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Matches 1 - 50 out of 15,012

Document Document Title
WO/2017/122864A1
Disclosed are an apparatus for inspecting and replacing expendables and a solder ball application apparatus comprising same. Provided according to one embodiment of the present invention is an apparatus which is used for an apparatus for...  
WO/2017/109933A1
A heat exchanger comprising: a plurality of flattened pipes having a flattened cross-section; and a plurality of flattened U-bend pipes having a flattened cross-section and a U-shaped appearance . A plurality of rows of flattened pipes a...  
WO/2017/102213A1
The invention relates to a pipette for equipping a circuit card (2) with solder paste (3), said pipette comprising a tubular body (4) for digging out a defined portion of the solder paste (3) from a solder paste supply (5), a plunger (6)...  
WO/2017/104745A1
A fluid discharging method for applying fluid to inside a mask upon a workpiece for an electronic component, wherein a fluid discharging device comprising a head unit that is smaller than the workpiece and that is provided with a dischar...  
WO/2017/093388A1
An apparatus for holding a printed circuit board when mounting components thereon, said apparatus comprising a base plate, a mounting means for mounting a printed circuit board spaced from and substantially parallel to the base plate, a ...  
WO/2017/073299A1
[Purpose] The present invention relates to an ultrasonic soldering method and an ultrasonic soldering device. The purpose of the present invention is to make it possible to solder a section to be soldered to an electrode or similar that ...  
WO/2017/057651A1
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used toge...  
WO/2017/050530A1
A strip solder advancement system for advancing a single solder strip is improved in such a way that it allows the process to be condensed. Proceeding from said strip solder advancement system, system components are modified in such a wa...  
WO/2017/049511A1
A vacuum reacting force welding method, comprising the following steps: a chip being die-bonded onto a substrate by means of a solder to form a semi-finished product (16); the semi-finished product being placed within a vacuum eutectic c...  
WO/2017/038282A1
To provide a heater chip having an iron part with superior conductivity and heat generating properties, said heater chip being capable of performing processing for bonding conduction wires and terminal members efficiently, stably, and re...  
WO/2017/020564A1
A DC heating circuit comprises a triode, a diode, an inductor, a first capacitor, a second capacitor, and a heating wire. A source of the triode is grounded. A drain of the triode is connected to a positive electrode of the diode and one...  
WO/2016/202327A1
The invention relates to a calibration method for a bonder, wherein characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during productive operation o...  
WO/2016/192231A1
Provided is a preparation method for an alloy material suitable for use in a soldering iron tip. The preparation method comprises the following steps: step 1, taking a copper with a purity of 99.3% or more and an iron with a purity of 99...  
WO/2016/189254A1
The present invention relates to a method for manufacturing a titanium aluminide blade of a turbine engine, comprising steps of: (E1) production of a titanium aluminide ingot, (E2) extrusion of the ingot through an opening in a die havin...  
WO/2016/189902A1
Provided are a soldering device and a flux applying device that use a nut which is configured such that the nut is attached to the soldering device and the flux applying device and a fixed position of the nut can be changed more easily t...  
WO/2016/187010A1
A liner (92) for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate (94) having a length and a width defining an area. The substrate (94) has a thickness defined by first and second sides. An adh...  
WO/2016/176865A1
Disclosed is a butt welding machine, comprising a machine table, and a clamp device and a welding machine which are provided on the machine table. The clamp device comprises a first chuck device, a second chuck device, at least one biasi...  
WO/2016/169551A1
The device according to the invention is used to cool a flat object (2) with a first main surface (200) and a second main surface (202) lying opposite the first main surface in a nonhomogeneous manner. The flat object is cooled from the ...  
WO/2016/153017A1
A soldering device (A) comprising a soldering tip (5) which is heatable and which has a substantially cylindrical shape extending vertically, and solder-piece supplying units (2, 6) that supply a solder piece (Wh) from above into the ins...  
WO/2016/148126A1
The present invention has a vertically extending heatable iron tip (5) of substantially tubular shape, and a solder piece supply section for causing a first solder piece (Wh1) and a second solder piece (Wh2), which are provided with a la...  
WO/2016/143771A1
Bottom surfaces of stepped portions of corrective rings arranged at ends (2) positioned at either side of a barrel (1), and back surfaces of projections of the ends (2) are brought into contact. A control unit (10A) provided to a pressur...  
WO/2016/144714A3
A honeycomb extrusion die (100), a method of making the same, and an apparatus for forming the same. The die (100) includes: a feed hole plate (202) comprising an input surface (202A), an opposing output surface (202B), and feed holes (1...  
WO/2016/135634A1
A control system for a fluxer, the control system comprising: a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank; a pulse- width-modulated (PWM) valve coupled to the variable speed pump; a...  
WO/2016/135891A1
This soldering apparatus is provided with: a solder bath (12) for storing a molten solder; a jet nozzle (14) extending upward from the solder bath toward a holding surface (45); a pump (16) that pumps a molten solder (46) stored in the s...  
WO/2016/127715A1
A gas floating rotary reflow soldering device, comprising a rotary table (8), a heating plate (14), a limit plate (16), a furnace body, a furnace door (4), a furnace cover, a rotating speed adjustment device (7), a temperature controller...  
WO/2016/126463A1
The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the...  
