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WO/2002/096167 |
The aim of the invention is to drill microholes in a multilayer substrate having a first and at least one second metal layer (11, 12) and having a dielectric layer (13) arranged between each two metal layers. To this end, a solid-state l...
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WO/2002/092272 |
Catalytic converter (2) includes a catalyst container (10) formed from a tubular blank (10') and having a catalyst carrier, and a flange member (11) joined to the hollow member. The tubular blank (10') is subjected to a spinning operatio...
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WO/2002/090032 |
The invention refers to a method of brazing together thin heat exchanging plates of an iron based base material provided with port holes and a pressing pattern of elevations and depressions over the heat exchanging area of the plates and...
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WO/2002/088615 |
The invention refers to a lining device (15) for a plate heat exchanger, a plate heat exchanger, and a method for manufacturing a plate heat exchanger with a package of heat transfer plates and an end plate (5), which has at least one po...
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WO/2002/087814 |
A process of making a shaped product consisting of aluminium or an aluminium alloy comprising the steps of producing an intermediate object by extrusion or rolling and having at least one flat surface, coating the at least one flat surfa...
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WO/2002/085606 |
The invention relates to a connecting element for welding onto a circular front face of a pipe, said element having an annular region, (friction region), that can be friction welded to said front face. The connecting element can be welde...
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WO/2002/087297 |
An electronic apparatus provided by a quite novel solder connection, specifically, a flip chip connection implemented on a high-temperature side in a temperature hierarchy connection, in place of a high-lead solder containing much lead. ...
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WO/2002/083350 |
The invention relates to a device for applying solder globules to a substrate (7, 9) and for remelting the solder globules onto soldering points (6) of the substrate (7, 9). Said device has a capillary (3) for guiding the solder globule ...
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WO/2002/078895 |
A precision, laser-based high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorph...
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WO/2002/078896 |
A method and system for locally processing a predetermined microstructure (10) formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate (13) or other structures formed on the su...
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WO/2002/078044 |
A plasma generator generates positive ions and negative ions in a plasma. An ion extracting portion (4, 5) selectively extracts the generated positive ions and negative ions from the plasma, and accelerates the extracted ions in a predet...
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WO/2002/076666 |
A substrate (16) is machined to form, for example, a via. The substrate is in a chamber (15) within which the gaseous environment is controlled. The machining laser beam (13) is delivered with control of parameters such as pulsing parame...
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WO/2002/073322 |
A quasi-CW diode- or lamp-pumped, A-O Q-switched solid-state UV laser system (10) synchronizes timing of the quasi-CW pumping with movement of the positioning system (36) to reduce pumping while the positioning system (36) is moving from...
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WO/2002/074028 |
Temperature-sensitive electrical and electronic components (4, 5), which are connected, during mounting, to a printed circuit board (1) by means of soldering, have to be protected from heat during soldering in order to prevent permanent ...
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WO/2002/068145 |
A controlled attenuation bonding tool for bonding a fine wire to a substrate. In one embodiment, the bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a ...
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WO/2002/067180 |
Laser beam positioners (Figure 12, 340, 236, 260, 262, 302, 304, 310, 312, 316, 318, 320, 322, 324, 326, 328, 330, 336, 342) employ a steering mirror that performs small-angle deflection of a laser beam to compensate for cross-axis setti...
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WO/2002/061361 |
A heat exchanger capable of performing a heat exchange for a medium with a heat conducting to tubes (210) and fins (220), comprising the tubes, fins, tanks (300), and a connector (400) assembled with each other and heated in a furnace to...
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WO/2002/060633 |
A uniform laser spot, such as from an imaged shaped Gaussian output (118) or a clipped Gaussian spot, that is less than 20 @m in diameter can be employed for both thin and thick film resistor trimming to substantially reduce microcrackin...
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WO/2002/047863 |
A semiconductor is cut by directing a green laser beam of high power, and subsequently a UV beam along the cut line. The first beam performs cutting with relatively rough edges and a high material removal rate, and the second beam comple...
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WO/2002/045143 |
The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including th...
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WO/2002/040210 |
This invention relates to a method of making a composite aluminium brazing sheet, which method comprises: providing a core sheet of a first Al alloy and a cladding sheet of a second Al alloy, wherein a) the composition of the first Al al...
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WO/2002/038327 |
An iron based brazing material for joining of objects by brazing represents an alloy, which apart from iron contains maximum 40 % Cr, maximum 16 % Mn, maximum 40 % Ni and maximum 7 % Mo, all stated in weight percent and 6-40 % Si, which ...
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WO/2002/036848 |
A tantalum or tungsten target-copper alloy backing plate assembly which comprises a tantalum or tungsten target and a copper alloy backing plate that are diffusion-joined via an aluminium- or aluminium alloy-sheet insert material at leas...
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WO/2002/034454 |
A method for laser machining parts from a strip (22) includes providing a strip of material from which parts are to be made, feeding the strip (22)into a laser station (40) having first and second lasers, and positioning the first laser ...
