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WO/2023/240260A1 |
A chemical mechanical polishing (CMP) slurry can comprise a plurality of particles distributed in a carrier, wherein at least a portion of the particles of the plurality of particles can have a body including a core comprising zirconia a...
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WO/2023/238452A1 |
[Problem] To provide a grinding system in which the main body of a glass plate can be firmly fixed and which, when the peripheral edges of the main body of the glass plate are ground by pressing the lateral surface (cylindrical portion) ...
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WO/2023/239420A1 |
A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a...
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WO/2023/234595A1 |
According to one embodiment of the present invention, provided are a magnesium alloy molded product and a method for manufacturing same, the method comprising: a first step of extruding a magnesium alloy billet into a pipe with a predete...
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WO/2023/233681A1 |
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of l...
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WO/2023/230846A1 |
A dovetail grinding fixture for a machine tool comprises a bottom plate and a workpiece, one end of the bottom plate is provided with a baffle, the other end of the bottom plate is provided with a second clamping piece, and three fixing ...
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WO/2023/234555A1 |
Transparent ceramic glass for a cooktop, according to one embodiment, may comprise: a glass material including an uneven layer etched on the upper surface thereof; an upper print layer formed on the upper part of the uneven layer; and a ...
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WO/2023/231063A1 |
A grinding device and grinding method for the periphery of an output shaft. The grinding device comprises at least one grinding unit; the grinding unit comprises a mandrel assembling and disassembling mechanism, a grinding mechanism, and...
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WO/2023/234389A1 |
The present invention addresses the problem of providing a wood-cutting cutter which is used for the cutting processing of a woody material and that can be easily reground. The wood-cutting cutter has a hardened layer provided on a sur...
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WO/2023/234998A1 |
Methods and systems for thinning a device wafer to tens of micron, micron, or sub-micron thicknesses are disclosed. Device wafers are thinned by using a two-step grinding process and a chemical mechanical polish (CMP) process. One or mor...
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WO/2023/233035A1 |
The invention relates to a profiled grinding tool (7) for rotatingly machining workpieces, in particular gearwheels and/or gears, comprising a main body, which has at least one device, in the form of a preferably hollow-cylindrical shape...
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WO/2023/234152A1 |
This superabrasive wheel comprises: a polishing surface which is disposed on the grinding surface of the superabrasive wheel and has a polishing layer including superabrasives; and a dressing surface which is disposed on the grinding sur...
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WO/2023/234974A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/231061A1 |
A fully automatic machining system for an output shaft and a machining method therefor. The machining system comprises a feeding and screening mechanism, a first conveying mechanism, a bushing press-fitting mechanism, a second conveying ...
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WO/2023/235582A1 |
A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier h...
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WO/2023/234663A1 |
According to one embodiment of the present invention, provided are a magnesium alloy molded product and a processing device therefor, the device comprising: a support unit that rotatably supports an object to be processed; at least one h...
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WO/2023/235681A1 |
The subject application relates to a thin wheel with glass reinforcing member, in particular, an abrasive article with an abrasive portion and a reinforcing member. The abrasive portion can include abrasive particles and a bond material....
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WO/2023/234186A1 |
Provided is a working machine including a satisfactory illuminating device. In a grinder 10, illuminating devices 80 are provided in both left and right side portions of a rear end portion of a gear housing 27, and are disposed above a...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/231266A1 |
A heating and ventilation metal pipeline repair device, which comprises a housing (1). Four first rotating grooves (2) are provided at the upper end of the housing (1). A first fixing block (3) is fixedly arranged on each of the first ro...
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WO/2023/231316A1 |
A super-finishing method for a cemented carbide coating of a surface of revolution, comprises the following steps: spraying an outer spherical surface of a surface of revolution part with a cemented carbide coating by means of a spraying...
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WO/2023/234973A1 |
A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relati...
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WO/2023/228579A1 |
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which m...
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WO/2023/229009A1 |
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate. One aspect of the present disclosure pe...
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WO/2023/229660A1 |
The invention relates to a brake disc arrangement (86) having a brake disc (12) that has a friction ring (14) and a brake disc pot having an opening concentric to a central brake disc axis, which opening is delimited by a boundary which ...
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WO/2023/228787A1 |
The present invention provides a method for producing a ground wafer, wherein a ground wafer is produced by grinding a starting material wafer that has a first main surface and a second main surface, the method comprising: a first resin ...
