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WO/2020/032964A1 |
A turbine blade airfoil portion having a total length and fixedly attached to a base includes a first portion extending from the base to a repair line such that the first portion has a first length that is shorter than the total length, ...
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WO/2020/033478A1 |
A system and method of purge testing for welding piping, including flowing a purge gas through a test pipe, determining concentration of a gas component in the purge gas discharged from the test pipe, and determining a time period to rea...
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WO/2020/033631A1 |
Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle p...
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WO/2020/031361A1 |
The invention of the present application addresses the problem of providing a lead-free solder alloy, which does not undergo the occurrence of cracking at a solder joint part even under such a severe environment (-40°C to 150°C) where ...
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WO/2020/026385A1 |
The chemical composition of this weld metal, by mass% with respect to the total mass of the weld metal, consists of 0.03-0.15% of C, 0.15-0.80% of Si, 1.2-2.0% of Mn, 0.025% or less of P, 0.020% or less of S, 0-0.050% of Al, 0.005-0.34% ...
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WO/2020/022046A1 |
[Problem] To realize brazing of alumina dispersion strengthened copper. [Solution] GlidCop (registered trademark), which is alumina dispersion strengthened copper, and another metal are prepared, and surfaces thereof to be joined are fin...
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WO/2020/021760A1 |
This method of manufacturing a semiconductor device includes: a step of preparing a second laminate which is obtained by mounting a first laminate on a base substrate via a solder sheet; a step of installing the second laminate inside a ...
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WO/2020/021967A1 |
Provided are a soldering alloy and a solder joint which have high tensile strength and which can suppress Ni erosion while suppressing the occurrence of a void in the joining interface. This soldering alloy has an alloy composition compr...
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WO/2020/017154A1 |
This solder alloy is characterized by having an alloy composition of As: 25-300 ppm by mass, Pb: greater than 0 and less than or equal to 5100 ppm by mass, at least one of Sb: greater than 0 and less than or equal to 3000 ppm by mass and...
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WO/2020/016535A1 |
The invention relates to an assembly method, comprising the following successive steps: a) providing at least two parts (10, 20) made of ceramic materials obtained by sintering non-metallic inorganic powders or a ceramic matrix composite...
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WO/2020/017064A1 |
This composition contains: a metal component which can undergo transitional liquid-phase sintering; and an organic component. The metal component contains: metal particles A having a melting point higher than 300°C; and metal particles ...
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WO/2020/017157A1 |
This solder alloy has an alloy composition of As: 25-300 ppm by mass, Bi: 0-25,000 ppm by mass and Pb: greater than 0 and less than or equal to 8000 ppm by mass, with the remainder consisting of Sn, and satisfies formula (1) and formula ...
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WO/2020/017049A1 |
Provided is a composition containing: a metal component which can undergo transitional liquid-phase sintering; and an organic component. The metal component contains: metal particles A having a higher melting point than 300°C; and metal...
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WO/2020/012925A1 |
The present invention relates to a flux-cored wire for two-phase stainless steel welding that comprises: at least one strong deoxidizing element chosen from the group consisting of Al, Mg, rare earth elements, Ca, Zr, and Ti; and a slag-...
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WO/2020/012226A1 |
The present application concerns an additivated solder paste and a process to apply a reactive additive element for the control of the soldering temperature of electronic components on the reflow soldering method by the use of metallic p...
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WO/2020/007583A1 |
The invention relates to a method for producing a high-temperature-resistant lead-free solder joint (7; 71) between a circuit board (1) and a part (2; 2b), wherein a lead-free solder preform (3; 3b) is used that has a composite material ...
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WO/2020/004543A1 |
Provided are: a low-residue and highly processable flux for resin flux cored solders and flux-coated solders; a resin flux cored solder and a flux-coated solder which use said flux; and a soldering method. The flux for resin flux cored s...
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WO/2020/004510A1 |
A method for producing an anisotropic conductive film, which comprises: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; a containing step wherein at least some of the so...
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WO/2020/006205A1 |
Disclosed herein are embodiments of copper-based alloys. The alloys can comprise hard phases of silicides and can be free or substantially free of Co, Mn, Mo, Ta, V, and W. The copper-based alloys can be used as feedstock for PTA and las...
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WO/2020/004511A1 |
A method for producing solder particles, which comprises: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; a containing step wherein at least some of the solder fine part...
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WO/2020/004513A1 |
The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anis...
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WO/2020/000083A1 |
A system includes a laser welder and a filler wire feed. The laser welder is configured to weld a workpiece to at least one additional workpiece to form a welded assembly. Each of the workpieces is formed from a steel material and compri...
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WO/2020/001418A1 |
A cable-type welding wire, comprising a central welding wire and n peripheral welding wires arranged so as to be spirally wound on the central welding wire, wherein all the peripheral welding wires have a diameter of dex, and adjacent pe...
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WO/2020/004512A1 |
The present invention relates to a solder paste which contains solder particles and a flux. A part of the surface of the solder particles has a flat portion. By using solder particles having a flat portion on a part of the surface thereo...
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WO/2020/002890A1 |
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
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WO/2019/240941A1 |
A brazing process using metal carbon alloys for joining ceramics to ceramics, ceramics to metals, and metals to metals. The joined pieces can be used in a wide variety of applications, and can include semiconductor processing equipment p...
