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JP2023144719A |
To improve dimensional accuracy of grinding by increasing the positioning accuracy of a workpiece during grinding.A grinding apparatus includes: a grinding wheel supported so as to be rotatable about a central axis; and a support table h...
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JP2023124321A |
To provide a tire polishing device that can achieve a target polishing level with high accuracy.A tire polishing device 10 as one example of embodiments comprises a driving unit 15 that rotates a tire 1, and a polishing unit 20 that poli...
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JP2023124308A |
To provide a tire polishing device than can measure polishing amounts of a tire accurately.A tire polishing device 10 as one example of embodiments comprises a driving device 15 that rotates a tire 1, a polishing device 20 that polishes ...
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JP2023124820A |
To provide a substrate polishing apparatus that can reduce overall processing time when performing multiple types of polishing.A substrate polishing apparatus comprises a first polishing module, a second polishing module, and a third pol...
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JP7338078B1 |
A tip dresser capable of applying an appropriate current and voltage to a welded portion when resistance welding is performed. A rod-shaped member (10) having a constricted portion formed by constricting the longitudinal central portion ...
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JP2023537587A |
Abrasive tool kits, equipment and methods are provided for bearing roller finishing of bearing rollers. The equipment includes a main body, an external circulation system, a polishing tool kit, and a fixture of the polishing tool kit. Th...
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JP7331510B2 |
To provide a processing method which is low-cost and enables a service life of a tool to be lengthened.A processing method using a grindstone comprises: an arranging step in which a grindstone 20 is arranged at a processing initial posit...
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JP7329496B2 |
A sealing apparatus which is capable of preventing static leakage of a target to be sealed without increasing sliding resistance with respect to a shaft, and a surface processing method of a disk member of the sealing apparatus which is ...
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JP2023114462A |
To provide an eccentric oscillation type speed reducer capable of suppressing degradation of service life of an eccentric body to solve a problem on shortening the service life of the eccentric body due to a processing condition in a cas...
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JP2023104445A |
To prevent a DAF and a protective member from adhering in a mark (a groove) for replacing a notch or the like.A processing method of a wafer, for reducing a thickness into a finishing thickness by grinding the wafer in which a structure ...
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JP7306818B2 |
To provide a fine frog manufacturing method that can form fine frogs by forming multiple columns with pointed tips on a surface of a workpiece.A fine frog manufacturing method of the present invention is constituted of at least an aspect...
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JP7293501B2 |
A device for the external machining of a workpiece (4) having a geometrically undefined cutting edge comprises a shoe (1) which is configured to press a rotationally symmetric workpiece (4) against a driver (7), wherein the shoe (1) has ...
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JP2023081458A |
To provide a film lapping processing device and a film lapping processing method that are capable of polishing a screw groove in a work of a screw shape with high accuracy.A film lapping processing device 100 is a film lapping processing...
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JP7285552B2 |
To provide a groove polishing body that can smoothly polish a groove surface of a groove formed on an object to be polished, without generating stripe-shape irregularities and can be easily prepared without needing special shaping-work s...
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JP2023075770A |
To provide a screw shaft polishing device that can evenly and accurately polish a male screw part of a screw shaft without causing any hindrance on polishing operation.A screw shaft polishing device 1 for polishing a male screw part 100b...
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JP7284535B1 |
The present invention reduces the work load of holding and releasing a polishing holder to and from an apparatus for polishing the end face of an optical fiber ferrule, which is repeated in each polishing process, by placing an offset ri...
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JP2023071253A |
To reduce a grinding amount of a wafer after a division original point formation.A processing method for processing a single crystal silicon wafer, in which a device is formed in each region that is formed so as to expose each specific c...
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JP7276027B2 |
An oscillating device includes: a driving source; an oscillating member which performs an oscillating motion; and a connecting mechanism which converts a rotational motion of the driving source into an oscillating motion and transmits th...
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JP2023063928A |
To provide a processing tool, a groove processing device, an elevator system and a groove processing method which can suppress the occurrence of clogging.A groove processing method according to the present disclosure comprises: an attach...
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JP2023061572A |
To provide a method for forming a reference mark, capable of easily forming a reference mark on a wafer without using a photoresist and a mask.A method for forming a reference mark includes: a processing device preparation step; a holdin...
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JP7264775B2 |
An embodiment of the invention of this application provides a polishing pad that eliminates a gap between an optical connector and a polishing film during polishing. A polishing pad of the embodiment is used by being placed between a pol...
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JP7263872B2 |
A method of producing a drill has a step of preparing a workpiece to be processed to produce a drill, and a step of forming a ground groove. The workpiece has a cutting blade, a chip discharge flute helically extending, and a rake surfac...
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JP7261088B2 |
To allow a life of a magnetic head to be extended and replacement frequency of the magnetic head to be reduced.A magnetic head polishing card 1 for maintaining a magnetic head is configured to comprise a magnetic stripe 2 on which data i...
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JP2023046599A |
To provide a film wrapping processing device which is capable of suitably polishing an entire range of a groove bottom of a screw for injection molding and improving work efficiency by automating complicated work when processing the scre...
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JP2023045378A |
To provide a slate polishing device capable of polishing a front layer of a wavy slate more accurately and also capable of suppressing scattering of dust generated in polishing.A polishing device includes: a brush member 22 that vertical...
