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Patent Searching and Data


Matches 1 - 50 out of 30,224

Document Document Title
WO/2017/026286A1
In the present invention, a circuit pattern including electrodes 21 for mounting a mounting component CP is formed on a flexible substrate 7, a solder paste P is applied to the electrodes 21, and the mounting component CP is mounted on t...  
WO/2017/021595A1
The invention relates to a method which is intended for welding a first steel part (P1) including a peripheral edge (BP) defined by inner (FI) and outer (FE2) end surfaces (FE1) onto a portion (PS) of a second aluminium part (P2). Said m...  
WO/2017/022663A1
A wound multi-ply tube (10) comprises: a tube body (12) formed by winding into a roll-shape a metal plate (13) configured to include a core material layer (18) formed using a metal material, and a brazing material layer (20) formed using...  
WO/2017/021434A1
The present invention concerns a process for the manufacture of flux compositions, flux compositions obtainable by the process according to the invention, aluminum or aluminum alloy parts at least partially coated with the flux compositi...  
WO/2017/018030A1
Provided is a production method by which a strong fillet can be easily formed on both an outer surface and an inner surface of a hollow structure in an aluminum structure comprising the hollow structure and a tubular member. A clad sheet...  
WO/2017/018438A1
The present invention is provided with: a plurality of aluminum heat transfer pipes (11) through which a heat medium flows and which are disposed side by side; a plurality of aluminum connecting pipes (12, 13) through which the heat medi...  
WO/2017/018540A1
The invention addresses the problem of simply and precisely assembling a header plate (3) and a header body (4) and precisely joining the same with brazing for a heat exchanger header tank comprising a header plate (3) into which ends of...  
WO/2017/012156A1
A method for preparing a local soft solder coating on the surfaces of aluminum and an aluminum alloy in an atmospheric environment under the low-temperature condition. The method achieves preparation of a local soft solder coating on the...  
WO/2017/006531A1
Provided are a joining composition and a joining method using the joining composition in which a joining body having a dense joining layer and high joining strength can be obtained at a relatively low joining temperature without applied ...  
WO/2016/207851A1
A method for driving a first component (11) into a second component (12) by superimposing a mechanical wave of ultrasonic frequency (18) onto the movement (17) of at least one of the components (11, 12). The method comprises a step of ad...  
WO/2016/208581A1
Provided is a flux fluid with which it is possible to improve both the hydrophilicity of a heat exchanger obtained by bonding tubes to fins by brazing and the persistence of the hydrophilicity and to improve the brazeability. The flux fl...  
WO/2016/202463A1
The present invention relates to a hermetic package (40) suitable to be implanted in a body of an animal or a human patient. The housing (40) comprises a base part (50), a cover part (60) suitable to cover the base part (50), and a conne...  
WO/2016/194672A1
The present invention provides an aluminum alloy clad material characterized in being obtained by cladding a pure aluminum surface layer material, in which Mg is limited to less than 0.1% (mass%, same below), on one or both surfaces of a...  
WO/2016/194434A1
A bonding member (1) that is provided with a resin body (2) that has an airtight interior and with a bonding material (3) that is enclosed in the resin body (2). In a pre-heat-treatment state, the bonding material (3) is a mixed powder t...  
WO/2016/194435A1
According to the present invention, a heat-generating element (101), a porous metal body (102), and a metal composition (105) are prepared (preparation step). The heat-generating element (101) is, for example, a power semiconductor that ...  
WO/2016/189902A1
Provided are a soldering device and a flux applying device that use a nut which is configured such that the nut is attached to the soldering device and the flux applying device and a fixed position of the nut can be changed more easily t...  
WO/2016/190199A1
The objective of the present invention is to provide a method of manufacturing an aluminum structure including a hollow structure and a tubular member, with which it is possible for robust fillets to be formed easily on the outer surface...  
WO/2016/187010A1
A liner (92) for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate (94) having a length and a width defining an area. The substrate (94) has a thickness defined by first and second sides. An adh...  
WO/2016/185408A3
The present invention refers to a brazing filler, which fulfil the requirements for fusion nuclear reactors, that comprises a metal mixture consisting of copper powder mixed with titanium powder, or Cu-Ti alloyed powders, wherein the con...  
WO/2016/185407A3
The present invention refers to a brazing filler, which fulfil the requirements for fusion nuclear reactors, that comprises a metal mixture consisting of iron powder mixed with titanium powder, wherein the content of iron is between 80 a...  
WO/2016/186566A1
The present invention relates to an electrical heater assembly (1) for liquid propellant chemical rocket engines, and more particularly to such heater assembly comprising a heating cable (30) and a heater support (10), wherein the heater...  
WO/2016/186528A1
In a method for manufacturing knives for forage harvesters the edges of the extended steel part (1) are machined by performing insert seats (1a) therein for reinforcement. Around these insert seats (1 a) the edges of the extended steel p...  
WO/2016/185149A1
The method for welding with filler material described in the present application is intended to transfer a semi-conductor chip (1) onto a substrate (2). The method involves forming an assembly brick (1, 2, 3) comprising the substrate (2)...  
WO/2016/184639A1
The method functions for producing a shaft-hub connection of workpieces (10, 12) made from the same or different materials, wherein, by means of a suitable material (18) as an intermediate layer between the two workpieces (10, 12) to be ...  
WO/2016/185996A1
