| Document |
Document Title |
|
WO/2022/187249A1 |
A carrier head for holding a substrate in a polishing system includes a housing, an annular body that is vertically movable relative to the housing by an actuator, a first annular membrane secured to extending below the annular body to f...
|
|
WO/2022/186992A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so ...
|
|
WO/2022/186745A1 |
An abrasive tool (200) for a floor grinder, the abrasive tool (200) comprising an attachment plate (230) arranged to releasably attach to a tool holder of the floor grinder, the abrasive tool (200) also comprising an abrasive tool sectio...
|
|
WO/2022/183225A1 |
The invention relates to an apparatus for machining the running edges (12) of a sporting device (9), more particularly a ski or a snowboard, comprising a transport apparatus (6), which can be temporarily connected to the sporting device ...
|
|
WO/2022/185734A1 |
A blasting machine for projecting an abrasive material onto an object comprises a projection unit for projecting the abrasive material, and a collection unit for collecting the projected abrasive material. The collection unit is capable ...
|
|
WO/2022/187025A1 |
A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first mod...
|
|
WO/2022/187023A1 |
A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the ...
|
|
WO/2022/186347A1 |
The present invention addresses the problem of obtaining a machining tool capable of effectively removing, from a machining place, machining chips formed during machining of a workpiece. The problem is solved by a machining tool of the p...
|
|
WO/2022/187057A1 |
Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camer...
|
|
WO/2022/185793A1 |
Provided is a means for being able to reduce the abrasive grain residue on the surface of an object to be polished after polishing. The polishing composition of the present invention is a polishing composition including abrasive grains a...
|
|
WO/2022/187055A1 |
A method for optimizing polishing includes, for each respective retaining ring of a plurality of retaining rings mounted on a particular carrier head, performing measurements for a bottom surface of the respective retaining ring mounted ...
|
|
WO/2022/186988A1 |
Method of training a neural network for spectrographic monitoring includes polishing a test substrate, measuring by an in-situ spectrographic monitoring system a sequence of test spectra of light reflected from the substrate and measurin...
|
|
WO/2022/182881A1 |
Containment and exhaust systems for substrate polishing components are disclosed. In one aspect, a substrate carrier head, includes a polishing pad, a substrate carrier head configured to retain a wafer against the polishing pad, an atom...
|
|
WO/2022/181787A1 |
Provided is a polishing pad which has a high tracking performance even if a surface to be polished is a curved surface. A polishing pad (1) according to an embodiment of the present invention is provided with a polishing layer (2) having...
|
|
WO/2022/180101A1 |
Embodiments of the invention relate to a method for applying an optical mark (30) to a spectacle lens (12) mounted in a spectacle frame (14). The method comprises determining an intended position of the optical mark (30) at the spectacle...
|
|
WO/2022/182513A1 |
A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially ...
|
|
WO/2022/181098A1 |
The present technology relates to an information processing device that makes it possible to more easily determine timing for maintenance, using event data. The information processing device comprises a state estimation unit that estimat...
|
|
WO/2022/181715A1 |
A magnetic disk substrate of an embodiment comprises a pair of main surfaces, and an outer peripheral edge surface. In the magnetic disk substrate, the outer peripheral edge surface has a pair of chamfered surfaces connecting to the main...
|
|
WO/2022/181019A1 |
The present invention provides an apparatus for double-side polishing of a semiconductor wafer using a polishing cloth and a polishing slurry, said double-side polishing apparatus being characterized in that: a dressing apparatus to whic...
|
|
WO/2022/176983A1 |
This fluid polishing device comprises a shaft body, a main magnetic material, a sub magnetic material, and an electric field path. The main magnetic material includes a conductive layer formed partially or entirely in a cylindrical magne...
|
|
WO/2022/175646A1 |
There is provided a method of improving a taper interface between a first prosthetic implant and a second prosthetic implant. The method has steps of a) selecting a first prosthetic implant of a desired dimension, having a first taper in...
|
|
WO/2022/176576A1 |
A processing condition setting device 20 is provided with a control unit 22 for selecting a parameter set to be applied to a wafer processing device 1 from among a plurality of parameter sets. On the basis of a pre-processing characteris...
|
|
WO/2022/177726A1 |
A substrate carrier configured to be attached to a polishing system for polishing a substrate is described herein. The substrate carrier includes a housing including a plurality of load couplings and a retaining ring coupled to the housi...
|
|
WO/2022/176278A1 |
Provided is a method for achieving more improved results in a base material adjusting method employed when maintaining a structure, such as a bridge, formed from a steel material. In this new method for removing rust from a rusted stee...
|
|
WO/2022/175630A1 |
The invention relates to a correction device (1) for machining a surface to be corrected (2A) of a part (2) rotating about a main central axis (X2) mounted to rotate on a frame (3), the device comprising a base (5) to be fixed on the fra...
|
|
WO/2022/174680A1 |
A cleaning device, in particular relating to a coin cleaning machine and an implementation method therefor, belonging to the field of cleaning devices. The coin cleaning machine comprises a machine frame (1) and coins (2). A coin collect...
|
|
WO/2022/175322A1 |
The invention relates to a grinding device having at least one endless abrasive belt (210, 310), which is guided in at least one circulating direction (P3) via deflecting elements (212, 214, 216, 312, 314, 316), and a pressing assembly (...
