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Patent Searching and Data


Matches 1 - 50 out of 15,597

Document Document Title
WO/2019/217535A1
An exhaust gas filter for a reflow oven is disclosed, which comprises a filter chamber, a filtering piece and a vapor chamber. An upper transverse passage is formed between the vapor chamber top plate and the filter element, a gap is for...  
WO/2019/213059A1
Systems for soldering a workpiece;(2) using a solder application system. A nozzle (30) includes a plurality of walls (46, 56) and a floor that together define a nozzle (30) reservoir for containing liquid solder. The plurality of walls (...  
WO/2019/213512A1
A soldering tool may include a power unit including a controller, a tool body configured to interface with the power unit, and a tip portion operably coupled to the tool body. The tip portion may include a tip that is heated to melt sold...  
WO/2019/209070A1
The present invention particularly relates to an apparatus (1) for thermally coupling a vehicle heat exchanger. The apparatus (1) is provided with a first holding element (2), a second holding element (3) and one or more heat source (7)....  
WO/2019/196327A1
A nickel brazing production line and process for a plate heat exchanger. The nickel brazing production line for a plate heat exchanger sequentially consists of a roll coater (1), a first tunnel oven (2), a comma coater (3), a second tunn...  
WO/2019/195249A1
A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion in...  
WO/2019/190475A1
A system for manufacturing of a sintered wire and in-situ feeding to a laser wire welding system is presented. The system includes a pressure vessel connected to a powder feed system for delivering at least two powders to a powder mixing...  
WO/2019/174929A1
The invention relates to a wave-soldering machine (10) comprising a pump (12) for delivering liquid solder in a solder delivery system, comprising at least one solder nozzle (14) into which the liquid solder is delivered in order to prod...  
WO/2019/170535A1
The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and wi...  
WO/2019/170212A1
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder...  
WO/2019/165662A1
A self-cutting welding terminal assembly for enameled wires, the self-cutting welding terminal assembly comprising a connection terminal, the connection terminal is provided with a terminal input end (1) and a terminal output end (2), so...  
WO/2019/165450A1
Systems and methods are provided for assembling an RFID device mounted to a fabric substrate via a "flip chip" approach. The system includes a pin thermode with a tip configured to penetrate the fabric substrate. The pin thermode may inc...  
WO/2019/156954A1
The present application relates to a soldering machine comprising a nozzle (50) having an outer surface defining an opening from which solder is configured to be dispensed; a dispenser (91) having an orifice and a valve (95) that is conf...  
WO/2019/151315A1
A brazing method in which brazing is performed without using flux, wherein the method is characterized in that brazing is performed in an inert gas atmosphere in a state in which: a body to be brazed is covered by a cover member (1) comp...  
WO/2019/150899A1
This manufacturing device is provided with: a preheating member (10) for preheating a workpiece (52) that is in contact therewith; a melting heating member (12) provided downstream of the preheating member (10) in a feed direction; and a...  
WO/2019/140846A1
A parent-child set of tin tanks comprises a parent tin tank (151), a child tin tank (152) and a lifting device. The parent tin tank has a cavity for accommodating molten tin. The child tin tank is provided inside the cavity and is driven...  
WO/2019/140842A1
A rosin recycling system comprises: a rosin recess (20) and a rosin tank (10) which are disposed one above the other; and a power device. A lower end of one side of the rosin tank is provided with a liquid outlet pipe (14) connected to a...  
WO/2019/140840A1
A flexible soldering device comprises an elastic slide mechanism (1) and an electric soldering iron assembly (2). The elastic slide mechanism (1) comprises an installation plate (11). The electric soldering iron assembly (2) is installed...  
WO/2019/140841A1
A flexible solder icicle pressing device comprises a frame (5). A solder icicle pressing assembly (1) and an ejection plate assembly (6) are installed at the frame. The solder icicle pressing assembly comprises an installation plate (12)...  
WO/2019/140832A1
A lead-wire soldering device for a transformer comprises a workbench (1) and a plurality of soldering modules (2). The plurality of soldering modules (2) are uniformly arranged in a circumferential direction of the workbench (1). An elec...  
WO/2019/128067A1
Disclosed is a vacuum soldering furnace control system, comprising a control module and a carrying mechanism (2). A vacuum soldering furnace comprises a soldering chamber (18), a soldering platform (20) arranged at a lower portion of the...  
WO/2019/128063A1
A handling mechanism of a vacuum brazing furnace, comprising handling rods (24), and a lifting and lowering mechanism, a translation mechanism, and an opening and closing mechanism which are provided at the lower side of a brazing chambe...  
WO/2019/131080A1
The present invention curbs unsoldered areas by the ample wetting of a molten solder within a through hole of a substrate, even where an electronic component requiring a high heat capacity is being soldered onto the substrate. A jet sold...  
WO/2019/128064A1
A vacuum welding furnace, comprising a welding chamber (18), a furnace cover (4), a transportation mechanism (2), and a negative pressure suction module (9) arranged on the furnace cover (4), the furnace cover (4) covering the upper side...  
WO/2019/128065A1
