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WO/2012/014932 |
Disclosed is a method for penetration welding of austenitic stainless steel. By using a welding rod with a high silicon content, said method can produce a weld with excellent penetration performance without using a back-shielding gas. In...
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WO/2012/010501 |
The invention is directed to a process to prepare metal nanoparticles or metal oxide nanoparticles by applying a cathodic potential as an alternating current (ac) voltage to a solid starting metal object which solid metal object is in co...
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WO/2012/007662 |
The invention relates to an electric arc welding method for welding at least one metal part including an aluminum-based surface coating, using a shielding gas. According to the invention, the metal of the aforementioned metal part is mel...
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WO/2012/007490 |
The invention relates to a method for producing a welding wire filled with filler material. The invention also relates to a welding wire which has a tube portion formed from a metal strip, wherein the tube portion is filled with filler m...
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WO/2012/007663 |
The invention relates to a hybrid laser/arc-welding method using an electric arc and a laser beam that are combined together within a single welding bath, to which molten metal is supplied by melting a filler wire, wherein the welding ba...
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WO/2012/007664 |
The invention relates to a hybrid laser/arc-welding method using an electric arc and a laser beam that are combined together within a single welding melt to which molten metal is supplied by melting a filler wire, wherein the welding mel...
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WO/2012/007452 |
The invention relates to a fluid channel for a heat exchanger, comprising a metal sheet (1), wherein the metal sheet (1) has at least one core region of an aluminium base alloy and at least one structure (4, 14) arranged inside the fluid...
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WO/2012/004498 |
The invention relates to a ternary gaseous mixture formed from argon, helium and oxygen, characterised in that it is formed from between 19.5 and 20.5 % of helium, between 2.7 and 3.3 % of O2, and argon for the remainder (volume %), and ...
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WO/2012/002173 |
A high-temperature solder alloy comprising a Bi-Sn-based solder alloy containing 90 mass% or more of Bi, wherein the Bi-Sn-based solder alloy additionally contains 1 to 5 mass% of Sn and 0.5 to 5 mass% of at least one element selected fr...
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WO/2012/000733 |
The present invention provides a welded product which comprises a first element and a second element, and further comprises a third element, wherein the melting point of said third element is between that of the material of said first el...
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WO/2012/002147 |
Disclosed is a Pb-free solder alloy for use under high-temperature conditions, which has strength at a level required for the bonding between an electronic component and a substrate and also has excellent wettablity and processability. S...
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WO/2011/158449 |
In a lead-free connection material used in a semiconductor device including a power module and the like, when being exposed to a temperature higher than a normally used temperature range, there has been a case in which the stress relaxat...
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WO/2011/158834 |
Disclosed is a saw wire which comprises: a steel wire (11) comprising a base steel wire (11a) having a given composition; abrasive grains (13) adhered to the steel wire (11) by means of an adhesion part (12); and an intermetallic compoun...
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WO/2011/158706 |
Disclosed is a welding material for an Ni-based heat-resistant alloy, which has a chemical composition that contains 0.06-0.18% of C, 0.5% or less of Si, 1.5% or less of Mn, 46-56% of Ni, 10-15% of Co, 20-25% of Cr, more than 10.0% but 1...
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WO/2011/158668 |
Disclosed is a Pb-free solder alloy with low residual stress at solidification and high bonding strength and reliability, that can suppress Ni-Bi reaction and Ni diffusion when an electronic component that includes Ni and a substrate are...
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WO/2011/155521 |
Disclosed is a lead-free composite (1) which is obtained by uniformly dispersing fine Sn-In-Bi alloy particles (3) in a poly(normal butyl acrylate) (2). The Sn-In-Bi alloy contains 57.50% by weight of Bi, 25.20% by weight of In and 17.30...
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WO/2011/155620 |
Disclosed is an ultra high-strength welded joint having excellent strength and toughness, which uses a steel sheet having a thickness of 4-12 mm and contains a welded metal that has a martensite single phase structure. The ultra high-str...
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WO/2011/155389 |
Disclosed is a welding material for austenitic heat-resistant steel, which has a chemical composition that contains more than 0.05% but 0.18% or less of C, 0.5% or less of Si, 1.5% or less of Mn, 40-50% of Ni, 20-25% of Cr, more than 8.0...
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WO/2011/152341 |
A copper-plated solid welding wire for carbon dioxide gas shielded arc welding has a lubricant oil and a solid lubricant coated on the surface thereof. Copper and iron particles deposited on the surface of the copper-plated solid welding...
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WO/2011/151894 |
Size reductions in electronic appliances have resulted in the appearance of printed boards which cannot be subjected to cleaning and in the necessity of a lead-free solder paste capable of conforming to the omission of cleaning. In order...
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WO/2011/151185 |
The present invention relates to a high-temperature-resistant component for use in an exhaust emission control unit and to an exhaust emission control unit and to a method for producing such a unit, the component or the exhaust emission ...
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WO/2011/148781 |
Provided is a method for producing an aluminum alloy heat exchanger formed by applying a coating material, which is obtained by mixing an Si powder, a flux powder, and a binder, to the surface of a flat, multi-hole coolant tube formed fr...
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WO/2011/147526 |
The invention relates to a wire-like spray material (4) based on iron for electric arc wire spraying and also a functional layer (2) which can be produced therewith on a substrate (1). The functional layer (2) has good corrosion resistan...
