| Document |
Document Title |
|
JP2011151140 |
To provide a solder powder adhering apparatus for making solder powder adhere to an electronic circuit board finely, and to provide a method of adhering the solder powder to the electronic circuit board.The solder powder adhering apparat...
|
|
JP2011151211 |
To provide a laser processing method, wherein processing accuracy in a resin layer laminated as an intermediate layer of a multilayer substrate is improved.A multilayer printed board 10 is configured, by laminating the resin layer 12 as ...
|
|
JP2011147982 |
To provide a solder material which is hardly melted by re-heating after soldering and has excellent mechanical properties and excellent corrosion resistance.The solder material contains: first solder powder containing, by mass, 7% to 9% ...
|
|
JP2011151220 |
To solve a problem wherein, for a liquid flux reduced in the amount of a VOC or not using the same, the conventional actual soldering achievement can not be applied to it, because it uses water difficult to evaporate relative to alcohol,...
|
|
JP2011151400 |
To suppress the breakage of a group III nitride semiconductor film when the group III nitride semiconductor film is peeled from a base substrate by laser irradiation.This leaser peeling device peels a GaN film 12 from a sapphire/GaN stru...
|
|
JP2011147966 |
To provide a laser beam machining apparatus and method, wherein an object to be machined is irradiated with a laser beam by turning on/off at high speed.The laser beam machining apparatus 1 includes: a light absorbing member 7 absorbable...
|
|
JP2011147941 |
To provide a cooling apparatus for brazing which prevents adverse thermal effect such as thermal strain, and is also applicable to brazing of piping of an air conditioner or the like and simplifies brazing work.A second and third clampin...
|
|
JP2011151358 |
To provide a method for manufacturing a non-plane element allowing a non-plane to be formed directly on a hard carrier.The method includes steps of: fitting a flexible element onto a carrier by means of hybridization columns, each column...
|
|
JP2011151374 |
To provide a solder ball weighing instrument which weighs and supplies a solder ball without surface oxidation and damage of the solder ball, and also to provide a solder ball arrangement device which reduces surface oxidation and damage...
|
|
JP2011146638 |
To provide a flow soldering nozzle, a soldering device, and a soldering method for suppressing variation in the discharge amount of molten solder.The flow soldering nozzle 2 jets molten solder 5, and includes a sidewall portion 2a, and a...
|
|
JP2011143422 |
To provide a soldering apparatus capable of enhancing maintainability, preventing occurrence of any defective soldering, and improving a product quality, and a method for manufacturing a lamp using the same.The soldering apparatus 11 for...
|
|
JP2011143456 |
To provide welding equipment, a tip tool guiding device, and a welding method, which can shift a welding wire in a suitable feeding position relative to a welding electrode and which are used in nuclear facilities.The welding equipment i...
|
|
JP2011143466 |
To provide a resistance seam welding method which can reliably eliminate twisting torque caused between a welding electrode wheel and a material to be welded in a curved welding zone with a comparatively simple structure and can prevent ...
|
|
JP2011143435 |
To provide a reflowing apparatus in which mist concentration of gas in a reflowing furnace is measured, and if the concentration becomes higher than a preset value, an alarm is generated and flux removal capability is enhanced.Gas in the...
|
|
JP2011144447 |
To provide an aluminum alloy brazing fin material for a heat exchanger which prevents the progress of cutting edge abrasion in various cutting processing and hardly forms such large burrs to lead to reduction in heat exchange efficiency,...
|
|
JP2011143445 |
To provide a flux for a lead-free solder containing Sn as a principal component, the flux suppressing the occurrence of any Sn whisker on a surface of a soldered part.The flux contains one or both of organic acid and amine compound as an...
|
|
JP2011140066 |
To solve conventional difficult problems of soldering or brazing of a fine wire with an insulation coating, wherein the difficulty lies in removing the insulation coating of the fine wire and in preventing fusion of the fine wire on slig...
|
|
JP2011140039 |
To provide a soldering apparatus which allows molten solder to stably flow out from a spout.A solder vessel 21 is formed inside a housing 2, and a spout 38 is opened in a lid 36 covering the solder vessel 21. The molten solder pressurize...
|
|
JP2011140040 |
To surely suppress the generation of erosion of a tube due to flowing of molten wax from a header plate to the tube without requiring special processing, additional processing, or the change of a brazing furnace, when the tube and the he...
|
|
JP2011140290 |
To provide a pipe for a fuel tank having a ring projection providing airtightness and welding strength, and a method for welding the same.In this pipe for the fuel tank including the ring projection in a flange, the ring projection has a...
|
|
JP2011140035 |
To provide a MIG welding method of an austenitic stainless steel tube including a clad steel tube.A clamping device 7 capable of fixing steel tubes 6 to be welded to each other, and aligning the steel tube, and having the back-shield gas...
|
|
JP2011140690 |
To provide an aluminum alloy flat tube obtained by bending and welding an aluminum alloy two layer clad material for a heat exchanger, which has excellent low cycle fatigue strength as well as high cycle fatigue strength and further has ...
|
|
JP2011142161 |
To perform soldering operation in the best state by suitably determining a melting state of solder.The present invention relates to a solder melting detection method for soldering by transferring a transfer portion 1 having a movable por...
|
|
JP2011137203 |
To provide a tube superior in corrosion resistance for a heat exchanger, which can prolong the corrosion-resistant life, and to provide the heat exchanger provided with the same.The aluminum alloy tube superior in corrosion resistance fo...
|
|
JP2011136365 |
To provide solder paste and flux suppressing slump-in-heat in a reflow soldering method.Solder paste contains solder powder and flux containing resin component, solvent component, activator, thixotropic agent and additive. The additive c...
