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Patent Searching and Data


Matches 101 - 150 out of 138,367

Document Document Title
WO/2018/096991A1
Provided is a polishing composition containing a cellulose derivative, the polishing composition being effective in giving polished surfaces having few defects. This application provides a polishing composition comprising abrasive grains...  
WO/2018/095655A1
The invention relates to a method for grinding the contour of the body (110) of a roll (100), in particular a roll having a roll contour having a steep curve course in a roll stand for rolling metal strip, having the following steps: spe...  
WO/2018/094504A1
A system and a method for laser-driven propulsion, comprising transferring momentum to a projectile through a low-density material at laser fluences below plasma ablation threshold, the method comprising providing a metal layer having a ...  
WO/2018/098422A1
Magnetic sample holders for abrasive operations include an array of magnets embedded in a matrix material. Each magnet of the array is positioned between about 0 mm and about 4 mm from at least one adjacent magnet of the array. Exposed s...  
WO/2018/096791A1
Through the present invention, burr on pins of card clothing used in a slicker brush is removed, and rounding is imparted to the distal ends of the pins, whereby the feeling in use and safety of the slicker brush are enhanced, and pillin...  
WO/2018/093629A1
This invention relates to abrasive flap discs that include wearable backing plates and methods of making and using such abrasive flap discs and wearable backing plates. The claimed articles, processes, and systems related to the use and ...  
WO/2018/090075A1
There is described a media metering valve (18) comprising a main body (21) having a media inlet (26), a central bore (24) extending through the main body (21 ), said media inlet (26) being in communication with the central bore (24) and ...  
WO/2018/091989A1
Disclosed is a method for detection, control and automatic compensation of pressure during polishing, comprising the following steps: detecting the pressure between a polishing wheel (10) and a polished workpiece (11) by means of a detec...  
WO/2018/093656A1
Various embodiments disclosed relate to an abrasive article. The abrasive article includes a metallic matrix component, an abrasive particle component dispersed within the metallic matrix component; and a filler particle component disper...  
WO/2018/091023A1
The invention relates to a device for removing burrs on slab edges, which are formed on longitudinal or transverse parts of a slab by means of flame cutting, by rotating an abrasive disk which is guided along the slab edges. According to...  
WO/2018/091932A1
A stencil (1) for finishing a vehicle surface, the stencil (1) comprising a body with a plurality of apertures (2) for positioning over the vehicle surface to be repaired or abraded, the body having areas (3) of reduced thickness surroun...  
WO/2018/092520A1
This curved plate machining device comprises: a support unit that supports one main surface of a curved plate having a curved surface on both main surfaces thereof; a machining unit that machines the outer circumference of the curved pla...  
WO/2018/092361A1
The electro-deposited diamond dresser is provided with: a disk-shaped wheel (2) which has tapered surfaces (21) on both sides of an outer circumferential portion thereof so as to decrease in thickness toward an outer circumferential surf...  
WO/2018/093652A1
In various embodiments, the present invention provides a structured abrasive article. The structured abrasive article includes an abrasive layer disposed on a backing. The abrasive layer includes shaped abrasive composites, which include...  
WO/2018/093178A1
Provided are a method for coating an electrode for resistance welding and an electrode for resistance welding. The present invention includes: a tungsten carbide preparation step for preparing tungsten carbide (WC) as a coating material ...  
WO/2018/092440A1
[Problem] To provide a wafer edge polishing device provided with a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. [Solution] This edge polishing device 1 is provided with: a chuck table...  
WO/2018/091000A1
A combined additive manufacturing method applicable to parts and molds, relating to the field of parts and molds manufacturing by mold-free forming, and comprising the following steps: S1, according to the shape, thickness and dimensiona...  
WO/2018/092630A1
The present invention addresses the problem of providing: a polishing pad that is long-lasting, has a high polish rate, and is capable of producing a high degree of flatness on polished articles; and a method for manufacturing the polish...  
WO/2018/088088A1
The present invention addresses the problem of providing a silica composite particle dispersion capable of polishing silica films, Si wafers, or difficult-to-machine materials at high speed and of achieving high surface precision at the ...  
WO/2018/089074A1
The disclosure relates to a hardbanding removal apparatus and method for use with oilfield tubulars and downhole tools. The apparatus includes a tiltable frame with support arm, a grinding wheel coupled to the support arm, and an idler w...  
WO/2018/085985A1
A method of polishing a work piece with a tool includes steps of effecting a relative movement between polishing area of the tool (20) and the work piece with engaging the polishing area of the tool (20) with a portion of the work piece ...  
WO/2018/088009A1
Provided are an abrasive grain whereby the quality of a wafer sliced by a wire saw can be stabilized, a method for evaluating the abrasive grain, and a method for manufacturing a wafer comprising slicing a wafer using a slurry including ...  
WO/2018/086302A1
A spindle compound motion parameter selecting method, a parameter selecting control device, and a compound motion system. The method comprises: performing analog simulation on multiple H-Z sharp knife removing functions separately, and d...  
WO/2018/086912A1
The invention relates to a method for two-sided polishing of a semiconductor wafer, wherein polishing cloths having a hardness at room temperature of at least 80° according to Shore A and having a compressibility at room temperature of ...  
