2012/013437 |
The invention relates to a method for stabilizing a concentration (10) of a constituent, in particular a Cu concentration (10), in a solder bath (34). The removal of the constituent from the solder bath (34) by attachment to the componen...
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WO/2012/009612 |
A method of removing oxidation from certain metallic contact surfaces utilizing a combination of relatively simple and inexpensive off-the-shelf equipment and specific chemistry. The method being a very rapid dry process which does not r...
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WO/2012/007452 |
The invention relates to a fluid channel for a heat exchanger, comprising a metal sheet (1), wherein the metal sheet (1) has at least one core region of an aluminium base alloy and at least one structure (4, 14) arranged inside the fluid...
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WO/2012/007667 |
Method of assembling two facing metal workpieces consisting of a thin sheet (2) and of a hollow body (1), of the type in which a plurality of pressed oblong impressions (4) intended to accept a slug of filler material (8) is provided on ...
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WO/2012/005997 |
A reflow oven chamber assembly (50) that is configured to be installed within a reflow oven chamber of a reflow oven includes a chamber housing (52) disposed within the reflow oven chamber, one or more heating elements (66) disposed in t...
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WO/2012/001644 |
In accordance with an example embodiment of the present invention, a method, comprises receiving an integrated circuit component comprising at least one solder ball substantially surrounded by a first epoxy flux, applying a second epoxy ...
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WO/2012/002173 |
A high-temperature solder alloy comprising a Bi-Sn-based solder alloy containing 90 mass% or more of Bi, wherein the Bi-Sn-based solder alloy additionally contains 1 to 5 mass% of Sn and 0.5 to 5 mass% of at least one element selected fr...
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WO/2012/002273 |
Provided is a soldering method which reduces position deviations between substrates even though the defluxing process can be omitted. A temporary fixing agent (55) is applied to a plurality of substrates (50a, 50b), the substrates (50a, ...
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WO/2011/158449 |
In a lead-free connection material used in a semiconductor device including a power module and the like, when being exposed to a temperature higher than a normally used temperature range, there has been a case in which the stress relaxat...
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WO/2011/148781 |
Provided is a method for producing an aluminum alloy heat exchanger formed by applying a coating material, which is obtained by mixing an Si powder, a flux powder, and a binder, to the surface of a flat, multi-hole coolant tube formed fr...
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WO/2011/142180 |
Disclosed is a pipe coupling method that does not require joints during pipe coupling and which can reduce the coupling time required. The pipe coupling method has: a blocking step, wherein an open end section of a first pipe (10a) of tw...
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WO/2011/142262 |
Disclosed are: a brazing material for bonding in atmosphere, which has a low melting point and therefore can have a low bonding temperature in atmosphere without using any flux; a bonded article which is bonded using the brazing material...
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WO/2011/135737 |
Disclosed are a heating apparatus and a cooling apparatus, whereby a whole printed substrate can be uniformly and stably heated or cooled without minutely increasing or reducing the temperature of the printed substrate while the printed ...
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WO/2011/127506 |
The invention relates to an apparatus and to a process for cohesively joining two plates (1 and 2) having differing melting points, one of which plates, the end plate (1), comprises a light metal material, in particular aluminium materia...
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WO/2011/128624 |
An apparatus (10) for the production of brazed aluminium products on a continuous flow basis comprises, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15, 16) and a transportation means (25) for conveyi...
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WO/2011/125017 |
The invention relates to a method for brazing two or more parts. A hard solder having a composition consisting of NiRestCraBbPcSid having 20 atom % < a < 22 atom %; 1.2 atom % ≤ b ≤ 3.6 atom %; 12.5 atom % ≤ c ≤ 14.5 atom %; 0 at...
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WO/2011/124451 |
The invention relates to a fluxing agent (1) for soldering and to a method for connecting two components (3, 4). A fluxing agent (1) is applied to connection points (5, 6) of the components (3, 4) to be connected, and the connection poin...
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WO/2011/125669 |
In the disclosed soldering device, a support and sealing mechanism for covers for a preheating/cooling/etc. treatment vessel is engineered such that the covers can slide freely on top of the treatment vessel and can be supported and seal...
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WO/2011/125668 |
In the disclosed soldering device, the configuration of a labyrinth section that hangs down on the side where a heat treatment unit, a cooling treatment unit, and the like are is engineered such that the distance the labyrinth section ha...
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WO/2011/125324 |
Disclosed is an apparatus (1) for manufacturing a heat exchanger which is provided with: a core tube (2); a winding tube (3); a rotating mechanism (10), which rotates the core tube (2) in the circumferential direction, said core tube bei...
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WO/2011/113758 |
The present application describes a method of joining at least two parts (21, 22) made of silicon-carbide-based materials by non-reactive brazing, in which the parts are brought into contact with a non-reactive brazing composition (26), ...
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WO/2011/116093 |
A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e...
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WO/2011/113759 |
The present application describes a method of joining at least two parts (1, 2) made of silicon-carbide-based materials by non-reactive brazing, in which the parts are brought into contact with a non-reactive brazing composition (3), the...
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WO/2011/114945 |
Disclosed are a method and an apparatus for determining acceptance/rejection of fine diameter wire bonding of semiconductor devices, LED devices, and the like at a high accuracy without contact, said acceptance/rejection having not been ...
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WO/2011/113760 |
The present application describes a method of joining at least two parts (1, 2) made of silicon-carbide-based materials by non-reactive brazing, in which the parts (1, 2) are brought into contact with a non-reactive brazing composition (...
