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WO/2012/000426 |
A dressing head of a polishing pad includes a bearing block (6), a spindle (14), a protection cover (5), a press disc (3), an adaptive disc (19), a diamond disc (1) and a flexible ring (18). A flange (15) is installed at the lower end of...
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WO/2012/001032 |
The invention describes a polishing device (100) for polishing a component (200), comprising an elongated polishing element (110), which is directed against the surface (205) of the component (200) parallel to the longitudinal axis (z) o...
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WO/2012/000669 |
The invention relates to a security element for a security paper, value document or the like, comprising a support having a motif region (3), which provides a visually perceptible motif having a first and a second motif part (4, 5), wher...
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WO/2011/162265 |
Disclosed is a silicon carbide substrate-polishing composition for polishing silicon carbide substrates, said composition comprising colloidal silica particles having a true specific gravity of 2.10-2.30 and water, and having a free alka...
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WO/2011/163542 |
A tool (10) for use in abrading, honing, lapping or otherwise finishing or working the interior surface of a bore, aperture, cylinder or like work piece includes an abrading element (11) dependently supported about a mandrel assembly (18...
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WO/2011/163450 |
A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the s...
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WO/2011/162893 |
Various methods and systems are provided for finishing a target surface. In one embodiment, a arrangement includes a target surface; at least two electromagnets; a magnetic abrasive fluid mixture disposed on the target surface; and at le...
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WO/2011/161994 |
Provided are a method and a device for buff polishing an inner surface of an annular member such as an annularly formed precure tread uniformly and without any excess or deficiency, wherein the inner surface of the precure tread (20) def...
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WO/2011/161841 |
Disclosed is a drum that: keeps the degree of abrasive blasting of an entire product to be treated uniform by improving the agitation of the product to be treated, which is buried at the bottom of a drum for a shot blast apparatus; and m...
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WO/2011/162163 |
The amount of adhesion of cullet to the major planar surface of a glass substrate due to the grinding of an end surface is reduced. An end surface (12) of a glass substrate (10) is ground into an elliptical shape. The ellipse is defined ...
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WO/2011/160142 |
A grinding tool carrier (1) with substantially circular grinding discs (2) arranged thereupon, an abrasive covering detachably secured on said discs and chip-removing cutters (4) arranged on the grinding tool carrier and between the grin...
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WO/2011/160868 |
The invention is based on an, particularly for an angle grinding machine (14a-l), comprising at least one damping element (16a-l; 18a-l, 20a-l; 22a; 22b; 22d-h; 94d; 94e; 96d; 96e; 98d; 98e; 100d; 100e), which is intended for damping vib...
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WO/2011/162275 |
The purpose of the present invention is to simply and affordably build a machining line without making major structural changes to a machine tool for machining crank shafts. This machine tool machines a scroll workpiece received at a fir...
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WO/2011/162767 |
A sharpening device with an abrasive material, a polishing coat encapsulating the abrasive material and an instruction card coupled to the polishing coat. The abrasive material having a property of conforming to the shape of a pointed ar...
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WO/2011/162281 |
Disclosed is a case that houses a transmitter and receiver for an ODU and which has environmental resistance even without coating the surface of the case. Specifically disclosed is a communications device (ODU) (1) installed outdoors and...
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WO/2011/158718 |
Disclosed is a polishing liquid for a semiconductor substrate, which contains modified silica particles the surfaces of which are modified by an aluminate, a water-soluble polymer and water. The content of the water-soluble polymer is mo...
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WO/2011/158522 |
Disclosed is a polishing treatment technology that uses polishing particles consisting of manganese oxide and exhibits polishing characteristics equivalent to those of cerium oxide: namely, good polishing speed and polishing-surface prec...
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WO/2011/158526 |
A formed cutter (1) comprises, at the tip side, a cutting blade section (2) whereon helical teeth (6) and helical grooves (8) are alternately formed. The cutting blade section (2) rotates centering on a rotation axis (O), thereby perform...
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WO/2011/158834 |
Disclosed is a saw wire which comprises: a steel wire (11) comprising a base steel wire (11a) having a given composition; abrasive grains (13) adhered to the steel wire (11) by means of an adhesion part (12); and an intermetallic compoun...
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WO/2011/157493 |
The invention relates to a method for polishing a semiconductor wafer having a front side and a rear side, comprising the following steps in the stated order: (a) simultaneous polishing of front and rear sides of the semiconductor wafer ...
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WO/2011/157252 |
The invention relates to a shim (2) for supporting a reground indexable insert (1) with respect to a tool holder, wherein the shim (2) has an underside, resting on the tool holder, and an upper side (2a), facing the indexable insert (1)....
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WO/2011/155283 |
The disclosed method for manufacturing leaf springs can improve the durability of eyes of said leaf springs, improve productivity, and decrease manufacturing costs. When forming a gap (115), the front edge (113) of an eye section (112) i...
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WO/2011/156150 |
A superabrasive cutting element including a diamond or other superabrasive material table having a peripheral cutting edge defined by at least one chamfer between a cutting face and a side surface of the table, an arcuate surface extendi...
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WO/2011/153596 |
A duplicating pantograph for sanding, deburring and polishing cast, forged or the like parts, consists essentially of a machine (1) for sanding, deburring and polishing any excess material characteristic of parts (P) made of cast iron or...
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WO/2011/155768 |
The present invention relates to a descaling apparatus for effectively removing scales formed on surfaces of hot-rolled steel strips (steel sheets). An embodiment of the descaling apparatus of the present invention comprises: a housing a...
