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WO/2011/142764 |
A method of CMP wherein the polishing pad is partially or wholly replaced by a counter face made of a smooth hard material, and beads or particles of a hard material are suspended in the polishing slurry to provide asperities for the pol...
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WO/2011/142362 |
Disclosed is a silicon-wafer polishing composition that contains silica, a basic substance, a chelating agent, and water. The chelating agent comprises at least one species selected from a group comprising ethylenediamine-N,N'-di(o-hydro...
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WO/2011/142986 |
A fixed abrasive pad (100) in the form of a structured abrasive article is provided that has a structured abrasive layer (120) disposed on a backing (110). The structured abrasive layer (120) includes a polymeric binder, abrasive particl...
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WO/2011/142159 |
Provided is a wafer chamfering device such that wafers are chamfered in parallel on a plurality of processing tables, that the throughput is improved, and that the total number of grindstones is restricted, resulting in the cost and the ...
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WO/2011/142323 |
A grinding machine is such that a pair of workpiece support devices (12, 13) which clamp and rotate a workpiece (W) are provided on a bed (11). A pair of saddles (14) are provided on the bed (11) in such a way as to be movable along the ...
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WO/2011/141204 |
A fastening flange in a machine tool is used to receive a tool and has a form-fit geometry designed as a recess for connecting to a drive shaft and form-fit elements for connecting to the tool. The form-fit geometry for connecting to the...
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WO/2011/141500 |
The present invention relates to a grinding disc which comprises a carrier (1), which is drilled through in the centre (6) for mounting purposes, and a working region (2) which forms the outer edge of the grinding disc (7) and has at lea...
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WO/2011/139934 |
A method of making a 3D glass article includes forming at least one marker on an edge of a 2D glass piece. The 2D glass piece is thermally reformed into a 3D glass article, where the at least one marker formed on the edge of the 2D glass...
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WO/2011/139562 |
Ceramic shaped abrasive particles have four major sides joined by six common edges. Each one of the four major sides contacts three other of the four major sides. The six common edges have substantially the same length. Methods of making...
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WO/2011/139760 |
Methods of forming a polycrystalline compact for use in an earth-boring tool include sintering a plurality of hard particles with catalyst material to form a polycrystalline material that includes a plurality of inter-bonded particles of...
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WO/2011/139143 |
System for blasting objects by means of a blasting head (1) with a blasting medium (2), the medium contains a blasting fluid comprising a mixture of a transport fluid and an abrasive material. The blasting fluid is supplied to the blasti...
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WO/2011/139562 |
Ceramic shaped abrasive particles have four major sides joined by six common edges. Each one of the four major sides contacts three other of the four major sides. The six common edges have substantially the same length. Methods of making...
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WO/2011/139668 |
Methods of forming a polycrystalline diamond compact for use in an earth-boring tool include forming a body of polycrystalline diamond material including a first material disposed in interstitial spaces between inter-bonded diamond cryst...
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WO/2011/139668 |
Methods of forming a polycrystalline diamond compact for use in an earth-boring tool include forming a body of polycrystalline diamond material including a first material disposed in interstitial spaces between inter-bonded diamond cryst...
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WO/2011/137467 |
The invention related to a linear conveyor (21) for transporting glass panels (3) in the vicinity of grinding stations (9, 13) or a washing station (15) of a system for producing glass panel blanks comprising a linear conveyor (23), for ...
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WO/2011/139760 |
Methods of forming a polycrystalline compact for use in an earth-boring tool include sintering a plurality of hard particles with catalyst material to form a polycrystalline material that includes a plurality of inter-bonded particles of...
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WO/2011/139808 |
A tool securing device (2) capable of clamping a tool to a machine spindle as well as assisting in the removal of a tool from a machine spindle, all in a tool-less manner. The tool securing device includes distal means (10) to be releasa...
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WO/2011/140043 |
Lens processing and testing systems are provided various forms of marking and/or holding lens components, such as lens substrates and the like including electro-active elements. A lens testing system may include, for example, a light sou...
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WO/2011/140043 |
Lens processing and testing systems are provided various forms of marking and/or holding lens components, such as lens substrates and the like including electro-active elements. A lens testing system may include, for example, a light sou...
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WO/2011/138304 |
The invention relates to a method for simultaneous double-side grinding of at least one semiconductor wafer, wherein the one or a plurality of semiconductor wafers lie(s) in freely movable fashion in a cutout in a guide plate fixed in a ...
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WO/2011/135118 |
The invention relates to a device for grinding the blades of rotor discs and to the associated grinding method, said device comprising a bed plate (1) having a carriage (2) mounted thereon, which carriage can move transversally and longi...
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WO/2011/136106 |
Provided is a polishing fluid composition for glass hard disc substrates which combines a high polish rate and high cleanliness and which, even when used in a fluid-circulating polishing system, can keep a high polish rate for a long tim...
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WO/2011/135949 |
Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is lapped, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution t...
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WO/2011/135526 |
A method for removing ceramic coatings using a special equipment without modifying the characteristics of the substrate such as roughness and thickness and able to prepare the substrate to be recoated with a new ceramic layer, is provide...
