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WO/2012/014905 |
In order to manufacture a large number of contacts each having an insulating coating in an arbitrarily defined position, this method comprises a step for forming a plated layer produced from a conductive material around a core to form a ...
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WO/2012/014639 |
Disclosed is a method that, in the cutting of a polarizing plate using laser light, cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of th...
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WO/2012/014720 |
The disclosed laser processing method includes: a modified-region formation step in which laser light (L) is focused on a flat target object (1) formed from silicon, thereby forming a plurality of modified spots (10) inside the target ob...
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WO/2012/014711 |
Disclosed is a laser processing method in which laser light (L) is focused inside a target object (1) formed from silicon, thereby forming a modified region (7), and etching is performed along the modified region (7), thereby forming a t...
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WO/2012/014724 |
Disclosed is a substrate processing method for forming a void along a prescribed line (12) in a silicon substrate (11). Said method includes: a first step in which elliptically polarized laser light (L), which has an ellipticity other th...
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WO/2012/014722 |
Disclosed is a substrate processing method for forming a void along a prescribed line (12) in a silicon substrate (11). Said method includes: a first step in which elliptically polarized laser light (L), which has an ellipticity other th...
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WO/2012/014709 |
Disclosed is a laser processing method for forming a hole (24) in a flat target object (1) formed from silicon. Said method includes: a recess-formation step in which a recess (10), which opens to a laser-light incidence surface (3) of t...
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WO/2012/014718 |
Disclosed is a method for manufacturing an interposer provided with a plurality of through electrodes. Said method includes: a laser-light focusing step for forming modified regions in a flat silicon workpiece by focusing laser light on ...
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WO/2012/013818 |
The invention relates to a method and a device for quality assurance of the processing result in the processing of a workpiece (4) by means of a laser, in particular as far as the positioning and output monitoring of the quantity of ener...
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WO/2012/014717 |
Disclosed is a method for manufacturing a semiconductor device (10) that has a cooling mechanism (61). Said method includes: a modified-region formation step in which laser light (L) is focused on a flat workpiece (1) formed from silicon...
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WO/2012/014712 |
Disclosed is a laser processing method in which a modified region (7) is formed by focusing laser light (L) inside a workpiece (1) formed from silicon, and a through hole (24) is formed in the workpiece (1) by etching along the modified ...
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WO/2012/014716 |
Disclosed is a method for manufacturing a chip comprising a functional element formed on a substrate. Said method includes: a functional-element formation step in which a functional element is formed on a principal surface of a flat targ...
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WO/2012/014710 |
Disclosed is a laser processing method in which laser light (L) is focused inside a target object (1) formed from glass, thereby forming a modified region (7), and etching is performed along the modified region (7), thereby forming a thr...
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WO/2012/014879 |
A laser processing machine which causes laser light (La) emitted from a laser oscillator (21) to propagate along a light path and applies the laser light to a workpiece (W) is provided with a bellows (2) which protects the environment of...
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WO/2012/014721 |
The disclosed laser processing method includes: a laser-light focusing step in which laser light (L) is focused on a flat target object (1) formed from silicon, thereby forming modified regions (71 to 73) inside the target object (1); an...
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WO/2012/014815 |
Disclosed is a method that is for abrasion processing of a glass substrate for semiconductor chip mounting, and that has: (a) a step for preparing the glass substrate; (b) a step for increasing the absorption of a first laser light havin...
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WO/2012/011446 |
Disclosed is a laser processing method for cutting out at least a first effective section and a second effective section from a plate-shaped object to be processed. The method comprises a first step and a second step. In the first step, ...
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WO/2012/011322 |
The present invention minimizes adhesion of dross on a cut portion at the time of cutting a cylindrical work by laser beam irradiation. At the time of cutting a rotating cylindrical work (W) using a laser beam, a machining head (200) is ...
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WO/2012/011445 |
Disclosed is a glass film cutting device (1) that uses thermal stress generated by local heating and cooling of the heated area along a planned cutting line (7) in a glass film (G) to move an initial crack (10) formed in the end section ...
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WO/2012/010740 |
The invention relates to a method for the removal of an oxidation from a surface of metal object. It is directed to an oxidation (3,12) on the surface of a metal object (2,11) at least one laser beam (4,13), which is essentially absorbed...
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WO/2012/010924 |
Embodiments of the invention provide a method of and apparatus for graphically marking a series of portable objects, such as a card, each portable object being graphically marked on a respective zone by a respective marking device, where...
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WO/2012/011072 |
The invention relates to a laser processing machine, in particular a laser cutting machine (LM), comprising a work table for receiving a work piece (W) to be processed and a work arm (1) with at least one laser cutting head (2). The lase...
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WO/2012/007326 |
Proposed is a structural element for an injection valve, having a first tubular component and a second tubular component, wherein the first component is connected to the second component by cohesive bonding in a region of overlap, wherei...
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WO/2012/007832 |
The invention provides a laser cutter producing a pulsed light beam and which is characterised in that it includes a first detector for measuring the waveform of light reflected from an object to be cut. A processor is provided which is ...
