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WO/2011/096366 |
Provided is a glass substrate polishing method such that even if a plurality of batches are polished, reduction in the polishing processing rate can be restricted. Also provided is a glass substrate manufacturing method such that glass s...
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WO/2011/096019 |
Provided is a wire saw which uses a cutting wire to cut a workpiece, this wire saw being such that wire tension can be adjusted with high responsiveness. The wire saw has first and second workpiece cutting sections (1A, 1B). The workpiec...
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WO/2011/094196 |
A head for an orbital abrading machine comprising a housing, a shroud including inner and outer portions, defining a chamber between the inner and outer portions, a drive means for driving an abrading pad, the drive means at least partia...
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WO/2011/092803 |
Provided is a cutting device wherein even if the spacing between a plurality of cutting blades is reduced, it is possible to prevent the cutting blades from falling over or performing improper cutting. Said cutting device (30) serves to ...
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WO/2011/092748 |
A spherical core type lens grinding device (1) performs an operation wherein a dish-shaped grindstone (8) provided with a spherical grindstone surface (8a) which is equipped with diamond abrasive grains, is pressed against a surface-to-b...
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WO/2011/093195 |
Disclosed is an aqueous dispersion for chemical mechanical polishing, which is characterized by containing abrasive grains, ferrate ions (FeO4 2-) and a dispersion medium.
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WO/2011/092021 |
In a first aspect, the invention relates to a grinding body (1) made of a compacted and sintered material. In particular, the invention relates to a grinding body (1) that has additional particles (4), in particular additional particles ...
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WO/2011/093071 |
The disclosed glass-plate processing device (1) includes: a rotary suction-cup device (4A) that moves back and forth between a glass-plate loading area (S1) and a grinding area (23); and another rotary suction-cup device (4B) that moves ...
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WO/2011/092745 |
A reciprocating linear movement device is equipped with a slider drive means (17) which assures the reciprocating movement of a slider (16) which can move along the guide surface (15a) of a guide member (15) having a guide surface (15a) ...
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WO/2011/092744 |
The optical fiber polishing apparatus of the present invention is equipped with: a base (11) having a flat mounting surface (11a); a polishing board support member (12) which is mounted on this base (11); a polishing board (13) which is ...
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WO/2011/092764 |
Processing rollers (4) are made to abut only one surface of a glass substrate (50) while the glass substrate (50) is conveyed by conveying rollers (3). Surface roughening liquid (6) which roughens the surface of the glass substrate (50) ...
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WO/2011/093223 |
Provided is a polishing composition used for polishing the surface of a semiconductor wafer in order to planarize the surface of a semiconductor having steps and thereby reclaim the semiconductor wafer. The polishing composition comprise...
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WO/2011/093215 |
Provided is a method for manufacturing a roller, which improves the efficiency of grinding performed on a roller end surface of a work piece for a tapered roller or a convex roller, and expands the range of work pieces that can be proces...
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WO/2011/092736 |
A first rotating suction pad device (4A) and a second rotating suction pad device (4B) are installed in a glass plate machining apparatus (1), said first rotating suction pad device (4A) moving between a first glass plate insertion area ...
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WO/2011/093153 |
An aqueous dispersion for chemical mechanical polishing, characterized by comprising (A) silica particles each having at least one functional group selected from the group consisting of a sulfo group and salts thereof and (B) an acidic c...
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WO/2011/093747 |
The method is directed towards the production of mobile machine tools for processing long surfaces such as the bed ways of cutting machine tools, forging and pressing equipment, and metallurgical and other equipment. In the processing of...
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WO/2011/090686 |
A cloth backing for an abrasive article is treated by combining a phenolic resin, a latex and a colloidal silicon oxide composition to prepare a colloidal formulation, which is then applied to the cloth backing and cured. Coated abrasive...
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WO/2011/089979 |
Disclosed is a method for producing a semiconductor wafer, which involves: placing a wafer (10), which is provided with a substrate (11) and a semiconductor layer (20) formed on the substrate (11), on a carrier plate (fixed plate) (31) o...
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WO/2011/088884 |
The invention relates to a cleaning method to be used on adjacent areas in coating systems. Before the coating, an anti-adhesion layer (10) is applied to the adjacent areas. After coating material has been deposited onto the anti-adhesio...
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WO/2011/088873 |
The invention relates to a method for producing individual compacts made of coke and suitable for coke oven chambers by dividing a coal cake in a non-mechanical manner, wherein the coal cake is produced by a compression method according ...
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WO/2011/090681 |
A coated abrasive article includes a backing having a surface, a plurality of abrasive regions overlying the surface in each of the first and second portions, and at least one macro-channel. The surface of the backing has a shape defined...
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WO/2011/089185 |
The invention relates to a grinding center, wherein a workpiece headstock (2) and a tailstock (3) are disposed on a machine stand (1). The tension and rotation axle (4) for the workpiece, not shown, is provided between said stocks. A com...
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WO/2011/091240 |
A rotor assembly is provided for blast processing. The rotor assembly includes multiple lofting elements to create a vortex to loft particulate material to be used to process a target, and multiple impelling elements to project the parti...
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WO/2011/090483 |
A surface grinding machine (10) generally consisting of a drive means (11) provided with an output shaft; a planetary disk (13) mounted on the shaft; and at least two grinding head units (14) mounted on the planetary disk (13), each incl...
