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Matches 601 - 650 out of 145,922

Document Document Title
WO/2020/055594A1
Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polish...  
WO/2020/052974A1
The invention relates to a hand-held cutting grinder, comprising a cutting disk (11), a motor housing including a drive unit, and an arm (16) having a support arm (17) and an arm cover (18). A stop element (41) is provided for the spindl...  
WO/2020/054631A1
The present description discloses a tool. The tool may be provided with: a motor; a power transmission mechanism connected to the motor; a housing which houses the motor and the power transmission mechanism; a tip tool holding part which...  
WO/2020/055901A1
A smart coolant pump for a robotic or computer-controlled machine. The smart pump uses a servo motor rather than a conventional industrial motor such as an induction motor. The smart pump has inherent torque and speed sensing, and a cont...  
WO/2020/054823A1
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...  
WO/2020/054616A1
Provided is an electric work machine in which it is possible to limit the risk of contact between a control unit and wiring provided inside a motor housing. In the electric work machine (1A), a motor (6) and a control unit (13) are house...  
WO/2020/052819A1
The invention relates to a cutting device having a housing (28). In this case, a driven disc-shaped cutting tool (10), mounted in the housing (28), for cutting a workpiece (12) is provided. Arranged on a circumferential side of the cutti...  
WO/2020/051943A1
A grinding system for eliminating crack sources of an inner tapered bore of a motor rotating shaft and a grinding method therefor; the grinding system comprises a movable device (1), a pneumatic gun (2), and a clamping device; the movabl...  
WO/2020/052497A1
Disclosed is a rechargeable angle grinder, comprising a housing (1), wherein the housing (1) has a driving shaft (6) provided therein for transferring power; a locking button (7) is movably embedded in the housing (1); the housing (1) ha...  
WO/2020/055849A1
A wet abrasive blasting system includes a vessel having multiple outlets for dispensing slurry. A first sprayer of the system is operatively associated with a first blast control switch, and a second sprayer is operatively associated wit...  
WO/2020/055571A1
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.  
WO/2020/054811A1
Provided is a wafer mirror surface chamfering method by which corner burrs at the boundaries between main surfaces and chamfered surfaces of the wafer can be reduced. The present invention is a wafer mirror surface chamfering method by w...  
WO/2020/051729A1
A ceramic sphere abrasive, a preparation method therefor, and use thereof. The ceramic sphere abrasive comprises the following components in mass percentages: 6-30% of grinding agent; 0.5-5% of dispersant; 15-40% of suspending agent; 10-...  
WO/2020/052797A1
The invention relates to a slide-grinding body having two sections that come to a point and emanate from a base cross-section, wherein the geometry of the base cross-section (4) has curved flanks, the base cross-section is the largest at...  
WO/2020/055538A1
Embodiments described herein relate to rotary unions for use in wafer cleaning processes. The rotary union includes a process media and a supporting media that interact in a gap between a nozzle and rotary element. By regulating the supp...  
WO/2020/048731A1
The invention relates to an edge-removing tool for sheet metal, comprising a head with a rotating cutting tool, wherein the head has at least one guide for an edge. The head preferably comprises a sleeve comprising the guide, and the too...  
WO/2020/048311A1
A chemical-mechanical planarization device, comprising a polishing module, a cleaning module and a wafer transfer module, wherein the polishing module comprises two rows of polishing unit arrays (100), each row of polishing unit arrays c...  
WO/2020/048874A1
A polishing device held on a robot arm (1), having a support plate (9), a polishing disc (10) held thereon, a drive moving the support plate (9) in a plane, and a metering device (8) for feeding a polishing agent to the working side of t...  
WO/2020/051485A1
Apparatus, assemblies, and/or systems related to material removal are disclosed, such as saws, grinders, polishers, and/or more general material preparation and/or testing machines, for example. A material removal system may include a ma...  
WO/2020/027754A3
The invention particularly relates to the discrete channel grooving system (10), which reduces costs by using fewer discs and allows channel engraving at the desired length and depth in the desired area of the glass. The discrete groovin...  
WO/2020/049395A1
The invention relates to an abrasive article 1 for abrading at least one workpiece, the abrasive article with: a carrier body 2, at least one abrasive layer 3 with a main surface and a predefined thickness, the at least one abrasive laye...  
WO/2019/245491A3
Invention is a hand held grinding machine consisting of electrical engine body (1), grinding disk (11) by means of hard particles blasted onto surfaces used for both cleaning of and making it rough as used in surface processing technolog...  
WO/2020/048886A1
The invention relates to a grinding device, comprising a support element (3) and a preferably flexible grinding means (5) held thereon, which has a carrier resting against the support element (3), and a grinding layer designed in such a ...  
WO/2020/049052A2
The present invention relates to a device for lens processing, comprising at least one receiving device for at least one transport box, at least one measuring device, and at least one processing device. According to the invention, it is ...  
WO/2020/047942A1
Disclosed is a chemical mechanical planarization apparatus, comprising a polishing module, a cleaning unit (200) and a wafer transmission module, wherein the polishing module includes two columns of polishing unit arrays (100), and each ...  
