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Matches 1 - 50 out of 15,487

Document Document Title
WO/2019/108508A1
Methods and apparatus for applying molten solder are disclosed. A system for applying solder to a workpiece includes a conveyor for moving a first workpiece along a machine direction, and a first selective soldering nozzle to apply solde...  
WO/2019/093232A1
This flux collecting device (10) comprises: a stage (12) having a recessed portion (13) for collecting flux (51); a flux pot (20) which is an annular member having a through hole (21) into which the flux (51) is introduced, which recipro...  
WO/2019/042050A1
A brazing crucible. The brazing crucible comprises a base portion made of a first material and a brazing portion made of a second material which is different from the first material. The base portion and the brazing portion together defi...  
WO/2019/032418A3
Provided in the present application are a solder paste addition device capable of automatically removing residual solder paste, and a solder paste nozzle and a worktable thereof. The device comprises a solder paste nozzle and a worktable...  
WO/2019/040284A1
The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflo...  
WO/2019/032418A2
Provided in the present application are a solder paste addition device capable of automatically removing residual solder paste, and a solder paste nozzle and a worktable thereof. The device comprises a solder paste nozzle and a worktable...  
WO/2019/031484A1
This soldering iron control device (100) can be electrically connected to a soldering iron (200), and controls the temperature of a bit (221) of the soldering iron (200). The soldering iron control device (100) comprises a storage unit (...  
WO/2019/032417A1
The present application provides a solder paste addition device capable of automatically removing residual solder paste. The device comprises a worktable and a solder paste nozzle. The worktable is used for carrying the solder paste nozz...  
WO/2019/011687A1
The invention relates to a soldering system and a method for wave soldering, comprising at least one flux nozzle (16) and a device (10) for monitoring a state of a spray jet (12) of said flux nozzle (16).  
WO/2019/011686A1
The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, co...  
WO/2019/011132A1
A micro-region semi-solid additive manufacturing method. A rod-shaped material is used as a consumable material; heating modes such as high energy beams, electric arcs and resistance heat are used to act on the front end of the consumabl...  
WO/2019/011675A1
A jetting device that is configured to jet droplets of a viscous medium through a jetting outlet of the jetting device on to a substrate may include a gaseous flow control element that may be controlled to control a flow rate of a gaseou...  
WO/2019/007900A1
The invention relates to a method for operating a soldering system for selective wave soldering comprising at least solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump be...  
WO/2018/220320A1
Heating device (10) suitable for heating at least one solder spot positioned between an electronic component (8) including at least one first pad (8_1) and a printed circuit board (4), the solder spot both rigidly connecting the electron...  
WO/2018/217051A1
The present invention relates to a method for manufacturing a device for cooling an electric car battery and, more particularly, to a method for manufacturing an electric car battery cooling device wherein a flux is applied to an upper c...  
WO/2018/214373A1
A storage container for a photovoltaic ribbon, the storage container comprising a main container member (1) and an upper container member (2). An upper side of the main container member (1) is hinged to a lower side of the upper containe...  
WO/2018/210844A1
The invention relates to an assembly (100) for applying solder in the form of solder balls (12) to a substrate (104), the assembly containing a reservoir (14) comprising a plurality of solder balls (12); a discharge opening (26) for disc...  
WO/2018/208095A1
Provided is a laser machining apparatus comprising: a head part for emitting an inspection light to an object; and a control part for matching surface information of a pre-inputted area to be soldered and surface information acquired by ...  
WO/2018/208097A1
Provided is a laser processing method capable of: loading an object on a jig; detecting and pre-inspecting an alignment state including the rotation and the arrangement of the object loaded on the jig; moving the jig to a soldering locat...  
WO/2018/208096A1
Provided is a jig assembly comprising: a jig having a mounting part on which an object can be mounted; and a close attachment part coupled to the jig, and maintaining the object so as to be fixed in the mounting part, wherein the jig and...  
WO/2018/202920A1
The invention relates to a soldering device (50) for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B),...  
WO/2018/202919A1
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber sealed from the surroundings, by heating and melting solder material (16) which is arranged between the...  
WO/2018/203319A1
A gas powered tool (70) comprising a housing (73) and a soldering tool element (72) releasably coupled to the housing (73). A latching element (105) pivotally mounted on a pivot pin (106) in the housing (73) is retained in a non-latching...  
WO/2018/204561A1
Apparatuses and a method for cleaning a nozzle by removing an accumulation of material from the surface of a nozzle are disclosed. The apparatus includes a dispenser (50) for dispensing a length of wire and a gantry configured to bring t...  
WO/2018/198838A1
A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquir...  
WO/2018/192646A1
The invention relates to a laser brazing system (100), comprising a braze tool (110) having a laser (112) configured to emit a laser beam (114) along a radiation path (RP), and a braze wire tool (120) being configured to guide a braze wi...  