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WO/2012/007663 |
The invention relates to a hybrid laser/arc-welding method using an electric arc and a laser beam that are combined together within a single welding bath, to which molten metal is supplied by melting a filler wire, wherein the welding ba...
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WO/2012/007664 |
The invention relates to a hybrid laser/arc-welding method using an electric arc and a laser beam that are combined together within a single welding melt to which molten metal is supplied by melting a filler wire, wherein the welding mel...
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WO/2012/008326 |
Disclosed are: a method for manufacturing an oriented film whereby a non-oriented thin-film layer can be omitted; a method for manufacturing a master plate that can be used in the manufacture of such an oriented film; a method for manufa...
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WO/2012/006736 |
A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selecte...
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WO/2012/008699 |
The present invention relates to a light guide plate laser processing apparatus using a rotary motor as a driving source. The light guide plate laser processing apparatus includes: a frame; a laser oscillation unit for generating a laser...
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WO/2012/007956 |
Laser fire protection system used to prevent the diamond break due to fire on any unwanted focal point inside the diamond. Graphite layer is creates on the diamond surface before sawing process by applying high temperature of 800°c to 1...
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WO/2012/008577 |
Disclosed is a substrate (10A) for trapping a microorganism or cell (T), characterized by comprising a base (4) and having a space (2) into which a fluid (R) containing the microorganism or cell (T) is introduced and a microfine suction ...
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WO/2012/005454 |
The present invention relates to a glass substrate cutting system using a laser. In detail, the glass substrate cutting system using a laser may correct a cutting line radiated with a laser beam on a transferred glass substrate seated on...
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WO/2012/004012 |
The invention relates to a method for introducing an invisible weak point (4) into a decorative layer (2), wherein holes are introduced into the decorative layer (2) by exposing the decorative layer (2) to a laser beam (10), wherein to t...
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WO/2012/004230 |
The invention relates to a laser optics head (10) configured for use in a laser scribing device, comprising a diffractive optical element (11), a focusing objective (13) and an adjusting means (21), whereby the diffractive optical elemen...
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WO/2012/005477 |
The present invention relates to an apparatus for laser processing a light guide plate wherein a light path is constantly maintained to provide a light guide plate having high quality. The apparatus includes a laser oscillator, a laser i...
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WO/2012/003914 |
The invention relates to a device and method for processing workpieces using energetic radiation (3), in which an energetic beam (3) is guided through a nozzle arrangement and can be directed at a workpiece (11) together with a process g...
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WO/2012/005816 |
Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irr...
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WO/2012/003560 |
A laser drilling equipment (300) is described, comprising: a) an optical component or supply module, constituted by a set of lasers (200) with active optical fibre (320), in the form of a hollow reel (210), the active medium of the laser...
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WO/2012/004491 |
Method for inspecting the quality of a solder joint, characterized in that it implements a probabilistic statistical model that determines a rating for the quality of the solder joint.
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WO/2012/001965 |
Disclosed are a device and a method, by which it is possible to solve the problem of dust, prevent reduction in laser irradiation capability due to contamination, and reliably reduce the core loss of a grain-oriented magnetic steel sheet...
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WO/2012/000648 |
The present invention relates to a method for closed-loop controlling a processing operation of a workpiece, comprising the steps of: (a) recording a pixel image at an initial time point of an interaction zone by means of a camera, where...
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WO/2012/000686 |
This application concerns a method and devices for creating a multiplicity of holes (12) in thin workpieces (1) of glass or glass-like materials and semiconductors. Often, laser beams (41) are directed onto predetermined perforating poin...
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WO/2012/000986 |
The invention relates to a cutting tool, in particular cutting wheels, and a method for producing the same. For the purposes of smoothing the surfaces (6a, 6b) and of sharpening the cutting edge (4), use is made of a method in which at l...
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WO/2012/000106 |
A method for laser welding first and second components is provided including moving a laser beam across a portion of a surface of the first component at a speed sufficient to generate protuberances on the surface of the first component b...
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WO/2012/001971 |
Disclosed is a process for producing a grain-oriented magnetic steel sheet, the process comprising production steps that includes a final finish annealing step in which a forsterite coating film is formed on a surface of the steel sheet ...
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WO/2012/000572 |
The invention relates to a connecting arrangement (22) for connecting a fiber-reinforced composite component (10) to a further, at least partially metal component (24), wherein the composite component (10) has at least one metal reinforc...
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WO/2012/003139 |
A method for processing a coated glass substrate may include a high-temperature activation process.
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WO/2012/000193 |
Laser processing method for slots of steel screen pipe involves taking one of the endpoints in one of the long edges of slots (2) as a starting point, performing punching operation at the starting point by using pulse laser and cutting s...
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WO/2012/001698 |
Multiple Diamond planning and Brating Machine is used to scan the multiple diamond on the single machine so, it reduce the labor and production cost. The invention mainly comprised in two parts; Flat scanner setup, Multi bruit machine wh...
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WO/2012/003268 |
Methods of manufacturing a vacuum chamber and methods of forming a port tube for use in connection with a vacuum chamber are provided. Vacuum chambers, bodies, containers, port tubes, and related components made in accordance with these ...
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