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WO/2023/229658A1 |
A carrier head for chemical mechanical polishing includes a housing, a substrate mounting surface, and a retaining ring assembly. The retaining ring assembly includes an inner ring surrounding the substrate mounting surface and having an...
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WO/2023/228434A1 |
[Problem] To provide a tip dresser that is capable of, when performing resistance welding, applying appropriate electric current and voltage to a welding spot. [Solution] The present invention comprises: a rod-like member 10 which has ...
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WO/2023/228591A1 |
The present invention pertains to a cylinder grinding machine that comprises: first and second detection means for detecting, in a non-contact manner, proximity between one end or the other end of a crystal rod and a spindle or a counter...
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WO/2023/227980A1 |
The method comprises the following phases: - supply of one petal to be regenerated (1) comprising: - one hole (2) defining an axis of rotation (R1) around which the petal to be regenerated (1) is movable between an opening position, wher...
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WO/2023/226697A1 |
A cleaning device, comprising: a cleaning assembly (1), a driving control assembly (2), a bottom plate (3), and a diagnosis feedback assembly (4). The cleaning assembly (1) and the driving control assembly (2) are both fixed on the botto...
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WO/2023/228483A1 |
Provided are a roll grinder abnormal vibration predicting method and a roll grinder abnormal vibration predicting device capable of predicting abnormal vibration of a roll grinder corresponding to a natural frequency of an entire mechani...
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WO/2023/229661A1 |
A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing sy...
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WO/2023/220770A1 |
The present invention provides a process of forming a cutting tool comprising the steps of: additive deposition of a tool material comprising at least one of: tungsten carbide, TaNbC, a tungsten carbide containing alloy or composite, or ...
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WO/2023/223142A1 |
A drive assembly for an adapter assembly of a surgical device includes an input shaft, a middle shaft, and an output shaft. The input shaft includes a proximal portion configured for operable engagement with a drive member of a handle as...
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WO/2023/225356A1 |
Aspects of the present disclosure relate to an abrasive assembly and a method of making an abrasive assembly. The method can include receiving a segmented adhesive-backed abrasive article that includes a release liner and a plurality of ...
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WO/2023/223959A1 |
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a ...
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WO/2023/224477A1 |
A polishing and/or sanding head 1 has a frame and three discs movably coupled to the frame. Of these discs, a first disc 5 forms a round inner disc and a second disc 7 is annular and surrounding the first disc. These first and second dis...
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WO/2023/217805A1 |
The disclosure provides a method for manufacturing an ophthalmic device, comprising machining to provide a predetermined surface on a part and which corresponds to an initial ophthalmic surface, the machining comprising: - selecting (130...
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WO/2023/219004A1 |
The present invention provides colloidal silica in which fine particles are reduced and a production method therefor. Provided is colloidal silica wherein the number distribution ratio of fine particles having a particle diameter such th...
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WO/2023/218812A1 |
The present invention provides a double-sided polishing method including a startup stage for gradually increasing a polishing rate from a polishing stopped state, a main polishing step, continuous with the startup stage, for performing d...
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WO/2023/219220A1 |
The present device relates to a grinder with an easily replaceable abrasive disc and, more particularly, to a grinder in which an abrasive disc can easily be replaced by assembling a holder for coupling and supporting the abrasive disc. ...
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WO/2023/217171A1 |
A polishing apparatus, comprising a frame (1), and a polishing disc (2), an accompanying polishing disc (3) and a clamp (5) arranged on the frame (1). At least one polishing position (4) used for placing a workpiece to be polished is arr...
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WO/2023/219781A1 |
A method of fabricating a drill bit is described. The method includes forming a mold with interior surfaces defining a mold cavity within the mold, the mold cavity having a shape corresponding to a shape of a body of the drill bit; formi...
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WO/2023/219783A1 |
Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed o...
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WO/2023/218809A1 |
This silicon carbide substrate has a main surface. The silicon carbide substrate contains a plurality of carbon inclusions. The main surface has a plurality of pits formed therein. The plurality of carbon inclusions each have a maximum l...
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WO/2023/212981A1 |
Provided in the embodiments of the present disclosure are a chemical mechanical polish process method and a device, relating to the technical field of semiconductor manufacturing. The method comprises: providing a substrate on which a di...
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WO/2023/214986A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/214985A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/208585A1 |
The invention relates to a protective hood for a machine tool having a rotating, disc-shaped tool, wherein the protective hood is designed to carry out a first rotational movement and a second rotational movement, wherein the first rotat...
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