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Patent Searching and Data


Matches 101 - 150 out of 145,028

Document Document Title
WO/2020/150932A1
Disclosed are a method and device for ground grinding, a robot (13) and a computer readable storage medium. The method comprises: obtaining information of an area to be ground; generating, according to the information of the area to be g...  
WO/2020/153001A1
The present invention adjusts a plurality of parameters of this substrate processing device so as to enhance a performance value of the substrate processing device. The present invention includes: a first artificial intelligence unit whi...  
WO/2020/152373A1
The invention relates to a method comprising the steps of: generating abrasion, preferably but not restrictively, by means of sandblasting, which produces mechanical roughing on the surface of a glass substrate; optionally applying a pri...  
WO/2020/153979A1
Embodiments of the present disclosure generally relate to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process in the manufacture of semiconductor devices. The p...  
WO/2020/150931A1
A floor grinding robot comprises a grinding device (30), an elevation control device, and a movement control device. The elevation control device comprises an elevation information acquisition device (10) for acquiring elevation informat...  
WO/2020/128720A3
The present disclosure provides systems, devices, and methods for abrasive articles and manufacturing the same. A method includes receiving, at a shaped abrasive particle placement tool comprising cavities (1020), shaped abrasive particl...  
WO/2020/152511A1
An electrospindle comprising a motor (2) for moving a tool and a motor shaft (3) for transmitting motion from the motor (2) to the tool, the electrospindle (1) comprising a gripping head (5) of the tool and coupling of the latter to the ...  
WO/2020/153219A1
This processing device that processes a substrate is provided with: a substrate holding part having a substrate holding surface that suctions and holds the substrate; and an outer edge washing part that washes an outer edge part of the s...  
WO/2020/147922A1
The invention relates to a grinding disc (1) comprising a grinding layer (2) which is made of grinding grains (4) bonded together by a binder (3). Reinforcing fabrics (6, 8) are embedded into the grinding layer (2) at outer faces (5, 7) ...  
WO/2020/150072A1
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane...  
WO/2020/149468A1
The present invention relates to a method for processing a sink top formed from an engineered stone material. A method for processing a top plate formed from an engineered stone material comprises (a) a step of polishing a sink top forme...  
WO/2020/149868A1
A power operated trimming tool including a head assembly affixed to a handle assembly. The head assembly includes a frame body supporting a feed roll, a blade, a blade support and a blade retainer plate. The frame body includes an interf...  
WO/2020/149816A1
A holder device for dispensable abrasive tape for manicure or pedicure files comprises a shaft (6) and a fastening means (7) for same. A roll (8) of dispensable abrasive tape with an adhesive layer is wound on the shaft.  
WO/2020/150562A1
Various embodiments of the present invention are generally directed to a buckle assembly for sharpening a cutting tool. A quick release buckle assembly is provided including: a male buckle component having a pair of resiliently flexible ...  
WO/2020/148390A1
The present invention relates to a polishing tool (10), comprising a holder (11), a sphere (12) received in the holder (11) and a polishing film (13) which completely or partially covers the free surface (12a) of the sphere (12).  
WO/2019/131886A9
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyur...  
WO/2020/149470A1
The present invention pertains to a method for processing an MMA artificial marble top plate, the method comprising: (a) a step for polishing the MMA artificial marble top plate with a polish; (b) a step for coating the MMA artificial ma...  
WO/2020/149125A1
The present invention is a workpiece cutting method for simultaneously cutting a workpiece at multiple sites by winding a fixed abrasive grain wire on multiple grooved rollers to form a wire row and, while reciprocating the same, feeding...  
WO/2020/149804A1
The invention is an abrasive disc(10) that uses abrasive sector and abrasive processes. It is specialized that; contains fixing holes(11.2) to placed abrasive strips(12.1) on both sides, contains fixing holes(11.2) which has same or diff...  
WO/2020/146538A1
A guidewire for use in penetrating through complex and stenosed lesions. The distal tip of the guidewire has a roughened surface to increase frictional engagement with calcified and fibrous tissue to increase the penetration of the dista...  
WO/2020/143267A1
A multi-carrier disk wafer transfer device, transfer system, and transfer method. In the multi-carrier disk wafer transfer device, a drive control mechanism (100) can drive and control a circular track (200) to sequentially transfer each...  
WO/2020/143261A1
Disclosed are a supporting structure for chemical mechanical polishing equipment and the chemical mechanical polishing equipment. The supporting structure comprises a polishing head frame body (1), wherein the polishing head frame body (...  
WO/2020/144613A2
The subject of the invention is an abrasive blast machine for surfaces of large-scale workpieces comprising a housing (O) constituting a working chamber, a kinematic mechanism for moving the effector, an abrasive recirculation system, an...  
WO/2020/144609A1
The object of the invention is a device for abrasive blast treatment, comprising a housing providing working space, with a filter-ventilation system, a multi-part kinematic mechanism comprising a rotatable telescopic assembly, a means of...  
WO/2020/143272A1
A refurbishment treatment method for a coating of a cold rolling furnace roller. A lump deposition region of the roller face and other defect positions are marked; lump deposition convex points and sharp points are manually polished away...  
WO/2020/144911A1
