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Patent Searching and Data


Matches 1 - 50 out of 54,168

Document Document Title
WO/2017/006606A1
Provided are: a laser processing machine capable of easily and efficiently transferring a workpiece by making it possible to lift a workpiece placing section for placing the workpiece; and a laser processing method. This laser processing...  
WO/2017/006693A1
A method for manufacturing a hollow composite magnetic member in which magnetism is weakened in a part of a ferromagnetically formed hollow member, the method including a step of forming a feebly magnetic region in which magnetism is wea...  
WO/2017/006306A1
An apparatus for material deposition on an acceptor surface includes a transparent donor substrate having opposing first and second surfaces, and a donor film on the second surface. The apparatus additionally includes an optical assembly...  
WO/2017/006233A1
Methods of fabricating devices vial selective laser etching are provided. The methods can include selective laser etching of a portion of a metal layer, e.g. using a laser light source having a wavelength of 1,000 nm to 1,500 nm. The met...  
WO/2017/006704A1
The purpose of the present invention is to provide a laser welding method with which it is possible to ensure an effective welding length when irradiating a laser beam at an incline. A laser welding method for performing welding by perio...  
WO/2017/007257A1
A laser processing device is disclosed. The disclosed laser processing device comprises: a light source emitting a processing beam for laser-processing a subject to be processed; a light-collecting optical system light-collecting the pro...  
WO/2017/006692A1
A hollow composite magnetic member obtained by partly modifying a hollow member formed from a ferromagnetic material containing 15-18 mass% Cr, the modified part including an alloy containing 8-18 mass% Cr and 6.5-50 mass% Ni. Due to thi...  
WO/2017/005675A1
The invention relates to a method for monitoring a process for powder-based additive manufacturing of components and to a system that is suited to carry out said method. According to the invention an image sensor (31) is used, on which t...  
WO/2017/006683A1
A blast machining apparatus, which performs blast machining of a section to be machined in a workpiece by jetting abrasive grains (1A) at said workpiece while moving over said workpiece, is provided with: a nozzle (1) for jetting the abr...  
WO/2017/005463A1
A lithographic apparatus comprising an illumination system configured to condition a radiation beam, a support structure constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with...  
WO/2017/006702A1
A method for manufacturing an outer joint member 11, 112 of a constant velocity universal joint 10, 102 that is obtained by configuring a cup section 12, 122, on the inner circumference of which track grooves 30, 302 with which torque-tr...  
WO/2017/007256A1
A focusing point detection device is disclosed. The focusing point detection device, according to one embodiment, comprises: a first beam splitter which is provided between a light source emitting a processing beam and a light-collecting...  
WO/2017/006821A1
This method for producing a deposition mask comprises steps of: preparing a deposition mask preparation body having a metal mask on one surface of a resin plate for a resin mask and a protective sheet on the other surface of the resin pl...  
WO/2017/004573A1
A system and method for physically destroying the data storage portion of electronic media storage devices such as hard disk drives, solid state drives and hybrid hard drives that comprises a rotatable milling cutter and a cradle for loc...  
WO/2017/002422A1
In order to cut a plurality of clumps having substantially uniform shapes and dimensions out of a propagated cell aggregate and appropriately eliminate contamination by fragments of different shapes or dimensions, when cutting a pluralit...  
WO/2017/001102A1
The invention relates to a method for producing modifications (14) in or on a transparent workpiece (2) by means of a laser processing device (1), wherein a laser processing device (1) is used which has a short pulse or ultrashort pulse ...  
WO/2017/003559A2
Devices and methods for optical-fiber processing for connector applications are disclosed, wherein the devices and methods utilize a quantum cascade laser operated under select processing parameters to carry out end face polishing. The m...  
WO/2017/002605A1
The purpose of the present invention is to provide an object to be managed from which an engraving code can be favorably detected. Provided is an object to be managed on which an engraving code having a plurality of dot recesses is forme...  
WO/2017/001098A1
The invention relates to an apparatus and a method for powder-based laser build-up welding of a workpiece comprising in particular a highly reflective material, in particular copper, with a laser source for the emission of a laser beam; ...  
WO/2017/001790A1
The invention relates to a method for the laser welding of monolithic semi-finished products made from aluminium alloy, without filler wire, known to the person skilled in the art as "remote laser welding", comprising the following steps...  
WO/2017/002604A1
The object to be managed is provided such that a marking code thereof can be well detected. The object to be managed 10 has thereon a marking code 11 having multiple dot-like recesses 15, wherein opening peripheral edge parts 22 of the d...  
WO/2017/001220A1
The invention relates to a laser-machining head (1) comprising the following: a focusing device (2) for focusing a machining laser beam (3) onto a workpiece (4) to be machined which is arranged in a machining beam path (14) of the machin...  
WO/2017/001027A1
The invention relates to a head for a welding device (1) for welding at least one first part to at least one second part level with a junction area (S), comprising: - at least one means (20) for applying a force with said device (1) to t...  
WO/2017/001301A1
The invention relates to a method for machining a substrate (18), in particular a packaging material composed of paper, cardboard, plastic, or the like, or a composite material comprising the substrate, by means of at least one laser dev...  
WO/2016/206943A1
The invention relates to scanning head (2) for laser material processing, comprising a focusing optical unit (15) and a beam position system (3) for influencing the laser beam position, said beam position system being disposed upstream o...  