Provided are: a solder connection structure for improving the solder wettability; and a film forming method for forming a metal film on an aluminum base. This solder connection structure (50) is to be connected with another member throug...  
WO/2016/185959A1
[Problem] To provide a heat exchanger, and a manufacturing method therefor, that can effectively prevent the clogging of heat-medium communication holes by a solder, even if a solder flow occurs at the outer circumferential surface of a ...  
WO/2016/180505A1
The present invention relates to a joining component (10) having a shank (14) and a flange (16) which extends transversely with respect to the shank (14), wherein the flange (16) comprises a top surface (18) which faces away from the sha...  
WO/2016/177825A1
The invention relates to a method for producing a soldered connection between at least two components (10, 30), in which the components (10, 30) are heated to melt a solder in a solder region (24), wherein the solder region (24 and/or th...  
WO/2016/174584A1
A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt% of a mixture of metal particles comprising 30-70 wt% of a lead-free low melting point (LMP) particle composition compr...  
WO/2016/169551A1
The device according to the invention is used to cool a flat object (2) with a first main surface (200) and a second main surface (202) lying opposite the first main surface in a nonhomogeneous manner. The flat object is cooled from the ...  
WO/2016/171623A1
There is provided a method for soldering a first non-metallic component to one or more metallic or non-metallic component, the method comprising the step of removably securing the first non-metallic component to the one or more metallic ...  
WO/2016/169705A1
Joining device and joining method, wherein the joining device (1) is used for laser beam-based joining of at least two components (B1, B2) and comprises a first laser radiation source (10), a first radiation guide (11), which is connecte...  
WO/2016/172674A1
A method for producing an alloy self-brazing strip. In an aspect, a process is used to generate a multi-layer alloy strip made up of at least one base layer of with a least another layer of material, that when both the material and base ...  
WO/2016/163062A1
A composite material (10) has a first metal layer (21), a brazing material layer (14), a graphite layer (13), a brazing material layer (14), and a second metal layer (22). The composite material (10) has a graphite region (15) in which t...  
WO/2016/162168A1
A method of producing a heat exchanger, comprising: obtaining a titanium plate (201) that has been cladded with a melting depressant foil (208), and heat treated; pressing a pattern in the titanium plate (201); stacking the titanium plat...  
WO/2016/156492A1
The invention concerns a metal bead forming a junction between the ends of at least one hollow metal profile section, adhering permanently to the surfaces of the profile section and overlapping inside the hollow profile section over at l...  
WO/2016/157612A1
One purpose of the present invention is to provide: a joined component that suppresses spilling of a brazing material from the outer peripheral contour of a joint interface between a first member and a second member; and a method for man...  
WO/2016/156853A1
A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised gr...  
WO/2016/156299A1
The invention relates to a heating element (17) having a mounting side (31) for SMD mounting on a circuit carrier (11). Additionally, the invention relates to an electronic assembly having a printed circuit board (11) on which the heatin...  
WO/2016/153017A1
A soldering device (A) comprising a soldering tip (5) which is heatable and which has a substantially cylindrical shape extending vertically, and solder-piece supplying units (2, 6) that supply a solder piece (Wh) from above into the ins...  
WO/2016/150425A1
The invention relates to a method for joining workpieces (12, 13) using a laser beam (7), wherein the laser beam (7) is focused onto a focal plane downstream of the machining plane in the beam propagation direction and subdivided into a ...  
WO/2016/146560A1
As a result of the use of a soldering system based on nickel (Ni), manganese (Mn), chromium (Cr), aluminum (Al) and titanium (Ti), a fracture free alternative to the soldering of nickel or cobalt-based alloys is created.  
WO/2016/143771A1
Bottom surfaces of stepped portions of corrective rings arranged at ends (2) positioned at either side of a barrel (1), and back surfaces of projections of the ends (2) are brought into contact. A control unit (10A) provided to a pressur...  
WO/2016/142428A1
The invention relates to a method for producing a reflector element, in which a layer sequence is deposited, said layer sequence comprises at least one mirror layer (5, 9) and at least one reactive multi-layer system (3). The reactive mu...  
WO/2016/143631A1
Provided is a manufacturing method for a junction formed by joining a copper member (13B) comprising copper or a copper alloy, and an aluminum member (31) comprising an aluminum alloy having an Si concentration in a range of not lower th...  
WO/2016/139018A1
The invention relates to an electric contact element, in particular a switch spring, preferably a switch spring for a thermal temperature regulator or a thermal fuse. The contact element comprises a strip-shaped support (2), which is mad...  
WO/2016/139429A1
The invention especially relates to a brazing method (100) for assembling two elements, said method comprising the following steps: selecting (101) two brazing materials that can generate, when they are heated and melted, an intermetalli...  
WO/2016/135891A1
This soldering apparatus is provided with: a solder bath (12) for storing a molten solder; a jet nozzle (14) extending upward from the solder bath toward a holding surface (45); a pump (16) that pumps a molten solder (46) stored in the s...  
WO/2016/131811A1
The invention relates to a laser soldering device (LL) and to a method for controlling a laser soldering device (LL), wherein the laser soldering device has a laser source for outputting concentrated electromagnetic radiation to the sold...  
WO/2016/131702A1
The invention discloses a nickel based brazing filler metal in form of an alloy containing or consisting of between 20wt% and 35wt% chromium, between 7wt% and 15wt% iron and between 2.5wt% and 9wt% silicon, between 0wt% and 15wt% molybde...  

Matches 1 - 50 out of 30,224