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WO/2019/131874A1 |
Provided is a method for producing a chain-like silica particle dispersion. The production method has: a dispersion preparation step for hydrolyzing an alkoxysilane in the presence of ammonia to produce a silica particle dispersion; an a...
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WO/2019/131448A1 |
Provided is a polishing composition which can further reduce minute defects and haze in a polished semiconductor wafer. The polishing composition comprises abrasive grains, a basic compound and a vinyl alcohol-based resin having a 1,2-di...
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WO/2019/131545A1 |
A polishing solution composition for silicon oxide films according to the present invention contains cerium oxide particles, a water-soluble polymeric compound and a water-based medium, wherein the water-soluble polymeric compound is a w...
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WO/2019/131431A1 |
This disk-shaped glass substrate manufacturing method is for manufacturing a disk-shaped glass substrate from which one or more sheet glass substrates are to be cut out. The disk-shaped glass substrate manufacturing method comprises: pre...
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WO/2019/119522A1 |
A universal rolling brush type deburring machine, comprising a frame (1) and a rolling brush mechanism (2) mounted on the frame (1). The rolling brush mechanism (2) comprises: a supporting plate (21) connected to the frame (1); a rolling...
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WO/2019/119089A1 |
Structural arrangement for a cutting disc for stones in general, comprising a disc that in the centre has a through-hole for fastening purposes, characterized in that the radial peripheral area is provided with various receiving cavities...
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WO/2019/125995A1 |
A phenolic resin composition is described comprising at least 50 wt.-% of phenolic resin; first polymerized units comprising a cationic group; and second polymerized units comprising an anionic group. The cationic groups are ionically bo...
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WO/2019/119816A1 |
A CMP polishing solution for polishing a GaAs wafer and a preparation method therefor. The CMP polishing solution comprises the following components in parts by weight: 0.1-50 parts of abrasive, 0.001-0.4 part of surfactant, 0.001-0.6 pa...
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WO/2019/122810A1 |
A method of removing a conformal coating from a circuit board coated with said conformal coating, the method comprising : subjecting the circuit board to a jet comprising dry-ice ejected from a nozzle, to remove said conformal coating fr...
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WO/2019/123134A1 |
The present invention regards a machine for the dry processing of tiles or slabs comprising at least one head (2) for processing tiles or slabs, means (3) for transporting tiles beneath or at the machining head(s) (2) for processing tile...
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WO/2019/125572A1 |
A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin ...
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WO/2019/124031A1 |
This substrate processing system for processing a substrate comprises: a first peripheral edge removal unit which is provided with a first grinding stone that comes into contact with the peripheral edge portion of the substrate, and whic...
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WO/2019/122002A1 |
The invention relates to a device for providing preferably flexible abrasive discs (8), one of which can be removably attached to a backing pad of a hand-held grinding tool at any given time, said device being formed by a dimensionally s...
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WO/2019/123335A1 |
The present disclosure relates to an abrasive article construction containing an anti-loading composition which significantly reduces loading, is coatable, is durable, and is relatively inexpensive to manufacture. In particular, the use ...
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WO/2019/124442A1 |
[Problem] To provide a composition for polishing that eliminates a protrusion in the periphery of a laser mark in a wafer polishing process, and a polishing method in which the same is used. [Solution] A composition for polishing for eli...
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WO/2019/119523A1 |
Disclosed is a deburring machine, comprising a machine base (1), and a conveying device (2) for conveying a workpiece, a universal rolling brush grinding machine head (3) for deburring edges and holes of the workpiece, and an abrasive be...
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WO/2019/120600A1 |
The invention relates to a device for sharpening knives, comprising two grinding strip carriers, each holding one grinding strip, which are movably arranged next to one another in a housing in such a way that the intersecting grinding st...
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WO/2019/123755A1 |
The shot peening method according to the present invention is provided with, as a first stage, a step for projecting a first projectile material having a predetermined particle diameter to the surface of a metal product, and, as a forego...
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WO/2019/121973A1 |
A mechanism for removing an abrasive disk (3) retained on a backing pad (2) of an abrasive tool (1) is characterized by a removal mechanism (5) held in a stationary housing (4) and acting upon the abrasive disk (3) when operated, the hou...
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WO/2019/123833A1 |
Provided are fused alumina grains which do not aggregate during the production thereof and can exhibit high grinding performance. The fused alumina grains according to the present invention contain tungsten and/or molybdenum.
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WO/2019/123310A1 |
An apparatus (1) for carrying out the replacement of an abrasive element (20) in a machine (100) for finishing surfaces, comprises a support body (10) configured to reversibly engage the abrasive element (20). The support body (10) and t...
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WO/2019/120211A1 |
The present disclosure relates to saturated or primed abrasive article constructions containing an anti-loading composition which significantly reduces loading, is coatable, is durable, and is relatively inexpensive to manufacture. In pa...
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WO/2019/121977A1 |
The invention relates to a device for loading a sanding tool with a preferably flexible sanding sheet (11), formed by a table (1) having multiple receptacles (2) in which a respective dispenser (3) accommodating a plurality of stacked sa...
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WO/2019/124032A1 |
A substrate processing system that machines a machining face of a substrate on which a protective material is provided on a non-machining face has: a grinding unit that grinds the machining face of the substrate in a plurality of steps; ...
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WO/2019/123922A1 |
The purpose of the present invention is to provide a polishing material whereby a polishing part can be made thicker while a reduction in polishing rate is suppressed, and a method for manufacturing a polishing material. This polishing m...
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WO/2019/123921A1 |
The purpose of the present invention is to provide an abrasive member in which it is possible to increase the thickness of an abrasive part while preventing a reduction in the abrasion rate. This abrasive member (1) comprises a base mate...
