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Patent Searching and Data


Matches 1 - 50 out of 133,861

Document Document Title
WO/2017/068748A1
The present invention is a method for cutting a circularly columnar workpiece by a wire saw for simultaneously cutting the workpiece at a plurality of locations aligned in the axial direction by winding a fixed abrasive wire around a plu...  
WO/2017/069696A1
According to various embodiments, there is provided a grinding module including a base; a cylinder mounted to the base with a longitudinal axis of the cylinder arranged at least substantially perpendicular to a surface of the base, where...  
WO/2017/068945A1
Disclosed is a semiconductor wafer processing method wherein, firstly, a thin disc-like wafer is manufactured by slicing a semiconductor single crystal ingot (slicing step), then, a planarized coating layer is formed by applying a curabl...  
WO/2017/067597A1
Systems and processes for generating a finished or semi-finished lens, such as a spectacle lens, from a lens blank that comprises an intermediate functional layer. Some embodiments, of the process involve locating the functional layer an...  
WO/2017/068753A1
The present invention addresses the problem of implementing a tool capable of uniformly polishing even the outer peripheral surfaces of objects to be processed, such as the heads of nuts or bolts, which have non-circular outer peripherie...  
WO/2017/069202A1
Provided is a polishing composition that can suppress surface defects and reduce haze. A polishing composition that includes: abrasive grains; at least one type of water-soluble polymer selected from among vinyl-alcohol-based resins that...  
WO/2017/068787A1
The present invention is provided with two grinding work tables (11A, 11B). The two grinding work tables are caused to advance and retreat to corresponding positions on a grinding head (12), and are configured such that while one grindin...  
WO/2017/070387A1
Systems and related methods are provided for maintaining a spatial relationship between a tool (40) of the multi-axis machine (e.g., fluid jet nozzle of a fluid jet cutting machine) and a workpiece (14) to be processed by the tool. An ex...  
WO/2017/067884A1
An apparatus (1) for dressing a grinding wheel (2) mounted thereon by creating structures (12) on the surface of a, in particular cylindrical, grinding surface (3) of the grinding wheel (2), the apparatus (1) comprising: - a dressing too...  
WO/2017/067779A1
The treatment plant (1) for treating longitudinal bars (2) comprises at least one painting sub-station for painting the bars (2) and a sequence of decoration sub-stations (19, 19', 19", 19'", 19"") for decorating the painted bars, each s...  
WO/2017/070221A1
A comminutor reduces the size of particles of frangible blast media from each particle's respective initial size to a size smaller than a desired maximum size. The frangible blast media may be entrained in a flow of transport gas. The co...  
WO/2017/069253A1
Provided is a polishing composition that can suppress surface defects and reduce haze. A polishing composition that includes: abrasive grains; at least one type of water-soluble polymer selected from among vinyl-alcohol-based resins that...  
WO/2017/063932A1
The present invention relates to a stoning or honing device for automatically applying an essentially constant and uniform pressure of an abrasive hard component onto a continuously moving metal strip (6) surface, for the purpose of defe...  
WO/2017/064022A1
The invention relates to a device and a method for producing a security document (1), wherein the security document (1) is provided in an oversized format, and the security document (1) is cut in at least one peripheral area along a cutt...  
WO/2017/064021A1
The invention relates to a device and a method for producing a security document (1), wherein: the security document (1) is provided with at least one projecting layer (6); at least one image of at least one projecting section (7) of the...  
WO/2017/066420A1
Various examples are provided for polishing techniques for flexible tubular workpieces. In one example, a method includes supporting a tubular workpiece on a rod that extends axially through it; positioning a turning wheel against an ext...  
WO/2017/065951A1
Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer...  
WO/2017/066077A1
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has ...  
WO/2017/065082A1
A blade comprising: a disc-shaped base metal (12); tips (14) (edges) for cutting or grinding that are provided to a peak section (outer circumferential edge) of the base metal (12); and a protruding coating (30) on a side surface (13) of...  
WO/2017/059995A1
The invention relates to a method for cleaning using solid carbon dioxide, wherein adhesive surfaces of the vehicle components (102) are cleaned automatically in an assembly line having several work stations.  
WO/2017/060655A1
The invention relates to a method for generating settings for machining an optical lens (L1). According to the invention, this method includes steps consisting in: a) acquiring a file characterising the shape (F1) to which the optical le...  
WO/2017/059935A1
The invention relates to a method for machining at least a part of a surface (26) of a component (28) for a vehicle, said surface being coated with a clearcoat layer with a given first layer thickness, wherein the component (28) is arran...  
WO/2017/062719A1
The present disclosure relates to polishing pads which include a polishing layer, a porous substrate and an interfacial region. The present disclosure relates to a method of making the polishing pads. The present disclosure relates to a ...  
WO/2017/061077A1
The present invention pertains to a measurement method for a template characterized by comprising: a step for preparing a measurement wafer and measuring the thickness of the measurement wafer; a step for placing the template on a refere...  
WO/2017/062482A1
An epoxy-functional coupling agent comprises a reaction product of a polyepoxide and an aminosilane represented by the formula HNR1R2. R1 represents Z-SiL3 and R2 represents Z-SiL3 or an alkyl group having from 1 to 4 carbon atoms. Each ...  
