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WO/1999/004923 |
The invention relates to a dispenser (10) for discharging a specific amount of a medium onto a work piece (40). The dispenser (10) has a head (12) with a dispenser needle (14) and a spacer element for determining a specific distance betw...
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WO/1999/000214 |
The invention concerns an electric soldering iron wherein the heating resistor (15), and two conductors (16, 17) supplying the current thereto, are formed by a coating (12) deposited by screen process printing on one of the surfaces of a...
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WO/1998/057774 |
The invention relates to a method for repairing defective soldered joints. According to said method, in a first step a solder handling device (12) with a solder removal device is placed at the level of a defective soldered joint and a de...
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WO/1998/056533 |
A pressure regulator system for a pneumatically or hydraulically actuated weld head (10). The weld head (10) includes a switching valve (21) comprising several ports: an inflow port (44) attached to a source of pressurized gas, preferabl...
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WO/1998/053946 |
When applying solder paste to substrates, for example circuit boards, a jet comprising a fluxing agent (15) on top of a core of molten solder (11) is used. It is achieved by making a jet of molten solder (11) pass through a space filled ...
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WO/1998/050189 |
The placement of solder 'balls' in a Ball Grid Array is accomplished by placing a solder strip (73) in contact with the top surface of the ball grid array carrier. The pulsing of a laser directed at the solder (74) in discrete positions ...
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WO/1998/048606 |
The invention relates to a device for selectively processing on individual components of a flat electronic sub-assembly in predetermined ambient conditions. This device comprises a receptacle for lodging the sub-assembly module, the cove...
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WO/1998/047330 |
A solder ball loading mechanism (1) comprises a movable plate (5). Resting on top of the plate is a ball container (15) adapted for holding relatively large quantities of solder balls (20). Pressurized air is provided from two sides of t...
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WO/1998/040184 |
Known devices for producing component joints or surface coatings, comprise a heating device with a working part (1) which can heat a working substance until it reaches a plastic or fused state. In order to ensure that the working substan...
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WO/1998/036864 |
Continuous jetting of liquid metal droplets for deposit on a substrate includes an ejector, a deflection device, a print chute, and a collection reservoir. Liquid metal from a cartridge in the ejector provides a continuous molten materia...
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WO/1998/036451 |
A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. An alignment plate (30) having holes (31) corresponding to the predetermined pattern is mated to...
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WO/1998/034748 |
A technique for producing soldering iron tips entails cutting clad wire into a plurality of segments, each segment comprising a core of material (such as copper) and an outer protective layer (such as stainless steel, Ni, Cr, or alloy th...
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WO/1998/034749 |
An apparatus for placing an array of solder balls on a substrate (10) includes a carrier plate (18) having an array (80) of holes (82) therethrough. Each hole (82) is capable of holding a solder ball (102). A ball placement head (126) ha...
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WO/1998/033600 |
A machine for terminating a computer chip with one or more stripes of a solderable paste, comprising a feed plate wheel (13) defined by an outer marginal edge (15) and having an upper exposed plate surface inclined to the horizontal (19)...
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WO/1998/031496 |
The invention relates to a device for assembling several individual parts (5-8) to form a spectacle frame (4) by soldering. The invention provides for a workpiece holder (1) into which a form (3) of a spectacle frame (4) which is open at...
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WO/1998/030351 |
When a soldering iron is used to subject a work to soldering while blowing a high temperature gas flow against that portion of the work, which is to be soldered, a tip end of the soldering iron jets a main heating gas flow of a sufficien...
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WO/1998/030352 |
When soldering is carried out by using a soldering iron and by blowing a high temperature gas stream to a to-be-soldered portion of a work, a main heating gas stream having a high temperature sufficient to melt and soften the solder is j...
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WO/1998/026894 |
This device comprises means (14) for maintaining the object (4), means (16) for moving these maintaining means, a tank of liquid (18), means for applying liquid to the object which communicate with the tank and means (22) for moving the ...
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WO/1998/025725 |
The invention concerns a soldering/unsoldering arrangement (1), in particular for integrated circuits (2) with electrical/electronic components (3). The soldering/unsoldering arrangement (1) comprises a heater nozzle (6) with a substanti...
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WO/1998/017431 |
The invention relates to a method for producing a metal honeycomb body (1), consisting of at least partly structured rolled, stratified or looped laminated sheets (2, 3). In accordance with the invention, at least the structured laminate...
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WO/1998/016323 |
In a device for ejecting small amounts of a liquid material having accurately defined volumes from a chamber (1), the chamber has a nozzle aperture (7) and a rod (9) is mounted in or attached to a wall of the chamber (1), so that an end ...
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WO/1998/008644 |
A stripe terminator (18) includes a carrier plate (20) for carrying a matrix of chips (12), a carrier plate shuttle (22) for longitudinally transporting the carrier plate (20) along guide rails (24), a paste platen (26), a doctor blade f...
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WO/1997/047422 |
A first electromagnetic induction pump (46) is provided vertically along a longitudinal plate portion (35) on a work carry-in side in a vessel body (33), which receives therein a brazing fill metal (32), and a second electromagnetic indu...
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WO/1997/047424 |
A first electromagnetic induction pump (46a) is provided vertically on a work carry-in side along a longitudinal plate portion (35a) disposed on the work carry-in side in a first vessel body (33a), which receives therein a brazing fill m...
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WO/1997/047423 |
A first electromagnetic induction pump (46) composed of a plurality of electromagnetic induction pumps (46a, 46b) arranged in a widthwise direction of a work (P) is provided vertically along a longitudinal plate portion on a work carry-i...