WO/2018/088369A1
A cubic boron nitride (cBN) polycrystalline body according to the present invention is a non-orientation polycrystalline body composed of cBN single-phase crystal structures having an average grain diameter of 200 nm or less, and has a K...  
WO/2018/087701A1
The present invention relates to a method for the construction of rotor and stator elements for turbomachinery comprising: preparing a solid (14) of material to be machined; performing cuts (15', 15", 15'", 15"", 22', 22", 22'", 22"") in...  
WO/2018/087194A1
Grinding element (20) comprising an abrasive surface (22) and an abutment surface (30) which is offset by an offset (x) from the abrasive surface (22), thus allowing a grinding depth (t) to be adjusted. In an illustrative embodiment, the...  
WO/2018/088370A1
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. These abrasive particles have ...  
WO/2018/088371A1
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. The product of the abrasive pa...  
WO/2018/089276A1
Reciprocating tool accessories are presented including: a damping handle assembly; and a surface contact assembly coupled with the damping handle assembly along a distal end and the reciprocating tool along a proximal end. In some embodi...  
WO/2018/082776A1
The present invention relates to a device (10) for surface treatment of one or more workpieces (20), comprising at least one treatment tank (50) for storing an abrasive mixture, and at least one manipulation assembly (30) with at least o...  
WO/2018/085393A1
A bottomhole assembly may include a downhole motor and bearing assembly. The downhole motor may include a rotor and stator. The bearing assembly may include a bearing mandrel. The bearing mandrel may be coupled to the rotor by a transmis...  
WO/2018/083078A1
Apparatus A for capturing a filter device (14) in a water treatment unit (1) containing at least one signal transmitter (13) and at least one sensor (12) for capturing a signal from the signal transmitter (13), wherein the water treatmen...  
WO/2018/083931A1
The present invention provides a double side polishing method for semiconductor wafers, said method making it possible to suppress variance in polishing quality by corresponding to a polishing environmental change that occurred when perf...  
WO/2018/082279A1
A grinding apparatus, comprising: a grinding belt cleaning structure. The grinding belt cleaning structure may further comprise a cleaning section (300) at a side of a grinding surface of a grinding belt (100) and a support section (400)...  
WO/2018/084422A1
The present invention relates to an assembly used when working with a grinder. Provided is a removable grinder rail assembly comprising: a mounting unit, provided with a mounting space corresponding to a mounting surface of a grinder, fo...  
WO/2018/083571A1
Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bod...  
WO/2018/084839A1
The present disclosure provides a sintering assembly and a polycrystalline diamond compact (PDC) including a acid-labile leach-enhancing material, a PDC including cavities formed by removal of an acid-labile leach-enhancing material, and...  
WO/2018/082976A1
The invention relates to a honing machine (100) for carrying out honing operations on at least one borehole in a workpiece (W), in particular for honing cylindrical boreholes in a cylinder crankcase, comprising a machine base (110), a su...  
WO/2018/080797A1
The present invention relates to a retainer ring for chemical mechanical polishing (CMP). A method of manufacturing a retainer ring for CMP comprising steps of: preparing two or more of arc-shaped polishing parts comprising a non-thermop...  
WO/2018/080784A1
A bonded abrasive wheel comprises magnetizable abrasive particles retained in an organic binder. The bonded abrasive wheel has a central portion adjacent to a central hub, an outer circumference and a rotational axis extending through th...  
WO/2018/081546A1
The present invention relates generally to coated abrasive articles that include a blend of abrasive particles, an increased tear resistance, or combinations thereof, as well as methods of making and using said coated abrasive articles.  
WO/2018/080778A1
The present disclosure provides bonded abrasive articles including abrasive particles retained in a binder. The abrasive particles are oriented at a predetermined angle greater than 0 degrees and less than 90 degrees with respect to a lo...  
WO/2018/080704A1
A bonded abrasive wheel comprises magnetizable abrasive particles retained in a first organic binder. The bonded abrasive wheel has a central portion adjacent to a central hub, an outer circumference, and a rotational axis extending thro...  
WO/2018/079541A1
The grinding machine is provided with a dividing wall and a clamp part. The dividing wall divides a machining area from a non-machining area excluding the machining area. The clamp part extends from the non-machining area toward the mach...  
WO/2018/080881A1
A system and a method for reduction of dimensional end-taper in abrasive blasted tubes (300) includes a pressurized chamber (301), which maintains higher air pressure inside the chamber than atmospheric pressure, an air-exit port (302) t...  
WO/2018/079105A1
A resin layer forming process for forming a resin layer (RH) on one surface (W1) of a wafer (W) includes: a holding step for holding, through suction, the other surface (W2) of the wafer (W) by a holding means; a flat surface forming ste...  
WO/2018/077327A1
The invention relates to a method for producing bearing components for forming a roller or slide bearing (40), wherein at least two production lines (1, 1a, 1b, 1c, 1d) are used and operated synchronously. A dimension of a first bearing ...  
WO/2018/077925A1
The invention concerns a sanding-polishing machine for plate-like products made of stone material of a type comprising a plurality of machining stations (101) containing operating heads positioned above a supporting pallet (102), where a...  
WO/2018/079334A1
Provided is a fumed silica for chemical-mechanical polishing with which post-polishing scratches occurring on a surface of an object to be polished can be significantly reduced, and which is important for miniaturization and multi-layeri...  

Matches 101 - 150 out of 138,367