WO/2018/189592A1
The present application provides an apparatus for automatically clearing away residual solder paste, comprising a working platform (150) for bearing a solder paste tub accommodating a solder paste nozzle, the solder paste nozzle having a...  
WO/2018/189586A3
The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the...  
WO/2018/188062A1
A robotic imaging system based on virtual reality technology. A cover ring a (2), a cover ring b (3), and a cover ring c (4) are sleeved in sequence on a photomask barrel (5) by means of screws, and a top sealing ring (1) is fixed to the...  
WO/2018/187537A1
Automation of soldering work may be difficult, in part because present systems may be configured to dispense solder in a uniform preset amount. Provided are systems and methods in which soldering products (such as soldering paste and sol...  
WO/2018/175901A1
An apparatus for wax welding is provided that includes a removable cartridge adapted for operative engagement with a power supply. The removable cartridge includes a tube defining a proximal end portion, a distal end portion, a longitudi...  
WO/2018/171275A1
A mechanism for feeding a busbar (308) comprises a frame (101). A busbar coil (103) is mounted on the frame. A busbar holding mechanism, a busbar cutting mechanism, holding jaws (302), and a busbar transfer mechanism are sequentially dis...  
WO/2018/167209A1
A printhead (1) for a 3D printer, comprising a reservoir (2) for a metal (3), wherein the reservoir (2) has an outlet opening (4) for discharging drops (3c) of a liquid phase (3b) of the metal (3), wherein a displaceably mounted punch (5...  
WO/2018/167232A1
The present invention discloses a fixing system comprising a base (1) and at least one set of clamping devices (2) mounted on the base. Each set of clamping devices includes a first fixture (100), in which a first positioning groove (111...  
WO/2018/167216A1
An automatic solder paste feeding system includes: a base (10); a container (200) mounted on the base and configured to contain solder paste therein; a syringe (100) mounted on the base and configured to inject the solder paste into the ...  
WO/2018/161240A1
An automatic PCB substrate assembly apparatus comprises a support (1). Opposing inner sides of the support (1) are provided with vertical guide rails (9). A mechanical arm is connected below a cylinder (2) and retrieves an electronic com...  
WO/2018/160137A1
An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the ba...  
WO/2018/149959A1
The present industrial property right relates to a method for producing a cooling plate (2a, 2b), to the cooling plate (2a, 2b) as such and to a battery system and an electric vehicle. According the method for the production of the cooli...  
WO/2018/142733A1
Provided is a soldering apparatus whereby work time for soldering can be reduced and non-wetting of solder can be suppressed. A soldering apparatus 100 having a plurality of cylindrical solder-piece guiding pipes 10 having a space throug...  
WO/2018/135149A1
A plate-like member (20) forming a part of a structure (501, 502) has: a first core material layer (21) exposed at a first surface (210) to the outside; a second core material layer (22) exposed at a second surface (220) to the outside, ...  
WO/2018/132532A1
The present application relates to a method and to an apparatus for applying molten solder to a substrate are disclosed. A soldering machine for applying solder to a substrate includes at least one slot soldering nozzle (28) configured t...  
WO/2018/132566A1
The present application relates to a laser brazing system including a torch body (24), a wire feed tip (28), a laser processing head, and a cooling collar (34). The torch body (24) includes nozzle (28), mounting (26), and cooling section...  
WO/2018/132532A8
The present application relates to a method and to an apparatus for applying molten solder to a substrate. A soldering machine for applying solder to a substrate includes at least one slot soldering nozzle (28) configured to apply a wave...  
WO/2018/132566A8
The present application relates to a laser brazing system (20) including a torch body (24), a wire feed tip (28), a laser processing head (32), and a cooling collar (34). The torch body (24) includes nozzle, mounting, and cooling section...  
WO/2018/123261A1
Provided is a jet solder height confirmation jig with which the height of a jet wave of molten solder can be precisely adjusted. Also provided is a method for handling this jig. A jet solder height confirmation jig 100 is equipped with: ...  
WO/2018/117991A1
The invention relates to a method of coating with brazing paste discontinuously and only onto the desired sections on the surface of the fuel rail (1) through the use a roller (9, 11), with a view to join the external elements such as in...  
WO/2018/109463A1
There is provided an applicator device (1) for applying a composition to an end of a pipe. The applicator device comprises an applicator head(3), the applicator head having a cavity (9) with an opening into which the end of the pipe can ...  
WO/2018/096917A1
The purpose of the present invention is to prevent solder from scattering during a reflow process and to reliably remove oxide films formed on surfaces of the solder and an electrode. A soldering method according to the present invention...  
WO/2018/092493A1
Provided is a reflow device that reflow solders a substrate (90) having a first component (91) and a second component (92) which has a greater heat capacity than that of the first component (91). The reflow device comprises: a plurality ...  
WO/2018/088520A1
Provided are a flux applying device and a flux applying method with which flux is applied to one surface of a workpiece and is prevented from moving around to another surface and becoming attached thereto. This flux applying device is pr...  

Matches 1 - 50 out of 15,487