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WO/2018/090075A1 |
There is described a media metering valve (18) comprising a main body (21) having a media inlet (26), a central bore (24) extending through the main body (21 ), said media inlet (26) being in communication with the central bore (24) and ...
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WO/2018/091989A1 |
Disclosed is a method for detection, control and automatic compensation of pressure during polishing, comprising the following steps: detecting the pressure between a polishing wheel (10) and a polished workpiece (11) by means of a detec...
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WO/2018/093656A1 |
Various embodiments disclosed relate to an abrasive article. The abrasive article includes a metallic matrix component, an abrasive particle component dispersed within the metallic matrix component; and a filler particle component disper...
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WO/2018/091023A1 |
The invention relates to a device for removing burrs on slab edges, which are formed on longitudinal or transverse parts of a slab by means of flame cutting, by rotating an abrasive disk which is guided along the slab edges. According to...
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WO/2018/091932A1 |
A stencil (1) for finishing a vehicle surface, the stencil (1) comprising a body with a plurality of apertures (2) for positioning over the vehicle surface to be repaired or abraded, the body having areas (3) of reduced thickness surroun...
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WO/2018/092520A1 |
This curved plate machining device comprises: a support unit that supports one main surface of a curved plate having a curved surface on both main surfaces thereof; a machining unit that machines the outer circumference of the curved pla...
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WO/2018/092361A1 |
The electro-deposited diamond dresser is provided with: a disk-shaped wheel (2) which has tapered surfaces (21) on both sides of an outer circumferential portion thereof so as to decrease in thickness toward an outer circumferential surf...
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WO/2018/093652A1 |
In various embodiments, the present invention provides a structured abrasive article. The structured abrasive article includes an abrasive layer disposed on a backing. The abrasive layer includes shaped abrasive composites, which include...
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WO/2018/093178A1 |
Provided are a method for coating an electrode for resistance welding and an electrode for resistance welding. The present invention includes: a tungsten carbide preparation step for preparing tungsten carbide (WC) as a coating material ...
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WO/2018/092440A1 |
[Problem] To provide a wafer edge polishing device provided with a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. [Solution] This edge polishing device 1 is provided with: a chuck table...
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WO/2018/091000A1 |
A combined additive manufacturing method applicable to parts and molds, relating to the field of parts and molds manufacturing by mold-free forming, and comprising the following steps: S1, according to the shape, thickness and dimensiona...
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WO/2018/092630A1 |
The present invention addresses the problem of providing: a polishing pad that is long-lasting, has a high polish rate, and is capable of producing a high degree of flatness on polished articles; and a method for manufacturing the polish...
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WO/2018/088088A1 |
The present invention addresses the problem of providing a silica composite particle dispersion capable of polishing silica films, Si wafers, or difficult-to-machine materials at high speed and of achieving high surface precision at the ...
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WO/2018/089074A1 |
The disclosure relates to a hardbanding removal apparatus and method for use with oilfield tubulars and downhole tools. The apparatus includes a tiltable frame with support arm, a grinding wheel coupled to the support arm, and an idler w...
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WO/2018/085985A1 |
A method of polishing a work piece with a tool includes steps of effecting a relative movement between polishing area of the tool (20) and the work piece with engaging the polishing area of the tool (20) with a portion of the work piece ...
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WO/2018/088009A1 |
Provided are an abrasive grain whereby the quality of a wafer sliced by a wire saw can be stabilized, a method for evaluating the abrasive grain, and a method for manufacturing a wafer comprising slicing a wafer using a slurry including ...
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WO/2018/086302A1 |
A spindle compound motion parameter selecting method, a parameter selecting control device, and a compound motion system. The method comprises: performing analog simulation on multiple H-Z sharp knife removing functions separately, and d...
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WO/2018/086912A1 |
The invention relates to a method for two-sided polishing of a semiconductor wafer, wherein polishing cloths having a hardness at room temperature of at least 80° according to Shore A and having a compressibility at room temperature of ...
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WO/2018/088369A1 |
A cubic boron nitride (cBN) polycrystalline body according to the present invention is a non-orientation polycrystalline body composed of cBN single-phase crystal structures having an average grain diameter of 200 nm or less, and has a K...
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WO/2018/087701A1 |
The present invention relates to a method for the construction of rotor and stator elements for turbomachinery comprising: preparing a solid (14) of material to be machined; performing cuts (15', 15", 15'", 15"", 22', 22", 22'", 22"") in...
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WO/2018/087194A1 |
Grinding element (20) comprising an abrasive surface (22) and an abutment surface (30) which is offset by an offset (x) from the abrasive surface (22), thus allowing a grinding depth (t) to be adjusted. In an illustrative embodiment, the...
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WO/2018/088370A1 |
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. These abrasive particles have ...
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WO/2018/088371A1 |
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. The product of the abrasive pa...
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WO/2018/089276A1 |
Reciprocating tool accessories are presented including: a damping handle assembly; and a surface contact assembly coupled with the damping handle assembly along a distal end and the reciprocating tool along a proximal end. In some embodi...
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WO/2018/082776A1 |
The present invention relates to a device (10) for surface treatment of one or more workpieces (20), comprising at least one treatment tank (50) for storing an abrasive mixture, and at least one manipulation assembly (30) with at least o...
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WO/2018/085393A1 |
A bottomhole assembly may include a downhole motor and bearing assembly. The downhole motor may include a rotor and stator. The bearing assembly may include a bearing mandrel. The bearing mandrel may be coupled to the rotor by a transmis...