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WO/2019/235001A1 |
Provided are: a lead-free solder alloy, which is a means that can achieve both of a cracking propagation prevention effect and resistance to impact associated with high-speed deformation at a solder joint part under an environment where ...
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WO/2019/234209A1 |
The present invention concerns a concentrate comprising at least one brazing flux, at least one binder and water in a specific ratio; a process for the manufacture of a brazing flux paint composition which comprises the steps of a) provi...
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WO/2019/232162A1 |
The disclosure describes techniques for eliminating or reducing non- wet open (NWO) defect formation by using a low activity flux to prevent a solder paste from sticking to ball grid array (BGA) solder balls during reflow soldering. The ...
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WO/2019/230694A1 |
Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount ...
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WO/2019/227756A1 |
A solder preform. At least one surface of a solder (C) is provided with multiple protrusions spaced apart from one other at a certain distance and/or multiple recessed portions spaced apart from one other at a certain distance.
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WO/2019/231749A1 |
A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both hig...
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WO/2019/224290A1 |
The present disclosure relates to an austenitic nickel-base alloy having a high content of Ni, Mo and Cr which is suitable for use as a weld metal. Weld metal containing the present austenitic nickel-base alloy will have a high resistanc...
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WO/2019/226438A1 |
It is described herein a light emitting diode (10) which may comprise a metal core printed circuit board (100), a mounting platform, and a thermal interface membrane located between the metal core printed circuit board and the mounting p...
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WO/2019/223949A1 |
The invention relates to a method for producing a surface of a base material (2), wherein the base material (2) has spheroidal graphite cast iron, wherein firstly a partial surface (3) is located, in a further step a two-ply buffer layer...
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WO/2019/224064A1 |
The invention relates to a shaped, small diameter brazing preform for brazing components to one another, the preform comprising a length of aluminium-based filler alloy wire having a continuous, uniform cavity in a centre of the preform ...
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WO/2019/221284A1 |
Provided are: a solid wire for electroslag welding, the solid wire making it possible to produce a welding joint comprising a welding metal that has high efficiency such as a heat input quantity of, e.g., 10 kJ/mm or higher, has exceptio...
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WO/2019/219104A1 |
The invention relates to a method for producing a welding wire (10), comprising at least the steps: - providing a hollow wire (12), through at least part of which at least one cavity (14) extends; - producing the welding wire (10) by int...
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WO/2019/216291A1 |
The present invention includes an iodine-containing cyclic compound which has, in a single molecule, a single ring structure or a plurality of ring or a plurality of ring structures which form a fused ring. The ring of the ring structure...
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WO/2019/212529A1 |
A weld filler is proposed which significantly improves the weldability of some nickel-based superalloys and includes the following constituents (in wt%): 11.2% - 15.6% chromium (Cr), 9.6% - 11.4% cobalt (Co) 2.4% - 5.0%, molybdenum (Mo) ...
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WO/2019/212530A1 |
A method of forming alloy welding consumables for use in welding a base material includes providing a plurality of first welding consumables having a first diameter and a first chemical composition that closely matches the base material ...
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WO/2019/207823A1 |
The present invention relates to a silver brazing material in which the essential constituent elements are silver, copper, zinc, manganese, nickel, and tin. The silver brazing material comprises 35 to 45 mass% of silver, 18 to 28 mass% o...
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WO/2019/210180A1 |
A microporous tubular welding electrode having a length and a circumference may comprise a granular flux fill core extending substantially along the length of the electrode and a sheath extending substantially along the length of the ele...
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WO/2019/208305A1 |
Provided is a flux which is able to achieve specific rheological characteristics both at normal temperature and in a thermal history expected by soldering, and which is capable of suppressing the amount of a residue after soldering, ther...
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WO/2019/201750A1 |
The present invention deals with a brazing sheet comprising: - a core layer made of a AA3xxx alloy comprising, in weight percentages: up to 0.70% Si, up to 0.70% Fe, 0.20 to 1.10% Cu, 0.70 to 1.80% Mn, up to 0.40% Mg, up to 0.30% Zn, up ...
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WO/2019/201551A1 |
The invention relates to a welding electrode (1) which is provided for welding balls (6). The welding electrode (1) has a concave end-face region (2) which is suitable for and/or designed to receive a spherical dome-shaped section of a b...
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WO/2019/198690A1 |
Provided is a solder paste that shows reduced void formation and has a high reliability. The solder paste comprises an Sn-based powder, an SnSb-based alloy powder containing Sn and 10 mass% or more of Sb, and a flux, wherein: the liquid ...
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WO/2019/195656A1 |
The present disclosure relates to methods for welding aluminum alloy products, and products made from the same. The new welded aluminum alloy products may be produced by abutting a first aluminum alloy component against a second aluminum...
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WO/2019/195249A1 |
A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion in...
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WO/2019/189427A1 |
Provided is an aluminum alloy heat exchanger for exhaust gas recirculation system obtained by brazing a fin material to a tube material. The fin material comprises: a core material containing 0.05-1.50% by mass Si and 0.40-2.00% by mass ...
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