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WO/2002/034455 |
A UV laser beam is used to machine semiconductor. The beam intensity (I¿B?) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing I¿B?. An elongate...
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WO/2002/030636 |
A process for forming a through or non-through hole in a desired position in a board material, comprising the steps of setting a drilling target position for each hole and also setting a plurality of auxiliary drilling positions around t...
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WO/2002/028584 |
A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components...
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WO/2002/028583 |
A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components...
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WO/2002/030167 |
A curable composition which comprises an insulating resin such as an alicyclic olefin polymer or aromatic polyether polymer, a nitrogenous hardener such as 1,3-diallyl-5-glycidyl isocyanurate, and an ultraviolet absorber such as 2-[2-hyd...
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WO/2002/025189 |
A heat exchanger (7) and a method of manufacturing the heat exchanger; the heat exchanger used in a refrigerant circulating compression refrigeration cycle (1) and exchanging heat between the high and low pressure sides of the refrigeran...
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WO/2002/022299 |
Methods for the manufacture of assemblies which included brazed components and in which nickel/chromium-based filler metals are used wherein the manufactured assemblies are characterized by low leaching rates of nickel in water and water...
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WO/2002/007965 |
The present invention relates to the stainless steel honeycomb building interior and exterior finish which can be used semipermanently and, in particular, to the stainless steel honeycomb panel made using stainless steel which is excelle...
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WO/2002/007927 |
A method of cutting thin bodies of silicon so as to minimize edge damage comprises traversing said bodies with the beam of a pulsed laser in a vacuum or in the presence of forming gas or a noble gas.
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WO/2002/005352 |
A photovoltaic cell comprising a supporting substrate, a front contact layer on the substrate, a layer or layers of semiconductor material and a back contact layer comprising a metal, the back contact having areas without metal thereby p...
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WO/2002/005345 |
A Q-switched, diode-pumped, solid-state (DPSS) laser (54) employs harmonic generation through nonlinear crystals (72) to generate UV light (74) for both link processing and target alignment. The type and geometry of the nonlinear crystal...
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WO/2002/001579 |
A covered conductor, comprising an insulation film capable of increasing the absorptance of laser beam and a fusing layer formed transparent to the laser beam, whereby, in a soldering with laser beam, the absorptance of the laser beam to...
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WO/2002/000441 |
A singulated article, such as a packaged semiconductor device is marked with a green laser, thereby broadening the scope of materials that can be marked vis-à-vis conventional infrared lasers.
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WO/2001/091962 |
The invention relates to a composite tool comprised of a metallic supporting part and of at least one working part of the like with different material compositions. Said parts are metallically joined to one another. The inventive composi...
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WO/2001/089753 |
An apparatus for dispensing solder accurately onto a prescribed surface of a substrate including a feeding mechanism for dispensing the solid solder and a dispensing piece with a feeding channel. The positioning device has a front openin...
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WO/2001/087529 |
The invention relates to a method for producing a structural member from plates (9, 10) stacked on top of each other, soldered together and provided with at least partial recesses (11, 12). At least one solder layer is provided between s...
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WO/2001/087534 |
A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a lase...
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WO/2001/085382 |
With a view to making it unnecessary to employ a filler material lowering the conductivity and keeping satisfactory conductivity, strength and corrosion-resistance after the jointing, an aluminum alloy member of a conductivity of 55 % or...
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WO/2001/085377 |
A production method of radiators capable of joining corrugated fins to a base plate at low costs and preventing the heat distortion of corrugated fins by low-temperature soldering. A first soldering is conducted by a first soldering allo...
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WO/2001/083152 |
A bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section (302) having a first diameter; a second cylindrical section (312) coupled to an end of the first cylindrical section, the secon...
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WO/2001/078473 |
A copper-clad laminated sheet hole-drilled by laser and using electrolytic copper foil, the rough surface of the copper foil being used as a laser entry surface. A copper-clad laminated sheet, easy to hole-drill by laser and suitable for...
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WO/2001/075966 |
The invention relates to an object (1) that is cut by means of a laser and a water beam and to further processing of the cut material. The object is glued on a carrier (3) that is provided with an adhesive and can be transparent for the ...
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WO/2001/066300 |
The aim of the invention is to solder metal foils (2, 3) by means of a soldering material. The inventive foils are disposed in layers and/or are wound in layers to form a honeycomb body (1). The aluminium content of said foils amounts to...
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WO/2001/064385 |
The invention relates to a method for producing a surface-alloyed cylindrical, partially cylindrical or hollow cylindrical component. A locally defined melting bath having a warming-up and a melting-on front (20), a dissolving zone (21) ...
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WO/2001/064386 |
Process for welding duplex steel in the presence of a shielding gas without use being made of welding aids and with nitrogen being added to the shielding gas and with an austenitic-ferritic duplex steel with a chromium content of between...
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WO/2001/065011 |
A method and system for automatically filling the narrow gap between facing end walls of adjacent first and second railway rails (12) by depositing vertically spaced layers of molten metal in the gap (g) with an electric arc welding torc...
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