|
|
JP2011136358 |
To provide a powder brazing filler metal composition which achieves brazing excellent in corrosion resistance, and to provide a tube having the powder brazing filler metal composition, and a heat exchanger.The powder brazing filler metal...
|
|
JP2011131229 |
To move a glass substrate in a state that the attitude of the glass substrate is held in a predetermined state by reducing the effect of the distortion of the glass substrate as far as possible.Both side ridges along the conveying direct...
|
|
JP2011132570 |
To provide a fin material for a heat exchanger which satisfies all of strength, corrosion resistance and thermal conductivity, and has excellent heat exchanging performance.An Al alloy fin material for a heat exchanger has a composition ...
|
|
JP2011131247 |
To ensure the excellent appearance of the composition for aqueous aluminum brazing after the brazing without impairing the solubility in water during the saponification.The composition for the aqueous aluminum brazing contains (A) water-...
|
|
JP2011131230 |
To obtain sufficient strength and improve workability when brazing an end of a stainless tube inserted into a connection hole in a connection structure where a metal tube is brazed into the connection hole formed at a metal plate to be c...
|
|
JP2011134894 |
To provide a solder reflow device suppressing generation of defects of products by avoiding voids, joint failures and appearance failures generated in the solder reflow step and achieving ideal reduction and cleaning of a soldered surfac...
|
|
JP2011129647 |
To provide a reworking device capable of reliably and efficiently performing an operation of removing a chip component from a substrate and an operation of mounting a chip component on the substrate.The reworking device includes a suppor...
|
|
JP2011129548 |
To process a relatively large size electronic circuit board using a compact fluxer 3 and a compact molten solder bath 5, while overcoming the problem of upsizing of a preheater 4 associated with an increased conveyance speed by an intern...
|
|
JP2011121111 |
To provide a reflow apparatus capable of reducing the supply amount of nitrogen gas while preventing the concentration of oxygen from increasing because the external air enters a furnace.Gas sucked from a gas suction part of a zone Z6 is...
|
|
JP2011121102 |
To provide a solder joining apparatus which continuously measures the concentration of a carboxylic acid-containing gas in a heating chamber during solder joining in real time, prevents a variation in solder joining, and thus enhances th...
|
|
JP2011121101 |
To provide a reflow furnace in which, in order to prevent a gasified flux from depositing and solidifying on a motor rotary shaft for rotating fans disposed in a preheating zone, a main heating zone, and a cooling zone, the gasified flux...
|
|
JP2011124457 |
To obtain superior solder bonding without causing variations, and to improve the throughput of solder bonding by uniformly cleaning an oxide film of a work and a foreign substance contamination, etc.A vaporizer for generating a carboxyli...
|
|
JP2011124323 |
To provide a light-emitting device that allows a light beam to be efficiently emitted from inside a sapphire layer.The light-emitting device is configured such that a light-emitting layer 3 is laminated on a sapphire layer 2. The sapphir...
|
|
JP2011121070 |
To improve productivity of a head gimbal assembly.In one embodiment of the invention, a nozzle 21 holds a solder ball 32 near the injection opening. The nozzle 21 has a hole near the solder ball holding part separately from the solder ba...
|
|
JP2011124453 |
To reduce mixing of oxide in molten solder jetted from a nozzle.A solder jet relaxation portion 1 has cages 2, 3 each having an opening atop and also having a plurality of holes bored in a bottom portion and a side portion, and molten so...
|
|
JP2011115814 |
To prevent breakage or embrittlement of a metal thin plate laminated member.The metal thin plate laminated member 20 formed of laminated metal thin plates is horizontally supported by an anvil 1, and the metal thin plate laminated member...
|
|
JP2011119466 |
To provide a heating condition determination method that allows efficient production by a reflow device configured to heat substrates of different kinds.The method for determining heating conditions of the reflow device used for a mounti...
|
|
JP2011119465 |
To provide a heating condition determination method for reflow device that can determine heating conditions of a multiple-carrying type reflow device configured to carry a plurality of substrates in parallel.The method for determining th...
|
|
JP2011115819 |
To improve the productivity of a head gimbal assembly.In one embodiment of the present invention, a soldering device 2 holds a solder ball at a suction port by sucking the solder ball 32 at the suction port 212 in a nozzle 21. An inert g...
|
|
JP2011115849 |
To provide a thin-walled bottomed metal cylindrical member which can prevent oxidation and rusting on an inner circumferential surface of the member, can prevent generation of cracking and fissuring in the wall-thickness direction of the...
|
|
JP2011117720 |
To provide a plate heat exchanger improved in mounting a connection conduit pipe by brazing.This invention relates to the plate heat exchanger, and a method of manufacturing the plate heat exchanger. The plate heat exchanger includes a n...
|
|
JP2011115831 |
To provide a joint welded by high energy density beam, which (i) obtains execution conditions of no tensile stress remaining in a weld zone and which (ii) has fatigue resistance for enduring vibration environment of gigacycle range for a...
|
|
JP2011119544 |
To prevent temperature interference between conveying paths in a reflow device having a plurality of conveying paths.A reflow furnace 2 includes a first carrying conveyer 3 and a second carrying conveyer 4 carrying a substrate W in a con...
|
|
JP2011119464 |
To provide a reflow device capable of manufacturing mounting substrates of different kind while suppressing increases in arrangement space and facility investment expenditure.This invention relates to the reflow device 10 that heats subs...
|
|
JP2011119338 |
To provide a method of joining a metal member and a joined metal member unit, wherein even when one metal member is joined to the other member, reliability of the joining is obtained for a long period.When a lid member 3 having two oppos...
|