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WO/2018/083078A1 |
Apparatus A for capturing a filter device (14) in a water treatment unit (1) containing at least one signal transmitter (13) and at least one sensor (12) for capturing a signal from the signal transmitter (13), wherein the water treatmen...
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WO/2018/083931A1 |
The present invention provides a double side polishing method for semiconductor wafers, said method making it possible to suppress variance in polishing quality by corresponding to a polishing environmental change that occurred when perf...
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WO/2018/082279A1 |
A grinding apparatus, comprising: a grinding belt cleaning structure. The grinding belt cleaning structure may further comprise a cleaning section (300) at a side of a grinding surface of a grinding belt (100) and a support section (400)...
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WO/2018/084422A1 |
The present invention relates to an assembly used when working with a grinder. Provided is a removable grinder rail assembly comprising: a mounting unit, provided with a mounting space corresponding to a mounting surface of a grinder, fo...
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WO/2018/083571A1 |
Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bod...
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WO/2018/084839A1 |
The present disclosure provides a sintering assembly and a polycrystalline diamond compact (PDC) including a acid-labile leach-enhancing material, a PDC including cavities formed by removal of an acid-labile leach-enhancing material, and...
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WO/2018/082976A1 |
The invention relates to a honing machine (100) for carrying out honing operations on at least one borehole in a workpiece (W), in particular for honing cylindrical boreholes in a cylinder crankcase, comprising a machine base (110), a su...
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WO/2018/080797A1 |
The present invention relates to a retainer ring for chemical mechanical polishing (CMP). A method of manufacturing a retainer ring for CMP comprising steps of: preparing two or more of arc-shaped polishing parts comprising a non-thermop...
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WO/2018/080784A1 |
A bonded abrasive wheel comprises magnetizable abrasive particles retained in an organic binder. The bonded abrasive wheel has a central portion adjacent to a central hub, an outer circumference and a rotational axis extending through th...
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WO/2018/081546A1 |
The present invention relates generally to coated abrasive articles that include a blend of abrasive particles, an increased tear resistance, or combinations thereof, as well as methods of making and using said coated abrasive articles.
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WO/2018/080778A1 |
The present disclosure provides bonded abrasive articles including abrasive particles retained in a binder. The abrasive particles are oriented at a predetermined angle greater than 0 degrees and less than 90 degrees with respect to a lo...
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WO/2018/080704A1 |
A bonded abrasive wheel comprises magnetizable abrasive particles retained in a first organic binder. The bonded abrasive wheel has a central portion adjacent to a central hub, an outer circumference, and a rotational axis extending thro...
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WO/2018/079541A1 |
The grinding machine is provided with a dividing wall and a clamp part. The dividing wall divides a machining area from a non-machining area excluding the machining area. The clamp part extends from the non-machining area toward the mach...
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WO/2018/080881A1 |
A system and a method for reduction of dimensional end-taper in abrasive blasted tubes (300) includes a pressurized chamber (301), which maintains higher air pressure inside the chamber than atmospheric pressure, an air-exit port (302) t...
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WO/2018/079105A1 |
A resin layer forming process for forming a resin layer (RH) on one surface (W1) of a wafer (W) includes: a holding step for holding, through suction, the other surface (W2) of the wafer (W) by a holding means; a flat surface forming ste...
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WO/2018/077327A1 |
The invention relates to a method for producing bearing components for forming a roller or slide bearing (40), wherein at least two production lines (1, 1a, 1b, 1c, 1d) are used and operated synchronously. A dimension of a first bearing ...
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WO/2018/077925A1 |
The invention concerns a sanding-polishing machine for plate-like products made of stone material of a type comprising a plurality of machining stations (101) containing operating heads positioned above a supporting pallet (102), where a...
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WO/2018/079334A1 |
Provided is a fumed silica for chemical-mechanical polishing with which post-polishing scratches occurring on a surface of an object to be polished can be significantly reduced, and which is important for miniaturization and multi-layeri...
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WO/2018/081044A1 |
Magnetizable abrasive particles are described comprising ceramic particles having outer surfaces comprising a coating of unsintered polyion and magnetic particles bonded to the polyion. In favored embodiments, the magnetic particles have...
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WO/2018/080765A1 |
A structured abrasive article comprises a plurality of shaped abrasive composites disposed on and secured to a major surface of a backing. The shaped abrasive composites comprise magnetizable abrasive particles retained in an organic bin...
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WO/2018/077929A1 |
The invention relates to an operating device (1) for a machine tool, containing at least a first and a second switching element (40, 50), wherein the first switching element (40) can be set to a first and a second mode and the second swi...
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WO/2018/077576A1 |
Device for abrasive fluid-jet cutting with a compressor unit (1) for compressing a fluid, which can be fed to a nozzle (25) in the form of a stream of high-pressure fluid, wherein the nozzle (25) is designed for discharging a high-pressu...
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WO/2018/079319A1 |
Provided is a grinder that facilitates manual grinding work requiring careful operation. A grinder 1 has: a grindstone 4 that grinds a workpiece; a nozzle 71 through which a cooling liquid is jetted out to the workpiece; hand-feed handle...
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WO/2018/079222A1 |
This wafer manufacturing method includes: a chamfering step for chamfering a wrapped wafer or a wafer cut out from a single crystal ingot; a resin layer forming step for forming a resin layer by applying a curable resin on one surface of...
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