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JP2010205756 |
To execute solder junction between an electronic component and a circuit board by increasing an area of solder while discharging void and specifying a solder feed state for stably obtaining a change in solder area before and after heat t...
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JP2010194569 |
To enhance working efficiency and suppress an increase in the cost without oxidizing a brazed part and the periphery thereof when joining a base material as a metallic member having the shape such as a tubular shape with a hollow inside ...
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JP2010194592 |
To provide a solder flattening tool capable of forming a fed solder in a rectangular shape, and preventing occurrence of any defective product.The solder flattening tool presses a solder 21 fed on a workpiece in a flat shape. The tool in...
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JP2010199190 |
To make it possible to make a junction at low cost and in a short time by keeping pressuring force on each bonding member constant without distorted weighting under the condition that a plurality of bonding members lie with a small amoun...
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JP2010196931 |
To provide a method of manufacturing a heat exchanger reducing manufacturing cost and the weight of the manufactured heat exchanger.The method is used for manufacturing the heat exchanger which includes aluminum header tanks 2, 3 each ha...
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JP2010199232 |
To provide a soldering device for, especially, assuring packed amount of solder into a through-hole and surely securing a lead inserted into the through-hole, relating to a soldering method for reflow soldering a surface mounting compone...
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JP2010194578 |
To provide a method for producing a laminated heat resistant alloy plate which can shorten working time and can improve yield in the working.The method comprises a hole forming step of placing a sheet-shaped brazing member 8 on a surface...
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JP2010194593 |
To provide a charging tool and a joining device, capable of preventing a molten metal from largely swelling on or drooping from the end part face of a plate material when filling the outer edge gap of a pair of plate materials with the m...
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JP2010194553 |
To provide soldering equipment capable of improving a solder release after soldering operation and of enhancing a function of removing residual solder stuck to the tip end of a soldering iron.In the soldering equipment 1, when a cam 200 ...
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JP2010192796 |
To provide technique for removing a solder ball arranged not at a predetermined position on a wiring board in a solder bump forming process of the wiring board.A solder ball removing device 100 includes a rotary brush 110 and a suction p...
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JP2010184247 |
To optimally control the state of a flame generated from the tip of a torch.A heating device 10 includes: a combustion gas adjusting valve 19, which is arranged on a supplying passage 17 of a mixture of a flux and a combustion gas, and w...
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JP2010186625 |
To provide an aluminum wire soldering method which suitably maintains conductivity between an aluminum wire and a terminal and has less variation of quality and stable quality and is good workability, and a terminal for soldering an alum...
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JP2010182566 |
To provide a terminal for wire connection, wherein strong soldering is possible by appropriate flux treatment even if the terminal and electric wire are made from different kinds of materials, to provide a wire connection structure and a...
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JP2010179310 |
To provide a method of manufacturing a sheet-like brazing filler metal applicable to a variety of brazing filler metals and specifically suitable for obtaining the sheet-like brazing filler metal used for brazing of stainless steel, Ni-b...
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JP2010172939 |
To provide a wire cutting apparatus that accurately adjusts a post-cut length of a wire extending from a nozzle and that can properly change the post-cut length of the wire even in the case of change in a wire length suitable for brazing...
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JP2010172928 |
To provide a solder supply device that can supply solder from various solder storage containers to a target such as a solder printing mask and that has superior general versatility, and to provide a printer equipped with this solder supp...
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JP2010177250 |
To position a substrate with respect to a screen mask once when conveying the substrate to a flux printing device and to remarkably improve operating efficiency in a case where printing of flux by the flux printing device and loading of ...
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JP2010177287 |
To equalize the height of fused solder which is jetted from the tip of a nozzle.A tank body 2 houses fused solder 20; a pump pressure feeds the fused solder 20 contained in the tank body 2; a first duct 4 guides the fused solder 20 press...
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JP2010167485 |
To exchange a soldering iron tip, which is deteriorated by the arrival of a service life or the like, without any possibility of damaging a heater in the soldering iron, in which the small-diameter heater is inserted into the soldering i...
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JP2010171274 |
To provide a method of bonding Si wafers, by which second and third Si wafers each having a diameter almost equal to that of a first Si wafer and protecting plural MEMS functional elements are bonded to both sides of the first Si wafer w...
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JP2010171353 |
To solve the problems of low productivity in a washing process, change of configuration in an adhesive formed by the washing process and limitation on the number of uses.The problems are solved by a method using a heat-resistant rubber a...
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JP2010167461 |
To achieve improvement of work efficiency at a lower cost by rapidly supplying work-heat quantity required for lead free solder.A bit (10) of an iron for the lead free solder is arranged at a tip of a soldering iron body (12) and is used...
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JP2010167473 |
To solve a problem that a commercial hand soldering iron requires skill of an operator, with no data systematized for the soldering operation, while an automatic soldering iron needs soft landing in a soldering position and absorption of...
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JP2010168625 |
To recover a higher purity reclaimed solder when oxidized scum is removed from solder dross, and also to dispose of only the oxidized scum without entraining the reclaimed solder.An agitation unit 3 is set to an opening 2a of a solder me...
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JP2010167450 |
To reduce soldering processing time by properly controlling heating temperature of a heater tip and to increase working rate of the apparatus.In a reflow soldering method, a heater tip 30 held on an elevation head 14 that rises/lowers re...
