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Patent Searching and Data


Matches 1 - 50 out of 144,844

Document Document Title
WO/2020/185463A1
A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, osc...  
WO/2020/182336A1
The invention relates to a system and a method for catalytically producing diesel oil from a starting material selected from the group of waste materials, such as plastics (RE, PP, PET, PVC, etc.), cellulose-containing materials, and bio...  
WO/2020/183013A2
The invention relates to a method for shaping sheets of glass material, characterized in that the shaping is performed using a grinding wheel having several grooves, the shaping being performed by alternating from one groove of said grin...  
WO/2020/183768A1
A displacement driving unit and a rotation driving unit move a loading member supported by a loading member supporting mechanism after the loading member is placed in a workpiece withdrawn state from a workpiece set state and before the ...  
WO/2020/184078A1
Provided are a control system having an improved yield, for controlling a polishing device, and a polishing method. A defect data receiving portion 112 of a control system 102 receives defect data relating to a defect of a substrate. A...  
WO/2020/185153A1
A grinding- and polishing tool (1, 1') in combination, comprising a stave (2) which has an edge-treatment side comprising a primary treatment area (6, 6') covering a part of its length, and which in the length direction (L) of the stave ...  
WO/2020/178072A1
The present invention relates to: - a dust hood extension device for use in conjunction with a dust hood for a grinding tool; - a system comprising such a dust hood extension device; and - an adapter. The dust hood extension device is ch...  
WO/2020/177295A1
Disclosed is an apparatus for the batch polishing of workpieces, the apparatus comprising an annular cavity (7), in which several workpieces are mounted, magnetic abrasives (12), which are arranged in the annular cavity (7) and used for ...  
WO/2020/179804A1
This substrate processing device is provided with a polishing part and a transport part. The polishing part has a first polishing unit and second polishing unit, and a polishing part conveyance mechanism. The first polishing unit has a f...  
WO/2020/178952A1
Provided is a trimming method for facilitating deposition of a seed layer that is formed on a side surface of a stacked body. This trimming method is for trimming the edge of stacked semiconductor wafers 10, the trimming method comprisin...  
WO/2020/179790A1
The present invention provides a workpiece processing device and method capable of grooving, with high precision, the surface of workpieces having various shapes and sizes and a cylindrical surface. The workpiece processing device is pro...  
WO/2020/178675A1
Described is a machine (100) for grinding sheet-like elements (10), comprising a main frame (101), a plurality of positioning systems (1) of said respective tools (2), each of said positioning systems (1) comprising a portion (6) for the...  
WO/2020/178793A1
A multi-tool machine (1 ) for surface processing of slabs (L) of stone material or the like, comprising a substantially horizontal support surface (2), which is able to move along a longitudinal axis (X), a portal structure (3) defining ...  
WO/2020/177504A1
Disclosed are an electrostatic nozzle and a controllable jet minimal quantity lubrication grinding system. The electrostatic nozzle comprises a nozzle core (45), wherein an upper portion of the nozzle core (45) is connected to an upper n...  
WO/2020/178677A1
Described is a machine (100) for grinding sheet-like elements (10), comprising a main frame (101), a plurality of positioning systems (1) of said respective tools (2), each of said positioning systems (1) comprising a portion (6) for the...  
WO/2019/149305A8
The invention relates to a device for treating 3D powder printing elements, in particular 3D laser printing elements and/or 3D powder bed elements, in particular produced using a plastic powder laser sintering method, comprising at least...  
WO/2020/175069A1
The present invention provides a grinding wheel which has excellent grinding efficiency and enables stable grinding for a long period of time. A glass filler-containing metal bond grinding wheel (10) according to the present invention ...  
WO/2020/176385A1
A carrier head for chemical mechanical polishing includes a base, an actuator, a substrate mounting surface, and a retainer. The retainer includes an inner section and an outer section connected by a flexure. A bottom of the inner sectio...  
WO/2020/176460A1
A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface and a backing layer formed of a fluid-permeable material. The backing layer includes a lower surface configured to be sec...  
WO/2020/175009A1
The present invention reduces occurrence of vibration in a direction different from the reciprocating direction due to contact between power transmission parts during power transmission of a work machine. The work machine has a rotating ...  
WO/2020/175850A1
The present invention relates to a grinder wheel fixing device, and the objective of the present invention is to provide a grinder wheel fixing device which quickly fixes a grinder wheel with thread-fastening, and which prevents threads ...  
WO/2020/174676A1
The present disclosure relates to a method for producing shot. This production method comprises a cutting step for obtaining a granular product by cutting a wire formed from an iron-based alloy and a heat treatment step for heat treating...  
WO/2020/175364A1
Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sh...  
WO/2020/175363A1
Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer. The present invention provides an adhesive sheet for the backgrinding of a semiconduct...  
WO/2020/175853A1
