Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 31,691

Document Document Title
WO/2019/151974A1
A shielding gas system for superalloy welding and additive processing, including constituents (24) which react with a weld shielding gas (20) when heated during weld processing creating one or more scavenging gas by-product gases (14) th...  
WO/2019/145074A1
The invention relates to a method for welding a welded part (10, 10A) to a component (30), wherein the method is carried out as arc ignition welding by means of direct current, having a bias current phase (41, 51) in which an arc (L) is ...  
WO/2019/146587A1
Provided is a joining layer (13) that is included in a semiconductor module (10), that is interposed between an electronic component (14) and a substrate (15), and that comprises a CuSn intermetallic compound. This joining layer (13) is ...  
WO/2019/141916A1
The invention relates to an electrode for welding sheets of steel or aluminium, with a conductivity greater than or equal to 90% IACS and made of an alloy consisting, by weight based on the total weight of the alloy, of chromium in a pro...  
WO/2019/142826A1
Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a sol...  
WO/2019/142772A1
Provided is flux that can achieve a low residue so as to make it possible to ensure wetness of solder, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without ...  
WO/2019/142835A1
The purpose of the present invention is to provide a flux-cored wire that can provide a weld metal having an excellent strength and toughness after PWHT and also an excellent resistance to SR cracking and that exhibits an excellent weldi...  
WO/2019/142795A1
Provided are a soldering resin composition in which wet-spreading properties are improved and which also has exceptional reliability and processability, a resin flux cored solder in which the soldering resin composition is used, a flux c...  
WO/2019/101886A3
A laser marking system for marking a product comprising a laser source for providing a laser beam, a marking head for projecting the laser beam on to the product, a housing comprising an extraction device configured to generate a flow of...  
WO/2019/142802A1
Provided are flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. This flux includes 30-70 wt% of a thermosetting resin, 3-15 wt% of an amine, and 5-...  
WO/2019/143358A1
A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively depo...  
WO/2019/094241A3
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...  
WO/2019/139723A1
Aluminum alloys described herein include silicon, iron, copper, manganese, magnesium, and chromium. In various implementations, the aluminum alloys also include one or more of zinc and titanium. Typically, a total amount of iron and mang...  
WO/2019/132289A1
A high-strength high manganese-plated steel plate welded structure having excellent spot weldability and a method for manufacturing same are provided. The present invention relates to a high manganese-plated steel plate comprising, in we...  
WO/2019/131718A1
Provided is a solder alloy having superior continuous casting performance. The solder alloy of the present invention has an alloy composition, by mass%, of Cu: 0.8 to 10%, the remainder being Sn, and includes an intermetallic compound. I...  
WO/2019/132015A1
Provided are a resin composition and a soldering flux that are configured so as to make it possible to suppress cracking of a residue. In the resin composition, a ratio of 0.15-1.00 is achieved, with reference to a rosin, as the ratio of...  
WO/2019/132003A1
Provided is flux in which solder wettability can be maintained and with which it is possible to suppress the amount of residue after soldering and realize low residue. This flux includes 65-99 wt% of a solvent, and also includes 1-13 wt%...  
WO/2019/124512A1
Provided are solder particles capable of effectively increasing the coalescence of solder when forming electroconductive connections. The solder particles according to the present invention comprise an oxide film on the surfaces thereof....  
WO/2019/123674A1
The present invention addresses the problem of providing: a flux whereby it becomes possible to prevent the occurrence of bridging or the formation of balls during soldering; and a resin composition for a flux. A flux characterized by co...  
WO/2019/119281A1
An in-situ synthesized metallic coated flux-cored silver solder, comprising: a flux core (1), and a solder outer skin (2) wrapping the flux core. The solder outer skin comprises, by weight: 20.0-36% of Ag, 35.0-45.0% of Cu, 27.0-37.0% of...  
WO/2019/124305A1
This gas-shielded arc welding wire is a wire for joining a plurality of sheets of a thin steel plate by gas-shielded arc welding, and contains, in mass% with respect to the total mass of the wire, 0.06-0.15% of C, more than 0% and at mos...  
WO/2019/124513A1
Provided are solder particles capable of effectively increasing the coalescence of solder when forming electroconductive connections. The solder particles according to the present invention comprise a solder particle body and an oxide fi...  
WO/2019/117041A1
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...  
WO/2019/115422A1
The present invention relates to a process for the production of an aluminium multilayer brazing sheet which comprises a core layer made of a 3xxx alloy comprising 0.1 to 0.25 wt.% Mg, a brazing layer made of a 4xxx alloy on one or both ...  
WO/2019/116910A1
A semiconductor device according to the present invention is provided with: an insulating substrate (1) which is obtained by integrating a ceramic base material (1b) and a fin (1a) for cooling with each other; a plate-like wiring member ...  
WO/2019/116917A1
Provided are: a gas-shielded arc welding wire which enables automatization of welding (continuous automated welding) even with use of a high-Cr welding material by suppressing welding defects such as fusion failure and bead shape defect;...  
