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Patent Searching and Data


Matches 101 - 150 out of 137,602

Document Document Title
WO/2018/032659A1
A method and device for magnetorheological finishing, the method comprising: winding coils on iron cores (1-1, 1-2); designing magnetorheological finishing fluid containers (2-1, 2-2, 2) of different shapes according to different shapes ...  
WO/2018/035049A1
In some aspects, waterjet cutting pressurization systems can include a water pump: (i) having a pressurization chamber and (ii) having a high-pressure water seal maintaining water pressure within the chamber; and a leak detector in fluid...  
WO/2018/035049A4
In some aspects, waterjet cutting pressurization systems can include a water pump: (i) having a pressurization chamber and (ii) having a high-pressure water seal maintaining water pressure within the chamber; and a leak detector in fluid...  
WO/2018/034308A1
The present invention relates to a polishing method for polishing a substrate such as a wafer. The polishing method comprises: polishing a substrate (W) by pressing the substrate (W) against the surface of a polishing pad (3); changing t...  
WO/2018/028742A1
Cutting methods are used in the production of round parts. Milling machines that perform shaping by machining are known. In the meantime, grinding has become established as an alternative in the machining of round parts. For example, cen...  
WO/2018/030254A1
Disclosed is a method for washing a substrate using a washing liquid containing at least any one of the following (A), (B) and (C) after chemical-mechanical planarization of the substrate: (A) a reducing agent having the ability to donat...  
WO/2018/028846A1
The invention relates to a grinding disc for processing material surfaces, comprising a disc-shaped base body (3) which has a tool side (13) that can face towards a tool and a workpiece side (12) that can face towards a workpiece, and wh...  
WO/2018/029156A1
An attachment 300 for a sanding tool 130 includes a first portion and a second portion. The first portion has a generally tubular shape that defines a mounting end portion for mounting the attachment on the sanding tool 130. The second p...  
WO/2018/028849A1
The invention relates to a roughing disc for machining material surfaces, comprising a disc-like main body (3) with a tool side (13) that is able to face towards a tool and a workpiece side (12) that is able to face towards a workpiece, ...  
WO/2018/027250A1
The invention relates to a carrier body (1, 2, 3, 4, 5, 6, 30) for grinding tools having an inner hub ring (7), which surrounds a central bore (8) for connecting the grinding tool to a rotary drive, and an jacket ring (9) for receiving a...  
WO/2018/030120A1
A ground workpiece having a smaller diameter than that of an object to be ground 10 is manufactured by grinding a side surface of the object to be ground 10 through the following steps (a) and (b). In step (a), a cup-type grindstone 30 i...  
WO/2018/030675A1
The present invention comprises: a holding jig for supporting a processing object; a brush rotating/driving portion arranged on the holding jig so as to rotate a brush such that the processing object is polished; an X-axis direction driv...  
WO/2018/029112A1
The invention relates to a separating blade (1) having a machining section (2) for the material-removing machining of a mineral-containing hard material, wherein the separating blade (1) is designed to be set into rotation by means of a ...  
WO/2018/029181A1
The invention relates to a method for exchanging a sanding or polishing element, in particular a sanding disc, arranged on a sanding or polishing apparatus, wherein the sanding or polishing apparatus is arranged on a sanding or polishing...  
WO/2018/029612A1
The present disclosure relates to lapping pads which include an abrading layer, wherein the abrading layer includes a working surface and a second surface opposite the working surface having a projected area Ap, and at least one cavity h...  
WO/2018/030236A1
Provided is a method for efficiently removing deposits including hard deposits adhered to a jig in a film-forming process using crystal growth while suppressing the damage to the jig. This deposit removing method includes: a step of prep...  
WO/2018/025655A1
Provided is a liquid concentrate of a composition for rough-polishing silicon wafers, which, when being diluted, is able to deliver preferable polishing performance, and which exhibits excellent stability. The liquid concentrate of a com...  
WO/2018/026918A1
Apparatuses, methods, and techniques for selectively texturing concrete surfaces are provided. An example method of providing a surface portion of an architectural precast concrete wall panel with an abraded texture is provided. The meth...  
WO/2018/024356A1
The invention relates to a method for machining an internally toothed workpiece, wherein the workpiece is clamped into a toothed honing machine, and wherein at least one tool that is at least partially made of a high-hardness cutting mat...  
WO/2018/024769A2
The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic, or such like. The invention further relates to a sanding machine...  
WO/2018/023358A1
A securing mechanism, mounted at an end of a workpiece shaft (2), and consisting of a brake wheel (7), brake pad support frames, brake pads, and a pneumatic cylinder construction. The brake wheel (7) is sleeved on a terminal end portion ...  
WO/2018/025539A1
Proposed is a method for suppressing contamination by nickel to less than the detection limit when cutting a silicon ingot having a diameter exceeding 300 mm using a fixed abrasive wire saw. A method for feeding a silicon ingot having a ...  
WO/2018/025656A1
The present invention provides a production method for a silicon wafer rough-polishing composition, said method being capable of simultaneously providing excellent stability and the advantage of a concentrated liquid, and enabling improv...  
WO/2018/026075A1
The present embodiments provides a mechanism in which the thickness of a scanned wafer shape is calculated to determine a profile, and a calculated PV value and a set predictive PV value for each profile are used such that a delta correc...  
WO/2018/025915A1