The present invention relates to a grinder holder enabling a polishing pad to be attached thereto and detached therefrom by one touch. A grinder holder, which is mounted on a rotating shaft of a grinder and enables a polishing pad to be ...  
WO/2020/171134A1
The purpose of the present invention is to provide silica particles that exhibit excellent polishing properties and storage stability. The present invention relates to silica particles such that when the surface silanol group content is ...  
WO/2020/169645A1
The invention relates to an apparatus (1) for manually treating a surface (2), the apparatus comprising a mixer unit (8) for providing a dry ice/compressed air mixture (G) and a manually guidable blasting device (5) for applying the dry ...  
WO/2020/171185A1
Provided are a method for grinding a steel billet, a method for manufacturing steel bar, and a method for manufacturing wire rod, with which surface defects can be reduced further while suppressing a deterioration in productivity. This m...  
WO/2020/172554A1
Oxides formed during annealing of stainless steel strip are removed with abrasive brushes, in lieu of acid or molten salt based pickling. In some embodiments, the stainless steel strip is treated with a rare earth element or a related tr...  
WO/2020/170331A1
One aspect of the present invention is a polishing liquid containing abrasive grains, a copolymer, and a liquid medium, wherein the copolymer has a structural unit derived from at least one styrene compound selected from the group consis...  
WO/2020/171140A1
The purpose of the present invention is to provide silica particles that exhibit excellent polishing properties and storage stability. The present invention relates to silica particles such that when the d value measured using wide-angle...  
WO/2020/169882A1
The disclosed solution comprises a device for changing abrading products (30), the device (1) comprising a detacher (2) comprising a table (10), a blade (14) adapted to penetrate into between an abrading product (30) and the gripping mea...  
WO/2020/170120A1
Described is a device (1) for calibrating the position of sheet-like elements on a conveyor comprising a supporting frame (10) which can be connected to a machine for grinding sheet-like elements and having one or more transversal guides...  
WO/2020/170950A1
An oxide sintered body which has a surface having surface roughness Rz of less than 2.0 μm.  
WO/2020/170801A1
The present invention provides an optical member which includes an organic polymer and which includes a surface A having a surface area of at least 1 mm2, the flatness of a region thereof having a surface area of 1 mm2 being 80 µm or le...  
WO/2020/067914A8
A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modifi...  
WO/2020/172215A1
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a ...  
WO/2020/130603A3
The present invention relates to a zinc-nickel-alloy-electroplated steel sheet comprising a base steel sheet, and a zinc-nickel-plated layer which is located on at least one surface of the base steel sheet and which has a hairline patter...  
WO/2020/164242A1
A blank leather strip and bristle co-body inserting machine. The machine comprises a first bristle supply mechanism (1), a second bristle supply mechanism (2), a bristle inserting mechanism (3) which is located between the first bristle ...  
WO/2020/166438A1
Provided is a polishing composition capable of suppressing swelling in a peripheral part of a laser mark without lowering the polishing rate thereof. The polishing composition contains water, abrasive grains, a basic compound, a benzyltr...  
WO/2020/165759A1
An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features...  
WO/2020/167315A1
A masking system (105) for a turbine including a first quantity of blades (35) attached to a rotor (30) and arranged adjacent one another to define a blade (35) row with each blade (35) including a blade root (70), includes a second quan...  
WO/2020/166553A1
The present invention addresses the problem of providing: a target material washing method whereby it becomes possible to remove impurities derived from a bonding material constituting a bonding layer and a support member from a used tar...  
WO/2020/163923A1
The useful model refers to a polishing brush that can be used in dentistry for carrying out various operations, in particular for cleaning and / or polishing dental restorations, for example, polishing of a single tooth or complete denta...  
WO/2020/166259A1
The present invention relates to a method of cutting a workpiece with a wire saw, wherein: a wire guide has a plurality of grooves formed on the outer surface at a predetermined pitch along a rotation direction; the cross-sectional shape...  
WO/2020/165683A1
An abrasive article comprises abrasive particles secured to a substrate by at least one binder material. The at least one binder material comprises a cured reaction product of components comprising: a) at least one phenolic resin; and b)...  
WO/2020/168360A1
Various dust collection apparatuses are disclosed. In a first example, a dust collection apparatus includes a vacuum source configured to provide a negative pressure, and a multistage filter configured to collect airborne dust drawn by t...  
WO/2020/166694A1
A production method for a hard disk board 10. The production method: makes it possible to achieve high-precision polishing by quickly selecting to change polishing conditions or replace a polishing pad on the basis of the flatness of the...  
WO/2020/165709A1
The disclosure relates to an abrasive article comprising: a fabric substrate comprising strands forming first void spaces between the strands; a laminate joined to the fabric substrate; a cured resin composition joined to the laminate op...  
WO/2020/167485A1
A substrate carrier head is disclosed. In one aspect, the carrier head includes a carrier body, a substrate retainer, a first resilient membrane and a second resilient membrane. The carrier head can include an inner support plate. The su...  

Matches 1 - 50 out of 144,844