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Patent Searching and Data


Matches 601 - 650 out of 61,639

Document Document Title
WO/2019/011419A1
The invention relates to a polariser arrangement (1) for polarisation of a laser beam (2), comprising: a plurality of plate-shaped optical elements (5, 16) which are arranged in the beam path of the laser beam (2) and which each have a b...  
WO/2019/011132A1
A micro-region semi-solid additive manufacturing method. A rod-shaped material is used as a consumable material; heating modes such as high energy beams, electric arcs and resistance heat are used to act on the front end of the consumabl...  
WO/2019/011480A1
The invention relates to a method for laser welding at a low pressure of between 0,1 and 500 mbar in a welding chamber, wherein a gas mixture of at least two different gases is used as the process gas and the process gas is guided from t...  
WO/2019/013591A1
A battery module with improved weldability between electrode leads and/or between the electrode leads and bus bars is disclosed. The battery module according to the present invention comprises: a cell assembly having a plurality of secon...  
WO/2019/008810A1
An adhesive sheet 1 for stealth dicing which is at least used in the cutting and separation of a semiconductor wafer having a modified layer formed in the interior thereof into individual chips in a room-temperature environment, wherein ...  
WO/2019/007488A1
The invention relates to a method of forming a surface texture on a process chamber component for use in a substrate processing chamber, the process chamber component having at least one component surface, the method comprising the step ...  
WO/2019/008807A1
An adhesive sheet 1 for stealth dicing which is at least used in the cutting and separation of a semiconductor wafer having a modified layer formed in the interior thereof into individual chips in an environment of -20℃ to 10℃, where...  
WO/2019/009293A1
According to the present invention, a temperature sensor (1) is provided with: an element (2) that comprises a resistor (21), which has a resistance that changes in accordance with the temperature thereof, and a lead wire (22); a signal ...  
WO/2019/008031A1
The invention relates to a method of forming a surface texture on a process chamber component in the form of an annular shield element for use in a substrate processing chamber which is designed for manufacturing wafers, chips or dies, t...  
WO/2019/009005A1
Provided is a technique that enables a secondary battery to have a desired size. A secondary battery (10) according to one embodiment of the present disclosure is provided with: a base material (11); a charge layer (14) which is formed o...  
WO/2019/007449A1
The invention relates to a method for generating a structured surface on a substrate, in which surface structures with dimensions in the sub-micrometre range are generated by means of treatment with an intensive pulsed laser beam, wherei...  
WO/2019/008535A1
The present invention concerns an apparatus 1 for the removal of protective films 10 wrapped around a load C comprising a movement member 3 and a cutting head 4, the movement member 3 being intended to move the cutting head 4 towards the...  
WO/2019/009123A1
This substrate treatment method has: a support substrate bonding step for bonding a support substrate to a first primary surface on the side where a device layer of the substrate is formed; a dicing step for performing stealth dicing on ...  
WO/2019/003381A1
[Problem] To provide a machining method in which a laser blanking device having exceptional productivity is used, the method enabling high-precision machining even of complex shapes. [Solution] The present invention is a machining method...  
WO/2019/003557A1
A three-dimensional laser processing machine is provided with: a processing head (203); a controller for performing positioning of the processing head (203) and controlling orientation of a nozzle (203N); and a sensor for detecting the d...  
WO/2019/002563A2
Provided are a jet device and systems and methods using the jet device for manufacturing objects by additive manufacturing, especially titanium and titanium alloy objects, wherein the jet device directs a cooling gas across a liquid molt...  
WO/2019/000026A1
A method of joining and sealing a vanadium based membrane to a metallic connection section comprising: mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed ...  
WO/2019/002301A1
The present application relates to a method for structuring a substrate (11) and comprising the following steps: providing a device (2) comprising a light source (21), an optical system (3) for obtaining an outgoing light beam (7) spatia...  
WO/2019/005530A2
A laser processing system can include a laser source configured to generate a beam of laser pulses at an average power of greater than 10 W and a turn mirror disposed in a path of the beam. The turn mirror can include a mirror configured...  
WO/2019/000523A1
A method and a device for rapidly forming a component using arc fused deposition and laser impact forging, comprising: 1) dividing a preformed component model into one or multiple basic formation units by using a simulation system and de...  
WO/2019/003513A1
This laser machining system is provided with: a robot that has a laser cutting head having multiple degrees of motional freedom at least on a two-dimensional plane; and a laser oscillation device that guides a laser beam to the laser cut...  
WO/2019/002847A1
A method of removing a coating (101) is provided, the method comprising at least one pulse of radiation (105) to a coating (101) on a substrate (103), wherein the coating (101) has an absorption coefficient of between 250 and 5,000,000 m...  
WO/2019/005989A1
A preparation method for adhesive bonding of magnesium-containing aluminum alloy products includes a magnesium-containing aluminum alloy product including a matrix and a surface oxide layer overlying the matrix. The magnesium-containing ...  
WO/2019/003596A1
Provided is a laser beam machine whereby durability against laser beam irradiation can be improved. A workpiece transfer device, which carries a workpiece to the inside/outside of a workpiece machining chamber has a turntable device, and...  
WO/2019/000322A1
