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Matches 1 - 50 out of 138,309

Document Document Title
WO/2018/130495A1
The invention relates to a method which is carried out in a grinding machine (100) comprising the following: - a tool spindle (11) for receiving a cup grinding wheel (10), which is provided with an abrasive surface, and for rotating the ...  
WO/2018/131399A1
Provided are a grinding apparatus, etc. with which the grinding pressure acting on a workpiece from a grinding stone can be appropriately controlled. A roughly cylindrical workpiece (W) is fixed on a workpiece support (104). A grindstone...  
WO/2018/131293A1
[Problem] To provide an electrically powered tool having a simple configuration comprising a reduced number of parts, the configuration enabling the tool to be provided with a coordination mechanism while satisfactory operability and rel...  
WO/2018/130540A1
The invention relates to a blasting probe (10) for introducing a granular blasting material into a cavity, in particular into a narrow coked cavity, such as an inlet channel (18) of a valve (19) of a combustion engine, in particular for ...  
WO/2018/132598A1
The invention comprises a new and improved device, system and method of using a ride- on planetary power grinder that may utilize a ride-on power trowel having at least two rotors, at least three arms to the respective at least two rotor...  
WO/2018/130237A1
The invention relates to a roughing disk for machining material surfaces, comprising a disk-shaped main body which comprises a central opening, through which an axis of rotation passes, for the direct or indirect connection of a drivesha...  
WO/2018/131182A1
This edge finishing device (90) for use on a glass substrate (1) as a brittle material substrate includes a first heating unit (10) and a second heating unit (20). The first heating unit (10) heats an edge of the glass substrate (1) to m...  
WO/2018/132661A1
Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using a grinding wheel mounted on one end of a spindle, the grinding wheel having a peripheral edge that contacts the edg...  
WO/2018/131790A1
The present invention comprises: a grinder body (10); a coupler (P) composed of a power transmitting member (20) coupled to a rotary shaft (11) of the grinder body (10), and a main body (30) provided between the grinder body (10) and the...  
WO/2018/131868A1
An embodiment relates to a porous polyurethane polishing pad used in chemical mechanical planarization (CMP) of a semiconductor and a method for manufacturing same, wherein the polishing performance (polishing rate) of the porous polyure...  
WO/2018/131187A1
The polishing of a three-dimensional curved surface of buildings, structures, and the like at a constant pressure has conventionally been done manually. Provided is a hand tool that, by being mounted on an articulated robot or the like, ...  
WO/2018/131508A1
[Problem] To provide a polishing composition with which it is possible to use abrasive grains that do not cause defects and increase a mechanical friction effect to polish, at high speed, a substrate on which a coating film of silica or ...  
WO/2018/131341A1
A polishing composition including abrasive grains, a dispersion medium, and an additive, the polishing composition being for use in polishing an object to be polished, wherein the abrasive grains are surface modified, the additive is rep...  
WO/2018/131771A1
The present invention relates to a peening position control technology of an ultrasound peening system, comprising: an ultrasound wave generation unit for generating an ultrasound wave; an ultrasound wave radiation unit arranged to make ...  
WO/2018/130934A1
The present disclosure relates generally to the field of surface finishing operations, more particularly to micro-finishing systems and processes. The micro-finishing system and process of the present disclosure is configured to perform ...  
WO/2018/126526A1
An efficient polisher, comprising: a conveying mechanism (40) for conveying an external workpiece to be processed (60) along a first direction; at least two polishing components (10) for polishing a surface to be polished of the workpiec...  
WO/2018/126521A1
A supersonic nozzle vortex tube refrigeration and nanofluid minimal quantity lubrication coupled supply system. The system consists of a low temperature gas generation device (1), a nanofluid minimal quantity lubrication supply system (2...  
WO/2018/122500A1
A polishing pad (1) formed from a foam body (2), provided with an attachment surface (21) for being attached to the rotary plate of a polishing machine and having an active surface (22) wet by the polishing liquid and coming into contact...  
WO/2018/124226A1
Provided is a polishing composition which is capable of further reducing microdefects and haze on polished wafers. The polishing composition includes silica particles, an inorganic alkali compound, polyglycerol, and a multi-chain polyoxy...  
WO/2018/123875A1
The present invention provides: a means for preventing sedimentation of abrasive grains while maintaining polishing performance; and a means for improving re-dispersibility of abrasive grains while maintaining polishing performance. The ...  
WO/2018/120273A1
A miniature tap, comprising a miniature tap blade member (2). The miniature tap is provided with one or more blade members (2), or one or more spiral blade members, or one or more tapered blade members in a connected or integrated manner...  
WO/2018/122740A1
A coated abrasive article (10) having a backing (12) and an abrasive coat (20) attached to the backing (12), the abrasive coat (20) comprising a cured abrasive slurry containing a plurality of abrasives particles, wherein the abrasive sl...  
WO/2018/124017A1
Provided in one embodiment are cerium oxide abrasive grains with which it is possible to improve a polishing rate. The present disclosure, in one embodiment, pertains to cerium oxide abrasive grains to be used in an abrasive, wherein the...  
WO/2018/122349A1
An attachment (116) is configured to be used with a hand-held rotary power tool (100). The attachment (116) includes a housing (120), a sanding disk (124), and a cap (132). The housing (120) has a first portion (136) hingedly connected t...  
WO/2018/124013A1
In one embodiment, provided is a cerium oxide abrasive grain with which it is possible to improve the polishing rate. The present disclosure, in one embodiment, pertains to a cerium oxide abrasive grain used for an abrasive, wherein the ...  
