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WO/2010/084339 |
A method of drilling holes through a solid material in such manner as to give holes in a first area a first profile and distribution and holes in a second area a second profile and distribution comprising the steps of: - defining a first...
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WO/2010/083867 |
The present invention is related to a method for irradiating semiconductor material comprising: irradiating a region of a semiconductor material layer surface with a first laser having laser irradiation parameters to melt at least a part...
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WO/2010/082267 |
Provided is a sapphire substrate mainly for epitaxial growth of a nitride semiconductor layer, wherein the shape and/or the amount of deflection of the substrate can be efficiently and accurately controlled; and the deflection of the sub...
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WO/2010/081734 |
The invention relates to a stamped sheet metal for stamping one- or multi-layered materials, such as labels, envelopes or stickers, comprising a stamping body (1) having at least one stamping edge (2, 7), wherein the stamped sheet metal ...
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WO/2010/082644 |
Performing scribing accurately with a high yield rate. A scribing apparatus (1), including a conveyance means (10) for conveying a web of strip-like continuous flexible substrate (B) on which a target scribing film (M) is formed by apply...
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WO/2010/081533 |
The invention relates to a method for simultaneously microstructuring and passivating siliceous solid bodies by means of a fluid jet-guided laser process. Local heating of the solid body surface occurs due to the laser, while a precursor...
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WO/2010/083091 |
A laser processing system provides a burst of ultrafast laser pulses having a selectively shaped burst envelope. A burst pulse laser includes a high repetition rate ultrafast laser to deliver a pulse train with each pulse in the train ha...
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WO/2010/083091 |
A laser processing system provides a burst of ultrafast laser pulses having a selectively shaped burst envelope. A burst pulse laser includes a high repetition rate ultrafast laser to deliver a pulse train with each pulse in the train ha...
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WO/2010/082081 |
A method and system to start and use a combination wire feed and energy source system for any of brazing, cladding, building up, filling, and hard-facing overlaying applications. High intensity energy is applied onto a workpiece (115) to...
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WO/2010/082862 |
The invention is directed to changing the initial properties of materials by artificially producing three-dimensional structures on the surface thereof by means of exposure to a single laser beam, said three-dimensional structures having...
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WO/2010/080233 |
A device for maintaining a cutting edge, e.g. a focused laser beam (120) at a constant distance from a surface (66) of the work piece (59) as the cutting edge imposes a cut line in a coating (32) on the surface of the work piece (59). Th...
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WO/2010/079092 |
The invention relates to a device for projecting an image on a surface, comprising: a light source generating a light beam; a mask arranged in the path of the light beam; a lens arranged behind the mask to focus the image of the mask on ...
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WO/2010/079659 |
A cylindrical glass (4) diverges a laser beam L1 in Y-direction (namely in the Y-Z plane) and does not diverge or converge the beam in X-direction (namely in the Z-X plane). An object glass (5) then converges the beam (L1) in Y-direction...
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WO/2010/078611 |
The invention relates to a printed circuit board element (1), in particular a multilayer printed circuit board element, comprising a plurality of dielectric layers (5, 6, 7) and conductor layers (8, 9, 10, 11), and comprising a dedicated...
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WO/2010/079295 |
The invention relates to a power storage device (1), particularly for fitting on an automobile, comprising at least two power storage cells (2), each cell comprising at least one electrical connection terminal (8; 11), characterized in t...
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WO/2010/079658 |
A cylindrical glass (4) diverges a laser beam L1 in Y-direction (namely in the Y-Z plane) and does not diverge or converge the beam in X-direction (namely in the Z-X plane). An object glass (5) then converges the beam (L1) in Y-direction...
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WO/2010/079295 |
The invention relates to a power storage device (1), particularly for fitting on an automobile, comprising at least two power storage cells (2), each cell comprising at least one electrical connection terminal (8; 11), characterized in t...
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WO/2010/078120 |
A magnetically levitated monolithic stage positioning system includes linear three phase motors and coil windings connected to the monolithic stage that interact with a ferromagnetic base. The linear three phase motors may be excited to ...
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WO/2010/077506 |
A method of accomplishing high-throughput laser processing of workpiece features (18) arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loa...
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WO/2010/077506 |
A method of accomplishing high-throughput laser processing of workpiece features (18) arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loa...
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WO/2010/078120 |
A magnetically levitated monolithic stage positioning system includes linear three phase motors and coil windings connected to the monolithic stage that interact with a ferromagnetic base. The linear three phase motors may be excited to ...
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WO/2010/076547 |
A method for the formation of grooves (74, 85) in the surface of a polymer layer substrate (36, 46, 51, 65, 73, 83) by a direct write laser vaporization process, the polymer being selected, or modified by the addition of organic or inorg...
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WO/2010/077845 |
A laser machining process is described for laser 72 machining glass or glass-like materials 62. This process machines articles 60 with chamfered edges 96 in one manufacturing operation. Chamfered edges 96 are desirable in glass and glass...
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WO/2010/078058 |
A method of forming a pattern (700) on a work piece (1260) includes placing a pattern mask (1210) over the work piece, placing an aperture (100, 500, 600, 1220) over the pattern mask, and placing the work piece in a beam of electromagnet...
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WO/2010/073465 |
A pulsed laser machining apparatus capable of micromachining of surfaces of a large-sized work with stableness and high speed comprises a base clock oscillator for generating a clock signal, a laser oscillator for emitting a pulsed laser...
