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WO/2024/052352A1 |
A grinding robot (7) for grinding a surface (2, 3, 4, 5) has a grinding device by means of which the surface (2, 3, 4, 5) can be ground using a grinding means, a movement device by means of which the grinding device can be moved over the...
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WO/2024/046699A1 |
The invention relates to a machine tool (10) having a rotating tool (20), wherein, to support a conventional braking operation, the machine tool has an eddy current brake (2), wherein the eddy current brake comprises a means (14) for gen...
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WO/2024/047149A1 |
The invention relates to a glazed assembly comprising a monolithic or laminated glazing (300) and a finishing joint and/or seal (50), the glass sheet of the monolithic glazing, or, respectively, an external sheet (320) of the laminated g...
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WO/2024/049890A1 |
A retaining ring for a carrier head of a chemical mechanical polishing system includes an annular outer portion having an annular outer surface and a plurality of flanges projecting radially inward from the annular outer portion. Adjacen...
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WO/2024/045493A1 |
A shape-controlled flexible polishing method for a microarray mold. The following solution is used: a magnet is mounted below a microarray mold (3), so that a prepared magnetic abrasive is attached to the surface of the microarray mold (...
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WO/2024/047305A1 |
The invention relates to a method for polishing the front face of a polycrystalline silicon carbide slab comprising a surface region at least partially work-hardened under the effect of grinding, comprising: - relative movement of a rota...
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WO/2024/049642A1 |
The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as p...
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WO/2024/050006A1 |
Abrasive agglomerates can include cubic boron nitride particles and a vitrified binder material. An abrasive article can include the abrasive agglomerates and a vitrified bond material. The bond material can include zircon, crystalline z...
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WO/2024/048271A1 |
Provided are: a composition for chemical mechanical polishing; and a polishing method using the same. The composition allows rapid polishing of a polishing surface that contains a silver material for wiring, and makes it possible to obta...
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WO/2024/049562A1 |
The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facilit...
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WO/2023/182264A9 |
This vitrified-bond superabrasive wheel has a superabrasive layer, the superabrasive layer 6 including superabrasive grains 3, pores 5, and vitrified bonds 2. In the superabrasive layer 6, the area ratio of coarse vitrified bond grains h...
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WO/2024/047282A1 |
The invention relates to a cleaning product (100, 200, 300) for dry dust cleaning of a sanded surface. The cleaning product (100, 200, 300) comprises a substrate (101, 201) having a first surface (101a, 201a) and a second surface (101b, ...
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WO/2024/050141A2 |
A polishing pad comprising a textile layer, a compressible layer, and a water impermeable layer disposed between the textile layer and the compressible layer. The polishing pad reduces slurry use by improving slurry transport and require...
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WO/2024/042542A1 |
The present disclosure relates to a Fluid Jet Polishing (FJP) device (200) for a workpiece (203). The FJP (200) includes a mixer (201), a nozzle (202), and an acoustic transducer (202a). The mixer (201) is adapted to mix a carrier fluid ...
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WO/2024/042769A1 |
A cutting device (100) comprises a sliding door structure (200). The sliding door structure (200) is provided with: a rail cover (21) configured to cover a rail (23) that is configured to enable linear movement of a sliding door (20); an...
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WO/2024/042450A1 |
A shaving device (100) including a handle (110), a sharpening member (126), and a cartridge (150, 200, 650). The sharpening member (126) includes an abrasive material. The cartridge (150, 200, 650) couples to the handle (110). The cartri...
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WO/2024/043236A1 |
Provided is a balancer with which it is possible to further inhibit vibrations from occurring when a rotary body is rotating. In a nut 1 serving as a balancer, a groove portion 12 in which balance pieces 30, 40 can be placed along the ci...
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WO/2024/041451A1 |
The present invention relates to the field of optical cold working equipment. Disclosed is a down swing polishing machine, comprising a seat and a base connected to the seat by means of three bearing units; a pressure unit is provided on...
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WO/2024/040700A1 |
Disclosed is an automatic adjustment device for converting linear motion into angle adjustment motion. The automatic adjusting device comprises: a moving assembly, which moves linearly in a first direction; a limiting member, which is fi...
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WO/2024/044023A1 |
The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad The pad surface cleaning system may be used to spray the polishing surface with a h...
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WO/2024/042559A1 |
Holding unit (10) for holding a sheet (200) comprising a stabilizer device (11) provided with gripping members (12, 13) of which at least one is mobile with respect to the other along an axis of grip and release (Z) to hold said sheet (2...
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WO/2024/042829A1 |
Provided is a cylindrical grinding device that produces a slicing single crystal by performing cylindrical grinding in which the outer peripheral surface of a grinding single crystal is ground while the grinding single crystal is caused ...
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WO/2024/043207A1 |
Provided are an aircraft coating removal device and method. The device comprises: a travel cart that can move; a blast head that is mounted on the travel cart and that can spray a blast material; a raising/lowering device that can move t...
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WO/2024/041619A1 |
The present application relates to the technical field of grinding machines, and specifically provides a chuck assembly, a grinding machine and a control method therefor. The grinding machine comprises a feeding device, the chuck assembl...
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WO/2024/043237A1 |
Provided is a flanged grindstone that can reduce the amount of grindstone that is ground due to truing, and to reduce variations in balance adjustment. In a flanged grindstone 1, flanges 30, 51 comprise: spindle insertion holes 33, 52 th...