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JP2010135839 |
To provide soldering equipment, capable of uniformly heating a printed circuit board and the mounted electronic components, and of soldering, without thermally damaging the electronic components in soldering equipment using lead-free sol...
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JP2010120029 |
To solve such a problem that a conventional apparatus for removing solder oxide film has a complicated structure and is expensive, and cleaning operation of a scraper has to be carried out near a solder tank and it is accompanied with da...
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JP2010123740 |
To achieve a desired narrow pitch by suppressing the occurrence of a short circuit between adjacent pad electrodes by solder when depositing solder powder on pad electrodes and then adhering solder on those electrodes by melting the sold...
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JP2010115675 |
To provide a brazing method for copper tube by which a plating film of a tin-plated copper tube can be prevented from being melted due to heat shielding as possible, and to provide a heat exchanger manufactured by the method.When brazing...
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JP2010114330 |
To provide a masking material raising the accuracy of a masking pattern by preventing a droop due to heating, increasing the transfer quantity of solder paste, and ensuring excellent detergency after heating curing, and also to provide a...
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JP2010114309 |
To provide a flux transfer head whose pins can be made compact.The flux transfer head includes a plurality of pins 11 and a support portion 12 for supporting the respective pins 11, and is configured to transfer flux stuck on tips 11a of...
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JP2010110808 |
To solve the problem that there are problems in the working time and quality in a conventional soldering device, in particular, the quality of a solder is largely varied in early morning in winter and in daytime when the inside of a fact...
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JP2010112671 |
To facilitate swelling work during manufacturing of a plate-shaped body for manufacturing a tube and suppress wear of a tool for the swelling work in manufacturing of the tube for a flat multiple-hole type heat exchanger.In this method o...
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JP2010114338 |
To provide a component mounting machine and a method of mounting components, capable of preventing occurrence of component mounting mistakes caused by the film formation failure of a paste film.A non-film-forming region S1, where there a...
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JP2010105133 |
To enable a blower blade to continue long-lifetime operation of four years and a half, as a conventional blower blade in a dust collecting blower device of molten iron pretreatment equipment needs to be cleaned every 3-5 days due to adhe...
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JP2010105029 |
To suppress oxidation of a body of a thermally conductive member for solder handling equipment and to improve thermally conductive characteristics.The thermally conductive member for the solder handling equipment includes a body 3, 3' ha...
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JP2010105032 |
To reduce thermal influence to a holding part of a solder trowel as much as possible without generating noise.A solder trowel stand includes: a base 10; and a trowel holder 30 arranged at the upper part of the base 10 and having an arc s...
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JP2010099676 |
To provide a soldering vessel including at least two vessels and having a function for detecting solder leakage due to corrosion of the soldering vessel.The soldering vessel 40 with the function for detecting the solder leakage includes:...
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JP2010098153 |
To provide a semiconductor chip positioning jig unit capable of easily setting a thickness of a solder layer formed during bonding of a semiconductor chip to a suitable thickness.The semiconductor chip 12 is bonded after it is positioned...
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JP2010094719 |
To provide a solder paste having excellent wettability of a molten solder to a lead and an electrode subjected to the lead-free solder plating, excellent wettability of molten solder to a metal surface of a circuit board, and excellent e...
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JP2010094735 |
To provide a soldering method for reliably joining a metal sheet, and a metal sheet with solder and a soldering iron suitably used therefor.Metal sheets 1, 2 are soldered to each other by heat-pressing the two metal sheets 1, 2 constitut...
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JP2010089372 |
To provide a tray cleaning method for a paste film forming apparatus that can clean in a short time even when the amount of remaining paste is much while reducing the amount of paste which is discarded and becomes useless.A squeegee 23 i...
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JP2010089159 |
To improve the productivity of a head gimbals assembly.A soldering device for interconnecting the joining pads for a head slider and gimbals has a nozzle 21 at a position near the head slider. The nozzle has a receiving section 214 which...
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JP2010093035 |
To solve the problem that when a flux is supplied to each through-hole from above a substrate, the applied flux falls to stick on a member to be bonded, a tool, etc., disposed below the substrate.The apparatus for applying flux 10 for ap...
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JP2010075981 |
To provide a soldering iron cleaning apparatus capable of reducing consumption of an iron tip of a soldering iron and a cleaning member of the soldering iron cleaning apparatus by preventing liquid solder deposited on the iron tip from b...
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JP2010075930 |
To solve such problems that a flux is coated above necessity, thereby lengthening a cleaning time, wasting a material, and lengthening a processing time.A method for solving the problems includes: a dispensing step of dispensing a stream...
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JP2010077019 |
To provide a process for assembling of an article or structural member made of a silicon carbide-based material by brazing.The process for assembling of at least two articles 1, 2 made of silicon carbide-based materials by moderately ref...
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JP2010069528 |
To provide a soldering apparatus having high productivity and reliability, a soldering apparatus that can make a pressing face meet the joining face of a workpiece by uniformly and elastically holding down the entire face of the workpiec...
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JP2010069495 |
To provide a flux-containing capsule which sufficiently removes any oxide film on the surface of a conductive particle, and reduces the connection resistance between the electrodes when attached to a surface of the conductive particle ha...
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JP2010074186 |
To provide a high-quality printed circuit board device to which oxide of solder floating in a flow soldering tank does not adhere when an electronic component is mounted on the printed circuit board by soldering.In the soldering palette ...
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