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Patent Searching and Data


Matches 601 - 650 out of 113,825

Document Document Title
WO/2023/030774A1
A method for grinding a semiconductor wafer, wherein the semiconductor wafer is machined in a material-removing manner by means of a grinding tool containing grinding teeth having a height h while supplying a cooling medium into a contac...  
WO/2023/034874A1
Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto ...  
WO/2023/032196A1
In a process in which grinding is performed after additive manufacturing, the present invention reduces the amount of a portion of a coating, formed during the additive manufacturing, that exceeds a thickness necessary for a product. Thi...  
WO/2023/034573A1
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the pl...  
WO/2023/032715A1
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing a...  
WO/2023/032714A1
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound,...  
WO/2023/032197A1
This complex grinding machine comprises: a holding unit capable of holding and rotating a workpiece; an additive manufacturing unit that is movable with respect to the holding unit and melts a material while supplying the material to a s...  
WO/2023/032929A1
This polishing solution is for polishing a resin-containing polishing target member and contains an ether compound having a hydroxy group, and abrasive grains containing cerium oxide. This polishing method is for polishing a resin-contai...  
WO/2023/032489A1
Provided is a method for polishing a spectacle lens, the method having: a step for preparing a polishing pad in which a flocked polishing pad is provided to a polishing surface that comes into contact with a plastic spectacle lens, the f...  
WO/2023/032961A1
Provided are a glass member that excels in tactile sensation such as the feel of writing using an input pen and the feel of touching with a fingertip, an input device provided with the glass member, a pen input device, a mobile apparatus...  
WO/2023/033981A1
A backup pad assembly is presented that includes a backup pad with a cavity and a centerpost that is coupleable to the backup pad. The backup pad is configured to couple to a tool in a first configuration, without the centerpost, and in ...  
WO/2023/032928A1
Provided is a polishing liquid for polishing a member to be polished, said polishing liquid containing abrasive grains which include a cerium oxide, wherein the member to be polished contains a resin and particles which include a silicon...  
WO/2023/034962A1
Articles and methods regarding abrasive articles that include antimicrobial properties and improved abrasive performance and comprise a first fiber element comprising a woven or non-woven material; and a second fiber element comprising m...  
WO/2023/026814A1
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium or molybdenum, while maintaining a stabl...  
WO/2023/026948A1
Provided are: a surface processing method for a GaN substrate, which is capable of performing surface processing on the GaN substrate in a short period of time; and a manufacturing method for a GaN substrate. This surface processing meth...  
WO/2023/024043A1
A PCB substrate burr removing apparatus for electronic device production. The apparatus comprises a collecting box (1), wherein two fixing supports (2) are fixedly mounted at the top of the collecting box (1); lifting grooves are provide...  
WO/2023/026171A1
The present disclosure discloses an apparatus (100) for performing superfinishing operation on a raceway of a bearing (200). The apparatus has an arm (10) extending from the superfinishing unit (100). The apparatus comprises a pivot (40)...  
WO/2023/027140A1
The purpose of the present invention is to provide a magnetic disk substrate and a method for manufacturing same, and a magnetic disk all of which make it possible to maintain high flatness, despite being thin, after a long-term use, be ...  
WO/2023/027932A1
A glass-based article with a textured surface exhibiting low haze is provided. The glass-based articles are produced by utilizing a combination of abrasion and etching, where hydrofluoric acid is not utilized. The process for producing t...  
WO/2023/025577A1
The present invention relates to a profiled structure for a component of a power tool, wherein the profiled structure has a front side and a rear side, and wherein the profiled structure has at least two beads on one of the two sides and...  
WO/2023/026813A1
Provided is a chemical mechanical polishing composition capable of chemically mechanically polishing a ruthenium- or molybdenum-containing semiconductor substrate while maintaining a stable polishing rate and suppressing the corrosion of...  
WO/2023/025148A1
A clamping mechanism and an electric tool. The clamping mechanism comprises a main body (1), a locking cap (2), a spring chuck (3) and an outer sleeve (5) which is sleeved on the periphery of the locking cap and can drive the locking cap...  
WO/2023/026778A1
The present invention provides a chemical mechanical polishing composition with which it is possible to suppress ruthenium corrosion and also perform chemical mechanical polishing of a semiconductor substrate containing ruthenium while m...  
WO/2023/024190A1
Provided in the present application are a grinding disk and a substrate cleaning device. The grinding disk comprises a thickness self-adaptive layer, and a base layer and a grinding sheet which are fixed to two opposite surfaces of the t...  
WO/2023/026779A1
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium, while maintaining a stable polishing ra...  
WO/2023/026780A1
Provided is a composition for chemical mechanical polishing, with which chemical mechanical polishing can be carried out while suppressing corrosion of ruthenium and maintaining a stable polishing speed for a semiconductor substrate cont...  