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WO/1997/045867 |
A conductive polycrystalline diamond film having a specific resistance of 1x10-4 to 1x103'OMEGA'cm and a thickness 1-500 'mu'm is formed on the surface of a substrate used for contact bonding, the opposite surface of the substrate, or tw...
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WO/1997/043071 |
An apparatus for dispensing solder includes a nozzle body (10) having a plurality of flow channels (12) formed therein. Each flow channel (12) includes an inlet end (14) and a dispenser end (16) for dispensing solder. The nozzle body (10...
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WO/1997/038265 |
A soldering iron (1) comprises a soldering head (4) connected to a handle (2). A cylindrical catalytic element (20) located in a combustion chamber (8) converts gas to heat for heating a soldering tip (15). An electrode (40) located with...
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WO/1997/036710 |
A solder dispensing apparatus for depositing fluid solder into and around a pin-in-through-hole joining zone of an electronic circuit board which comprises: a valve assembly defining a valve chamber (15) with an inlet (17) and an outlet ...
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WO/1997/026108 |
The invention concerns a soldering iron with a housing for at least one heating device and a soldering iron tip which is releasably attached to housing. The heating device is provided with a heat-conducting contact surface located on the...
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WO/1997/025152 |
A simple yet highly reliable technique for ejecting a droplet of heated solder, or other liquid conductive material, is described. Small droplets of an electrically-conductive liquid are ejected on-demand from a drop generator (100) oper...
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WO/1997/025175 |
Depositing a selected pattern of solder droplets (14) onto a substrate (22) on which one or more electronic components are to be mounted, the substrate (22) being mounted on a substrate support (46) and moved relative to a solder ejector...
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WO/1997/018054 |
Apparatus and methods for dispensing droplets of liquid or viscous material are disclosed. A valve is opened to dispense a stream of the heated liquid or viscous material through an elongated orifice of a nozzle. The stream of material b...
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WO/1997/017191 |
The invention relates to a device for singular application of joint material deposit (30), in particular soldering globules, from a joint material reservoir (11) with application means (13) and means (12) for the isolation of joint mater...
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WO/1997/007924 |
The invention relates to an apparatus for subjecting objects to processes, wherein the apparatus comprises: a plurality of chambers which are each adapted to contain at least one object; and processing devices for processing objects pres...
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WO/1997/007542 |
A method of making low and high mass assemblies at surface mount profile conditions utilizing a solder paste have a binder comprised of a thermosetting resin and cross-linking agent that also acts as a flux is described. The method of se...
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WO/1997/003784 |
An assembly of disc-shaped thermistors, in which first and second thermistors (24, 26) rest on respective fulcrums (20, 22) on a first contact (18), and a third thermistor (28) rests on the first two thermistors (24, 26), with a second c...
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WO/1997/000752 |
A gas knife cooling system for reflow soldering cools soldered articles (12) by impinging a gas flow directly on the articles and as a result uses less cooling gas. A heater (32) is associated with the cooling system to remove flux depos...
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WO/1996/041699 |
A device for manufacturing solid spheres such as solder spheres having a high sphericity and a high dimensional accuracy without the necessity for classification of solid spheres. The device comprises a flat plate having a plurality of h...
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WO/1996/038253 |
The soldering paste (1) is applied by means of a doctor blade (4, 8) via a template (2) disposed on the printed circuit board (3). The object of the present invention is to propose a suitable checking device which ensures that the produc...
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WO/1996/025264 |
A surface mount device desoldering and removal tool (10) including a flexible carrier plate (12) and a plurality of heated legs (14) attached to the flexible carrier plate (12) for contacting the leads (52) of an electrical component (50...
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WO/1996/023616 |
A device and method for attaching, or for removing, a solder-connected component to, or from, a circuit board. A direct contact heater mounted for movement on upper housing (200) and including laterally sliding housing (300) and a vertic...
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WO/1996/019312 |
A method for making bicycle frames from tubes made of a light non-ferrous material by preassembling the various elements and joining them together by braze welding in a salt bath. The basic tubes (1, 2, 3, 4, 5, 6, 7) are mutually arrang...
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WO/1996/014647 |
A connecting pin (10) of a coil, on the end section (11) of which is wound an end section (12) of a multi-turn winding, is first given a drop of fluxless soft solder (14) and then arranged near the points of two opposite electrodes (2, 3...
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WO/1996/010467 |
There are prior art manual soldering tools (1) consisting of a heat-insulating handle (2), a soldering tip (4) and a heating device (3) generating the soldering temperature. Here, in order to allow single-handed operation, there are acce...
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WO/1996/009121 |
Apparatus and methods for making uniformly-sized and predictably-spaced droplets from high-temperature liquids. Liquid droplet generators having electromechanical driving elements (16) are coupled to a power supply (17) to apply pulsed e...
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WO/1996/008338 |
A process and device are disclosed for applying a bonding material (11) in the form of discrete measures, in particular globules, to a substrate connection surface (12). In the proposed process, the bonding material is taken up by a plac...
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WO/1996/008336 |
A method for manufacturing metallic structures, in particular honeycombed bodies, especially for catalytic converters, from at least partially structured, wound up, intertwined or layered sheet metal layers, comprises the following steps...
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WO/1996/005014 |
A soldering tip comprising 50-95 weight percent uncoated copper particles and 5-50 weight percent iron particles is prepared by a method in which the particles are compacted, sintered and shaped into a soldering tip. The soldering tips a...
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WO/1996/002348 |
A flat tube brazing method for a laminated heat exchanger, having the steps of laminating a plurality of solder-clad flat tubes (2) via fins (3), inserting both end portions of a flat tube or at least one end portion thereof into a tube ...
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