|
|
WO/2022/172438A1 |
Provided is an abrasive agent for tungsten materials, the abrasive agent comprising abrasive grains, an ammonium salt, an iron-containing compound and an oxidizing agent, in which the abrasive grains have a positive zeta potential and th...
|
|
WO/2022/173581A1 |
Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical ...
|
|
WO/2022/171506A1 |
The invention relates to a device for treating a mold surface (12) limiting a mold cavity of a mold or being an outer surface of a mold core for producing a mold, the device comprising: a treating carriage (22) having at least one treati...
|
|
WO/2022/170875A1 |
Disclosed are a device and method for gradient utilization and residue recycling of a waste sagger. The device comprises a sandblasting chamber, a sand collection hopper, a cyclone separator, and a spiral conveyor. A polishing device is ...
|
|
WO/2022/170697A1 |
A jet strengthening and polishing integrated apparatus and process for performing surface strengthening on a workpiece to be machined. The jet strengthening and polishing integrated apparatus comprises: a storage (1) for storing water an...
|
|
WO/2022/171810A1 |
Method of polishing a surface of an optical lens intended to be mounted in a spectacle frame, wherein the method comprises: obtaining edging contour data representative of the edging contour of the optical lens so as to be mounted in the...
|
|
WO/2022/172683A1 |
The present invention relates to a polishing device and a polishing method for polishing a planar section of a substrate such as a wafer. This polishing device (100) comprises a substrate-holding part that holds a substrate (W) and that ...
|
|
WO/2022/168860A1 |
The present invention provides a polishing composition which contains abrasive grains, a permanganate salt, an aluminum salt and water. With respect to this polishing composition, the concentration W1 (% by weight) of the abrasive grains...
|
|
WO/2022/167386A1 |
A decontamination apparatus (1; 101; 434) for decontaminating an external surface (16; 116; 416) is provided. The decontamination apparatus has a moveable platform (4; 104; 204) and a containment structure (6; 106; 406) mounted on the mo...
|
|
WO/2022/167205A1 |
The invention relates to a honing bar (200) for use in a honing tool for processing the inner surface of a bore, comprising a cutting layer carrier (202) which carries a cutting layer (210) on an outer side, which cutting layer has cutti...
|
|
WO/2022/165739A1 |
A 2D/3D visual fusion-based robot intelligent polishing method and apparatus for hardware. The method comprises the following steps: S100, acquiring RGB images of a plurality of viewing angles of input hardware; S200, performing detectio...
|
|
WO/2022/168558A1 |
This switch mechanism, provided in an electric work device driven by a motor accommodated in a housing, comprises: a switch that is accommodated in the housing, and that supplies electric power to the motor in an ON state, and stops the ...
|
|
WO/2022/168944A1 |
A grinding device (1) comprises: a grinding material drive unit (6) that has a motor for causing a grinding material (5) to rotate; a table drive unit (8) that causes the grinding material (5) to come into contact with a workpiece (20) b...
|
|
WO/2022/167114A1 |
The present invention relates to a method for braking a rotating tool of an electric machine tool, the electric machine tool comprising an electronic machine unit and a motor. A braking method is provided, in which the braking process ha...
|
|
WO/2022/166776A1 |
A flexible membrane for chemical mechanical planarization, the flexible membrane comprising a bottom plate part (141) for receiving a substrate; an annular edge side wall, the edge side wall being provided with an upright part (142), whi...
|
|
WO/2022/167113A1 |
The invention relates to a method for braking a rotating tool of an electric machine tool, the electric machine tool comprising an electronic machine unit and a motor. A braking method is provided, in which the braking process comprises ...
|
|
WO/2022/168682A1 |
Provided are a disc-shaped edged tool, and a manufacturing method of the same. The disc-shaped edged tool: includes a disc-shaped base metal having a single-edged tip portion formed by connecting a flat face on a side contacting another ...
|
|
WO/2022/166777A1 |
A chemical mechanical planarization control method, comprising: planarizing a wafer (w) by using a carrier head (30) having a plurality of pressure chambers (C1, C2, C3, C4, C5), wherein the pressure chambers correspondingly divide the s...
|
|
WO/2022/167204A1 |
The invention relates to a honing tool (100) comprising a tubular tool body (110), at least in sections, which has a cutting region having at least one honing bar receptacle opening which is continuous from the inside of the tool body to...
|
|
WO/2022/168858A1 |
The present invention provides a polishing composition which is capable of suppressing an increase in the temperature of a polishing pad during polishing. A polishing composition according to the present invention contains: water; an oxi...
|
|
WO/2022/170015A1 |
A chemical mechanical polishing composition for polishing a substrate including a silicon carbonitride layer, the composition comprising, consisting essentially of, or consisting of a water based liquid carrier, anionic colloidal silica ...
|
|
WO/2022/168859A1 |
Provided are a polishing method and a polishing composition that are applied for polishing silicon carbide and that enable suppression of an increase in pH of the polishing composition and an increase in the temperature of a pad during p...
|
|
WO/2022/162182A1 |
The invention relates to a plastic blasting medium A and to the use of a plastic blasting medium A, comprising at least one particle PA1 made of at least one polymer KA1 and at least one foreign particle FA1 for the surface treatment of ...
|
