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WO/2011/121640 |
An apparatus (1) for processing a plate glass comprises one rotary suction device (4A) reciprocating between one plate glass entering area (S1) and a grinding area (23), and the other rotary suction device (4B) reciprocating between the ...
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WO/2011/120740 |
The present invention relates to a holding body, in particular a grinding plate (10), comprising a fastening layer (1) with a fastening surface (11) for fastening a flexible grinding means (9). The fastening layer (1) consists of an air-...
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WO/2011/120730 |
The invention is based on a run-off securing device, in particular a run-off securing device of a handheld power tool, to avoid running off of a clamping element (12a) and/or a tool (14a) from a spindle (16a), having at least one transmi...
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WO/2011/121895 |
Disclosed is a glass sheet processing device (1) which is fitted with: a first-side rotary suction cup device (4A) which moves back and forth between a first-side glass sheet insertion area (S1) and a grinding area (23); and a second-sid...
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WO/2011/121913 |
When repeatedly using colloidal silica as a polishing material when subjecting a glass material to precision polishing, a limitation on the frequency in which the colloidal silica can be repeatedly used is removed by preventing the collo...
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WO/2011/122454 |
Disclosed is a glass substrate holding film body such that、in terms of configuration, a self-adsorption type sheet (32) is bonded to a back plate with a double-faced adhesive sheet (34) therebetween, and that a glass substrate is held ...
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WO/2011/120174 |
An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an o...
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WO/2011/122386 |
Provided is a polishing pad with which microscopic undulations that occur on the surface of an object to be polished can be reduced. Also provided is a method for producing the polishing pad, and a method for producing a semiconductor de...
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WO/2011/121903 |
When repeatedly using colloidal silica as a polishing material when subjecting a glass material containing cerium oxide in the composition thereof to precision polishing, a limitation on the frequency in which the colloidal silica can be...
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WO/2011/121835 |
Provided is a disturbance suppression load control device capable of causing a measured load value output from a linear motor-combined cylinder to better approach an objective load value to heighten responsiveness to a disturbance, and s...
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WO/2011/122415 |
Disclosed is a polishing agent for chemical mechanical polishing of a surface to be polished including surfaces comprising silicon oxide and surfaces comprising metal, wherein the polishing agent contains cerium oxide particles, a comple...
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WO/2011/118010 |
Disclosed is a film for holding a glass substrate, wherein a self-sucking sheet is attached, via a double-coated adhesive sheet, to a back plate, and the glass substrate is sucked and held by the self-sucking sheet, characterized in that...
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WO/2011/118355 |
Disclosed is a polishing pad with excellent planarization properties and not vulnerable to scratches. The disclosed polishing pad includes a polishing layer having elliptical gas bubbles, wherein the long axis of the aforementioned ellip...
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WO/2011/117050 |
The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of -manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the dept...
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WO/2011/118864 |
The present invention relates to a method for slicing an ingot that can reduce slicing time and wire consumption when slicing a synthetic corundum single-crystal ingot having an R-axis direction. According to the present invention, the m...
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WO/2011/118788 |
Disclosed is a method for manufacturing a silicon substrate having a glass embedded therein, wherein a step generated on the polishing surface due to the difference between the polishing rate of silicon and that of the glass is suppresse...
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WO/2011/116827 |
A segmented cutting disc, in particular a diamond cutting disc, having a disc body 1 and having cutting segments 2 distributed over the circumference of the disc body 1, wherein the disc body 1 defines a central cutting plane 4, and wher...
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WO/2011/118419 |
Disclosed is a laminate polishing pad having a polishing layer and a cushion layer not prone to separating. The disclosed laminate polishing pad comprises a polishing layer, which does not having a transfixing region, and a cushion layer...
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WO/2011/119069 |
The group of inventions relates to the mechanical jet treatment of materials. The apparatus comprises: a vessel for preparing an abrasive suspension with a mixing mechanism comprising a mixer with at least one paddle; and a pulverizer fo...
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WO/2011/117531 |
The invention relates to a dispensing container (10) for storing ice particles. Said dispensing container includes a hopper (12) having an upper loading opening (18) and a lower outflow opening (22). Said dispensing container (10) also i...
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WO/2011/117244 |
Aggregate abrasive grains (10) for use in the production of abrading or cutting tools are formed. Each aggregate abrasive grain comprises an abrasive core particle and a plurality of abrasive peripheral particles disposed around the core...
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WO/2011/117252 |
Mobile blasting cubicle (100) having two sides (204), a roof (112; 208) and a front cover (102), wherein the front cover has two openings (104) for the passage of human arms (202), and having a rear cover which can be opened, wherein the...
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WO/2011/117792 |
Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the g...
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WO/2011/118532 |
Disclosed is a processing method which can achieve a high processing rate, and is capable of making a surface smooth. In order to achieve this an SiC substrate (8) is arranged in a potassium hydroxide solution (2) containing hydrogen per...
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WO/2011/118593 |
A workpiece transfer apparatus (5) for inputting and dispensing an engine valve (V) having an umbrella portion (Vb) into and out of a three-jaw hollow chuck (70) having a hollow part (72) and jaws (71), is provided with: a slider (41) wh...