WO/2016/119118A1
Disclosed is an electronic module repairing method for repairing a failed electronic module. The electronic module repairing method comprises the following steps: fixedly connecting a suction device with a second bottom plate, so that wh...  
WO/2016/117357A1
Provided are: a heat exchanger that suppresses electrical corrosion and makes it possible to strongly fix a plurality of components; and a method for producing said heat exchanger. A plurality of aluminum communication pipes (25a-25j) ar...  
WO/2016/114263A1
This soldering iron (1) is designed to melt solder with the distal end (10a), and has an iron tip (10) provided at the basal end (10b) with a first terminal (24), and an iron base (50) housing a second terminal (61) capable of fastening ...  
WO/2016/114275A1
In the prior art, as the amount of a fluid discharged by a fluid discharge device becomes more minute, defects occur in which the fluid does not fill in a mask even when discharged. In order for the fluid to fill in a work piece, air in ...  
WO/2016/112375A1
The preparation and use of particulate metallic solder alloy having particles of a single chemical composition is described. The particles of the particulate metallic solder alloy have a bimodal size distribution in which particles in a ...  
WO/2016/104231A1
 This soldering device (X) is provided with at least a first soldering iron part and a second soldering iron part, which serve as soldering iron parts, each comprising a substantially cylindrical soldering tips (51) having a supply hol...  
WO/2016/103526A1
A soldering flux includes rosin, a thixotropic agent, an activator, an antioxidant and a solvent, in which rosin ester is included as the rosin, a content of the rosin ester is set in a range of 20 mass% to 50 mass% with respect to the e...  
WO/2016/104710A1
Provided is a heating and cooling device which is capable of performing heating and cooling processes within an airtight processing chamber, and which enables size reduction of the device, while increasing the heating and cooling efficie...  
WO/2016/104658A1
Provided are a high-sphericity joining member, a solder material, a solder paste, a foam solder, a flux coating material, and a solder joint. This Ni-plated Cu ball 10 is provided with a Cu ball 12, and an Ni plating layer 14 covering th...  
WO/2016/097634A1
The present invention relates to a brazing tool (20) for producing a part (30), and in particular to a tool (20) suitable for brazing a set (30) of metal parts, in particular a composite panel, in a chamber of a brazing furnace, the tool...  
WO/2016/091250A1
The invention relates to a cooling device for cooling down liquid solder (4) for producing a soldered connection between a first and a second element (2, 3), between which the liquid solder (4) is arranged, wherein the cooling device (1)...  
WO/2016/091962A1
The invention relates to a heat transfer device (10, 110, 210) for thermal coupling of a component (28, 128) to be soldered, comprising a heat source and/or a heat sink (48) in a soldering machine (200), having at least one base plate (1...  
WO/2016/075982A1
A flux reservoir device (100, 200) includes: a stage (12) having a recess (13) in which flux (51, 52, 53) is reserved; and a flux pot (20), which is a ring-shaped member having a through-hole (30) into which the flux (51, 52, 53) is pour...  
WO/2016/075934A1
A soldering correction device provided with: an external-appearance inspection device for inspecting soldering defects relating to a workpiece on which a component is mounted, and storing information about the soldering defect locations;...  
WO/2016/068081A1
In the present invention, a joint is formed from a first metal member 2 and a second metal member 3. Brazed joint portions 14, 24, 34, and 44 provided intermittently with a brazing material and solder joints 16, 26, 36, and 46 filling th...  
WO/2016/062978A1
The invention relates to a method for producing a final metal part for a nacelle of a turbojet (4), comprising brazing at least two parts, one being an inner part (5) having an inner surface and the other being an outer part (6) having a...  
WO/2016/053078A1
The present invention relates to a dross removal apparatus (1) and method to transfer and collect dross or oxidized solder to a collection chamber of a soldering machine therefrom, comprising front declination plate (11), hingable declin...  
WO/2016/047733A1
[Solution] A solder tip used to join together a terminal and an electroconductive film formed on a glass substrate, wherein the solder tip has a first surface in surface contact with a surface of the electroconductive film facing the ter...  
WO/2016/044680A1
A self-contained speed indicator (10) that can be placed next to a weldment (11) and configured for a desired speed, which then provides a target speed indicator (10) to help a welder (14) practice maintaining that desired speed.  
WO/2016/039057A1
A metal paste containing a metal component and a flux is prepared. The metal component is composed of a first metal powder and a second metal powder. The first metal powder is Sn. The second metal powder is a CuNi alloy. Next, the metal ...  
WO/2016/034395A1
Disclosed is a hard soldering method wherein an amorphous or partially amorphous hard soldering film having a composition that has a metalloid content of 10 to 30 atomic percent is disposed at a joining point between two or more parts. T...  
WO/2016/028407A1
A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station co...  
WO/2016/015188A1
A solder-reinforced bonding system comprises a first substrate (110), a second substrate (120) at least partially in contact with a heating element (400), an adhesive (200) in contact with a first contact surface (115) of the first subst...  
WO/2016/017027A1
The invention provides a dip flux unit (1) and a squeegee position correcting method capable of improving the accuracy with which a squeegee (2) is positioned. The dip flux unit (1) is provided with the squeegee (2), a squeegee position ...  

Matches 1 - 50 out of 15,012