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WO/2019/126296A1 |
A pneumatic tire pre-conditioning system (200, 300, 400) includes a conveyor system (1), a belt assembly (8), a friction device (10) and a pin (16). The conveyor system (1) includes a tire engaging surface (2), a first side (4), and a se...
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WO/2019/121975A1 |
The invention relates to a device for exchanging a polishing disc (8) which, during operation, is coated with a polishing agent, said disc being made in particular from a foam material, foam rubber, felt or lambskin and being fastened by...
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WO/2019/125571A1 |
A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element t...
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WO/2019/115849A1 |
The invention comprises a conveyor belt (13), at least one roller (2) configured to rotate, and a head structure (3) coupled onto a bridge (4); wherein the roller is coupled onto the head structure; and wherein the roller is configured t...
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WO/2019/115476A1 |
The present invention relates to an agglomerate abrasive grain made up of a plurality of individual abrasive grains which are bonded into an inorganic or organic binder matrix, wherein, based on the total weight of the agglomerate abrasi...
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WO/2019/116833A1 |
The present invention provides a polishing composition whereby, when a silicon wafer is roughly polished, it becomes possible to prevent the elevation of the periphery of a hard laser mark, it also becomes possible to reduce the surface ...
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WO/2019/115323A1 |
The present invention relates to a pressing-on shoe (1) for pressing a finishing belt onto surfaces of a rotating workpiece, comprising - a carrier (2), - a radial pressing-on face (3) for pressing a finishing belt onto a circumferential...
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WO/2019/114871A1 |
The invention relates to a method for grinding rolling elements for a rolling bearing, having the steps of: providing a workpiece (20) to be ground, providing a grinding wheel (10), wherein the grinding wheel (10) has a wheel body (12), ...
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WO/2019/115985A1 |
A machine tool (2) is configured to receive input data defining a profile (40,70,100) to be machined onto a workpiece (20), with the profile defined in a plane perpendicular to an axis of rotation (18) of the workpiece and non-circular i...
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WO/2019/115850A1 |
The invention relates to a glazing-brushing machine comprising a conveyor belt (11), at last one brushing cylinder (2) arranged to rotate, and a head (3) coupled to a bridge (4). The brushing cylinder (2) is coupled to the head (3) and i...
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WO/2019/113491A1 |
A tool can be used remove one or more outer layers of a tubular such as a flexible pipeline to enable an inspection on the remaining layers of the flexible pipeline. It allows the precise removal of outer layers of a flexible riser so th...
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WO/2019/111212A1 |
An abrasive article comprising an attachment layer and an abrasive layer. The attachment layer comprises a porous backing having a first major surface, an opposed second major surface, and a first plurality of voids extending from the fi...
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WO/2019/109435A1 |
Disclosed is a new water jet cutting machine, comprising a single-dimensional compressor (99), a fixing rod (1), a bearing plate (2), a water storage tank (3), water, sand, a guide pipe (88), a nozzle, an axial-flow compressor, and a dri...
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WO/2019/109593A1 |
Provided is an intelligent grinding machine tool, comprising a base (1), a vertical column (2), a combined power head (3), a workpiece rotating device (4), a workpiece exchange device (5), a flexible clamping device (6), a sliding table ...
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WO/2019/110964A1 |
Method of cleaning a first material from a plasma processing apparatus, comprising: subjecting the plasma processing apparatus to a jet of a second material so as to remove the first material from the plasma processing apparatus; mixing ...
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WO/2018/098556A8 |
Methods and systems for cleaning inner surfaces of tubes in a heat exchanger. Some systems include a cleaning device having a nozzle configured to inject cleaning fluid into first and second tubes to perform different first and second cl...
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WO/2019/111215A1 |
The disclosure relates to layers comprising a body having a thickness, T, comprising a curable composition comprising a polymerizable epoxy-acrylate resin composition and abrasive particles at least partially embedded in the polymerizabl...
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WO/2019/111210A1 |
A bonded abrasive article comprises a bonded abrasive matrix. The bonded abrasive matrix comprises, based on the total weight of the bonded abrasive matrix: 10 to 30 weight percent of phenolic binder; abrasive particles retained in the p...
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WO/2019/109920A1 |
Provided is a nano-fluid minimum quantity lubrication grinding apparatus with a grinding fluid infiltration microchannel assisted by ultrasonic vibration. The nano-fluid minimum quantity lubrication grinding apparatus comprises: an ultra...
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WO/2019/109429A1 |
A positioning fixture for grinding comprises a vertical plate (1). A first cylinder (7), a second cylinder (6), a first space, a second space, and a third space are arranged on a side end surface of the vertical plate (1). A first profil...
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WO/2019/111686A1 |
A polishing composition containing a cellulose derivative and water is provided. Prior to being mixed with water, the cellulose derivative has the form of a hydrophobized cellulose derivative having an aldehyde added to the surface of sa...
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WO/2019/110385A1 |
The invention relates to a rotor disk for guiding semiconductor wafers during material-removing machining of the semiconductor wafers on both sides. The rotor disk is coated with a layer of diamond-like carbon. The layer contains hydroge...
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WO/2019/113195A1 |
A skin treatment device comprising a skin polishing head to remove skin from a treatment area, a collection bin disposed within the housing and positioned to collect the skin removed by skin polishing head, a conduit disposed adjacent to...
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WO/2019/111632A1 |
The present invention provides a stationary sawing machine for metal work that does not require an operator to follow special cautions even should usability be improved and that can protect a rechargeable battery from sparks generated wh...
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