The present invention relates to a polishing device. Said polishing device comprises: a window member (50) for transmitting infrared rays; a polishing pad (1) in which the window member (50) is embedded; a polishing head (3), which rotat...  
WO/2020/143376A1
A pressing plate flange (10) having an annular body with a through hole, wherein the annular body comprises: a flange cover (106) and a flange base (101) that are cooperatively mounted; the flange base (101) is in cooperation with the fl...  
WO/2020/144158A1
The invention relates to a method for producing blades (32) from a steel material. The problem of specifying a method by means of which the edge shape of the blade (32) made of a steel material is optimized and which allows for flexible ...  
WO/2020/144268A1
The present invention relates to a lens edge simulation tool (10) for measuring the fitment of a lens edge profile (LEP) with respect to a frame groove profile (FGP) of a spectacle frame (20), the lens edge simulation tool (10) having a ...  
WO/2020/143262A1
A chemical mechanical polishing operation platform and a chemical mechanical polishing apparatus comprising a polishing head support (1). The polishing head support (1) comprises multiple branch supports (111). The multiple branch suppor...  
WO/2020/143260A1
A swing arm for polishing slurry delivery and a polishing device, comprising an arm element (1) provided with a polishing slurry delivery pipe (3) for polishing slurry delivery. A slurry landing-location adjustment block (7) is slidingly...  
WO/2020/145121A1
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...  
WO/2020/142648A1
A method for reconditioning a rollable wheel includes coupling a polymeric wheel to a reconditioning system, the polymeric wheel having an outer surface including an abraded area, the abraded area having a first average surface roughness...  
WO/2020/141017A1
The invention relates to a processing segment (41), which is made of a first matrix material (44) and first hard material particles (45), the first hard material particles (45) being arranged in the first matrix material (44) according t...  
WO/2020/098852A3
The invention relates to a disk-shaped cutting tool (1), to a radial cutting method for machining axially elongate workpieces, to a cutting device and to a use of a disk-shaped cutting tool. A disk-shaped cutting tool according to the in...  
WO/2020/142277A1
The present invention relates generally to coated abrasive articles, such as coated abrasive film belts having improved strength and durability, as well as methods of making and using said coated abrasive articles.  
WO/2020/140488A1
An intelligent continuous material feeding system for an ultrahigh pressure pre-mixed abrasive jet. An ultrahigh pressure material mixing tank (11), an ultrahigh pressure material storage tank (17), and a material feeding hopper (18) are...  
WO/2020/142038A1
The invention is a surface finishing method for generating homogeneous, residual stresses on the workpiece surface, comprising the steps of applying a carrier and retention polymeric paste tool containing spherical particles to the workp...  
WO/2020/142266A1
A method of producing a measuring tape may include providing a cupped blade with substantially uniform cupping over a longitudinal length of the cupped blade, applying a stress relief operation to a selected portion of only a convex side...  
WO/2020/137099A1
The information processing device of the present invention is for determining a polishing recipe on the basis of response data for each area acquired by changing pressure for each area of a polishing head, and is provided with: an abnorm...  
WO/2020/136973A1
Provided are: a silicon epitaxial wafer production method that can suppress DIC defects; and a silicon epitaxial wafer. Provided is the silicon epitaxial wafer production method in which an epitaxial layer is grown in a vapor phase on th...  
WO/2020/138198A1
Provided is a non-woven-fabric polishing pad characterized in having polishing performance that is exceptional in terms of polishing stability and smoothness of a polished object, and moreover characterized in that the change in the poli...  
WO/2020/137278A1
Provided is a polishing composition with which micro defects and haze in a polished semiconductor wafer can be further reduced. This polishing composition comprises abrasive grains, a basic compound, a vinyl alcohol-based resin having 1,...  
WO/2020/137186A1
This method for manufacturing a wafer having a notch part is provided with: a both side polishing step for polishing both main surfaces of a wafer; a notched mirror surface polishing step for performing mirror polishing on a notch-chamfe...  
WO/2020/137802A1
The present invention pertains to a pad temperature adjusting device for adjusting the surface temperature of a polishing pad. The pad temperature adjusting device (5) comprises: a pad contacting member (11); a supplying system (30) that...  
WO/2020/136553A1
Object: To provide a grinding wheel and a method of manufacturing a grinding wheel having added value while providing a suppressed manufacturing cost. Solution Means: The grinding wheel is a grinding wheel including an abrasive portion i...  
WO/2020/137187A1
This double grinding method comprises: a first grinding step in which grinding is performed until the thickness of a first wafer reaches a prescribed thickness while a grinding fluid is supplied in a prescribed amount to first and second...  
WO/2020/137837A1
Provided is a semiconductor wafer evaluation method that includes: acquiring a differentiation interference image at an evaluation position on the outer periphery of a semiconductor wafer to be evaluated by using a reflection-type differ...  
WO/2020/135498A1
Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing comprises: during final polishing to the remaining predetermined time, using both polishing slurry and an oxidizing solution as a ...  
WO/2020/139663A1
A method of generating a matrix to relate a plurality of controllable parameters of a chemical mechanical polishing system to a polishing rate profile includes polishing a test substrate. The test substrate is polished for a first period...  

Matches 101 - 150 out of 145,028