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Patent Searching and Data


Matches 1 - 50 out of 30,899

Document Document Title
WO/2018/007520A1
Embodiments of the present disclosure relate to a use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint. The all...  
WO/2018/009180A1
In some examples, a method of forming a logo on a device includes forming, using a laser, a pattern on an outer surface of a housing of the device, and soldering a metal to the pattern formed using the laser, the soldered metal forming t...  
WO/2018/002165A1
The invention relates to a machining cutting tool (10) and a method for the production thereof, wherein a base body (12), preferably made of a tool steel, and which can be accommodated in a machine tool, is brought into a final shape via...  
WO/2017/221224A1
The disclosure relates to bonded assemblies (89) and a method of manufacture of such bonded assemblies (89). A such bonded assembly (89) has low residual stress and includes an inner body (91) having a substantially conical form, an oute...  
WO/2017/221218A1
Electronic device encapsulation process, assisted by a laser, for obtaining a sealed electronic device, wherein said process comprises: providing a first substrate and a second substrate, the second substrate being transparent in the emi...  
WO/2017/221674A1
A brazing sheet for flux-free brazing, which is characterized in that an outermost brazing material layer that is formed of an Al-Si system alloy containing 4-12% by mass of Si and an intermediate brazing material layer that is formed of...  
WO/2017/217076A1
The ceramic matrix composite material component (10) is equipped with a first base material (12) and a second base material (14) respectively formed of a ceramic matrix composite material including a silicide, silicon carbide layers (16)...  
WO/2017/213465A1
The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present in...  
WO/2017/213189A1
A solder joint body (1) has: a first to-be-joined material (M1) and a second to-be-joined material (M2); and a solder joining layer (S) which is disposed between the first and second to-be-joined materials and which joins the first and s...  
WO/2017/210628A1
The disclosed apparatus, systems and methods relate to the design principles for forming a welded joint between two sections of tubing or pipe. The material at the end portion of a first section of tubing to is folded inwardly to create ...  
WO/2017/207272A1
The invention relates to a production line for soldering components (1) onto a printed circuit board (2), comprising: a soldering furnace (3) with at least two temperature zones (Z1, Z2,..), in which there is a predetermined temperature ...  
WO/2017/208940A1
Provided are: a brazing sheet that can be used for both brazing performed using flux and brazing performed without using flux; a manufacturing method therefor; and a brazing method. The brazing sheet comprises: a core made of an aluminum...  
WO/2017/205343A1
An electrical connector assembly includes an electrical connector having a conductor receiving portion. The conductor receiving portion defines a cavity. The electrical connector assembly further includes a capsule positioned within the ...  
WO/2017/201814A1
Disclosed is a reflow soldering apparatus. The device comprises furnace bodies such as a first furnace body (11), a second furnace body (12) and a third furnace body (13), and a conveying system. A first temperature zone (111) is formed ...  
WO/2017/198476A1
The invention concerns a method and apparatus for manufacturing a brazed heat exchanger. The method comprises the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder mach...  
WO/2017/198599A1
The present invention relates to an electrical bypass device having two electrical conductors (1, 2) that are electrically insulated from one another and are arranged such that two surface regions of the two conductors (1, 2) are spaced ...  
WO/2017/198916A1
The invention concerns a method for producing a honeycomb structure, comprising the following steps: a) providing a plurality of metal sheets (126) each having, in a first direction, corrugations formed from a succession of crown areas (...  
WO/2017/195625A1
This semiconductor device (100) is provided with: a semiconductor element (1); a conductor pattern (2b) that is provided on an insulating substrate (2) and has a main surface to which the semiconductor element (1) is bonded; and a termin...  
WO/2017/192003A1
A solder ball, a manufacturing method therefor, and electronic parts comprising the same are disclosed in the present specification. More specifically, disclosed is a solder ball which is applicable in all technical fields which are base...  
WO/2017/188608A1
The present invention relates to a method for manufacturing an air conditioner including a heat exchanger having a plurality of tubes and one or more return bends for connecting the tubes, the method comprising: a cladding step of claddi...  
WO/2017/187378A1
An active soft solder for soldering of the non-metal materials with non-metal/metal materials consists of In in 1 to 10% of its mass, of Mg in 0,5 to 3% of its mass, whereby the rest is Zn. Preferable composition is of In in 4 to 6% of i...  
WO/2017/187378A4
An active soft solder for soldering of the non-metal materials with non-metal/metal materials consists of In in 1 to 10% of its mass, of Mg in 0,5 to 3% of its mass, whereby the rest is Zn. Preferable composition is of In in 4 to 6% of i...  
WO/2017/178181A1
The invention concerns a method for the manufacturing of a clad sheet product comprising a core layer(6)and at least one cladding layer, the method comprising rolling an assembly of a core layer and at least one cladding layer and reduci...  
WO/2017/179625A1
This aluminum alloy fin material comprises an aluminum alloy containing 1.50-5.00% by mass of Si with the remainder consisting of Al and inevitable impurities, is a single layer and has heat bonding capabilities. In a cross section along...  
WO/2017/178580A1
The invention relates to a device (2) for working a surface (4) of a workpiece (6) by means of a laser beam (8), comprising a laser system (12) for providing the laser beam (8) and a plasma nozzle (14), which is designed to produce an at...  
