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WO/2012/013437 |
The invention relates to a method for stabilizing a concentration (10) of a constituent, in particular a Cu concentration (10), in a solder bath (34). The removal of the constituent from the solder bath (34) by attachment to the componen...
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WO/2012/011699 |
The present invention relates to a pencil-type solder, and the pencil-type solder of the present invention comprises: a soldering unit (50), into which a lead wire (3) is inserted, for heating the inserted lead wire (3) and discharging s...
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WO/2012/011698 |
The present invention relates to an arm-type solder for a connector, and the arm-type solder for the connector, according to the present invention, comprises: a coil portion (10) which encircles the outer circumferential surface of a soc...
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WO/2011/135737 |
Disclosed are a heating apparatus and a cooling apparatus, whereby a whole printed substrate can be uniformly and stably heated or cooled without minutely increasing or reducing the temperature of the printed substrate while the printed ...
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WO/2011/128624 |
An apparatus (10) for the production of brazed aluminium products on a continuous flow basis comprises, in sequence, a flux application zone (12), a tunnel furnace (14), a cooling zone (15, 16) and a transportation means (25) for conveyi...
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WO/2011/125324 |
Disclosed is an apparatus (1) for manufacturing a heat exchanger which is provided with: a core tube (2); a winding tube (3); a rotating mechanism (10), which rotates the core tube (2) in the circumferential direction, said core tube bei...
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WO/2011/113703 |
The invention relates to a method for monitoring a performance of a jetting device, the jetting device being configured to expel droplets of an electrically conductive fluid wherein at least a part of the conductive fluid is positioned i...
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WO/2011/116093 |
A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e...
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WO/2011/116093 |
A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e...
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WO/2011/105034 |
Disclosed is a soldering apparatus wherein, on the outer side of a jetting nozzle (303), which jets a molten solder pressure-fed from a solder bath (102) storing the molten solder, a solder drawing member (402) is removably attached, sai...
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WO/2011/104229 |
The invention relates to a method for applying soft solder (4) to a mounting surface (10) of a component (11), wherein a) a connecting means (1) comprising a carrier layer (2) and a soft solder layer (4) formed by physical vapor depositi...
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WO/2011/090031 |
Disclosed is a solder powder adhering apparatus, which finely adheres a solder powder to an electronic circuit board. Also disclosed is a method for adhering the solder powder to the electronic circuit board. The apparatus for adhering t...
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WO/2011/076402 |
The invention relates to a pipe having a relatively high wall thickness and relatively large diameter, comprising a wall composed of at least two layers made of at least one first and one second metal sheet (1, 2), which are adhesively b...
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WO/2011/071041 |
Disclosed is a reflow furnace wherein, in order to prevent a vaporized flux from being adhered and solidified on motor rotating shafts for rotating fans disposed in a preheating zone, a main heating zone, and a cooling zone, the vaporize...
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WO/2011/063526 |
A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for clea...
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WO/2011/063526 |
A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for clea...
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WO/2011/064239 |
The invention relates to a method (18) for quantitatively determining flux material residues remaining on a heat exchanger (3) after a preceding soldering process. To this end, a fluid is applied to the heat exchanger (3), wherein the re...
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WO/2011/049187 |
Disclosed are a soldering device and soldering method whereby it is possible to can solder a tab lead to a solar battery cell in a short time without damaging the solar cell. The soldering device (100), which is used to solder a tab lead...
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WO/2011/040890 |
A self-illuminating soldering iron comprising on the one hand a grip (1) together with a soldering tip (2), and on the other hand a depositing support (3), which is adapted for depositing said grip (1) together with the soldering tip (2)...
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WO/2011/040313 |
A semiconductor chip (40) is bound to one main surface of an insulating substrate (60). A metal base plate (50) is bound to the other main surface of the insulating substrate (60). Subsequently, a resin case is fixed to the peripheral pa...
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WO/2011/036948 |
A nozzle for a heating device provides an improved heat exchange rate (heat transfer coefficient) without an increase in the output of a fan motor. Gas which is heated by a heater section or gas which is cooled by a cooling section is de...
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WO/2011/037529 |
A method for controlling a brazing process, including the steps of applying a welding current through an electrode (52) pressed to a metal surface (83) of a workpiece to form a welding arc. Further steps are continuously measuring the we...
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WO/2011/029907 |
The invention relates to a method for assembling at least two plates (2) using a brazing process, said plates (2) being separated by a filler material (3) situated therebetween. Said method comprises the following steps: - placing said t...
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WO/2011/026761 |
The invention relates to a device (1) for supplying inert gas in order to protect the surface (13) of a solder bath (12) in a wave soldering installation (11) against oxidation. The device (1) is in the form of a cover (2) which can be a...
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WO/2011/024813 |
Disclosed is a heating and melting treatment device which is capable of directly cooling an object to be treated, and which eliminates the need to dispose an additional cooling plate. Specifically disclosed is a heating and melting treat...