WO/2018/125722A1
A process can include forming at least one precursor abrasive component on a core and infiltrating at least a portion of the precursor abrasive component. The precursor abrasive component can include a body including a metal bond matrix ...  
WO/2018/123420A1
The glass plate end face processing method according to the present invention comprises: a preparatory step S1 for preparing a subassembly 25 that is formed of a whetstone attachment flange 20 and a whetstone 11 (12) in which the static ...  
WO/2018/125908A1
A disclosed pipe scuffing device includes a frame and a shaft coupled to the frame and configured to rotate about a central axis. The pipe scuffing device also includes a drive motor configured to drive the rotation of the shaft. The dev...  
WO/2018/122523A1
The invention concerns a device (100) for treating a metal part (1) having an outer surface (1-1), comprising: - a chamber (11), - a vibration module (12) comprising: ▪ a generator (12-1) for generating an electric signal at ultrasonic...  
WO/2018/124230A1
Provided is a polishing composition which enables the achievement of an excellent wafer shape, while maintaining an adequate polishing rate and surface smoothness. This polishing composition contains abrasive grains, a basic compound, an...  
WO/2018/123416A1
A glass plate 1 according to the present invention has an edge face 2 that undergoes a specific processing, wherein the edge face 2 has an arithmetic average waviness Wa of 2.7 μm or more.  
WO/2018/120865A1
A specialized A-grade door frame surface polisher, comprising a base (1). The base (1) is provided with a door frame positioning jig (2), a robot (3), and a control box (11). The robot (3) and the control box (11) are positioned next to ...  
WO/2018/126178A1
The present disclosure relates to a dressing tool. The dressing tool can include a shank having a proximal end and a distal end as well as an abrasive tip. The abrasive tip may include a superabrasive material that may be bonded to the d...  
WO/2018/122742A1
A coated abrasive article (10) having a flexible backing (12) and an abrasive coat (20) attached to the backing (12) by a tie coat (18), wherein the tie coat (18) is liquid-softenable such that the tie coat (18) maintains the flexible ba...  
WO/2018/124229A1
Provided is a polishing composition which is capable of further reducing microdefects and haze on polished wafers. The polishing composition includes silica particles, a basic compound, and polyglycerol. The mass ratio of silica to polyg...  
WO/2018/123351A1
The present invention provides a carrier for a dual-surface polishing device in which, in a dual-surface polishing device, one or more holding holes, which are disposed between upper and lower platens to which a polishing cloth is attach...  
WO/2018/122119A1
The subject of the disclosure is a machine tool (10), in particular a grinding machine, comprising a measuring device (38) which is received on the machine tool (10), said measuring device (38) having at least one structure-borne sound s...  
WO/2018/118562A1
Presented is a diamond comprising a table, a crown, a girdle, a pavilion, and a culet. The table is rectangular, having a length and a width. The table comprises a first side, adjacent to a second side, adjacent to a third side, and adja...  
WO/2018/117436A1
The present invention relates to a grinding disc for use in a grinder that generates rotational power by means of a motor or an air pressure and then performs cutting work on a material to be processed and, more specifically, to a grindi...  
WO/2018/119275A1
The present disclosure relates generally to coated abrasive articles that include a tribological performance enhancing composition in a make coat, a size coat, a supersize coat, or combinations thereof, as well as methods of making coate...  
WO/2018/118699A1
In methods and systems of making an abrasive article, abrasive particles are loaded to a distribution tool including a plurality of upper walls defining a plurality of spacing slots, and a plurality of lower walls defining a plurality of...  
WO/2018/114960A1
The invention relates to a method for the treatment of an Fe-Ni-Cr alloy wall of an industrial reactor, which reduces the formation of coke on the wall when it is subjected to operating conditions conducive to coking, the structure of sa...  
WO/2018/118695A1
Various embodiments disclosed relate to an abrasive article. The abrasive article includes a first major surface and an opposed second major surface. Each major surface contacts a peripheral side surface. A central axis extends through t...  
WO/2018/114535A1
The invention relates to a transfer device (144) for a transport vessel, having a plurality of rotation/transport devices (144a, 144b, 144c,... 144i, 144j 144k, 1441, 144Za, 144Zb,...) arranged in a matrix-like manner, wherein each of th...  
WO/2018/116558A1
Provided are a method for polishing a silicon wafer and a method for manufacturing a silicon wafer which are capable of suppressing the occurrence of a step-shaped micro defect. This method for polishing a silicon wafer is characterized ...  
WO/2018/118596A2
Various embodiments disclosed relate to a composite abrasive article. The article can be formed from a first portion having a first color and a second portion of the article having a second color different than the first color.  
WO/2018/116521A1
A polishing liquid of the present invention comprises manganese oxide grindstone particles, permanganate ions, and a cellulose-based surfactant or a cationic surfactant, and has a pH of 5 to 11. The cellulose-based surfactant is preferab...  
WO/2018/118961A1
An abrasive article can include a body including a bond material and abrasive particles contained within the bond material. The bond material can include a siloxane functional group covalently bonded to a plurality of benzene rings. In a...  
WO/2018/116690A1
Provided is a single-wafer one-side polishing method for a silicon wafer with which the surface coarseness of a silicon wafer can be reduced and an increase in peripheral flatness can be suppressed more than previously. The single-wafer ...  
WO/2018/118688A1
An abrasive article includes a first plurality of abrasive particles and a second plurality of abrasive particles. The first plurality of abrasive particles differ in at least one of a size, an average weight and a shape from the second ...  

Matches 1 - 50 out of 138,309