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Matches 1 - 50 out of 56,257

Document Document Title
WO/2017/159425A1
Provided is a lap laser-welded joint that has superior peel-strength and dimensional accuracy. The lap laser-welded joint 1 is formed by stacking steel sheets 2, 3, and has a plurality of substantially C-shaped welded parts 4 set in an a...  
WO/2017/159439A1
A fiber coupling device according to the present invention includes a housing and a window provided in the housing. The fiber coupling device is configured to guide, all at once, to at least a fiber, a plurality of laser beams coming fro...  
WO/2017/157644A1
The invention relates to a method for laser welding a workpiece (1), wherein a laser beam (2) directed onto the workpiece (1) is moved relative to the workpiece (1), such that the workpiece (1) is welded along a weld seam (5) and a weld ...  
WO/2017/157856A1
The invention relates to a method for determining the quality of a weld (5) of a workpiece (1) welded by means of laser-beam welding along the weld (5), wherein at least a partial region of a molten pool (4) and/or of a surrounding area ...  
WO/2017/157725A1
A laser processing machine (1) has a processing region (3) with a protective housing (11). A laser processing device is arranged in the processing region (3), by means of which a workpiece (7) arranged in the processing region (3) can be...  
WO/2017/158995A1
This machining swarf removing apparatus 7 is provided with a left machining swarf removing unit 25 and a right machining swarf removing unit 26. When removing machining swarf adhered to a recovery box 6, the left machining swarf removing...  
WO/2017/158737A1
In order to make a beam branching structure more compact so as to miniaturize the device as a whole, this optical processing head is provided with an optical element group which guides a processing beam from a light source to a processin...  
WO/2017/158738A1
The purpose of the present invention is to prevent deterioration of a formed object. Provided is a nozzle for optical processing, the nozzle comprising: an optical system in which a focal point has been adjusted to a processing point; a ...  
WO/2017/160277A1
A method to join electrochemical cell members comprising an inorganic material by laser. The method includes the steps of positioning the electrochemical cell members to each other, defining the constituents of the joining process, utili...  
WO/2017/157548A1
The invention relates to a method for laser welding a front fillet seam with a reduced end crater, wherein a laser beam is guided to generate the front fillet seam (52) with an advancing movement in a welding direction (X) along a join (...  
WO/2017/158739A1
In order to increase maneuverability, this beam processing device moves a nozzle head to scan a processing region while irradiating an optical processing beam via a nozzle head onto a processing region having extension in one or more dim...  
WO/2017/156723A1
A method of laser welding a workpiece stack-up (10) that includes at least two overlapping metal workpieces (12, 14) comprises advancing a laser beam (24) relative to a plane of a top surface (20) of the workpiece stack-up (10) from a st...  
WO/2017/157794A1
The present application relates to a process for welding a conductive element (100a) to a terminal (202; 204) of a battery (200), the process comprising respectively firing (T1a) at least once a laser beam (302) at at least one point of ...  
WO/2017/159874A1
A laser processing device includes plural laser sources and a focusing section that focuses respective light beams of the plural laser sources to form plural focus points on a workpiece, and that focuses such that respective portions of ...  
WO/2017/159532A1
The present invention can improve accuracy of determining a welding quality or accuracy of maintaining, through feedback, a fixed welding quality in high energy beam welding, and thereby, improves the manufacturing efficiency, that is, t...  
WO/2017/157345A1
A method for machining a clearance area (10) of a housing (100), a housing (100) and a mobile terminal. The method comprises: providing a housing (100), the housing (100) being made of a signal shielding material and having a pre-set are...  
WO/2017/157566A1
The invention relates to a laser remote processing system, in particular a laser remote welding system having a laser cell (20) surrounded by a protective housing (22), in which a working robot (A) having a remote laser tool and a first ...  
WO/2017/158005A1
The invention relates to an optoelectronic component (10) comprising a first optoelectronic semiconductor chip (100) for emitting light (105) which extends into the optoelectronic component (10) along a first light path (110), an optical...  
WO/2017/153100A1
The invention relates to a method for determining the position of the focus (19) of a laser beam arrangement (10) in relation to a reference surface (55), comprising the steps (A) directing a laser beam (14) onto the reference surface (5...  
WO/2017/154669A1
In this method for laser cutting a stainless steel sheet using a fibre laser or a direct diode laser, when a mixed gas of nitrogen gas and air is used as an assist gas, the oxygen concentration in the assist gas is adjusted to 0.06-0.5%....  
WO/2017/154791A1
A laser light radiation device, provided with: a laser light source for generating laser light; a spatial light modulator having a display unit for displaying a phase pattern; an objective lens for condensing the laser light emitted by t...  
WO/2017/153707A1
Apparatus for controlling laser processing of a material (10), which apparatus comprises a laser (1) for emitting laser radiation (2); means (3) for directing the laser radiation (2) onto the material (10); at least one detector (4) for ...  
WO/2017/154800A1
In the present invention an acousto-optic deflector diverts a laser beam to a damper path, a first machining path, or a second machining path. Beam deflectors are arranged respectively in the first machining path and the second machining...  
WO/2017/153750A1
A method of reducing photoelectron yield (PEY) and/or secondary electron yield (SEY) of a ceramic surface comprises applying pulsed laser radiation comprising a series of laser pulses emitted by a laser (4) to the surface of a target (10...  
WO/2017/155104A1
A laser machining device is provided with a laser light source, a spatial light modulator having a display unit, an objective lens, an image-transferring optical system, a camera, and a control unit. The control unit executes a first dis...  
