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Patent Searching and Data


Matches 101 - 150 out of 139,825

Document Document Title
WO/2018/203134A1
A spark suppressor and spark- suppressing rotary abrasive tool having at least one non- smooth spark energy dissipating surface or layer disposed adjacent a spark generating region where there is abrasive contact between a workpiece and ...  
WO/2018/203448A1
The present invention is a wire-saw-based workpiece cutting method in which a fixed abrasive particle wire, to the surface of which are bonded abrasive particles, is wrapped around a plurality of grooved rollers to form a wire array, and...  
WO/2018/203516A1
This production method for a plate glass comprises a transport step for transporting a plate glass G in a predetermined transport direction. In the transport step, when the plate glass G is moved from a first waiting position WP1 to a pr...  
WO/2018/202507A1
The invention relates to a shaped ceramic abrasive particle, on the basis of alpha-Al2O3 and containing a proportion of 5 wt.-% to 30 wt.-% of ZrO2, the alpha-Al2O3 having a medium crystallite size of 0.5 µm to 3 µm and the ZrO2 having...  
WO/2018/203292A1
The present disclosure discloses a lug brushing machine for cleaning/brushing of lugs of tubular plates of lead acid storage batteries. The lug brushing machine incorporates feeder conveyor 210, a main conveyor 220 and a rotary table 230...  
WO/2018/196267A1
An automatic processing apparatus and processing method for a carbon fiber tube. The apparatus comprises a polishing device (1), a washing device (2), a printing device (4), a coating device (5), and a drying device of which the processi...  
WO/2018/197627A1
A cleaning container (10) for cleaning a mixing head (3) of an industrial mixing machine (1) comprises a cleaning vessel (11) with an opening and with connection means for connecting same to the mixing head (3). The cleaning vessel (11) ...  
WO/2018/197751A1
A blow-suction housing for an abrasive blasting apparatus comprises a jacket (7) having the shape of a housing with one open end, a blast nozzle (6), a suction opening in the jacket of the housing, and a suction hose (9) connected to the...  
WO/2018/197018A1
The water-abrasive-suspension cutting system (1) disclosed herein has a high-pressure source (3) for providing (701) water under high pressure, a high-pressure line (5) fluidically connected to the high-pressure source (3), said high-pre...  
WO/2018/198997A1
Provided is a CMP polishing device for flattening a quadrilateral substrate. Provided is a polishing device for polishing a quadrilateral substrate, the polishing device having a substrate retaining part for retaining a quadrilateral sub...  
WO/2018/198004A1
Various embodiments disclosed relate to an abrasive article. The abrasive article includes a nonwoven web. The nonwoven web includes a first irregular major surface and an opposite second irregular major surface. The nonwoven web further...  
WO/2018/198583A1
The present invention is a silicon wafer polishing method, comprising: a first polishing step for bringing the surface of a silicon wafer held by a polishing head into sliding contact with a polishing cloth attached to a surface plate an...  
WO/2018/198151A1
A grinding machine (10) for grinding tools (100; 100') comprises a support unit (11) configured to support a tool (100; 100') to be ground and provided with members suitable to incline it by certain angle (a) with respect to a horizontal...  
WO/2018/196105A1
Disclosed is a combination method for forming a gradient nanostructure on a surface layer of a metal workpiece, comprising the following steps: laser shock strengthening is first used to induce a deeper plastic deformation layer, and the...  
WO/2018/197115A1
The invention relates to a grinding machine (1), which can be manually translated on a track (3), for grinding a rail (2) of the track (3), comprising a support frame (5), which is guided on the rails (2) by means of two rail guides (8) ...  
WO/2018/200165A1
An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first...  
WO/2018/198928A1
A motor control apparatus 32 has: an on/off switch 22; a main control unit 36; a motor control circuit 38; an operating voltage generation circuit 40; a SW/AC monitoring unit 46; and an operating voltage monitoring unit 48. The SW/AC mon...  
WO/2018/197280A1
The invention relates to a machine tool (2), comprising a machine tool housing (4) and a handle assembly (6), which can be adjusted in the angular position thereof relative to the machine tool housing (4), the handle assembly (6) contain...  
WO/2018/198707A1
The present invention relates to a method for diminishing the peak power of a substrate processing device. In addition, the present invention relates to a substrate processing device operating method for processing a substrate such as a ...  
WO/2018/200913A1
Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using two grinding wheels mounted on spindles so that the edge of the grinding wheels chamfer the edge of the glass sheet...  
WO/2018/192871A1
The invention relates to a method for removing a flaw on a treated, in particular finally painted surface by grinding, wherein, after the flaw has been detected, a flexible abrasive sheet is moved to the surface and is pressed against th...  
WO/2018/193916A1
[Problem] To provide: a polishing composition which, when used in a wafer polishing step, gives a flat polished surface having a small difference in surface level between the central part and peripheral part (laser mark part) of the wafe...  
WO/2018/193040A1
The invention relates to a grinding machine, which is suitable for a robot-supported grinding process. According to one embodiment, the grinding machine has a housing, a motor arranged in the interior of the housing, a fan wheel arranged...  
WO/2018/193758A1
The present invention provides a double-sided wafer polishing method for placing multiple double-sided polishing carriers in a double-sided polishing apparatus and performing double-sided polishing of wafers, wherein, when readying a car...  