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WO/2011/150550 |
A processing machine tool for an integrated propeller includes a planar turntable (1); a stand (2) which is provided at a side of the planar turntable (1) and can move relative to it; a frame (3) which is provided on the stand (2) and ca...
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WO/2011/152073 |
The present invention provides an apparatus for removing the unnecessary thin-film layer on the periphery of the substrate of the plate-like member having a square shape, on the surface of which substrate is formed a thin- film layer. Th...
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WO/2011/152216 |
Disclosed is a cylinder block that, using existing equipment, can increase the cylindricity of a bore when fastening a cylinder head. Further disclosed is a method for machining same. The machining shape of the bore (111) is obtained on ...
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WO/2011/152356 |
Disclosed is a polishing agent for chemically and mechanically polishing a surface to be polished in the production of a semiconductor integrated circuit device. The polishing agent contains: abrasive grains; an oxidizing agent; a protec...
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WO/2011/152045 |
Disclosed is a semiconductor wafer surface protection sheet which has excellent adherence to the irregularities on the circuit formation surface of a semiconductor wafer, and has excellent detachability after being ground. Specifically, ...
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WO/2011/151550 |
A process for pickling or descaling a concrete surface via the use of at leat one jet of liquid nitrogen at a cryogenic temperature of less than ‑100°C at a pressure of at least 500 bar, distributed via the outlet orifice (2) of at le...
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WO/2011/149625 |
Disclosed is a method of applying particles to a coated backing. A first layer of particles is created over a second layer of particles on a support surface and the first layer of particles is different in at least one property from the ...
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WO/2011/149625 |
Disclosed is a method of applying particles to a coated backing. A first layer of particles is created over a second layer of particles on a support surface and the first layer of particles is different in at least one property from the ...
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WO/2011/148561 |
Provided is an abrasive tape which almost completely does not have fine free abrasive particles, and also provided is a method for fabricating the abrasive tape that almost completely does not have fine free abrasive particles, by means ...
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WO/2011/148762 |
Provided are a lens barrel part and a method of manufacturing the same, such that the generation of grinding debris due to friction with lenses is suppressed while maintaining the air permeability of porous ceramics. Those areas of a len...
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WO/2011/148111 |
The present invention relates to an adhesive composition which contains at least one water-soluble or water-dispersible unsaturated polyester and at least one ethylene-unsaturated monomer. Specifically, said unsaturated polyester is obta...
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WO/2011/147709 |
The present invention relates to a lining carrier for a sanding pad lining, in particular for use with a sanding pad for pressing sanding surfaces against workpieces in segment-belt and wide-belt sanding machines. Here, the lining carrie...
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WO/2011/150326 |
An abrasive article includes a backing including first and second major surfaces, an abrasive layer disposed over the first major surface, and a back coat layer disposed over the second major surface. The back coat layer includes a polym...
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WO/2011/148112 |
The present invention relates to an adhesive composition containing a water-soluble or water-dispersible carboxylic-acid-terminated unsaturated polyester and at least one ethylenically unsaturated monomer. More specifically, the polyeste...
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WO/2011/146884 |
Methods, systems, and techniques for automatically determining jet orientation parameters to correct for potential deviations in three dimensional part cutting are provided. Example embodiments provide an Adaptive Vector Control System (...
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WO/2011/144624 |
Methods and apparatuses are used for optically measuring by interferometry the thickness (T) of an object (2) such as a slice of semiconductor material. Readings of the object thickness by optical interferometry are carried out, rough th...
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WO/2011/145479 |
Disclosed is a method for roughening a substrate, which includes: a disposing step wherein a mask plate having a plurality of rectangular openings previously formed is disposed on the side of the substrate surface to be processed; and a ...
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WO/2011/146697 |
The present disclosure provides a silicon carbide (SiC) bonded diamond compact having less than about 2 weight % unreacted Si and less than about 1 weight % graphite, as well as processes for making the same.
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WO/2011/145521 |
Disclosed is a semiconductor device, wherein the surface of a semiconductor substrate (1) is formed with abrasive grain marks (62), and dopant diffusing regions (3,5) have a section which extends in a direction which forms an angle withi...
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WO/2011/145501 |
Disclosed is a glass etching composition which is characterised by being an aqueous solution containing an alkali compound and at least one kind of compound selected from the group consisting of (1) an alcohol having at least three alcoh...
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WO/2011/145698 |
A grindstone comprises a base (211) and a plurality of abrasive grains (210) which are bonded to a base surface (212) in such a way as to be lined up in a row. Each of the plurality of abrasive grains (210) comprises a relief surface (21...
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WO/2011/142765 |
The present invention relates to an apparatus for cleaning the grooves of a CMP polishing pad during CMP operation comprising a series of projections at intervals corresponding to the width between grooves, said projections being the wid...
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WO/2011/141505 |
The invention relates to a device (1) for the combined precision turning and honing of a cylindrical borehole (35). The device (1) according to the invention can comprise either only honing stones (29) which can be fed or also cutters (7...
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WO/2011/140693 |
A ball grinding machine includes a rotary grinding disc (3), a pressure grinding disc (2), a ball-feeding channel (4) and a ball-discharging channel (5). N concentric grinding channels are provided correspondingly on the upper surface of...
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WO/2011/142177 |
Disclosed is a polishing pad that can flatten a polishing object that has received finish polishing, including an edge section thereof, by making the edge section of the polishing object that has received rough polishing into a blade sha...
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