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WO/2011/116567 |
A method for preventing the wear of monocrystalline diamond tools by applying multiple physical fields during ultraprecise machining is disclosed, wherein dislocation form of lower energy state will appear by applying different physical ...
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WO/2011/118505 |
Disclosed is a polishing pad that can reduce tiny undulations on the surface of an object to be polished. Also disclosed are a method for manufacturing said polishing pad and a method for manufacturing a semiconductor device. The disclos...
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WO/2011/114556 |
Disclosed is an abrasive for use in moisture blasting. The disclosed abrasive is formed from spherical polymer particles derived from a monomer mixture containing 0.1-20 parts by weight of a (meth)acrylate monomer containing either an et...
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WO/2011/114399 |
A grinding head is lowered. Subsequently, with a large foreign object (A) (defect) being ground, the grinding head is moved, without being raised, along the large foreign object (A), in a state where a grinding tape feeding direction (d2...
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WO/2011/114550 |
Provided is a shot blasting device with a new configuration such that a dead space for a lid body which closes an opening for feeding and discharging workpieces is eliminated, and that revolution (turning) of a rotating drum can also ser...
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WO/2011/114222 |
The invention is a cover board (1) for bookbinding products (18), openable containers, packaging items or analogous products, comprising a centre area (2) having a predefined thickness and delimited on two opposing sides (3, 4) by corres...
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WO/2011/114658 |
Sensors, a memory which stores detected information obtained by the sensors, and a communication instrument which, by being driven by a power supply section, performs communication with the outside in a non-contact manner, are installed ...
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WO/2011/111993 |
The present invention relates to a hydrojet, and more specifically relates to a hydrojet spray opening and closing device and to a method in which said hydrojet spray opening and closing is directly controlled by means of a valve, and da...
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WO/2011/112927 |
A method and apparatus for releasably attaching flexible abrasive disks to a flat- surfaced platen that floats in three-point abrading contact with three rigid flat-surfaced rotatable fixed-position workpiece spindles that are mounted on...
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WO/2011/112591 |
A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicati...
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WO/2011/110529 |
In a machine for centreless cylindrical grinding, the workpiece (1) is located in a grinding gap (15), which is formed by the regulating wheel (3), the grinding wheel (5) and the support blade (7). The regulating wheel (3) rotates about ...
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WO/2011/111136 |
The disclosed foreign body polishing method involves creating information for capturing and correcting defects in the (work) surface of an array substrate (W), selecting a large foreign body (A) larger than a prescribed size from said in...
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WO/2011/110176 |
The invention concerns an abrasive element (1) for use in rotating abrading or polishing tools for abrading or polishing surfaces. Preferably, it includes an elongated profiled rail (2) and an abrading fabric (4) and support brushes (5)....
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WO/2011/112591 |
A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicati...
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WO/2011/110907 |
The machine (1) for grinding plate-shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-shaped element (4) havi...
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WO/2011/110430 |
Method for machining a semiconductor wafer (11), comprising a) providing a wafer (11) which is divided off from a crystal of semiconductor material by means of a wire saw and which has a laser marking (7) and a sawing substrate (12) in t...
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WO/2011/111993 |
The present invention relates to a hydrojet, and more specifically relates to a hydrojet spray opening and closing device and to a method in which said hydrojet spray opening and closing is directly controlled by means of a valve, and da...
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WO/2011/110947 |
The abrasive mixture for filling a mold cavity of a mold table is let to free fall off a distributing drawer travelling at a certain height above the mold table, being expelled through a transversal slot, practically at a constant rate a...
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WO/2011/112924 |
A knife sharpener sharpens a wide range of knives and blades. The knife sharpener includes an angle guide associated with a first stage abrasive surface at an angle in the range of 12-18 degrees. A second stage is provided at an angle in...
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WO/2011/111421 |
The disclosed slurry contains abrasive particles and water, said abrasive particles including tetravalent cerium hydroxide particles. An aqueous dispersion containing 1.0% of said abrasive particles by mass exhibits an optical transmitta...
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WO/2011/112600 |
Systems, methods, and apparatuses for debriding a tissue site, such as a wound, involve using solid CO2 particles and reduced pressure to cut and remove undesired tissue in a controlled manner. The system may urge the undesired tissue in...
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WO/2011/111808 |
Provided are a threaded electrodeposition tool and a gear processing method using the threaded electrodeposition tool. The threaded electrodeposition tool makes it possible for truing to be performed even with a truing grindstone that ha...
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WO/2011/112163 |
The invention relates to ultrasonic instruments for deformation treatment. The instrument comprises a body (1) with a handle (19) and sliding guides (2) in which a hollow metal cylinder having a flange (3) and extension piece (4) is moun...
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WO/2011/108773 |
The present invention relates to a milling apparatus for processing artificial teeth, the apparatus comprising: a support section which is installed on the top surface of a workbench and has a column placed upright on the rear side of a ...
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WO/2011/107529 |
The invention relates to a measuring assembly (1) for measuring an inside of a lens frame (2.1) of a spectacle frame (2), said lens frame at least partially delimiting an inscribed surface area F that corresponds to a lens shape, compris...
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