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WO/2024/043061A1 |
Provided is a polishing composition capable of achieving high HLM rim protrusion resolving ability while maintaining a polishing rate. Also provided is a polishing composition for preliminarily polishing the surface of a silicon material...
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WO/2024/041159A1 |
An ultrasonic thinning device for a wafer, comprising an adsorption unit and a grinding unit. The adsorption unit comprises vacuum suction cups (20) each having a cup body (201); air flow channels (202) and adsorption holes (203) are eve...
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WO/2024/036983A1 |
A polishing pad (2), comprising a polishing layer (20). The polishing layer (20) comprises a polyurethane substrate, and the polyurethane substrate is obtained by reacting a polyfunctional isocyanate, a polyol composition and a polyamine...
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WO/2024/036569A1 |
A polishing system (100), a fluid reuse system (500) and a method of polishing a substrate. The polishing system comprises a catch basin (200), a vacuum device (400), and a polishing fluid recycling module (501) for recycling polishing f...
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WO/2024/038170A2 |
A computer-implemented method (100) for facilitating an identification of an optical mark (410) in an image (400) of a spectacle lens (402) is provided. The method (100) is characterized in that it comprises a step of generating (104) en...
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WO/2024/039156A1 |
A razor blade according to an embodiment of the present invention comprises a substrate having a cutting edge formed at the tip thereof, wherein the thickness (T4) of the substrate as measured at a distance of 4μm from the tip has a val...
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WO/2024/036653A1 |
The present invention relates to the technical field of automated production, and specifically relates to an automatic material-preparation system. The automatic material-preparation system comprises a rack, a transfer manipulator, a mat...
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WO/2024/037742A1 |
The invention relates to a cutting disk, comprising a core disk (12) that is made of a metal material, and cutting segments (14) that are arranged on the circumference of the core disk (12) and each have a metal sinter matrix (18) in whi...
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WO/2024/039407A1 |
Embodiments of the present disclosure provide a multiple disk pad conditioner and methods of using the multiple disk pad conditioner during a chemical mechanical polishing (CMP) process. The multiple disk pad conditioner has a plurality ...
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WO/2024/033205A1 |
The invention relates to a device and a method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer between the upper polis...
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WO/2024/031521A1 |
An edge processing apparatus for manufacturing aluminum alloy doors and windows, and a utilization method, which relate to the technical field of grinding apparatuses, and comprise: a linkage rod (205), the linkage rod (205) being rotata...
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WO/2024/034076A1 |
This superabrasive grain comprises an abrasive grain body section and an antioxidant film that coats at least a portion of the surface of the abrasive grain body section, wherein the abrasive grain body section comprises cubic boron nitr...
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WO/2024/032734A1 |
The present application relates to the technical field of loading adjustment in equipment such as a grinding machine, and specifically provides a loading device and a grinding machine comprising the loading device. The loading device com...
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WO/2024/031914A1 |
Disclosed in the present invention is a magnetic field assisted powerful grinding minimal quantity lubricant supply and recovery apparatus, comprising a grinding wheel guard assembly, a controllable magnetic field assembly, a controllabl...
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WO/2024/034171A1 |
This cutting device cuts an object to be cut. The cutting device comprises a table, a cutting mechanism, and an imaging device. The table holds the object to be cut. The cutting mechanism cuts the object to be cut held by the table. The ...
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WO/2024/035840A1 |
An improved peening process to simulate the shadowing effect of workpieces that are being peened to more accurately determine the degree to which a workpiece has been peened, and to an improved test strip holder that can be used to bette...
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WO/2024/034618A1 |
The present invention provides a polishing liquid which contains: abrasive grains; an ether compound which has at least one group that is selected from the group consisting of a carboxy group and a carboxylate group; and water. The prese...
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WO/2024/029102A1 |
An abrasive stick (10) according to examples 1 and 2 is for grinding a grinding surface (S) of a workpiece (W) by pressing a tip end part (17) thereof against the grinding surface (S). The abrasive stick (10) according to examples 1 and ...
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WO/2024/029234A1 |
Provided is an air-blast abrasion material comprising a carbon powder having a new Mohs hardness of 2.5-7.0. The air-blast abrasion material does not readily remain on the surface of an object being blasted, and therefore, little residue...
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WO/2024/030291A1 |
A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm wi...
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WO/2024/029236A1 |
[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-p...
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WO/2024/029108A1 |
An end (17) of a stick grindstone (10) is pressed against a surface (S) to be polished of a work (W) to polish the surface (S) to be polished. The stick grindstone (10) comprises inorganic long fibers (15) and a resin having infiltrated ...
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WO/2024/029457A1 |
Provided is a polishing composition containing a water-soluble polymer, the polishing composition being capable of achieving a high-quality surface without compromising polishing rate. The polishing composition comprises: silica particle...
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WO/2024/027597A1 |
Provided is a tool grinding machine, comprising: a machine body (100), the machine body (100) being provided with a pillar (101); a rotating shaft housing (300), the rotating shaft housing (300) being arranged on the pillar (101) to be c...
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WO/2024/030819A1 |
Methods of forming a cutting element include sintering diamond particles at a temperature of at least about 1400ºC under a pressure of at least about 10 GPa in the absence of a metal solvent catalyst so as to form a polycrystalline diam...
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