WO/2017/061857A1
The invention refers to a grinding device and a grinding method for grinding at least one knife. The grinding device comprises a frame (20) with a knife holder(13.1, 13.2) and a grinding unit (30) comprising a grinding head (21), a grind...  
WO/2017/059996A1
The invention relates to a device (100) for cleaning adhesive surfaces of vehicle components (102) using solid carbon dioxide, said device (100) for automated cleaning in an assembly line with a plurality of work stations comprises a cha...  
WO/2017/059701A1
Disclosed is a grinder transmission device, comprising a first transmission shaft (2) for driving an inner grinding wheel to rotate, a second transmission shaft (3) for driving an outer grinding wheel to rotate, a main shaft (1), a first...  
WO/2017/061215A1
A stainless steel pipe with excellent corrosion resistance is provided which does not rust prematurely even in waterfront environments affected of sea salt particles, and a manufacturing method thereof are provided. This stainless steel ...  
WO/2017/061486A1
This duplex grinding device is equipped with: a disc-like carrier ring (2) which has a supporting hole (241) capable of supporting a silicon wafer (W); a rotating mechanism which causes the carrier ring (2) to rotate with the center (C1)...  
WO/2017/061059A1
A surface-coated cutting tool is provided with a substrate and a coating film formed on the substrate. The coating film includes an α-Al2O3 layer comprising a plurality of α-Al2O3 crystal grains. The α-Al2O3 layer includes: a first ar...  
WO/2017/061109A1
The purpose of the present invention is to provide is an abrasive agent for a magnetic disk, the agent having a fast polishing speed with respect to an object to be polished. Provided is an abrasive agent for a magnetic disk comprising 2...  
WO/2017/061229A1
[Problem] The present invention provides a means capable of achieving a further improvement in polishing speed, for use in a polishing composition. [Solution] The polishing composition according to the present invention contains abrasive...  
WO/2017/061989A1
A centrifugal blast wheel machine includes a wheel assembly having blades configured to throw blast media introduced into the wheel assembly against a work piece. An impeller driven by a motor is positioned about an axis of the wheel ass...  
WO/2017/056392A1
The present invention is a method for conditioning a polishing pad, which is affixed on a rotatable disc-shaped surface plate and is for polishing wafers, using a conditioning head. The polishing pad conditioning method is characterized ...  
WO/2017/054130A1
A method and a system for machining a work piece by a machining tool (501) are provided. The method comprises relatively moving the machining tool (501) against the work piece to apply machining feeds therebetween. The contact points at ...  
WO/2017/055376A1
A metal surface treatment method wherein the surface (10) is simultaneously bombarded with a mixture of abrasive particles (4) and dopant particles (6) which are delivered at a velocity in the range of 50-250 m/sec, and thereby depositin...  
WO/2017/057155A1
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an a...  
WO/2017/058864A1
A method of removing material from a workpiece includes moving a coated abrasive over a receiving surface of a platen, the receiving surface having at least one opening configured for the flow of an ejection material therethrough, moving...  
WO/2017/057156A1
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is ...  
WO/2017/055952A1
Marking device (1, 1', 1") of a substrate (10) substantially flat, concave or convex, comprising a support element (2), a marking head (4), supported by said element (2), which identifies an abutment perimeter (6) with the substrate (10)...  
WO/2017/059229A1
A sanding block adapted for abrading a surface, particularly drywall joints, comprising: (a) a body having an array of elongated raised portions having raised end surfaces and recessed portions, the raised end surfaces collectively defin...  
WO/2017/057264A1
Provided is a power steering device comprising a rack shaft (7) obtained by joining a first member on which rack teeth are formed and a second member (7b) serving as a ball screw shaft on which a shaft-side ball screw groove (42a) is for...  
WO/2017/055394A1
The invention relates to an abrasive sawing or polishing substrate comprising: a substrate; a binder C1 covering at least part of the substrate; abrasive particles having an at least partial coating C2; a coating C3 covering the binder C...  
WO/2017/057183A1
Dust collection covers for efficiently collecting dust are used in cutting machines used to cut stone and concrete. A dust collection cover of the present invention makes it possible to sufficiently collect dust by self dust collection w...  
WO/2017/057478A1
[Problem] To provide a polishing composition with which an object to be polished that includes oxygen atoms and silicon atoms can be polished at a high polishing speed, and with which the scratching of the surface of the object to be pol...  
WO/2017/058769A1
A method and apparatus for evaluating performance of a bonded abrasive article during a cutoff grinding operation including an abrasive assembly holding a bonded abrasive article, a workpiece assembly holding a workpiece and a measuring ...  
WO/2017/055108A1
The invention relates to a finishing tool (1), in particular an end milling cutter, a) suitable and intended for removing material over the area of a workpiece surface and for smoothing the workpiece surface in a milling motion by rotati...  
WO/2017/056636A1
The present invention relates to a method and a device for polishing the surface of a substrate having film thickness unevenness in the circumferential direction of the substrate. Disclosed is a polishing method whereby: film thickness d...  
WO/2017/057548A1
Provided is a grinding machine in which brittle-mode grinding is suppressed so as to achieve stable grinding of a wafer. This grinding machine (1) is provided with: a rotatable spindle (23) that has a grind stone (21) attached to a lower...  

Matches 1 - 50 out of 133,861