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WO/2007/032946A2 |
Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said supe...
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WO/2007/030419A2 |
An orbital rotary blade sharpener for sharpening rotary cutter blades and other rotary blades includes a bottom blade holding portion having a center and a perimeter edge, a top blade holding portion rotatably connectable to said bottom ...
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WO/2007/027486A2 |
The present invention provides a method of conditioning processing pads for use in processes such as electrochemical mechanical polishing. A processing pad is provided to perform the polishing, and a conditioning disc is provided to cond...
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WO/2007/024507A2 |
A centrifugal processor is disclosed with includes an outer frame having an inner surface and an axis. At least one inner vessel positioned within the outer frame and is adapted to receive an object to be processed. A drive system rotate...
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WO/2007/021637A2 |
A hand-held, manually-operated sanding tool including a base member, a clamping mechanism, a handle and a mounting assembly. The clamping mechanism is adapted to secure a sheet-like abrasive material to the base member. The handle includ...
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WO/2007/016919A1 |
Electromechanical knocking device and knocking method for working, smoothing and cold-hardening the surface of tools, machine parts and other parts by hammering an impact head onto the surface of the said parts by means of mounting them ...
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WO/2007/017524A1 |
The present invention relates to an apparatus for treating surfaces, in particular for polishing and/or grinding surfaces. The apparatus comprises a first retaining device (10) for at least one treatment tool (4) and a second retaining d...
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WO/2007/018117A1 |
[PROBLEMS] To provide an electron beam assisted EEM method that can realize ultraprecision machining of workpieces, including glass ceramic materials, in which at least two component materials different from each other in machining speed...
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WO/2007/015688A1 |
The invention relates to a method for vibro-impact processing of long-length product surfaces and can be used for mechanical engineering, mainly for finishing long-length metal products, in particular wire, pipes and other articles produ...
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WO/2007/016308A2 |
Grinding media are described herein. The grinding media can be used in milling processes to produce particle compositions. A wide variety of particle compositions may be produced with the grinding media which can be used in numerous appl...
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WO/2007/007683A1 |
A method and a device for polishing the surface of a substrate composed of SiC or diamond efficiently and extremely flatly without leaving sub-surface damage. A turn table (1) is turnable about a rotary shaft (4) and composed of quartz e...
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WO/2007/008822A2 |
A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alig...
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WO/2007/001700A2 |
The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied m...
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WO/2007/001699A1 |
The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of 0.01 microns to 10 microns. The polishing pad is produc...
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WO/2006/137453A1 |
A grinding device using ultrasonic vibration has a support table (32) on the upper surface of which an object (31) to be ground is supported and fixed, a liftable rotating shaft (34) provided above the support table, a drive device (35) ...
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WO/2006/134234A2 |
In the method, the shape of the shell (12) is measured and the outer surface (12a) of the shell (12) is ground based on measurements of the shape of the shell (12). The measurement of the shape of the shell (12) comprises measuring the s...
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WO/2006/124172A1 |
Compositions and methods for planarizing or polishing a corundum, GaAs, GaP or GaAs/GaP alloy surface, particularly a semiconductor wafer surface. The polishing compositions described herein comprise (a) a liquid carrier; (b) a smectite ...
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WO/2006/114919A1 |
A cutting or grinding machine is composed of a processing unit having a substrate and an exchangeable cutting or grinding rod fixed to the substrate at its middle portion or rear end, and a rotatable unit having a rotatable support for w...
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WO/2006/112392A1 |
A compatible shower plate of constant quality in which a process gas blow-out hole has a simple structure and can be machined easily, the blow-out hole has dimensions of high precision and uneven blow-out of process gas and generation of...
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WO/2006/109366A1 |
A ultrasonic cutting or grinding machine is composed of an exchangeable cutting or grinding rod, a chuck holding the cutting or grinding rod at a middle portion or rear end thereof, a motor having a rotatable rod, and a transmission rod ...
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WO/2006/097915A2 |
A method of polishing diamonds held by a tang (100) having a predefined axis (160) orthogonal to polishing surface (110). The axis (160) returns to its original spatial orientation with respect to the polishing surface (110) at the end o...
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WO/2006/094157A2 |
An abrasive flow apparatus for polishing a workpiece wherein a horizontal machine tool is adapted such that a workpiece may be secured to first shaft rotatable about a first longitudinal axis. A conjugate form to the workpiece may be sec...
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WO/2006/089896A1 |
The invention relates to a method for machining the valve seat of a fuel injection valve (1) comprising a valve body (3), which has a body seat (12) formed therein, and comprising a longitudinally displaceable valve needle (5), a nozzle ...
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WO/2006/088807A2 |
A method and apparatus for the descaling of metal surfaces without the use of caustic substances is provided. The apparatus includes a first and second blast heads containing nozzles that spray high velocity jets of media at a scale cove...
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WO/2006/081286A2 |
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing...
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WO/2006/077836A1 |
A method of working a fluoride single crystal into one with cylindrical (100) crystal face wherein the strain/birefringence within (100) face orientation crystal has substantially been reduced. There is provided a method of working a flu...