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WO/2011/022514 |
The present disclosure provides a solder dross removal apparatus (10) and methods useful for collecting and treating metal oxides (dross) formed in a soldering process, as well as for reclaiming solder from the dross. Among numerous othe...
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WO/2011/012175 |
A soldering apparatus for connecting solar cells (1) includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an ind...
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WO/2010/149189 |
According to the invention, the solder rod (22) comprises a stop-off (25) at the end (28) so that the solder cannot drip from an opening.
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WO/2010/147170 |
In brazing of a semi-sealed heat exchanger, while performing preferable brazing by applying a flux into a refrigerant chamber, brazing environment contamination due to dropping of the flux is minimized. In a brazing method for a heat exc...
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WO/2010/144823 |
A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package subs...
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WO/2010/142725 |
The invention relates to a brazing crucible intended for a device for the partial brazing of electronic components through-mounted on a printed circuit, characterised in that said crucible is shaped as a right prism, preferably with a he...
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WO/2010/136259 |
The invention relates to a hand tool (1) including a regulator (3) and a system (2) for controlling the temperature of the regulator (3), wherein the system (2) for controlling the temperature of the regulator (3) includes a fluid circul...
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WO/2010/137616 |
A joined body comprising a first material (1) comprising a sintered body of a super-hard alloy and a second material (3) comprising a sintered body of cBN or a sintered body of diamond, wherein the first material (1) and the second mater...
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WO/2010/131751 |
Flux is supplied to the entire interior of a through-hole provided in a printed substrate, and the area coated by the flux is increased. A first and a second nozzle (11, 12) are adjacent to each other in the X direction, and so that the ...
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WO/2010/131752 |
Provided are a jet solder bath and a soldering apparatus, wherein an liquid level error can be reduced and soldering failures can be eliminated. An operating unit sets the liquid level of a melted solder (20). An arm (81) is at a level t...
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WO/2010/120836 |
A heating apparatus (20) for induction heating is disclosed. The heating apparatus may comprise a bearing ring (32), at least one bearing element (74) disposed in the bearing ring (32), and a braze material (80) adjacent to the at least ...
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WO/2010/116750 |
A high-frequency induction heating system for a soldering iron includes a power assembly capable of supplying power with various voltages and frequencies. A control assembly supplies power to a coil with voltages including the voltage ra...
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WO/2010/116664 |
A solder bath, inside which a primary jet nozzle and a secondary jet nozzle are disposed, is filled with molten Sn-Ag-Cu solder; the primary jet nozzle spouts molten solder in a disturbed state and the secondary jet nozzle spouts molten ...
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WO/2010/114482 |
The long thermode assembly for precision thermal bonding, comprises of a heating element, a thermally stable rigid electrical insulator pressure pad held by a rigid bar, air nozzle for cooling and maintaining the overall temperature of t...
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WO/2010/108284 |
A thermode comprising: a shank; a tip; and a transition zone between the shank and the tip, the transition zone configured to provide resistance gradients to improve containment of heat in the tip. The thermode may also include an integr...
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WO/2010/103861 |
A method of soldering an electronic component, which is free of leftover solder existing between electrodes and allows a suitable amount of liquid solder to stick to the electrodes. A chip coil (1) is supported above the liquid solder su...
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WO/2010/102182 |
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relat...
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WO/2010/099851 |
The invention relates to a soldering head having two soldering electrodes made of an electrically conductive material for soldering solder contacts having low mass to the silver imprint of auto glass panes, wherein the two soldering elec...
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WO/2010/098921 |
High speed autofocus intereferometric inspection systems and methods are discussed in this Application. In accordance with some embodiments, an inspection system can generally include a laser module, an interferometer module, and a syste...
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WO/2010/098921 |
High speed autofocus intereferometric inspection systems and methods are discussed in this Application. In accordance with some embodiments, an inspection system can generally include a laser module, an interferometer module, and a syste...
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WO/2010/093031 |
A method of using a solder transfer sheet, which does not require position alignment, to form solder bumps on electrodes of a printed circuit board without forming a bridge. The solder transfer sheet comprises a support base on at least...
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WO/2010/088499 |
A method for attaching a fusible member (6) to a flexible circuit board (1) includes providing the flexible circuit board (1) including an electrode (3) and a hole (4) near each other, placing the fusible member (6) in the hole (4), and ...
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WO/2010/088499 |
A method for attaching a fusible member (6) to a flexible circuit board (1) includes providing the flexible circuit board (1) including an electrode (3) and a hole (4) near each other, placing the fusible member (6) in the hole (4), and ...
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WO/2010/087341 |
The height of molten solder which is jetted from the tip of a nozzle is made uniform. A bath body (2) contains molten solder (20), a pump pressure-feeds the molten solder (20) contained in the bath body (2), a first duct (4) guides the m...
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WO/2010/084946 |
Disclosed is a soldering device provided with a soldering tip having a front end and rear end. A blind bore is formed at the rear end of the soldering tip. An accommodating recess is formed at the bottom of this bore. A heater is arrange...
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