WO/2017/154304A1
In this invention, a mounting frame MF1 is held with an adhesive tape T1 placed thereunder, the adhesive tape T1 is cut away by following the external shape of a wafer W, and the cut-away adhesive tape T1 is recovered. The wafer W is sup...  
WO/2017/153825A1
The present invention relates to an improved cutting device and an improved cutting method, specifically For processing and cutting sheets of a stiff material, such as cardboard and others, in which the sheets are supplied and moved In a...  
WO/2017/154233A1
Provided are: a deposition mask whereby a resin film in openings can be completely removed; a method for manufacturing the deposition mask; and a mask member for the deposition mask. On one side of a resin film (11), an irradiation sourc...  
WO/2017/149495A1
The aim of the invention is to clearly and permanently identify a workpiece blank during a multi-stage machining or production process. In order to do this, a label comprising a code is welded to the blank in the form of a metallic dots....  
WO/2017/149496A1
A method of marking a substrate may include first coating at least a portion of a surface of the substrate with at least one layer of a flammable material, such as thermite or a metal powder. The method may then include directing a laser...  
WO/2017/148732A1
The invention relates to a method for integrally bonding a cast aluminum part (2) to a joining partner. Said method involves the steps of: - laser-treating a region of the cast aluminum part (2) that is to be joined to the joining partne...  
WO/2017/148716A2
The invention relates to a device for roughening cylinder bores using a beam tool and offering a very high level of process reliability even for a large quantity.  
WO/2017/150675A1
This adhesive tape for semiconductor processing is used by attaching said adhesive tape to the surface of a semiconductor wafer in a step in which the rear surface of a semiconductor wafer having a groove or a modified area formed on the...  
WO/2017/150111A1
In this invention, the entirety of a glass substrate 2 having a thickness of 500 μm or less is stacked onto a setter 1, and the glass substrate 2 is heat-processed in this state for the purpose of decreasing the heat-shrinking rate ther...  
WO/2017/148548A1
For producing a welded ring, a strip of a length corresponding to the circumference of the ring is bent into a ring and is welded at its ends. The ends of the strip that are to be welded to one another have in the circumferential directi...  
WO/2017/151122A1
Methods comprising providing an article comprising a first wall between an inner diameter and an outer diameter, wherein the article is structured to receive a mandrel within the inner diameter, inserting the mandrel into the article, an...  
WO/2017/146331A1
According to exemplary embodiments, a laser device and a laser generation method are provided. The laser device according to an embodiment generates a trigger signal from a laser modulation signal. In addition, the laser device emits pum...  
WO/2017/143789A1
Disclosed are a laser material increase and decrease composite manufacturing method and device. The specific method comprises: establishing a geometric model of an entity part, planning a scanning path of a laser for quick laser forming ...  
WO/2017/146330A1
Disclosed is an apparatus and method for measuring straightness. The disclosed method for measuring straightness comprises the steps of: acquiring photographed images by photographing a reference line marked on an object while changing a...  
WO/2017/144048A1
The device contains a welding unit comprising a tube (3), a laser radiation unit (1) that emits laser radiation towards the tube axis (3.0) and a mandrel (4) that is arranged in the tube (3) coaxially with the latter and that is connecte...  
WO/2017/144594A1
The present invention relates to a method of at least one of sintering, crystallization and/or crosslinking of a coating material (2) on a substrate (1) with laser radiation. The coating material (2) is scanned with a laser beam (8) alon...  
WO/2017/145502A1
A system and method depositing metal to form a three-dimensional (3D) part on a substrate (140). A wire (120) is moved relative to a location on the substrate while a laser heats a proximal end of the wire at the location using a laser b...  
WO/2017/145610A1
A laser light irradiation device is provided with: a laser light source for generating laser light; a spatial light modulator that has a display unit for displaying a phase pattern and modulates the laser light generated by the laser lig...  
WO/2017/145330A1
A laser processing device is provided with: a thin dielectric film (12) formed on the surface of a substrate (11); a blue semiconductor laser (3) with a wavelength of 400 nm; a semiconductor laser drive unit (4) for generating continuous...  
WO/2017/146424A1
The present invention relates to a laser machining nozzle capable of supplying sufficient machining-assist gas to a portion, which is irradiated with a laser beam, when a workpiece is machined by using the laser beam, lowering the surfac...  
WO/2017/145518A1
According to the present invention, an imaging unit (30) captures an image of a laser beam emission surface at a processing nozzle (29) mounted to a leading end of a processing head (28) provided in a laser processing machine (100) while...  
WO/2017/142147A1
Disclosed is an ultrasonic cleaning device for cleaning a surface of a processing material with ultrasonic waves, and an ultrasonic cleaning method using the same. The disclosed ultrasonic cleaning device comprises: a first cleaning unit...  
WO/2017/141883A1
A transparent or semi-transparent part of a container in which at least a part thereof has a transparent or semi-transparent part that contacts the outer surface, and at least a part of the transparent or semi-transparent part has a curv...  
WO/2017/142470A1
The present invention relates to a method for selecting optimum operation performance criteria for a metal working process. The method comprises the step of developing a process model relating process parameters for the operation with pe...  
WO/2017/141827A1
A gripping device (22) constituting a welding device (20) has a first contactor (28) and a second contactor (30), which face each other and come in contact with a material (10) to be welded. The first contactor (28) vibrates at a predete...  

Matches 1 - 50 out of 56,257