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WO/2006/063136A2 |
Methods of maximizing retention of superabrasive particles in a metal matrix are disclosed. The superabrasive particles (10) may be chemically bonded with the metal matrix (15) to a degree which holds the superabrasive particles (10) in ...
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WO/2006/058518A1 |
The invention relates to a method for hardening the surfaces of components. In order to harden a surface (11) of a component (10), a relative movement or advancing movement between the component (10) and at least one sonotrode-type tool ...
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WO/2006/057720A1 |
A pad for (200) CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer (202, 204); and a plurality of pressure-sensing and process (206) monitoring polishing elements eac...
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WO/2006/043928A1 |
A conditioner disk (200) for use on a polishing pad (32) in chemical mechanical polishing process includes a base structure (210), a plurality of blades (220) supported by the base structure (210). The blades (220) radiate radially and t...
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WO/2006/039413A2 |
CMP pad dressers (100) with superabrasive particles (130, 120, 110) oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be sele...
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WO/2006/034808A2 |
The invention relates to a method for automatically predicting wear caused on a surface of a physical body as a result of at least two movements of said surface relative to another surface of another physical body. The original contour w...
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WO/2006/034695A1 |
The invention relates to a method, whereby a reduced wear of the polishing tool and a reduced duration for the polishing process may be achieved and also free form surfaces and non-rotating workpieces may be polished. The above may be ac...
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WO/2006/036143A1 |
The invention is a riding floor polishing and grinding machine that uses one or more gangs of polishing heads (242) to treat concrete and similar surface flooring (208). A compact vehicle (210) equipped with a front loader arm (235) is f...
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WO/2006/027768A1 |
A mechanical device including: (a) a metal workpiece having a working surface for bearing a load, the working surface including a nanometric, adhesive, solid film containing carbon atoms, the film being intimately bonded to the workpiece...
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WO/2006/023350A1 |
Organic bonded abrasive tools, having controlled microstructures, comprise a relatively low volume percentage of abrasive grain and a relatively low hardness grade, but are characterized by the excellent mechanical strength and efficient...
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WO/2006/022592A1 |
Apparatus for ultrasonic vibration-assisted machining, the apparatus comprising an ultrasonic transducer for generating ultrasonic waves in a vibration horn; first clamp on the vibration horn at a static node of the ultrasonic waves; and...
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WO/2006/012094A2 |
A method of magnetic-abrasive machining of parts has the steps of supporting a part, generating a magnetic field by magnetic means located at one side of the part, placing a magnetic-abrasive powder on a surface located at another, oppos...
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WO/2006/007554A2 |
The present invention incorporates at least one thermoplastic or elastomeric polymer in abrasive flow machining media either as the sole or as one of the polymeric constituents. The presence of thermoplastic polymer imparts a greater ela...
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WO/2005/120772A2 |
Disclosed is a method of gemstones working enabling rapid gemstone working member exchange and gemstone processing sequence continuation without the need to level the gemstone or the working member. The apparatus includes a rotatable sup...
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WO/2005/115688A1 |
A fixture for simultaneously clamping a number of optical fiber ferrules or fiber stubs for polishing. The fixture includes a plate assembly with an upper surface, a lower surface and a number of ferrule-receiving bores disposed across t...
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WO/2005/113194A1 |
A system for dispensing magnetorheological fluid to an MR finishing machine includes a pump for pressurizing the system; a first magnetic valve for regulating MR fluid flow by magnetically varying the structure and apparent viscosity of ...
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WO/2005/110675A2 |
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a po...
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WO/2005/108008A1 |
A shoe (10) for supporting an abrasive tape (33) having an abrasive face and an opposed back face, wherein the shoe (10) comprises a support surface (20) including a frictional engagement material for frictionally engaging the back face ...
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WO/2005/092010A2 |
In one embodiment (1), the disclosure is directed to a chemical mechanical polishing retaining ring (106). The chemical mechanical polishing retaining ring (106) includes a support formed of a first material (114) comprising a first poly...
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WO/2005/090617A1 |
The invention relates to a method for increasing the bending strength and the endurance limit of crankshafts by locally restricted hammering in areas of high stress, such as grooves, the mouths of bores and cross-sectional transition zon...
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WO/2005/087434A1 |
Disclosed herein is a method for polishing metallic articles comprising immersing a portion of the metallic article in abrasive media; tumbling the metallic article in a centrifugal force field; and passivating the metallic article in a ...
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WO/2005/084261A2 |
A grinder assembly (10) contacts a tire (T) supported by a frame (F) relative to the tire (T). The grinder assembly (10) includes at least one section, and a vertical repositioning system (118) supporting the at least one section. The ve...
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WO/2005/082573A1 |
The object of the invention is an apparatus and method for deburring and roller-burnishing machine parts. The inventive apparatus can be applied for working plane and general spatial surfaces by deburring and roller burnishing action and...
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WO/2005/072338A2 |
An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slu...
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