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Matches 351 - 400 out of 61,154

Document Document Title
WO/2019/041638A1
A solder ball laser welding method, comprising: moving a laser beam of a first power density along a welding track (20) to irradiate a solder ball (10) placed on a bonding pad, so as to soften the solder ball (10), the welding track (20)...  
WO/2019/044142A1
Provided is a technique relating to a method for manufacturing a substrate. This method for manufacturing a substrate includes an irradiation step of irradiating the inside of a gallium nitride (GaN) ingot with laser light from a directi...  
WO/2019/044588A1
This thinned plate member production method is characterized by comprising a laser irradiation step for irradiating a plate member (WF) with a laser beam (LB), and a division step for forming at least a first thinned plate member and a s...  
WO/2019/042581A1
An apparatus for material processing comprises at least one beam source of electromagnetic radiation and a beam shaping optical unit that variably shapes and focuses the radiation. The emitted radiation has a first beam parameter product...  
WO/2019/044954A1
[Problem] To provide a high-speed shutter operation method and a high-speed shutter device that are capable of starting and ending the shutter operation within an inter-pulse time window without interfering with any of the adjacent pulse...  
WO/2019/041828A1
A roll for rolling surface topography of a steel plate. A plurality of protruding texturing points is distributed on a roll surface. The shape of the junction between a single texturing point and the roll surface is circular or substanti...  
WO/2019/042730A1
The invention relates to a method for laser beam welding of one or more steel sheets made of press-hardenable manganese-boron steel, wherein at least one of the steel sheets (1, 2, 2') has a coating (4) of aluminum. The laser beam weldin...  
WO/2019/044840A1
Provided is a method for manufacturing a substrate equipped with a transparent conductive film, wherein a sub-nanosecond to nanosecond laser beam is emitted on a transparent conductive film formed on the surface of a substrate so as to f...  
WO/2019/039307A1
A laser machining device 1 that partially cuts a short cylindrical workpiece W and comprises: a support mechanism 4 that supports one end Wa of the workpiece W; a cut-piece receiver 10 having an ejection-guiding surface 14 for ejecting a...  
WO/2019/039628A1
The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method for manufacturing the same. The bidirectional conductive pin according to the present invention comprises: a pin bod...  
WO/2019/039034A1
Provided is a laser processing method for forming a code having a low possibility of degradation over time or tampering. This laser processing method includes a step of radiating a laser at a prescribed position in the interior of a ligh...  
WO/2019/040614A1
Complementary systems comprising a functional assembly (40) including a functional head (42) are provided for use with industrial punch presses (1) which enhance the functionality of the presses relative to the machining of workpieces. T...  
WO/2019/037059A1
A dental implant having micro-pattern design on the surface and a construction method therefor. The construction method can apply a surface treatment method combining a physical method with a chemical method in the field of oral implants...  
WO/2019/038754A1
Aspects of the invention may be directed to a method of creating a predetermined structure from a diamond bulk. In some embodiments, the method may include: irradiating the diamond bulk with at least one laser having a focal point at a p...  
WO/2019/040854A1
A method for laser processing a transparent workpiece includes forming a contour line in the transparent workpiece and directing an infrared laser beam output by an infrared beam source through an afocal beam adjustment assembly and onto...  
WO/2019/038902A1
The present invention addresses the problem of providing a laser irradiation device capable of improving substrate processing accuracy. A laser irradiation device (1) relating to one embodiment of the present invention is provided with: ...  
WO/2019/038860A1
This laser machining method includes a first step for forming a first hole by applying a first laser beam to a workpiece (9), i.e., a laminated body. The workpiece (9), i.e., the laminated body, has a copper foil (11) on the surface, sai...  
WO/2019/039528A1
Provided are a tack welding method and a tack welding device with which the strength of a tack-welded joint portion can be increased, and the fill height of a bead can be decreased. The tack welding method according to the present embodi...  
WO/2019/039529A1
Provided are a hybrid welding method and a hybrid welding apparatus that are capable of performing welding without dropping welding metal even when butt-welding is to be performed in which a gap exists between base materials. A hybrid we...  
WO/2019/039994A1
A method and system for handling beam-cut parts (202) cut out of a piece of material, the method comprising the steps of: receiving the beam-cut piece of material from beam-cutting equipment (102), the beam-cut piece of material being si...  
WO/2019/037213A1
A method for preparing a metal structure on the surface of a transparent material by using a metal nanoparticle ink, comprising: placing a transparent substrate (6) in a metal nanoparticle ink (8), using a laser (1) to irradiate the subs...  
WO/2019/040702A1
Effluent extraction for laser processing is disclosed, A pre-filter condenser unit extracts LGACs in an effluent stream. The effluent stream passes a serpentine path in the condenser. Condensate and particles are collected on rotatable b...  
WO/2019/034273A1
The invention relates to a flexible bulk container with a container-receiving space defined by walls, the walls being constructed, at least in part, from a multi-layer film material and consisting of at least two film layers of a plastic...  
WO/2019/035501A1
The present invention relates to a gravure offset roll for printed electronics and a method for manufacturing micropatterns, and to a gravure offset roll for printed electronics and a method for manufacturing micropatterns, which impleme...  