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WO/2011/136387 |
Disclosed is a polishing slurry for sapphire polishing that is capable of obtaining polishing speeds and smooth surfaces during the polishing of sapphire substrates that are equivalent to or better than in prior polishing processes even ...
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WO/2011/131166 |
The invention relates to a method for processing a surface of a component, in particular in the aviation sector, comprising the following steps: spraying (4) the component with a first powder; and coating (5) the component with a second ...
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WO/2011/132868 |
The present invention relates to a portable scissor sharpener, which comprises: a portable grinder body having an empty space defined therein; an installation groove which is cut perpendicularly to the front of the body and is slantingly...
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WO/2011/133386 |
Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to...
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WO/2011/131394 |
The invention relates to an angle grinder (10), comprising a housing (22), a drive unit (12) for driving a usage tool (14) having a sensor device (16) for providing a rotation parameter and a control unit (18) for evaluating the rotation...
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WO/2011/131913 |
The invention relates to a structure based on glass strand coated with a resin composition which comprises the following constituents in the proportions indicated, expressed in percentage by weight of solid matter: - 75 to 98% of a mixtu...
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WO/2011/133850 |
Cutting elements, earth-boring drill bits having such cutting elements and related methods are described herein. In some embodiments, a cutting element for an earth-boring tool may include a diamond table having an indentation in a cutti...
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WO/2011/131333 |
A scouring body which comprises a sponge body and a sheet like textile structure arranged on the sponge body, wherein the cleaning surface (3) of the sheet-like textile structure is sealed, strengthened and provided with scouring particl...
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WO/2011/133386 |
Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to...
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WO/2011/132868 |
The present invention relates to a portable scissor sharpener, which comprises: a portable grinder body having an empty space defined therein; an installation groove which is cut perpendicularly to the front of the body and is slantingly...
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WO/2011/133850 |
Cutting elements, earth-boring drill bits having such cutting elements and related methods are described herein. In some embodiments, a cutting element for an earth-boring tool may include a diamond table having an indentation in a cutti...
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WO/2011/132665 |
The disclosed method for manufacturing an aluminosilicate glass substrate for hard disks includes a step in which an aluminosilicate glass substrate is polished using a liquid polishing composition that contains silica particles, a polym...
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WO/2011/127952 |
The invention relates to a blasting agent (4), which has at least one means for mechanically processing surfaces, in particular steel or cast beads. An additive (6) for degreasing and cleaning the surface (2) to be blasted and/or the bla...
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WO/2011/130516 |
A method of forming a substantially homogeneous suspension of nanodiamond particles and microdiamond particles is disclosed The method includes disposing a first functional group on a plurality of nanodiamond particles to form derivatize...
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WO/2011/129401 |
An ultrasonic peening method which, in order to improve the fatigue strength of the weld (3) between a floating building (1) and a structure (2) welded to the floating building (1), applies an impact to the weld (3) by a pin (4) vibrated...
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WO/2011/129254 |
Disclosed is a polishing pad (1), which can detect an optical end point with high accuracy when polishing is being performed, and which can prevent a slurry from leaking from the polishing layer (10) side to the cushion layer (12) side, ...
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WO/2011/128217 |
Method for producing a semiconductor wafer, comprising in the stated order: (a) simultaneous double-side material-removing processing of the semiconductor wafer sliced from a single crystal; (b) rounding the edge of the semiconductor waf...
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WO/2011/126028 |
Disclosed is a method for manufacturing glass plates. The method comprises the following steps: a forming step for forming sheet glass from molten glass; a cutting step for cutting the sheet glass into glass plates having a predetermined...
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WO/2011/123906 |
Abrasive blasting control method in which a control device (10) is used including at least a swing-arm (13) and in which the movement of the swing-arm (13) is controlled from the exterior of the casing of the wheel from its rest position...
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WO/2011/125246 |
Disclosed is a method for dressing a threaded grinding stone for internal gear grinding, by which a threaded grinding stone for grinding an internal gear can be dressed with a high degree of accuracy by using a dressing gear that has bee...
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WO/2011/126073 |
Disclosed is a wire material for a saw wire and a method for producing the same, wherein parameter P expressed by formula (1) for the C, Si, Mn, and Cr content is 1000 or higher. The metallographic structure includes an areal proportion ...
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WO/2011/124458 |
The invention relates to a portable power tool (30), comprising a machine housing (31), a drive motor (32), a drive shaft (33) of the motor, an angular gear (34) that can be driven by the drive shaft (33), and an output spindle (35, 28) ...
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WO/2011/124318 |
The invention relates to a method for structuring a surface (1), in particular for applying a sharkskin to a vehicle or vehicle parts. The known methods comprise films to be glued on or mechanically embossing the plate with the aid of a ...
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WO/2011/125254 |
In order to provide a polishing technique by which a silicon carbide that is difficult to polish can be polished with high efficiency and high surface precision, a polishing slurry for polishing substrates is characterized in that the ab...
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WO/2011/126599 |
Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes theret...
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WO/2011/122144 |
The disclosed main roller for a wire saw has wire grooves with increased rigidity, improves cutting precision, and can improve the yield of a product. As well as maintaining the rigidity of the partitions and a high level of yield, even ...
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