A method and an apparatus (20) for cutting a battery plate (23) are provided, the method comprising: determining a current cutting region of the battery plate (23); and adjusting cutting parameters of a laser generator (21) according to ...  
WO/2019/004719A1
The present invention relates to a method for welding an electrode tab and a cable-type secondary battery comprising an electrode manufactured thereby, the method preparing an electrode stacked body in which an insulating layer, a curren...  
WO/2019/002325A1
The invention relates to a measurement system (40) for producing a three-dimensional object (2) by selective, layered solidifying of a structural material (15). The device (1) contains an exposure device (18) for selective exposure of a ...  
WO/2019/003470A1
Provided is a laser machining device (1) wherein operability at the time of outputting machining laser light (L) after performing alignment using guide light is improved. An operation switch (35) that performs selective switching of the ...  
WO/2019/005033A1
An imaging device includes a light source configured to produce a beam and at least one beam director including at least one encoded image. The beam is incident upon a surface of the at least one beam director, and the beam is redirected...  
WO/2019/001630A2
The invention relates to a method and a treatment device for hardening at least one portion of a recess wall (6) in a workpiece (5), using a laser beam (1). According to the method, a divergent laser beam (2), the beam axis (8) of which ...  
WO/2019/001861A1
A cutting insert (1) for a cutting tool, having a cutting edge (7) of PCBN or PCD formed in a corner region of the cutting insert in a transition between a side surface (6) and a chamfer (4) formed in an upper side (2) of the cutting ins...  
WO/2019/001847A1
The invention relates to a laser beam cutting system (10). The laser beam cutting system (10) comprises a first focusing optics (16) which is adapted to focus the laser beam on points on a first spatial curve (26a) and a second focusing ...  
WO/2019/002283A1
The invention relates to a welding head (1) for a device (10) for laser deposition welding comprising a housing (2), an optical system (3) which is held in this housing (2) by means of an optical mount (31) and is composed of one or more...  
WO/2019/002018A1
The invention relates to a component (6) which is formed with a plurality of layers (1.1,..., 1.5) arranged one over the other. Material should be removed by means of a laser beam in order to form a recess on the surface of the component...  
WO/2018/234192A1
The invention relates to a device (1) for processing a surface (21) of a workpiece (2) having a plasma generating apparatus (4) and a laser beam generating apparatus (3), which are designed to apply laser radiation (35) and plasma (45) t...  
WO/2018/234541A1
A portable laser device has a laser head for emission of a pulsed laser beam having a wavelength between 400 nm and 3 µm and a pulse duration between 10 ns and 1600 ns.  
WO/2018/233842A1
A method comprises : providing a first stream of discrete volumes (908b) of material, and directing a pulsed laser beam (912) at a first discrete volume (908b) of material in the first stream of discrete volumes of material so as to inte...  
WO/2018/235753A1
A method for manufacturing a different material bonded member comprises: a step of striking a shaft portion of a steel rivet into a light alloy material provided with a solid resin layer on at least one surface thereof; a step of causing...  
WO/2018/235350A1
The purpose of the present invention is to provide a micro-hole array manufacturing method such that through holes with high precision in shape can be formed. The invention provides a micro-hole array manufacturing method for forming a p...  
WO/2018/233585A1
A laser encapsulation device and an encapsulation method. The laser encapsulation device irradiates a laser beam onto an encapsulation substrate to form a light spot. The light spot comprises a first section (B) close to the edge of the ...  
WO/2018/234312A1
The invention relates to an assembly for calibrating a head system of a power radiation source of an additive manufacturing device, comprising: - a calibration plate that has a plurality of reference markings, and - a firing support made...  
WO/2018/234457A1
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separ...  
WO/2018/234336A1
The invention relates to an assembly for calibrating a head system of a power radiation source of an additive manufacturing device, comprising: - a calibration plate that has a plurality of reference markings, and - a firing support made...  
WO/2018/188688A3
The invention relates to a method for producing an axle housing of a vehicle axle, by means of integrally connecting an axle tube (1) to an axle shaft (2) which is positioned on the longitudinal axis (L) of the axle tube, is equipped wit...  
WO/2018/234500A1
The invention relates to a device (200) for distance measurement for a laser processing system (100), comprising a collimator optics configured to collimate an optical measuring beam, a deflecting optics (220) which defines an optical ax...  
WO/2018/235509A1
A profile selector (31) comprises at least one beam forming lens for converting a beam profile by diffracting laser light that is input, and emits laser light having a beam profile selected from a plurality of beam profiles. A collimatin...  
WO/2018/235843A1
A semiconductor device manufacturing method comprises: a step of preparing a semiconductor wafer source including a first major surface on one side, a second major surface on another side, and a side wall connecting the first major surfa...  
WO/2018/233853A1
An apparatus (1) for making perforations in a packaging material is provided. In an aspect, the apparatus comprises a micro-perforator (7), a bag sealer (11), a cutter (12), and a conveyor (3,4,5,6) for transporting a web (2) of tubular ...  
WO/2018/234970A1
The present disclosure relates to a system of modular functional blocks that may be used to facilitate easy assembly of a welding head assembly in any one of a wide variety of configurations to allow for distribution of welding wire, gas...  
WO/2018/228919A1
The invention relates to a device and a method for layer-by-layer, additive, three-dimensional material build-up for the production of components (4) made of metal, plastic and/or mixed forms by means of a printhead (2), wherein differen...  

Matches 601 - 650 out of 61,639