WO/2020/049033A1
The present invention relates to a method for treating surfaces by means of an abrasive material in order preferably to obtain a roughened surface, wherein at least a water-soluble abrasive material is used as the abrasive material. In a...  
WO/2020/050932A1
Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor for...  
WO/2020/049887A1
The objective of the present invention is to prevent blow back, to an operator side, of sparks and the like generated when material to be cut is being cut using a metalworking stationary cutting machine. A dust collecting box 2 which can...  
WO/2020/028855A9
An abrasive article can include a wear detection sensor embedded within the abrasive body or extending along an exterior surface of the abrasive body. The wear detection sensor can include at least one conductive lead and be designed to ...  
WO/2020/048748A1
The invention relates to a machining system for machining spectacle lenses and to a method for machining spectacle lenses. The machining system has a plurality of machining stations, in particular a milling station, a turning station, a ...  
WO/2020/048368A1
A grinding device and method for small-diameter tube dense-tube row welds, the device comprising: a handpiece, said handpiece being internally provided with an accommodation space for accommodating a motor; a transmission mechanism (8), ...  
WO/2020/045955A1
The present invention relates to a hand grinder disk fixation device, which allows a cutting disk or grinding disk mounted on a hand grinder to be easily replaced and allows replacement work to be safely performed. More specifically, the...  
WO/2020/045087A1
Provided are alumina abrasive grains for chemical mechanical polishing that: suppress the occurrence of polishing scratches during chemical mechanical polishing when wiring semiconductor devices, while providing high-speed polishing of a...  
WO/2020/046781A1
An apparatus for processing a ferrule with an abrasive element. The apparatus includes a first mount to which the ferrule is secured, a second mount to which the abrasive element is secured, and a controller operatively coupled to at lea...  
WO/2020/044158A1
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rot...  
WO/2020/044157A1
A system for monitoring one or more of an abrading tool, a consumable abrasive product and a workpiece, the system can optionally comprise: a data storage device; a sensor; a communication unit; a consumable abrasive product that is atta...  
WO/2020/045433A1
The present disclosure provides a false twister disc comprising a discoid base and a surface layer located on the outer circumferential region of the base. The surface layer comprises a ceramic in which aluminum and titanium oxides are t...  
WO/2020/047118A1
Retention apparatus and systems for material removal machines are disclosed. In some examples, a material removal machine having a material removal tool (e.g., a saw blade, an abrasive saw, a polisher, a grinder, and/or more general mate...  
WO/2020/044585A1
The present invention improves surface roughness by knocking down protruding parts while leaving recessed parts in the surface of a metal product, protrusions/recesses having been formed in said surface via blasting, and improves surface...  
WO/2020/047190A1
Apparatus, systems, and/or methods for adjusting belt tension in a material removal machine are disclosed. In some examples, the material removal machine includes a material removal tool (304) secured on a spindle (310). A spindle pulley...  
WO/2020/044011A1
The present invention relates to a conditioning head which includes a substrate comprising a substrate surface; and at least one raised non-planar abrasive region relative to the substrate surface. The non-planar abrasive region comprise...  
WO/2020/046502A1
A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate and bring a lower surface of the substrate into contact with the polishing pad, and an in-situ friction monitoring sy...  
WO/2020/045088A1
Provided is an aqueous dispersion for chemical mechanical polishing that: suppresses the occurrence of polishing scratches during chemical mechanical polishing performed during wiring of semiconductor devices, while providing high-speed ...  
WO/2020/045239A1
The present invention provides a crankshaft which has excellent welding resistance. This crankshaft is provided with a journal part and a pin part; and the journal part and the pin part have surface profiles, each of which has an arithme...  
WO/2020/039802A1
This substrate processing system is equipped with: a first principal surface grinding device which holds a substrate from below in a manner such that the first principal surface of the substrate is oriented upward, and grinds the first p...  
WO/2020/038605A1
The present invention relates to a portable and 360 degrees operational particle blast system comprising a blast device (35) for blasting particles, comprising a blasting wheel (6), the blasting wheel comprising a rotor (6A), having blad...  
WO/2020/039803A1
This substrate processing system is equipped with a processing device for processing a substrate and a first transport device for transporting the substrate into and from the processing device, wherein the processing device is equipped w...  
WO/2020/018650A3
Provided is a disclosure for a cutting device configured to control a linear speed of a cutting wheel as the cutting wheel gets smaller with use.  
WO/2020/038258A1
Disclosed in the present application is a fully-automatic spring loading mechanism, comprising a machine body, a high-precision synchronous following positioning mechanism and a multi-channel feeding clamp assembly; a sealed box is arran...  
WO/2020/039940A1
A method for manufacturing a glass sheet, the method including a step for removing a grindstone flange 3 and a grindstone 6 from a spindle 2, wherein: the removal step includes an unfixing step for unfixing the spindle 2 and the grindsto...  

Matches 601 - 650 out of 145,922