WO/2019/034397A1
In a laser machining head (1) for laser machining workpieces (2) using a laser beam (3), an optical element (6) arranged in the beam path of the laser beam (3) is designed such that radiation components with a wavelength of less than 400...  
WO/2019/035813A1
A cored filler wire (10) used in a laser metal deposition (LMD) process and method of using the same. The cored filler wire includes an outer shell (12) surrounding an inner filler material (14). The outer shell is formed from a first ma...  
WO/2019/035758A1
The disclosure relates to a method for end rounding bristles of a brush section (V) comprising a plurality of bristles (4), the method comprising providing a focused laser beam (11) propagating along a geometrical main propagation direct...  
WO/2019/035810A1
Systems (100) and methods (1000) for additively manufacturing or repairing a component from a base material (10). The system may include a laser metal deposition (LMD) system (200) operably connected to a means for cooling (300) the base...  
WO/2019/034416A1
Spark plug electrode (1), having - an electrode main body (2) composed of a first material and - an ignition element (3) composed of a second material, wherein the ignition element (3) is designed to form an ignition surface for a spark ...  
WO/2019/034259A1
The invention relates to a method for processing a material layer using energetic radiation, in which method a plurality of separate energetic beams 2 are directed, at least intermittently, onto the material layer and are guided in a mov...  
WO/2019/034288A1
The invention relates to a method for producing a pipe fitting (10), e.g. a reducer, a pipe elbow or a branch fitting, wherein a metal material (11) is melted by heating and a plurality of material layers (12) is produced in succession f...  
WO/2019/031183A1
This semiconductor module (1) comprises: a base substrate (11) which is provided with a drive circuit (11a); and a plurality of light emitting elements (15) which are electrically connected to the drive circuit (11a). The distance betwee...  
WO/2019/030247A1
The invention relates to a production facility (40) for detaching wafers (2) from donor substrates (4). According to the invention, the production facility comprises at least one analysis device (6) for determining at least one individua...  
WO/2019/030400A1
The present invention relates to a method, according to claim 1, for separating at least one solid body layer (1), particularly a solid body disk, from a donor substrate (2). The method according to the invention comprises preferably at ...  
WO/2019/031222A1
Provided is an information projection method in which information about a cut piece that has been cut and separated from a sheet-shaped workpiece and placed on a mounting base is projected onto the cut piece or a position close to the cu...  
WO/2019/030210A1
An iron-based alloy is described. Also described is a component having a surface layer 12 of an iron-based alloy, a method of providing a surface layer of an iron-based alloy on a component, an apparatus arranged to provide a surface lay...  
WO/2019/030520A1
The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt ...  
WO/2019/030249A1
The present invention relates to a method for joining a first blank and a second blank, wherein at least one of the first and second blanks comprises at least a layer of aluminum or an aluminum alloy. In particular, the method comprises ...  
WO/2019/031013A1
The purpose of the present invention is to provide laser-welded shaped steel having superior weld strength, particularly fatigue strength. Provided is laser-welded shaped steel (1) wherein the prescribed conditions for the composition of...  
WO/2019/029535A1
A device and a method for preparing an amorphous alloy using a pulse laser, and use. The device comprises a pulse laser emitting device and a sample to be processed (106); the pulse laser emitting device comprises a pulse laser (101), an...  
WO/2019/032112A1
A product includes a substrate that is at least partially transparent to visible light. The substrate includes a first surface, an opposing second surface, and a conductive layer disposed on the opposing second surface. The conductive la...  
WO/2019/030016A1
The invention relates to a device for the laser welding of workpieces, wherein at least one laser beam emitted by a laser radiation source is directed into the joining region of the workpieces by means of a laser processing apparatus tha...  
WO/2019/032639A1
A method for laser processing a transparent workpiece includes focusing a pulsed laser beam output by a pulsed laser beam source into a pulsed laser beam focal line directed into the transparent workpiece, thereby forming a pulsed laser ...  
WO/2019/027816A1
A laser cleaning system for laser treating a pipe surface includes a frame mountable to an outer circumference of a cylindrical pipe, a plurality of circumferential guide supports mounted to the frame and engageable with the outer circum...  
WO/2019/025328A1
In a method for laser machining in which the influence of a position change of at least one optical element (4-9) in a beam guidance of the laser beam (3), more particularly in a laser machining head (2), and/or of the laser machining he...  
WO/2019/025135A1
A method for forming a defined surface roughness (OR) in a region of a component (10) that is to be manufactured or is manufactured additively is specified. The method comprises setting an irradiation parameter (P, v) and/or an irradiati...  
WO/2019/028082A1
A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured ...  
WO/2019/027020A1
A laser beam synthesizing device (10) is provided with an emission optical system (20) for emitting a plurality of circular laser beams IL propagated coaxially and having mutually different wavelengths, and a concentric circular diffract...  
WO/2019/026192A1
Provided are a wire for welding dissimilar materials, which makes it possible to reduce a flux filling factor and to suppress generation of filling unevenness, and a method for manufacturing the same. An electrically conductive core wire...  
WO/2019/025327A2
The invention relates to a method for laser cutting an in particular flat workpiece (6) along a curve (K) by means of a laser beam (5). In order to produce a microjoint (14) which has a lower height (d) than the workpiece thickness (d) a...  

Matches 351 - 400 out of 61,154