A welding mechanism of a vacuum welding furnace, comprising a welding chamber (18) and a furnace cover (4) on an upper side of the welding chamber (18), a welding cavity being provided between the furnace cover (4) and the welding chambe...  
WO/2019/128068A1
Disclosed is a vacuum soldering furnace, comprising a soldering chamber (18), a furnace cover (4) and a carrying mechanism (2), the furnace cover (4) covering an upper side of the soldering chamber (18), a soldering cavity being formed b...  
WO/2019/117838A1
The invention is a line type soldering system (L) for use in soldering processes, comprising at least one transformer (2) to supply required energy, at least one processor (3) controlling required parameters such as heat, time during sol...  
WO/2019/108508A1
Methods and apparatus for applying molten solder are disclosed. A system for applying solder to a workpiece includes a conveyor for moving a first workpiece along a machine direction, and a first selective soldering nozzle to apply solde...  
WO/2019/093232A1
This flux collecting device (10) comprises: a stage (12) having a recessed portion (13) for collecting flux (51); a flux pot (20) which is an annular member having a through hole (21) into which the flux (51) is introduced, which recipro...  
WO/2019/042050A1
A brazing crucible. The brazing crucible comprises a base portion made of a first material and a brazing portion made of a second material which is different from the first material. The base portion and the brazing portion together defi...  
WO/2019/032418A3
Provided in the present application are a solder paste addition device capable of automatically removing residual solder paste, and a solder paste nozzle and a worktable thereof. The device comprises a solder paste nozzle and a worktable...  
WO/2019/040284A1
The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflo...  
WO/2019/032418A2
Provided in the present application are a solder paste addition device capable of automatically removing residual solder paste, and a solder paste nozzle and a worktable thereof. The device comprises a solder paste nozzle and a worktable...  
WO/2019/031484A1
This soldering iron control device (100) can be electrically connected to a soldering iron (200), and controls the temperature of a bit (221) of the soldering iron (200). The soldering iron control device (100) comprises a storage unit (...  
WO/2019/032417A1
The present application provides a solder paste addition device capable of automatically removing residual solder paste. The device comprises a worktable and a solder paste nozzle. The worktable is used for carrying the solder paste nozz...  
WO/2019/011687A1
The invention relates to a soldering system and a method for wave soldering, comprising at least one flux nozzle (16) and a device (10) for monitoring a state of a spray jet (12) of said flux nozzle (16).  
WO/2019/011686A1
The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, co...  
WO/2019/011132A1
A micro-region semi-solid additive manufacturing method. A rod-shaped material is used as a consumable material; heating modes such as high energy beams, electric arcs and resistance heat are used to act on the front end of the consumabl...  
WO/2019/011675A1
A jetting device that is configured to jet droplets of a viscous medium through a jetting outlet of the jetting device on to a substrate may include a gaseous flow control element that may be controlled to control a flow rate of a gaseou...  
WO/2019/007900A1
The invention relates to a method for operating a soldering system for selective wave soldering comprising at least solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump be...  
WO/2018/220320A1
Heating device (10) suitable for heating at least one solder spot positioned between an electronic component (8) including at least one first pad (8_1) and a printed circuit board (4), the solder spot both rigidly connecting the electron...  
WO/2018/189586A3
The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the...  
WO/2018/217051A1
The present invention relates to a method for manufacturing a device for cooling an electric car battery and, more particularly, to a method for manufacturing an electric car battery cooling device wherein a flux is applied to an upper c...  
WO/2018/214373A1
A storage container for a photovoltaic ribbon, the storage container comprising a main container member (1) and an upper container member (2). An upper side of the main container member (1) is hinged to a lower side of the upper containe...  
WO/2018/210844A1
The invention relates to an assembly (100) for applying solder in the form of solder balls (12) to a substrate (104), the assembly containing a reservoir (14) comprising a plurality of solder balls (12); a discharge opening (26) for disc...  
WO/2018/208095A1
Provided is a laser machining apparatus comprising: a head part for emitting an inspection light to an object; and a control part for matching surface information of a pre-inputted area to be soldered and surface information acquired by ...  
WO/2018/208097A1
Provided is a laser processing method capable of: loading an object on a jig; detecting and pre-inspecting an alignment state including the rotation and the arrangement of the object loaded on the jig; moving the jig to a soldering locat...  
WO/2018/208096A1
Provided is a jig assembly comprising: a jig having a mounting part on which an object can be mounted; and a close attachment part coupled to the jig, and maintaining the object so as to be fixed in the mounting part, wherein the jig and...  
WO/2018/202920A1
The invention relates to a soldering device (50) for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B),...  
WO/2018/202919A1
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber sealed from the surroundings, by heating and melting solder material (16) which is arranged between the...  

Matches 1 - 50 out of 15,597