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WO/2011/148859 |
Disclosed is a welded metal which is obtained by submerged arc welding and contains, in mass%, 0.02-0.12% of C, 0.1-0.70% of Si, 1.0-2.0% of Mn, 0.1-2.5% of Cu and/or 0.5-3.5% of Ni, 1.0% or less (excluding 0%) of Cr and/or 0.5-1.5% of M...
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WO/2011/145591 |
Disclosed is a lead-free solder composition for a vehicle, which is characterized by being composed of 26-56% by mass of In, 0-10% by mass of Ag and the balance, namely 34-74% by mass of Sn. The composition is useful as a solder composit...
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WO/2011/146906 |
A welding torch (84) with a welding electrode (40) and a welding electrode holder (34) is provided. One welding torch includes a securing mechanism (78) and an insulated grip (74, 76). The securing mechanism is configured to secure an ex...
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WO/2011/141039 |
A welding element is formed from a sleeve (10), which is cold-pressed from a thin metal sheet and the open end of which forms the welding face, which is optionally provided with a flange (11). A thread (13) may be rolled in on the outer ...
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WO/2011/142262 |
Disclosed are: a brazing material for bonding in atmosphere, which has a low melting point and therefore can have a low bonding temperature in atmosphere without using any flux; a bonded article which is bonded using the brazing material...
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WO/2011/139454 |
A solder paste comprises an amount of a first solder alloy powder between about 60 wt% to about 92 wt%; an amount of a second solder alloy powder greater than 0 wt% and less than about 12 wt%; and a flux; wherein the first solder alloy p...
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WO/2011/127958 |
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WO/2011/128239 |
The invention proposes a germanium-containing nickel-based solder having a similar composition to a nickel-based superalloy, as a result of which the proportion of γ' formers in the solder can be reduced.
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WO/2011/127956 |
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WO/2011/125140 |
Lead-free connecting materials having satisfactory wetting properties and high heat resistance have come to be required as a result of increases in the temperature of element connection parts due to increases in the capacity of power mod...
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WO/2011/127072 |
This disclosure relates generally to arc welding. In an embodiment, a welding system has a welding gas supply system configured to supply a gas flow including a shielding gas and a fluorine-containing gas to a weld pool. Furthermore, the...
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WO/2011/125017 |
The invention relates to a method for brazing two or more parts. A hard solder having a composition consisting of NiRestCraBbPcSid having 20 atom % < a < 22 atom %; 1.2 atom % ≤ b ≤ 3.6 atom %; 12.5 atom % ≤ c ≤ 14.5 atom %; 0 at...
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WO/2011/124451 |
The invention relates to a fluxing agent (1) for soldering and to a method for connecting two components (3, 4). A fluxing agent (1) is applied to connection points (5, 6) of the components (3, 4) to be connected, and the connection poin...
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WO/2011/126121 |
Provided is a welding metal wherein: the chemical component composition thereof is appropriately controlled; value (A) that is defined by a preset relational expression satisfies the requirement of being 3.8-9.0% inclusive; value (X) tha...
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WO/2011/123390 |
A nickel-based alloy and welding processes and consumables that use the alloy as a weld filler metal to fabricate, weld overlay, and repair components, including components of nuclear power plant reactors that contact the hot coolant wat...
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WO/2011/123169 |
Certain example embodiments of this invention relate to silver pastes that are capable of making an electrical connection with at least one conductive layer in a layer stack, even where the at least one conductive layer is protected by o...
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WO/2011/121440 |
A feeding lubricant for use on a welding electrode comprises about 10 to 40 wt.% of at least one soap-based lubricant, about 40 to 90 wt.% of at least one solid particulate lubricant selected from MoS2, WS2, ZnO, graphite and PTFE and up...
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WO/2011/119456 |
Nitrogen-containing fluorochemical ketones are provided that can be useful in apparatuses that includes a device and a mechanism for transferring heat. The provided fluorochemical ketones are stable at temperatures above 170°C, are envi...
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WO/2011/119421 |
Fluoroether diketones are provided that can be useful in apparatuses that includes a device and a mechanism for transferring heat. The provided fluoroether diketones are stable at temperatures above 175°C, are environmentally friendly, ...
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WO/2011/115307 |
Disclosed is a sinter cake support stand which, in high-temperature environments having sintered ore heating temperatures of 1200-1400C, has excellent abrasion resistance and breaking resistance, and corrosion resistance to a high-temper...
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WO/2011/115305 |
Disclosed is a metal tape material having improved characteristics in terms of a low Young's modulus, a low yield stress, and a high break elongation. Also disclosed is a metal tape material for semiconductor mounting comprising said met...
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WO/2011/113758 |
The present application describes a method of joining at least two parts (21, 22) made of silicon-carbide-based materials by non-reactive brazing, in which the parts are brought into contact with a non-reactive brazing composition (26), ...
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WO/2011/113759 |
The present application describes a method of joining at least two parts (1, 2) made of silicon-carbide-based materials by non-reactive brazing, in which the parts are brought into contact with a non-reactive brazing composition (3), the...
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WO/2011/113760 |
The present application describes a method of joining at least two parts (1, 2) made of silicon-carbide-based materials by non-reactive brazing, in which the parts (1, 2) are brought into contact with a non-reactive brazing composition (...
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WO/2011/114824 |
Tin characterized in that a melted and casted sample thereof has an α-dose less than 0.0005 cph/cm2. With the recent tendency toward high-density and high-capacity semiconductor devices, the risk of soft errors caused by α-rays emitted...
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WO/2011/110532 |
The invention provides a fine particulate flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g. in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufactur...
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WO/2011/112722 |
Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a...
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