WO/2017/178182A1
The invention concerns a brazing sheet comprising a core layer (5) and a braze cladding, said core layer (5) being aluminium or an aluminium alloy, said braze cladding comprising (a) a flux composite layer(2), which flux composite layer ...  
WO/2017/179715A1
In the present invention a soldering area (30), an airtightness testing area (40), and a finishing area (50) are arranged in a row along a first side wall (21) of a single box (20), in the interior of the box (20), which is attached to t...  
WO/2017/168747A1
According to the present invention, a first pipe (1) has: a main pipe section (13); a fitting section (14) into which a second pipe (3) fits; and an enlarged diameter section (15) that has a larger internal cross-sectional area than the ...  
WO/2017/170113A1
A copper or copper alloy strip for a vapor chamber, the copper or copper alloy strip being characterized in that the maximum height roughness Rz of the surface is 1.5 µm or less, the arithmetic average roughness Ra is 0.15 µm or less, ...  
WO/2017/170930A1
The objective of the present invention is to facilitate maintenance work by translating an upper furnace body and a hood in an upward direction to form openings on both sides in a conveying direction. This conveying and heating device is...  
WO/2017/168082A1
The invention relates to a method of manufacturing a heat exchanger comprising a bundle of heat exchange channels in which a cooling fluid circulates, this exchanger being connected to at least one pipe, notably an aluminium pipe, design...  
WO/2017/169857A1
Scratches caused in a heat sink are decreased. In a semiconductor device (100), a first bonding region (142) on a rear surface of a heat sink (140) has a plurality of small recesses formed therein, the plurality of recesses being configu...  
WO/2017/170931A1
The present invention makes it possible to accurately inspect an object using an imaging signal. Provided is an imaging device having an imaging element, an imaging lens, and a blowing port for forming an air flow that traverses the fron...  
WO/2017/162481A1
The present invention relates to a diagnostic solder frame (1) for detecting contaminants in a solder bath (3) of a soldering installation, said diagnostic solder frame (1) being configured such that, by means of a transport system (6) o...  
WO/2017/160132A2
The present invention relates to a thin film material in which at least two kinds of metals are electroplated. In a first heating, melting occurs at a melting point (Tms) of a metal having a low melting point from among the metals, and a...  
WO/2017/159880A1
Provided is a plate laminate type heat exchanger which can easily be fixed temporarily prior to being assembled through brazing and which can reliably be manufactured with excellent accuracy. In the plate laminate type heat exchanger usi...  
WO/2017/154242A1
In this invention, a coil 16, having a shape surrounding a predetermined region R on a base board 7 on which mounting components CP have been mounted, is disposed above or below the base board 7. A ferrite material 41 is disposed so as t...  
WO/2017/154289A1
A semiconductor device of the present invention is provided with: a heat generating section including a semiconductor chip on which electrodes are formed; a pair of first member and a second member (19), which are disposed to sandwich th...  
WO/2017/144040A1
The apparatus according to the invention serves for the non-homogeneous cooling of a flat object having a first main surface and, opposite this, a second main surface. In this context, the flat object is selectively cooled from the direc...  
WO/2017/144544A1
Invention relates to method, an assembly and a controller for supplying an auxiliary material (5) for the purpose of automatically thermally connecting work pieces (17) to be thermally connected to one another, with the advantageous resu...  
WO/2017/141307A1
Provided are a twisted tube-type heat exchanger and a method for manufacturing a twisted tube-type heat exchanger, with which a large-diameter tube and a small-diameter tube can be bonded without the use of flux. The twisted tube-type he...  
WO/2017/143083A1
A programmable exothermic reaction controller includes input/output control circuitry for inputting and outputting information to/from the controller, processing circuitry including user programmable parameters, wherein the parameters ar...  
WO/2017/140009A1
A continuous vacuum nitrogen-protection brazing furnace having a low energy consumption and a good brazing effect, comprising a rack (1) and a chain-type circulating conveying device (2) arranged on the rack (1), wherein a workpiece load...  
WO/2017/136881A1
A method, apparatus and system for processing a composite waste source, such as e- waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. Th...  
WO/2017/136951A1
A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint assembly. The method comprising heating the solder in the assembly to a temperature near the solvus.  
WO/2017/138077A1
In a flux unit 30 for the present invention, a flux supply device 126 for discharging flux into a retention tray 122 has a discharge outlet 156 for discharging the flux and a discharge outlet moving device 148 for moving the discharge ou...  
WO/2017/134974A1
A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (1...  
WO/2017/129678A3
The invention relates to a device and a method which is carried out by means of the device, for the controlled cooling and heating of metallic workpieces I, II (8, 9) in the temperature field (14) during welding, thermal separating, sold...  
WO/2017/129486A1
The invention relates to a device for soldering components on printed circuit boards, comprising a soldering furnace (2) with at least two temperature zones (3, 4, 5), characterized in that in each of the at least two temperature zones (...  
WO/2017/122893A1
The present invention relates to a plate-type heat exchanger having a copper connector and, more specifically, to a plate-type heat exchanger having a copper connector and a method for manufacturing the same, the plate-type heat exchange...  

Matches 1 - 50 out of 30,899