| Document |
Document Title |
|
WO/2012/028564A1 |
A machine tool (1), designed in particular as a hand-held belt grinder (2), is subjected to high frequencies outside the working plane (100) between the abrasive belt (4) and the workpiece (13), in particular in a free-running region of ...
|
|
WO/2012/024267A2 |
A method of grinding a superabrasive workpiece includes placing a bonded abrasive article in contact with a superabrasive workpiece, wherein the bonded abrasive article comprises a body including abrasive grains contained within a bond m...
|
|
WO/2012/021210A1 |
A polishing composition and method for polishing polymer- based surfaces that can be rinsed from the polished polymer-based surface using water so as to leave substantially less polishing residue behind as compared to conventional polish...
|
|
WO/2012/018215A2 |
According to the present invention, it is possible to minimize the difference of the polished amount of the center and the edge of a large substrate in a method for polishing a large substrate.
|
|
WO/2012/007654A1 |
The invention relates to a method for trimming an ophthalmic eyeglass lens (10; 20) according to a desired outline (E, F), the lens (10; 20) comprising a substrate (11; 21) and a coating film (12; 22). The method comprises a step of cutt...
|
|
WO/2012/006504A2 |
An edge finishing apparatus includes a surface, a fluid delivery device configured to deliver at least one magneto rheo logical polishing fluid (MPF) ribbon to the at least one well, at least one magnet placed adjacent to the surface to ...
|
|
WO/2012/001616A2 |
A packet based switched multimedia network which consolidates networking of high throughput, time sensitive data, and control streams, with Ethernet data networking over home span. The multimedia network may support in parallel, over the...
|
|
WO/2011/163450A1 |
A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the s...
|
|
WO/2011/162893A2 |
Various methods and systems are provided for finishing a target surface. In one embodiment, a arrangement includes a target surface; at least two electromagnets; a magnetic abrasive fluid mixture disposed on the target surface; and at le...
|
|
WO/2011/152045A1 |
Disclosed is a semiconductor wafer surface protection sheet which has excellent adherence to the irregularities on the circuit formation surface of a semiconductor wafer, and has excellent detachability after being ground. Specifically, ...
|
|
WO/2011/121913A1 |
When repeatedly using colloidal silica as a polishing material when subjecting a glass material to precision polishing, a limitation on the frequency in which the colloidal silica can be repeatedly used is removed by preventing the collo...
|
|
WO/2011/121903A1 |
When repeatedly using colloidal silica as a polishing material when subjecting a glass material containing cerium oxide in the composition thereof to precision polishing, a limitation on the frequency in which the colloidal silica can be...
|
|
WO/2011/118532A1 |
Disclosed is a processing method which can achieve a high processing rate, and is capable of making a surface smooth. In order to achieve this an SiC substrate (8) is arranged in a potassium hydroxide solution (2) containing hydrogen per...
|
|
WO/2011/112927A1 |
A method and apparatus for releasably attaching flexible abrasive disks to a flat- surfaced platen that floats in three-point abrading contact with three rigid flat-surfaced rotatable fixed-position workpiece spindles that are mounted on...
|
|
WO/2011/085913A1 |
The invention relates to a cylindrical grinding machine, wherein a round rod (3) to be ground by peel-grinding is clamped in the chuck (2) of a workpiece spindle head (1) so that a rotation occurs around the common center axis (4). Accor...
|
|
WO/2011/081540A1 |
The subject of the invention is a unit for surface treatment of top layers, especially of metal, which is used for the treatment of top layers of working surfaces of machine parts, and especially for placement of coatings of micro- and n...
|
|
WO/2011/081541A1 |
The subject of the invention is a method for modification of top layers of working surfaces of machine parts, which is used for the treatment of top layers of working surfaces of machine parts, and especially for placement of coatings of...
|
|
WO/2011/072298A2 |
An abrasive article for use with a grinding wheel including an abrasive body having abrasive grains contained within a matrix of bond material, the abrasive body having a plurality of arm portions defining a twisted path having a plurali...
|
|
WO/2011/065462A1 |
A grinding tool comprises: a support plate (11), an annular grindstone mounting plate (14) which is supported under the support plate by means of an annular connection section (12) so as to be parallel to the support plate with a gap for...
|
|
WO/2011/065415A1 |
(1) There is prepared a polishing apparatus comprising a disk-shaped grinding stone holding plate (13) which holds an annular grinding stone (11) on the lower surface and has a disk-shaped ultrasonic wave oscillator (12) installed in the...
|
|
WO/2011/058969A1 |
Provided is a method for manufacturing a glass substrate for use in a magnetic recording medium, which enables a glass substrate that is for use in a magnetic recording medium and that has high smoothness and low surface swell to be manu...
|
|
WO/2011/054679A1 |
The invention relates to a method for grinding the main and pin bearings (3, 5) of a crankshaft (1) wherein the pin bearings (5) are first pre-ground and finish-ground in a first grinding station (22) and the main bearings (3) are then p...
|
|
WO/2011/045285A1 |
The invention relates to a device for surface treating, in particular for polishing, grinding, or the like, workpieces (5), comprising at least one working container (1) for receiving one or more workpieces (5) to be machined and for aux...
|
|
WO/2011/036439A1 |
A method of manufacturing a multi-tooth fir-tree or bulbous form milling cutter, by the grinding of a blank with a grinding wheel, wherein, a flat clearance angle Θ of between 0° and 20° is generated on each tooth (13) by the path (14...
|
|
WO/2011/020775A1 |
The invention relates to a tool for machining hard materials such as metal-matrix or organic-matrix composite materials, comprising a cylindrical sonotrode (22) connected, along the axis (A) of said cylinder, to an assembly vibrating at ...