WO/2019/118650A1
A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising cutting and placing a length of a solder ribbon onto a semiconductor release tape forming a solder ribbon and semiconductor re...  
WO/2019/113208A1
Paste compositions comprising 40-70 percent by weight (wt%) of a low melting point (LMP) particle composition comprising Y; 25-65 wt% of a high melting point (HMP) particle composition comprising M; and 1-15 wt% of a fluxing vehicle. The...  
WO/2019/111898A1
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the ...  
WO/2019/110781A1
Compositions for brazing of aluminium and aluminium alloys and their use are described. The compositions comprise a fluoride salt based flux; a solder metal, solder alloy or solder alloy precursor; a binder; and a diester as a solvent.  
WO/2019/110041A1
A welding filler material comprising (in wt.-%): C 0.01 - 0.05 %; N 0.05 - 0.10 %; Cr 20.0 - 23.0 %; Mn 0.25 - 0.50 %; Si 0.04 - 0.10 %; Mo 8.0 - 10.5 %; Ti 0.75 - 1.0 %; Nb 3.0 - 5.0 %; Fe max.1.5 %; Al 0.03 - 0.50 %; W 4.0 - 5.0 %; Ta ...  
WO/2019/110087A1
The present invention relates to a steel material composite having at least two layers (1, 2, 3, 4) comprising at least a first layer (1, 3) made of a machinable and/or shearable steel and at least a second layer (2, 4) made of a formabl...  
WO/2019/105711A1
The invention relates to a connection element (10) for connecting at least two components (12.1, 12.2) in a non-releasable manner by means of friction welding while rotating the connection element (10) about a longitudinal axis (10.1) of...  
WO/2019/102671A1
The present invention addresses the problem of providing a flux from which no crystal is precipitated and which enables the improvement of the wettability of a solder. A flux characterized by containing 0.4 to 10.0% by mass of ditolylgua...  
WO/2019/103090A1
Provided are: a flux which imparts thixotropy, and which exhibits excellent printing properties, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a t...  
WO/2019/103025A1
The purpose of the present invention is to provide a solder material which shows little discoloration, has excellent wetting properties, is highly reliable in terms of cycling properties, etc., and, when made into a solder paste, has a s...  
WO/2019/102932A1
A purpose of the present invention is to provide a flux-cored wire that excels in slag releasability and welding workability, and is capable of high-efficiency operation without the risk of reheat cracking and makes it possible to obtain...  
WO/2019/100445A1
Micro/nano particle reinforced composite solder used for low temperature brazing and a preparation method therefor, relating to the field of lead-free low temperature brazing solder production. Micro/nano particle reinforced tin-based al...  
WO/2019/099239A1
Fuel gas compositions for use in metal fabrication are provided comprising fuel gases comprising a base fuel gas mixed with from about 1% to less than 30% hydrogen.  
WO/2019/098169A1
Provided are flux, resin flux cored solder, and a flux coated pellet capable of being washed with water. Resin flux cored solder 10 is constituted of solder 20 formed in a linear shape and flux 30 that is loaded in a substantially center...  
WO/2019/098157A1
A brazing material (3) is interposed between an aluminium-based material and a Ni-plated iron-based material. The brazing material (3) has a structure in which an Al-Si-Ni-based alloy layer (10) and an Al layer (11) are bonded via a flux...  
WO/2019/098034A1
Provided is an austenitic heat-resistant steel welding metal which has low high-temperature cracking sensitivity and excellent creep strength. This austenitic heat-resistant steel welding metal has a chemical composition which contains, ...  
WO/2019/094243A1
A lead-free solder alloy is based on tin and comprises silver, copper, bismuth, cobalt and titanium. The alloy may further comprise antimony, nickel, or both. Silver is present in an amount from 3.1% to 3.8% by weight of the solder. Copp...  
WO/2019/092947A1
[Problem] To provide a car window glass equipped with a lead-free solder joined portion, which passes the VDA test. [Solution] This car window glass comprises: a glass plate having an electrically conductive body layer; a connection term...  
WO/2019/094241A2
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...  
WO/2019/094242A1
A lead-free, tin based solder alloy comprises silver, copper, cobalt and optionally bismuth and antimony. The alloy may further comprise nickel. Silver is present in an amount from 2.0% to 2.8% by weight of the solder. Copper is present ...  
WO/2019/093317A1
The present invention provides: a brazing sheet which offers favorable brazing properties during a brazing performed in an inert gas atmosphere, and with which it is possible to minimize material costs; and a method for manufacturing suc...  
WO/2019/094036A1
A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fractio...  
WO/2019/088222A1
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...  
WO/2019/088068A1
Provided are: a soldered joint which suppresses detachment between a back metal and a solder alloy during formation of the soldered joint, and which offers higher reliability by suppressing non-wetting of the solder alloy, splashing of m...  

Matches 1 - 50 out of 31,691