This polishing tool comprises a laminate plate that has a thermosetting resin layer and a thermoplastic resin layer, wherein the thermosetting resin layer includes an organic fiber aggregate, the thermoplastic resin layer does not includ...  
WO/2018/025173A1
The present disclosure relates to a deburring tool head. The deburring tool head of the present disclosure is of a generally conical configuration having at least one arcuate portion between two operative ends having an algebraic manifol...  
WO/2018/026010A1
Provided are a method and a tester for evaluating the loss of abrasive grains and the peeling of a binder layer on a wire saw during a cutting process without actually using a multi-wire saw to cut. A wire saw is fixed to a jig, and whil...  
WO/2018/024769A3
The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding ...  
WO/2018/027218A1
A hand-held sanding device for sanding a work piece. The sanding device includes a frame adapted for a manual grip and a sanding material provided within the frame for movement relative to the frame. The sanding material forms a sanding ...  
WO/2018/020349A1
The present invention concerns a piece of equipment (1) suited to process a glass sheet (L), comprising an edging device (8) and a workbench (4) suited to be mutually moved with respect to each other in order to allow an edging operation...  
WO/2018/019737A1
The invention relates to a surface-machining appliance (10), particularly a manual grinding appliance, with a machining body (20) comprising at least one machining surface (21-23) for the grinding or polishing machining of a workpiece su...  
WO/2018/020430A1
A modular apparatus (10) for machining flat sheets, in particular glass, plate glass, or mirror sheets or sheets made from stone materials or the like, comprising machining moduli consisting of a first store (16) suitable for receiving s...  
WO/2018/020798A1
The present invention limits roll-off of the outer edge of wafers in double-sided polishing and reduces variation in flatness. Provided is a method for double-sided wafer polishing in which the wafers, which have been set inside the wafe...  
WO/2018/020931A1
Abrasive grains according to the present invention are abrasive grains in which the surfaces thereof are coated with an additive and that are formed of inorganic abrasive particles having a positive zeta potential at pH 8 or lower. Also,...  
WO/2018/020975A1
The purpose of the present invention is to provide a recycled medium for barrel polishing and a method for manufacturing such a recycled medium for barrel polishing, said recycled medium utilizing media for barrel polishing which have be...  
WO/2018/019736A2
The invention relates to a surface machining apparatus (10), in particular a manual grinder, comprising a machining member (20) that has at least one machining surface (21-23) for grinding or polishing a workpiece surface (O); the machin...  
WO/2018/018821A1
A coated abrasive net, comprising a substrate (210), and an adhesive layer (204) and an abrasive layer (206) on one surface of the substrate (210). The substrate (210) is a knitted or machine-woven elastic fabric having a dense arrangeme...  
WO/2018/022520A2
A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plura...  
WO/2018/020089A1
The invention relates to a method for producing an ice projectile. The method comprises the steps of: - providing a quantity of water; providing a quantity of alcohol corresponding to at least 5 wt.-% of the quantity of water; mixing the...  
WO/2018/021428A1
Provided is a polishing pad having a polishing surface which has a zeta potential of +0.1 mV or higher at pH 10.0. Preferably, also provided is a polishing pad that comprises a polyurethane including a tertiary amine. More preferably, th...  
WO/2018/019799A2
The invention relates to a process for the manufacture of an oligonucleotide comprising at least one non-chiral phosphorothioate intemucleoside linkage of formula (I) wherein R1 is as defined in the description and in the claims.  
WO/2018/020947A1
Provided are a roll polishing rotating grindstone that prevents the polishing debris generated during polishing from accumulating in recesses in the center of a polishing face of the roll polishing rotating grindstone and that allows rol...  
WO/2018/017142A3
A portable and transportable die cavity modifying machine having a base carrying a carriage adjustable along one axis, e.g., a generally horizontal axis, and a machining head adjustable along another axis, e.g., a generally vertical axis...  
WO/2018/014568A1
Provided is a new process for the copper polishing processing of a sapphire wafer, belonging to the field of LED substrate processing. Scratches caused in the previous procedure are removed gradually by selecting three different polishin...  
WO/2018/014448A1
Disclosed are a 2.5D curved surface touch screen cover board and an edging cutter thereof, wherein the edging cutter comprises a cutter handle (1), a rough processing portion (2), a fine processing portion (4) and a cutting head (6) conn...  
WO/2018/014911A1
The invention relates to an apparatus (1) for chopping vertically oriented objects (30). The apparatus (1) has a cell (2) with a housing (3), a frame element (4), at least one fastening means (12) and at least one holding element (13). T...  
WO/2018/015529A1
A robotised hammering method for hammering a weld seam (C) made on a base surface (S) of a metal workpiece (V) using a robotised system (32), comprising the following steps: - controlling the robotised system (32) provided with an effect...  
WO/2018/016966A1
Gemstone cutting and polishing apparatus comprising two main components: a precision divider (100) and an angle and elevation platform (200). The precision divider (100) is arranged to cut and polish a desired number of facets in a gemst...  
WO/2018/017695A1
An abrasive agglomerate particle includes fused aluminum oxide mineral bonded in a vitreous matrix. The fused aluminum oxide mineral is present in a range from 70 percent by weight to 95 percent by weight and the vitreous matrix is prese...  
WO/2018/012313A1
The present invention is a wire saw device that includes: a wire feed reel that lets out wire; wire rows formed of the wire spirally wound around a plurality of wire guides; a wire winding reel on which the wire is wound; and a workpiece...  

Matches 101 - 150 out of 137,602