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WO/2011/113163 |
Sealing disks (44) for producing tear-open lids comprising lid rings having tear-open film sealed onto the lid rings are produced in that an annular sealing part made of steel (54) is fastened on a main plate (53) made of copper, for exa...
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WO/2011/116093 |
A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e...
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WO/2011/113832 |
A method (8) for brazing a surface (10) of a metallic substrate (12) having a generally passive metal oxide layer (18) including steps for activating said surface (10) of said metallic substrate (12) by machining said metallic substrate ...
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WO/2011/108460 |
Disclosed is a heat exchanger constituted of an aluminum alloy and obtained by brazing aluminum-alloy tubes and aluminum-alloy fins in combination, the tubes having, formed on the surface thereof, a brazing coating film which comprises 1...
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WO/2011/109567 |
The invention describes methods of welding onto laminated devices using a low temperature welding process. Also described are laminated devices with welds that do not disrupt a brazed core block of sheets in the laminated devices. Novel ...
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WO/2011/107692 |
The invention relates to a method for the braze-welding of two steel parts (1, 2), in which: a laser beam (3) and a metal filler wire (4) are moved continuously along the connecting line between the two parts (1, 2) in such a way that th...
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WO/2011/107194 |
The invention relates to a method for creating a laser weld joint between two components (10, 20), comprising the following steps: preparing a first component (10) which has a connecting surface (11) made of a first metal in the region o...
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WO/2011/105034 |
Disclosed is a soldering apparatus wherein, on the outer side of a jetting nozzle (303), which jets a molten solder pressure-fed from a solder bath (102) storing the molten solder, a solder drawing member (402) is removably attached, sai...
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WO/2011/104826 |
In the disclosed method for manufacturing a semiconductor module (100), a metal layer (20) and a cooler (30), which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin s...
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WO/2011/104229 |
The invention relates to a method for applying soft solder (4) to a mounting surface (10) of a component (11), wherein a) a connecting means (1) comprising a carrier layer (2) and a soft solder layer (4) formed by physical vapor depositi...
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WO/2011/105927 |
A method for manufacturing a plate heat exchanger consists in punching plates, in each of which at least one projection in the form of a hollow truncated cone is formed, cleaning the surfaces of the plates, forming a plate assembly by co...
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WO/2011/106421 |
A low melting temperature composite material including an alloy having about 0.1% by weight to about 99% by weight of tin and about 0.1% by weight to about 90% by weight of an element selected from the group consisting of silver and gold...
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WO/2011/098507 |
The invention relates to a method of manufacturing a hot-gas component (20) with cooling channels (25) and a hot gas component (20) manufactured by the said method. Pre-sintered preform materials are used for the manufacturing of a hot-g...
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WO/2011/091779 |
The invention relates to a method for bonding a titanium aluminide (TiAl) component to a dissimilar metal component, the two components being bonded by means of an intermediate part between the titanium aluminide component and the dissim...
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WO/2011/091779 |
The invention relates to a method for bonding a titanium aluminide (TiAl) component to a dissimilar metal component, the two components being bonded by means of an intermediate part between the titanium aluminide component and the dissim...
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WO/2011/081071 |
The disclosed cleaning method involves a cleaning step for cleaning an object to be cleaned, wherein said cleaning step involves: an immersion step (step 1) in which the object to be cleaned having deposited flux residues is immersed in ...
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WO/2011/080990 |
Provided are a solder paste and a flux capable of inhibiting heat slump in reflow soldering. The solder paste contains a solder powder and a flux which comprises a resin component, a solvent component, an activator, a thixotropic agent, ...
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WO/2011/076584 |
The present invention relates to a brazing method for a component (100) of an air-conditioning circuit comprising a fluid refrigerant receiver (200), said receiver containing a desiccator (210) for said fluid refrigerant. Said method inc...
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WO/2011/072976 |
The invention relates to the use of a solder connection as a planarization plane in a semiconductor chip. The invention describes a semiconductor chip and a method for producing a semiconductor chip, wherein a metallic planarization plan...
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WO/2011/071041 |
Disclosed is a reflow furnace wherein, in order to prevent a vaporized flux from being adhered and solidified on motor rotating shafts for rotating fans disposed in a preheating zone, a main heating zone, and a cooling zone, the vaporize...
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WO/2011/064239 |
The invention relates to a method (18) for quantitatively determining flux material residues remaining on a heat exchanger (3) after a preceding soldering process. To this end, a fluid is applied to the heat exchanger (3), wherein the re...
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WO/2011/064199 |
The invention relates to a soldered aluminum heat exchanger, having tubes made of a core material through which tubes a coolant flows, and said tubes being connected to at least one header by means of an inner soldered joint; having a pr...
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WO/2011/058062 |
The invention relates to a method of soldering a conducting body to a substrate using an alloy chosen from a tin-silver alloy and a tin-silver-copper alloy, characterized in that the method comprises the following steps: - metallization ...
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WO/2011/057851 |
The invention relates to a process for joining ceramic components (3). In the process according to the invention, the components (3) are soldered with the aid of a laser beam (1). Since the ceramic components (3) are soldered, the therma...
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WO/2011/057829 |
The invention relates to the improvement of the previous FIC cleaning process of oxidized cracks (5) by means of previous introduction of fluoride-containing material (16) into the crack (5).
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