WO/2023/023784A1
An axle buffer for buffing vehicle axles, the axle buffer comprising a buffer, a buffer rotating means and a buffer locating means, wherein buffer locating means comprises means to radially move the buffer relative to the axle surface an...  
WO/2023/028019A1
Described herein are textured glass-based articles. The textured glass-based articles may include a glass-based substrate including a first major surface and a second major surface. At least a portion of one or both of the first major su...  
WO/2023/026723A1
The present invention relates to a polishing device. The polishing device comprises: a plurality of window members (50) that transmit infrared rays, and a plurality of infrared radiation thermometers (51) that are disposed under the plur...  
WO/2023/022818A1
Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid...  
WO/2023/020837A1
The present invention relates to a grinder having a motor, wherein the grinder can be connected to a grinding disc. The grinder is designed to make possible, in addition to a grinding motion in a flat plane, a wobbling motion of the grin...  
WO/2023/021534A1
Finishing tool (10) for surface machining slab-like elements. The finishing tool (10) comprises a reusable base (12) and an abrasive component (14) releasably connected to said base (12) in order to be selectively replaced, wherein said ...  
WO/2023/022114A1
Provided is a sliding apparatus having excellent sliding properties and low frictional resistance with a snow surface or ice surface. The sliding apparatus for sliding on a slide object (snow surface or ice surface) has a slide surface (...  
WO/2023/019774A1
The present invention relates to a hot pressing device for an ACF glue film coupling structure and a process thereof. The hot pressing device comprises a transfer module and a first mounting plate connected to the transfer module; a nega...  
WO/2023/021521A1
This invention relates to a system for dispensing of abrasive powder and, water and oil mixture on polishing die for pavilion and crown processing and, table processing of natural and synthetic, single and poly crystal diamond at control...  
WO/2023/018428A1
A robotic sharpening system and method for rapidly and accurately sharpening or resharpening cutting tools is provided. The inventive system employs a robotic arm that grasps each cutting tool by its cutting blade instead of by its handl...  
WO/2023/016073A1
Provided is a waterjet cutting device, comprising a waterjet cutting head assembly (100). The waterjet cutting head assembly (100) comprises: a liquid transfer pipe (102), the liquid transfer pipe (102) being configured to allow a treatm...  
WO/2023/018881A2
A glass container that includes a base defining a hole, and methods of manufacturing and using the glass container, is disclosed. The glass container is manufactured by providing the container and cutting a hole in a wall of the containe...  
WO/2023/019134A1
The present invention provides, in one aspect, a rotating power tool including a housing, a drive unit within the housing having an electric motor defining a rotational axis, and a drive shaft coupled to the electric motor to receive tor...  
WO/2023/013509A1
A wire saw (1) abnormality diagnosis device comprises: a diagnostic mode execution unit (51), a data group acquisition unit (52), a deviation information calculation unit (54), and a determination unit (55). The diagnostic mode execution...  
WO/2023/011979A1
The invention relates to a polishing tool (100) for polishing a spectacle lens (L) in a surface machining process, which comprises a tool body (110) for being rotatably supported about a rotational axis (RA1). The tool body (110) compris...  
WO/2023/013146A1
The present invention enables accommodating diced workpieces in a tubular container while eliminating use of a moving mechanism for moving a processing table and comprises: a processing table which holds a workpiece; a first holding mech...  
WO/2023/013559A1
A robot system 100 comprises: a robot 1 for machining a machining portion B of an object W; a storage unit 32 for keeping an image of the object W, and three-dimensional information; a designation device 9 for designating the machining p...  
WO/2023/013576A1
This polishing pad has a polishing layer having a circular polishing surface, and is also provided with a spiral groove or concentric circular grooves consisting of a plurality of annular grooves arranged in concentric circles and formed...  
WO/2023/012042A1
The invention relates to a power tool apparatus which is provided to perform an abrasion work operation on a workpiece, said apparatus including at least one spindle which is driven to rotate and a plurality of abrasion components which ...  
WO/2023/013339A1
In the present invention, a polishing end point is detected with high accuracy even if there is a change in polishing frictional force. This polishing device comprises a polishing table for holding a polishing pad, a holding unit for h...  
WO/2023/014565A1
This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.  
WO/2023/014624A1
The disclosed system may include a slicing component that has a cutting blade. The cutting blade may be configured to cut a semiconductor wafer into multiple wafer strips, where the wafer strips have flat top surfaces and multiple edges....  
WO/2023/012940A1
Provided is a polishing pad that can stably achieve a required finishing quality of an object to be polished with strict product standards. The polishing pad is formed from a foam body comprising roughly spherical air bubbles, and is cha...  
WO/2023/013532A1
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that has high adhesive strength to rough surfaces and excellent shear strength at high temperatures. Further, a pressure-sensitive adhesive tape accord...  

Matches 601 - 650 out of 113,825