WO/2016/206756A1
A laser welding system (1) is provided. The laser welding system includes a laser source (3) configured to produce a laser beam, beam modifying means (5) configured to split the laser beam into at least two heat source points (30) positi...  
WO/2016/208522A1
According to the method for manufacturing a semiconductor element of the present invention, a spot where a laser beam (21) is focused is formed in an ellipsoidal shape, and the laser beam (21) is focused and directed on a planned separat...  
WO/2016/207660A1
A method of reducing photoelectron yield (PEY) and/or secondary electron yield (SEY) of a surface of a target (10), comprises applying laser radiation to the surface of the target (10) to produce a periodic arrangement of structures on t...  
WO/2016/208646A1
A cutter according to an embodiment of the present disclosure is provided with a blade including a base portion and a cutting edge portion which is disposed along an end portion of the base portion and which is connected to the end porti...  
WO/2016/210319A1
An apparatus, system and method for micro welding, wherein insulated object, such as a wire, that includes a metallic conductor that is at least partially covered by one or more layers of insulation, is positioned across a termination po...  
WO/2016/207852A1
Various examples are provided related to the preparation of electrodes on carbon fiber reinforced polymer (CFRP) composites with low contact resistance. Laser-based surface preparation can be used for bonding to CFRP composites. In one e...  
WO/2016/208686A1
Provided is a cutting apparatus (1) that cuts a workpiece (ZE) by laser light (CW, PW). The cutting apparatus (1) is provided with a pulse-wave laser light oscillator (10) that oscillates pulse-wave laser light (PW) and a continuous-wave...  
WO/2016/207659A1
A method of blackening a surface, comprises applying laser radiation to the surface of a target (10) to produce a periodic arrangement of structures on the surface of the target (10), wherein the laser radiation comprises pulsed laser ra...  
WO/2016/207277A1
The invention relates to a method for cutting solids wafers (1) off a donor substrate (2). The method comprises the following steps: providing a donor substrate (2), and producing at least one modification (10) in the interior of the don...  
WO/2016/207030A1
The invention relates to a method for laser welding one or more metal parts (7) positioned one against the other along a joining face, in which a laser beam (9) is generated by means of a laser generator, a nozzle (4) is fed with a gas o...  
WO/2016/207258A1
A building cylinder arrangement (1) for a machine (70) for the layer-by-layer production of three-dimensional objects (71) by laser sintering or laser melting of powdered material (74), with a substantially cylindrical shell-shaped main ...  
WO/2016/209583A1
A machine-vision-assisted welding system comprises welding equipment, a time of Flight (ToF) camera operable to generate a three-dimensional depth map of a welding scene, digital image processing circuitry operable to extract welding inf...  
WO/2016/209576A1
A method of welding with low shrinkage stress, including forming an excavation (42, 70) in a surface (24, 76) of a substrate (24, 76) with a shallow geometry (D, W, A) limited to surfaces oriented within 45 degrees of the surface. Molten...  
WO/2016/208248A1
In this method for cutting a tube glass G1, the tube glass G1 is irradiated with a laser light L that is focused inside the tube glass G1, and an inner crack region C1 which includes one or multiple cracks is formed on a portion of the t...  
WO/2016/207276A1
The present invention relates to a method for separating solid wafers (1) from a donor substrate (2). The method comprises the steps of: creating modifications (10) within the donor substrate (2) by means of laser beams (12), wherein the...  
WO/2016/207137A1
A container for consumer articles is at least partially formed from a blank having a thickness (T), a first surface and a second surface, wherein at least a portion of the blank is delimited by a plurality of cut edges that extend from t...  
WO/2016/207552A1
The invention relates to a pressure-sensitive adhesive film that includes a backing coated on one side with a rubber adhesive containing at least 5 wt.% tackifying resin, and on the other side with a silicone epoxy varnish. Such an adhes...  
WO/2016/202463A1
The present invention relates to a hermetic package (40) suitable to be implanted in a body of an animal or a human patient. The housing (40) comprises a base part (50), a cover part (60) suitable to cover the base part (50), and a conne...  
WO/2016/203419A1
The present application realtes to a method for carrying out precise laser cutting on a ribbon sheet (4) of length and width positioned in a laser cutting station (10), wherein the laser cutting station comprises a conveyor for advancing...  
WO/2016/203823A1
A processing machine (100) is provided with: a tool main shaft (121) for holding a tool for subtractive manufacturing of a workpiece (400); an additive manufacturing head (21) that is detachably attached to the tool main shaft (121) and ...  
WO/2016/205786A1
A laser cutting head includes a controllable collimator with movable collimator lenses for controlling beam diameter and/or focal point location. The laser cutting head may be used in a laser cutting system with a control system for cont...  
WO/2016/203357A1
A machine and a method for the laser working of profiles (P) are described, in particular for carrying out an inclined cutting operation on the profile (P), for example for making a flared hole (H), wherein before the working operation a...  
WO/2016/202633A1
With the method according to the invention for unloading a workpiece part (2) during machining by means of an unloading element (10), in particular a vacuum suction device, the workpiece part (2) is cut from an, in particular planar, wor...  
WO/2016/202987A1
The invention relates to a machine for the separative machining of a plate-shaped workpiece (12) using a machining tool, which machine comprises two workpiece support surfaces (14, 15) for supporting the workpiece (12), between which a g...  
WO/2016/205805A1
A laser welding head with movable mirrors may be used to perform welding operations, for example, with wobble patterns and/or seam finding/tracking and following. The movable mirrors provide a wobbling movement of one or more beams withi...  

Matches 1 - 50 out of 54,168