|
|
WO/2011/018925A1 |
Flushing of sludge is realized without the necessity of a large quantity of working liquid. A machining device for machining a workpiece (WK) is provided with a rod-shaped machining means (20) extending in one direction, a vibrating body...
|
|
WO/2011/012517A2 |
The invention relates to a sonotrode made of a material capable of transmitting vibrations and comprising at least a first, longitudinal portion (Pl) having a central axis (C), characterized in that it further includes an intermediate po...
|
|
WO/2011/012490A1 |
The invention relates to an ultrasonic machining machine having a generator coupled to means for putting it into operation, a transduction assembly equipped with a sonotrode (1), means for managing the descent of the sonotrode towards a ...
|
|
WO/2011/006753A1 |
In a method for machining a piston (10) for an internal combustion engine, a ring groove (12) is first at least partially hard anodized (14), and the hard anodized coating (14) is subsequently partially polished by a rotating grinding to...
|
|
WO/2010/145852A1 |
An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be sub...
|
|
WO/2010/124132A1 |
The present invention is directed toward the design of a holding apparatus which allows contact lens lathes to hold contact lens buttons during the contact lens manufacturing process. The holding apparatus functions to hold lenses manufa...
|
|
WO/2010/119765A1 |
Though in conventional wafer chamfering, the chamfered shape (cross-sectional shape) of the wafer circumference is uniform, in a chamfering step in wafer manufacture, the uniform chamfered shape varies by the position on the circumferenc...
|
|
WO/2010/096765A1 |
The present invention provides an apparatus and a method for manufacturing a wheel hub to reduce lateral run-out. Specifically, the present invention provides an apparatus and a method for machining the inner and outer surfaces of the wh...
|
|
WO/2010/091812A2 |
A surface treatment device (16) comprises an enclosure (18) which has an opening (20) through which the leading edge (14) of an aerofoil (12) passes. A sealing element (26) is provided on the enclosure (18) to seal the device (16) to the...
|
|
WO/2010/084234A1 |
The invention relates to a method and a treatment device, which operates by means of a vibrating movement for treating a workpiece. The treatment device comprises, in addition to a first vibrator (21), at least one other vibrator (22), w...
|
|
WO/2010/076230A1 |
The invention relates to a handheld electric machine tool (10) comprising - a housing (20) having a grip area (40), - a tool area (50) for a tool (60) that can be driven in a linear and/or oscillating manner, - an operating element (30) ...
|
|
WO/2010/065125A1 |
The present invention provides a method for selectively removing silicon carbide from the surface of a substrate in preference to silicon dioxide. The method comprises abrading a surface of substrate with a polishing composition that com...
|
|
WO/2010/060402A1 |
In a method for grinding a workpiece (30), a relative movement (50) of a rotational axis (42) of a rotating grinding tool (40) and the workpiece (30) is generated. The relative movement (50) is a superposition of a basic movement (52) in...
|
|
WO/2010/053729A1 |
An abrasive slurry, abrasive article, and method is provided for forming an abrasive coating on a surface of a backing. The abrasive slurry includes a continuous phase, a first discontinuous phase of abrasive particles dispersed in the c...
|
|
WO/2010/042209A1 |
A process for etching a silicon-containing substrate to form structures is provided. In the process, a metal is deposited and patterned onto a silicon-containing substrate (commonly one with a resistivity above 1-10 ohm-cm) in such a way...
|
|
WO/2010/024285A1 |
A method for manufacturing a nitride substrate (10) is provided with the following steps. First, a nitride crystal is grown. Then, the nitride substrate (10) including a front surface (11) is cut from the nitride crystal. In the cutti...
|
|
WO/2010/021821A1 |
A tool for moving an abrasive media. The tool includes a tool body, a platen, a drive system and a retaining knob. The platen has an exterior platen surface and a knob aperture that is formed through the exterior platen surface. The driv...
|
|
WO/2010/014180A2 |
The invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing a silicon-containing substrate. A method of the invention comprises the steps of contacting a silicon-containing substrate with a polishing...
|
|
WO/2010/009862A1 |
The invention relates to a method for finishing a surface of a workpiece by means of forming a third body utilizing a metal-cutting surface processing tool. The invention is characterized by the combination of the following process steps...
|
|
WO/2009/157777A1 |
A tool (20) is described for cutting and grinding of welds on doubling plates in offshore environments where there is a danger of explosions, where the tool comprises: at least one end support (22a, 22b) with corner legs (26) on wheels; ...
|
|
WO/2009/139357A1 |
Disclosed is a surface protection method which can prevent the detachment of a protective film even when a processing such as dicing is carried out. Specifically disclosed is a method for protecting the surface of a material to be proces...
|
|
WO/2009/134775A1 |
Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and polyolefin. The polymers are selected on the b...
|
|
WO/2009/122472A1 |
A board material being transferred by a transfer mechanism is sandwiched by two polishing heads, and the board material is transferred by the transfer mechanism by vibrating the two polishing heads by a vibrating mechanism in a direction...
|
|
WO/2009/111613A2 |
Floor sanding sponge pads (as referred to as "sponge pads") are designed to sand both raw (unfinished) or treated (finished with stain, sealer, polyurethane, etc.) floors in order to smooth out surface roughness while applying a sufficie...
|
|
WO/2009/110569A1 |
A shot peening device (1) is equipped with a containment vessel (2) that stores shot material (B) used in shot peening, and performs shot peening of a worksite surface (UP) by the containment vessel (2) moving to the shot peening worksit...
|
