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WO/2008/116478 |
Current crack-free welding methods have the disadvantage that tears are formed after welding or during use due to the formation of low melting phases or oxides. The inert gas mixture according to the invention and the method for crack-fr...
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WO/2008/115696 |
A method for joining together two or more ceramic and/or metal parts by providing a braze consisting of a mixture of copper oxide, silver, and ceramic particulate. The braze is placed upon the surfaces of the parts, which are then held t...
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WO/2008/115696 |
A method for joining together two or more ceramic and/or metal parts by providing a braze consisting of a mixture of copper oxide, silver, and ceramic particulate. The braze is placed upon the surfaces of the parts, which are then held t...
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WO/2008/110427 |
The invention relates to a claimed method of repair for repairing a base material having components (1) with a directional microstructure. The repair is carried out in such a manner that a solder (7) is used which comprises components ha...
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WO/2008/110454 |
Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The solder alloy comprises galli...
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WO/2008/110808 |
The invention relates to a self-fluxing brazing piece. The piece comprises a composite material comprising at least one inorganic material distributed in a metal or metal alloy matrix, the inorganic material forming a flux during brazing...
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WO/2008/108179 |
Provided are a tin powder which exhibits excellent shape stability when processed into a tin paste and also has excellent connection reliability, a tin paste and a tin powder manufacturing method. The tin powder is characterized in that ...
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WO/2008/107282 |
The invention relates to a method for the repair of a component (1) by means of a solder (10), the method being performed under specifically selected vacuum conditions in order to prevent oxidation and vaporization.
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WO/2008/105397 |
A corrosion resistant organic compound capable of forming a complex with a metal (e.g., an imidazole or benzimidazole derivative) is used to form a corrosion-resistant coating having an adhesion property only on an exposed part of a meta...
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WO/2008/101262 |
The invention relates to an electrode (7) for the spot welding of metal sheets (2, 3), comprising a base element (16) and a contact surface (12), which comes into contact with one of the metal sheets (2, 3) to be welded, wherein a concav...
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WO/2008/096886 |
In a relatively initial stage, a force of relatively low pressure (P1) is applied to members to be joined (10A,10B). In this pressurization with relatively low pressure (P1) (gas venting step), organic protective film (16) is evaporated ...
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WO/2008/097212 |
A reactive composite structure (RCS) having selected energetic and mechanical properties, and methods of making reactive composite structures (RCSs) enabling the construction of complex parts and components by machining and forming of re...
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WO/2008/095531 |
A brazing composition 507 for the brazing of superalloys comprising a base material (for example nickel) with at least one initial phase (for example fine aluminium particles) is provided. The initial phase has a solidus temperature that...
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WO/2008/095286 |
A suspension component for a vehicle includes a cast iron body, a high strength steel tube and an adapter ring. The adapter ring includes a protrusion engaged with a face of the cast iron body. The protrusion is heated to a plasticized s...
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WO/2008/091280 |
A method of welding with high nickel content and duplex stainless steel electrodes using adaptive outer loop control to change at least one of a peak current or pulse frequency of a pulse waveform used for welding. The pulse waveform is ...
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WO/2008/089752 |
Disclosed is a method for epitaxially closing and bridging cracks and gaps having a width d in monocrystalline or directionally solidified parts made of nickel base superalloys or cobalt base alloys by filling the crack or gap with a mol...
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WO/2008/091825 |
A solder material is formed utilizing a transient liquid phase sintering process, where a precursor material is first formed. The precursor material comprises a plurality of metal particles including a first metal having a first melting ...
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WO/2008/091773 |
A method for production of titanium particles or other metal of interest by a metallothermic reduction reaction of TiCl4 or other metal chloride in a reaction zone which comprises conducting the reaction in a fluidized bed reaction zone,...
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WO/2008/087083 |
Deepish cracks (4) can not be repaired with conventional techniques such as for example laser plasma welding since the crack (4) is not completely fused to the depth of the crack and thus sealed. According to the invention the method usi...
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WO/2008/087807 |
An austenitic stainless steel welded joint where the base metal and the weld metal contain by mass C: 0.3% or below, Si: 2% or below, Mn: 0.01 to 3.0%, P: more than 0.04% to 0.3%, S: 0.03% or below, Cr: 12 to 30%, Ni: 6 to 55%, rare eart...
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WO/2008/087070 |
The invention relates to a friction welding method for the production of a metal bonded joint, wherein two connection parts having contact surfaces are brought into contact with friction pressure. One of the connection parts is moved wit...
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WO/2008/087083 |
Deepish cracks (4) can not be repaired with conventional techniques such as for example laser plasma welding since the crack (4) is not completely fused to the depth of the crack and thus sealed. According to the invention the method usi...
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WO/2008/087084 |
Welding materials with a filler often have the disadvantage on application of mixing. The powder mixture (37) according to the invention involves the use of blocky or platelike powder (35) for the filler such as to prevent a mixing.
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WO/2008/086028 |
The present invention provides a method for welding and heat-treating seam- welded constructions of hardenable steel and ferrous alloys with reduced weld-zone hardness and improved weld-zone ductility and toughness. This method consists ...
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WO/2008/085570 |
Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also i...
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WO/2008/084603 |
An SnCu based lead-free solder alloy for manual soldering that enables production of a solder of stable composition with resistance to soldering iron tip thinning nearly equivalent to that of Sn37Pb (eutectic alloy). The SnCu based lead-...
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WO/2008/082191 |
The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either ...
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WO/2008/082015 |
Disclosed is a multipass butt-welded joint of a steel sheet, which has excellent brittle crack propagation resistance. In the joint, one or more weld layers or welding passes are arranged between a front welding layer and a rear welding ...