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WO/2011/090681 |
A coated abrasive article includes a backing having a surface, a plurality of abrasive regions overlying the surface in each of the first and second portions, and at least one macro-channel. The surface of the backing has a shape defined...
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WO/2011/089761 |
The disclosed system includes a personal computer (10) having correction coefficients (α) for the correction of errors in the tooth profile and correction coefficients (β) for the correction of meshing positions, the correction coeffic...
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WO/2011/089870 |
Disclosed is a method for manufacturing an electronic component provided with an adhesive film, wherein cutting dusts and the like are prevented from adhering to an adhesive layer (404) at the time of dividing a wafer in a state wherein ...
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WO/2011/090686 |
A cloth backing for an abrasive article is treated by combining a phenolic resin, a latex and a colloidal silicon oxide composition to prepare a colloidal formulation, which is then applied to the cloth backing and cured. Coated abrasive...
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WO/2011/091240 |
A rotor assembly is provided for blast processing. The rotor assembly includes multiple lofting elements to create a vortex to loft particulate material to be used to process a target, and multiple impelling elements to project the parti...
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WO/2011/087653 |
Provided are abrasive articles having a plurality of elongated channels extending across its working surface and intersecting with each other. These channels provide hinge points that enhance flexibility of the article along two or more ...
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WO/2011/087737 |
The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second...
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WO/2011/085950 |
The invention relates to a device (10) and method for determining the position of a working surface (16, 18) of a working disc (12, 14) of a double-sided machine tool, wherein the device comprises an optical measurement device (24) havin...
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WO/2011/087649 |
Shaped ceramic articles can be obtained by screen printing the desired shapes from a dispersion of a precursor of the ceramic onto a receiving surface using a transfer assisted technique that applies a differential pressure, at least par...
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WO/2011/087582 |
Medical devices, such as percutaneous prosthetic heart valves can include a stent or frame structure component. The stent can be shot peened, laser peened, and/or ultrasonically peened, thereby reducing surface abnormalities, improving s...
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WO/2011/085913 |
The invention relates to a cylindrical grinding machine, wherein a round rod (3) to be ground by peel-grinding is clamped in the chuck (2) of a workpiece spindle head (1) so that a rotation occurs around the common center axis (4). Accor...
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WO/2011/088057 |
A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aper...
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WO/2011/087528 |
A system for preparing a surface for painting, staining, or other treatment is provided. This system includes a surface preparation material and an optional dispenser for dispensing the surface preparation material. The surface preparati...
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WO/2011/087649 |
Shaped ceramic articles can be obtained by screen printing the desired shapes from a dispersion of a precursor of the ceramic onto a receiving surface using a transfer assisted technique that applies a differential pressure, at least par...
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WO/2011/086715 |
Provided is a super-abrasive grain wheel such that grinding fluid can be uniformly dispersed and that stable rotation can be achieved. The super-abrasive grain wheel (1) is equipped with a base metal block (10) which rotates about a rota...
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WO/2011/083605 |
Provided is a blast machining method or the like having high machining accuracy. The disclosed blast machining method is for forming a recess (9) in the surface of an object being machined (8) so as to conform with a target recess of a p...
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WO/2011/083082 |
The invention relates to a method for machining bar or tube material or inserts (10) for producing rotationally symmetrical workpieces (1, 1', 1'') comprising at least one axial contour section (2, 3, 4, 5, 6), by means of a grinding dis...
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WO/2011/083206 |
A method for grinding a roll, in which method a roll (2; 25) in a paper or paper- board machine or a corresponding machine for processing a fibrous web is ground by a grinding device (1; 15) installed in the machine, and in which method ...
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WO/2011/083667 |
Disclosed is a polishing method whereby chipping and breaking failures of a compound semiconductor wafer can be reduced. The method for polishing the compound semiconductor wafer, i.e., a method for lapping both the surfaces of the compo...
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WO/2011/082795 |
The invention relates to a device and method for cleaning, activating and pretreating a work piece by means of carbon dioxide snow particles that are generated from a pressurized carbon dioxide fluid and at least one carrier pressure gas...
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WO/2011/083918 |
Disclosed is a hand grinder. The disclosed hand grinder, having an abrasive (10) for polishing a surface of an object to be processed, includes: a holder (11), to one side of which the abrasive (10) is attached and in the other side of w...
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WO/2011/083082 |
The invention relates to a method for machining bar or tube material or inserts (10) for producing rotationally symmetrical workpieces (1, 1', 1'') comprising at least one axial contour section (2, 3, 4, 5, 6), by means of a grinding dis...
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WO/2011/083918 |
Disclosed is a hand grinder. The disclosed hand grinder, having an abrasive (10) for polishing a surface of an object to be processed, includes: a holder (11), to one side of which the abrasive (10) is attached and in the other side of w...
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WO/2011/083010 |
The invention relates to a grinding wheel (10) having a disc-shaped or plate-shaped carrier (12) having a central bore (18) and having grinding lamellae (20, 22) which are arranged overlapping in a shingle-like manner on a ring-shaped ou...
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WO/2011/083234 |
The invention relates to a machining method for machining a surface of a spectacle lens at a fixed rotation speed, comprising a step of determining said rotation speed from geometric characteristics of said surface, characterized in that...
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WO/2011/083953 |
A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller di...
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