WO/2018/193762A1
The present invention provides an evaluation method for a semiconductor wafer fabricated by: chamfering and grinding an edge of a semiconductor wafer sliced from a semiconductor ingot and comprising major surfaces including a major front...  
WO/2018/194480A1
The present invention provides a honing tool (10) for providing abrasive treatment of leaf end surface (6) of a seal element (2) of a leaf seal assembly (1), wherein each seal element (2) of the leaf seal assembly (1) extends in radial d...  
WO/2018/192596A1
The invention relates to a method and to a device for the monitored control of the machining process of systems machining the surface of a workpiece, in particular wide-band grinding machines, whilst taking safety-relevant long-term effe...  
WO/2018/192869A3
The invention relates to a dust cover (100) which comprises: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circu...  
WO/2018/192201A1
Disclosed is an automatic sandblasting machine for a silicon rod wafer dicing machine over-line wheel. The automatic sandblasting machine comprises an operating bench (1) and a sand-blasting chamber (2), wherein the sand-blasting chamber...  
WO/2018/193939A1
A connection device is provided with: a cylindrical holder (31) in which holes (31a) are provided in side walls thereof and an expansion rod (13) is fixed to a top end thereof; steel balls (32) fitted into a recess (22a) provided in a si...  
WO/2018/192869A2
The invention relates to a dust cover (100) which comprises: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circu...  
WO/2018/192823A1
The invention relates to an angle grinder (200) having a gear neck (210) for connecting a dust hood (100, 100') provided with a flange (90), the angle grinder (200) having a sensor unit (20) by means of which the type of dust hood (100, ...  
WO/2018/194022A1
When processing the edge face (2a) of a glass plate (2) protruding from a support stage (3) in a state where the glass plate (2) has been fastened onto the support stage (3), a fastening part (9) capable of fastening the glass plate (2) ...  
WO/2018/190160A1
A polishing sheet has a sheet-form base and abrasive grains disposed so as to penetrate from one surface of the base to the other surface. The abrasive grains are preferably disposed on the one surface with the tips, which will contact t...  
WO/2018/187885A1
An easy-to-use mechanical part polishing device, comprising a bottom plate (1). Vertical plates (2) are fixedly connected to two sides of the upper surface of the bottom plate, and sliding rails (3) are fixedly connected to the opposite ...  
WO/2018/188870A1
The invention proceeds from a grinding-means device, in particular from a grinding-disc device or from a backup-pad device, for arranging at least one grinding means, in particular at least one grinding wheel, on a portable power tool (1...  
WO/2018/189239A1
The invention relates to a device (1) and a method for polishing a surface (2) of a strip (3) made of metal, in particular a continuous strip, the device (1) comprising at least one polishing head (4, 5) for polishing the surface (2), th...  
WO/2018/188508A1
A method for predicting valve leakage, comprising the following steps: 1) prefabricating a valve; 2) mounting, on the valve, a sensor (70) and a signal transmitter (90); 3) debugging the valve, measuring and determining a critical specif...  
WO/2018/189155A1
The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) an...  
WO/2018/190077A1
The present invention provides a synthetic quartz glass substrate polishing agent comprising polishing particles and water, and is characterized in that the polishing particles comprise silica particles as base particles, on the surface ...  
WO/2018/188915A1
The invention relates to a fluid jet cutting device for producing a fluid jet (27), comprising a high-pressure fluid source (3), from which compressed fluid can be supplied to an injector (4) via a high-pressure line (5), the injector (4...  
WO/2018/190079A1
A wafer-retaining elastic film (10) of a CMP device, having: a film body (11) formed from an elastic material; and a coating layer (12) provided so as to cover the wafer-retaining-side surface of the film body (11). The coating layer (12...  
WO/2018/185580A1
A method for making a tool comprising the steps of providing a polymeric thermoplastic or thermosetting material or equivalent and abrasive material in powder to be mixed together with said polymeric material, in order to obtain a filame...  
WO/2018/184798A1
The invention relates to a device and a method for a high-pressure fluid jet cutting process, comprising a nozzle (1) by means of which a high-pressure fluid jet (10) can be produced and comprising a mixing tube (12) through which the hi...  
WO/2018/187513A1
An electrostatic spray application apparatus and method for producing an electrostatically charged and homogeneous CO2 composite spray mixture containing an additive and simultaneously projecting at a substrate surface. The spray mixture...  
WO/2018/184658A1
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...  
WO/2018/184657A1
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...  
WO/2018/186292A1
The purpose of the present invention is to provide: a polishing pad capable of maintaining a stable polishing rate due to having a proper disintegration property; a manufacturing method thereof; and a method for manufacturing a polished ...  
WO/2018/186087A1
The present invention is a workpiece cutting method that uses a wire saw in which a fixed abrasive-grain wire, which is sent out by one side of a set of wire reels and taken up by a wire reel on the other side and has abrasive grains fix...  
WO/2018/180083A1
Provided is a rotary tool in which, when a switch is turned off to stop a tip tool, a fixture that fixes the tip tool is prevented from being loosened. This rotary tool, in which a tip tool rotated by a fixture is mounted on a spindle, a...  

Matches 101 - 150 out of 139,825