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WO/2008/082016 |
Disclosed is a multipass butt-welded joint of a steel sheet, which has excellent brittle crack propagation resistance. The welded joint is characterized in that the fracture resistance properties of a front welding layer and a rear weldi...
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WO/2008/078653 |
It is intended to provide a high-temperature lead-free solder alloy which shows well-balanced strength and soldering characteristics without any variation in the strength in a soldered part, and a method of producing the same. Namely, an...
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WO/2008/076967 |
A wire (2) for use as a feedstock in metal spraying and in welding contains two components (4, 6) formed from different metals, with the components being in face-to-face contact along a convoluted interface (8) that extends throughout th...
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WO/2008/071764 |
The invention relates to a method for soldering electronic components to a rigid inorganic substrate, with the simultaneous action of ultrasonic waves. Said method is carried out in a gaseous atmosphere containing more than 2% volume of ...
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WO/2008/072835 |
Provided is a sintered flux for submerged arc welding which is applied to austenite stainless steel welding. The flux includes 12.0-20.0wt% SiO2, 18.0-27.0wt% Al2O3, 6.0-12.0wt% ZrO2 6.0-12.0wt% CaO, 7.0-16.0wt% CaF 2, 2.0-5.0wt% MnO, 20...
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WO/2008/073419 |
Systems and methods for brazing and soldering using low and non-silver based filler metals are described. The present invention includes methods and systems for brazing and soldering using copper based or bronze type filler metals in lie...
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WO/2008/072654 |
A flux for soldering which can prevent the development of whiskers which is apt to occur when electronic parts are soldered to a printed wiring board with a lead-free solder (e.g., Sn-3.0Ag-0.5Cu) having a higher tin content and a higher...
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WO/2008/070606 |
A hydrofluoroether compound comprises two terminal, independently fluoroalkyl or perfluoroalkyl groups and an intervening oxytetrafluoroethylidene moiety (-OCF(CF3)-) bonded through its central carbon atom to an alkoxy- or fluoroalkoxy-s...
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WO/2008/065728 |
A sintering metal particle composition having a plasticity which comprises: (A) 100 parts by weight of sintering metal particles having an average particle diameter of 0.001 to 50 μm; and (B) 3 to 100 parts by weight of a dispersion med...
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WO/2008/064624 |
The invention relates to a solid-solution strengthened iron-nickel alloy with a high level of ductility and an expansion coefficient < 5 x 10-6/K in the temperature range between room temperature and - 200 °C. Said alloy consists of (in...
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WO/2008/064624 |
The invention relates to a solid-solution strengthened iron-nickel alloy with a high level of ductility and an expansion coefficient < 5 x 10-6/K in the temperature range between room temperature and - 200 °C. Said alloy consists of (in...
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WO/2008/061406 |
A cadmium less silver brazing filler metal which comprises Ga, In, Ni and Ce element. Its composition includes (by wt %) 28.0-35.0% of Cu, 28.0-38.0% of Zn, 0.1-2.5% of Ni, 0.1-2.5% of Ga, 0.1-2.5% of In, 0.002-0.10% of Ce and the rest i...
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WO/2008/062548 |
A pasty metal particle composition comprising 100 parts by weight of metal particles which have a mean particle diameter of 0.001 to 50μm and whose surfaces are coated with a water-repellent organic substance and 3 to 30 parts by weight...
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WO/2008/062710 |
Single ball separating device and method which solve a bonding-to-slope problem that is posed when a single ball is separated and collected out of a mixture of a single ball, coupled balls and an abnormal ball by slope rolling, and which...
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WO/2008/060226 |
The present invention relates to a brazing material comprising an alloy containing essentially of: 15 to 30 wt% chromium (Cr); 0.1 to 5.0 wt% manganese (Mn); 9 to 20 wt% nickel (Ni); 0 to 4.0 wt% molybdenum (Mo); 0 to 1.0 wt% nitrogen (N...
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WO/2008/059654 |
A composition for preventing solder flux scrambling which contains a polymer comprising monomer units derived from an unsaturated compound having a C6 or lower polyfluoroalkyl group. Despite the constitution, this composition is comparab...
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WO/2008/060225 |
The present invention relates an iron based brazing material comprising an alloy consisting essentially of: 15 to 30 wt% chromium (Cr); 0 to 5.0 wt% manganese (Mn); 15 to 30 wt% nickel (Ni); 1.0 to 12 wt% molybdenum (Mo); 0 to 4.0 wt% co...
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WO/2008/060226 |
The present invention relates to a brazing material comprising an alloy containing essentially of: 15 to 30 wt% chromium (Cr); 0.1 to 5.0 wt% manganese (Mn); 9 to 20 wt% nickel (Ni); 0 to 4.0 wt% molybdenum (Mo); 0 to 1.0 wt% nitrogen (N...
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WO/2008/056676 |
Disclosed is a lead-free solder paste composed of a solder powder and a flux (13) mixed with the solder powder. The solder powder is composed of a first base alloy powder (11) which is a first alloy in a powder form, and a second base al...
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WO/2008/056371 |
A Penetration Enhancing Activating Flux (PEAF) in paste form for autogenous TIG welding of austenitic stainless steels adapted for ready application with a brush on top weld surface prior to conducting autogenous TIG welding to favour si...
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WO/2008/052944 |
The soldering method according to the invention uses a soldering material of grains in which the filler (core) is enclosed by a metallic shell, which prevents segregation and permits uniform distribution of the filling material. The core...
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WO/2008/049006 |
Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used...
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