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JP7241434B2 |
Carbon atoms of a single-crystal diamond and active abrasives are used to produce a chemical reaction to form carbides under a specific grinding condition of no higher than a graphitization temperature, and a hard abrasive is used to rem...
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JP2023033821A |
To provide a cam grinding data generation device for generating cam grinding data which enables highly accurately grinding of a cam ground surface.A smoothing processing unit 4 of a cam grinding data generation device 1 generates second ...
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JP2023029446A |
To provide a wafer grinding method and a wafer grinding device capable of thinning a wafer to a finished thickness.A wafer grinding method includes a rough grinding step of rough grinding the back surface of a wafer by rough grinding mea...
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JP7230575B2 |
To provide a tire polishing device and a polishing method, which can contribute to an improvement in productivity of tire.A tire polishing device 22 comprises: a rim part 24 for holding a tire 2; a rotary part 26 for rotating the rim par...
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JP3241044U |
The present invention provides a plastic bottle print peeling device that scrapes off print from the surface of the bottle to restore the bottle to its original color in order to recycle the plastic bottle. A support body 2 that presses ...
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JP7227270B2 |
The invention concerns a method and a grinding machine (4) for machining a workpiece (1) comprising a desired helical groove. The method comprises a step of grinding a calibration groove (12) on the surface (10) of the workpiece accordin...
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JP2023023263A |
To provide a cutting method of a substrate in which processing can be excellently done in step cut.A cutting method of substrate in which a substrate is cut along scheduled division lines by a cutting blade having a cutting blade on whic...
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JP2023506437A |
The machine tool comprises first and second rotary machine shafts (10, 16) which are parallel and mounted on the base in a fixed position relative to the base, and a linear machine carried by the first rotary machine shaft. An axis (8) a...
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JP2023019426A |
To provide a method for manufacturing an optical lens the shape accuracy of which is high, and the optical lens.Provided is a method for manufacturing an optical lens 10 which has a first optical plane 11a and a second optical plane 12a....
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JP7208691B1 |
[PROBLEMS] To improve maintainability and product life of an end face polishing device for an optical fiber ferrule by suppressing wear of a turntable and a thrust ring. Kind Code: A1 An apparatus for polishing an end face of an optical ...
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JP2023000305A |
To implement a DBG process without using a tape.A plate-like workpiece 20 in which lattice-like grooves 29 are formed on its surface 21 is held by suction using a suction surface 110 of a first jig chuck 100 having suction holes 111. Fur...
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JP2022551168A |
The present invention provides at least one dental tool (4) for finishing or prefinishing a dental restoration (5) at least completely along an equalizer (5a), with or without retaining stubs (5b). With respect to a method of machining a...
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JP7184452B2 |
To provide a groove grinder capable of inhibiting a grinding burn when a groove is ground in a fixed pulley of a transmission mechanism for a vehicle.A groove grinder comprises: a supply head moving in an axial X direction following a mo...
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JP3240005U |
An object of the present invention is to provide a polishing jig having a simplified structure and convenient attachment and detachment of a product. A jig body (1) is provided with a plurality of elastic clamping portions (2). A hole 23...
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JP2022172423A |
To prevent damage resulting from a grooving process, in particular, resulting from a short distance from a groove which is liable to be caused on the rear surface of a negative lens.A disk-shaped rotary processing tool for a spectacle le...
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JP2022547970A |
The present invention is a machine tool 1 for machining gears, comprising a work spindle 16 for rotating a work 18 around a work axis C1, and a tool spindle 11 for rotating a tool 12 around a tool axis B. Regarding machine tools. An axia...
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JP2022161165A |
To reduce grindstone replacing work and eliminate necessity of stockpiling a plurality of types of grindstones when bent plate-like workpiece is ground by reducing force for separating the bent plate like workpiece from a holding surface...
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JP7155582B2 |
The present invention relates to a manufacturing method of a processed member including removing a first uplift portion from a plate member containing the first uplift portion and a support portion connecting to the first uplift portion,...
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JP7150392B2 |
An object of the invention is to provide a nozzle in which the width of a slit is hardly widened due to the pressure of a fluid applied to a pipe material during use. To achieve the object, provided is a method of manufacturing a slit no...
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JP2022148341A |
To provide a rack bar polishing method for manufacturing a rack bar that can reduce friction resistance with a bearing member in a steering device and is easy to engage with a tooth part of a pinion in the steering device.In a rack bar p...
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JP7149178B2 |
To automatize grinding while maintaining high machining accuracy without need of work-reinforcing material.A grinding method is such one as to relatively move a work table supporting a workpiece and a grinding wheel to grind the workpiec...
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JP2022145055A |
To provide processing method for a metal tube by which a metal tube can be stably fixed when a groove is formed in the metal tube, thus improving productivity.A processing method for a metal tube includes: a first half-cut groove formati...
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JP7123915B2 |
A process for automated sanding of a vehicle component surface is provided and includes providing a sanding mechanism having a sanding head engaged with a housing, a rotary motor contained within the housing, the rotary motor having a dr...
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JP2022116208A |
To provide a method for automated sanding of a vehicle component surface.A method for automated sanding of a vehicle component surface includes the steps of: providing a sanding mechanism having a sanding head 12 engaged with a housing 1...
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JP2022110511A |
To provide a wafer division method capable of suppressing chipping on front and back surfaces.A wafer division method includes a holding step 1001 of holding a tape side of a wafer to a holding table, a first cutting step 1002 of cutting...
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