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WO/2010/073388 |
A laser ablation-in-liquid system, which irradiates laser light to a dispersion liquid in which solid materials are dispersed so that the solid materials are subdivided in the liquid, is provided with a light source that oscillates the l...
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WO/2010/073640 |
The issue is to control the adhesion of dross and the occurrence of cracking and chipping of ceramic substrates when cleaving a sealed substrate containing a ceramic substrate or metal substrate with a laser. Disclosed is a cleaving meth...
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WO/2010/072825 |
The invention relates to a hood for sucking up fine particles, comprising: an air intake mouth (30) comprising a crest (3b) intended to be placed close to a wall (2) or to emit fine particles, the crest (3b) defining an internal portion ...
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WO/2010/074091 |
A method of cutting a brittle-material plate is provided by which the brittle-material plate can be cut into a desired planar shape through automatic machine production without complicating the device. Also provided are a window glass f...
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WO/2010/072720 |
The invention relates to a hood for sucking-up fine particles, including: a mouth (3b) intended to be placed close to a wall (2), a base (3a) having a window (3) through which a laser beam (6) can pass, an intermediate portion (5a) betwe...
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WO/2010/071128 |
Provided is a splitting apparatus for a brittle material wherein a highly versatile CO2 laser source is used as a laser source, a cleavage rate is widely increased, and full body cleavage in a straight line is possible so that a cleavage...
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WO/2010/069643 |
The invention relates to a welding unit (1), having an energy source (4), in particular a laser beam source, for implementing a heat input for welding a first component (2) to at least one second component (3) in a connection area (5) an...
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WO/2010/071201 |
A film (3) formed on a substrate (2) is irradiated with a first light beam to divide the film (3) into multiple regions. A repair (RP1) is performed by removing the film (3) at defective removal places (DP) where the film (3) remains bet...
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WO/2010/071729 |
A method of manufacturing a battery is provided. A cathode assembly is provided, including a cathode and a cathode tab. The cathode tab is welded to a positive terminal of the battery. The areas to be welded are cleaned prior to welding ...
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WO/2010/070107 |
The invention relates to a method of ablating a surface layer (2) of a wall (P) by sweeping the said layer (2), comprising: a step (Ecom) of directional control by an optical deflector (5) of a plurality of pulsed laser beams (7); a step...
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WO/2010/071109 |
A welding apparatus has a work table (18) for supporting a first blank (B1), a second blank (B2) and a third blank (B3), a first positioning station (2) for positioning the first (B1) and the second (B2) blanks on the work table, a weldi...
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WO/2010/070940 |
Disclosed is an apparatus comprising: feed means that feeds a workpiece in a first direction with a fixed speed, holding the workpiece with the surface to be processed upwards; a laser oscillator that emits a pulsed laser beam; splitting...
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WO/2010/070548 |
A method of repairing a metallic artefact (40) with an open defect in or on a metallic surface or substrate of the metallic artefact includes cold forging the open defect to close the open defect and thereafter laser cladding the cold fo...
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WO/2010/068804 |
A method of manufacturing a medical device, the method comprising: providing a first elongate metallic member comprising stainless steel and having a first welding surface; providing a second elongate metallic member comprising nickel-ti...
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WO/2010/068410 |
A groove pattern is scribed into a silicon-nitride layer on a silicon wafer (12) using four independently scanned, focused beams (44 A-D) of laser radiation. Each focused beam (44A, 44B, 44C, 44D) is scannable within one of four scan- fi...
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WO/2010/067042 |
The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the subs...
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WO/2010/066974 |
Method of assembling two sheets (10, 11) by laser welding, in which the two sheets (10, 11) are placed resting against one another along a line (12) to form a dihedral angle in the region (13) that is intended to be laser welded. A clamp...
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WO/2010/063560 |
The invention relates to a method for producing tailor-made sheet strips (12), in particular steel strips, in which at least two sheet strips (1, 2) of different material quality and/or sheet thickness are continuously welded to each oth...
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WO/2010/063828 |
A diffractive optical element (DOE) is included in an apparatus for combining a plurality of laser beams. The DOE combines the plurality of laser beams to generate a plurality of spatially distributed laser beams. The DOE is one of movab...
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WO/2010/063132 |
When severing pipe sections (5) from a pipe (4) that is continuously produced, a closed separating line (16) is formed around the section axis (15) along the pipe circumference, said axis being disposed by a section length from the free ...
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WO/2010/065498 |
System and method of photoaltering a material. The system includes a laser source operable to produce a primary pulsed beam, a holographic optical element configured to receive the primary pulsed beam and transmit a plurality of secondar...
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WO/2010/064997 |
A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a f...
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WO/2010/065498 |
The present application relates to systems (10) and method of photoaltering a material. The system (10) includes a laser source (14) operable to produce a primary pulsed beam (18), a holographic optical element (32) configured to receive...
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WO/2010/063350 |
In a method according to the invention for the laser machining, in particular laser welding, of a workpiece (4) by means of a laser tool (2), which is arranged on a multiaxis hand (7) of a manipulator, in particular a robot (1), wherein ...
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WO/2010/063161 |
A cutter wheel for cutting fragile material and manufacturing method thereof, the cutter wheel includes a V-shape cutting blade part (1), a disc (2) and a centric shaft hole (3). The cutting blades (4) and the depressed structures (5) ar...
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