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WO/1987/002281A1 |
A device for the machining of the shell surfaces of the drying cylinders of a paper machine and particularly for the grinding thereof, which device comprises a carriage (1) which is displaceable in the direction of the length of the dryi...
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WO/1986/001447A1 |
A belt-grinding machine with a grinding belt (18) driven by a driving wheel (12) and guided over at least one deflection roller (14, 16) and with a rotating contact element (20) acting, with its peripheral surface, as a support for the r...
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WO1982000111A1 |
Self-centering feed apparatus (23) for a dual head abrasive grinding machine (11). The grinding heads (17, 18) are mounted in opposed vertical relation, and workpieces are fed therebetween along a horizontal center line or plane. The sel...
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WO/1981/003302A1 |
Abrasive grinding machine particularly suited for the removal of slag surrounding the edges of metal workpieces torch-cut from flat stock. The grinding machine includes a longitudinal conveyor (11) that is tilted about a longitudinal axi...
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WO/1981/003301A1 |
A surface grinding method and apparatus in a first embodiment of which a workpiece supported on a surface (56) is rotated about a vertical axis while being translated along ways (46, 47) past a cutting head (22) comprising an abrasive be...
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WO/1981/002967A1 |
An improved mowing machine of the type which includes a bed knife (101), a cylindrical rotary knife (110-128) which, in turn, comprises a plurality of generally elliptical discs (114-122) mounted parallel to each other on a shaft (110), ...
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WO/1981/002863A1 |
A continuous abrading belt means (150- 194) and method for manufacturing an improved mowing machine of the type which includes a bed knife (101), a cylindrical rotary knife (110-136) which, in turn, comprises a plurality of generally ell...
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WO/1981/002403A1 |
Improved apparatus and method for finishing the tips of turbine blades and the like. The invention is especially useful on worn turbine blades which have been repaired by adding weld material. An abrasive (42) first removes excess weld m...
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JP7419467B2 |
To eliminate wafer damage after performing wafer shape processing and damage of a wafer end face in a step of pressing a polishing tape against an edge portion of the wafer end face.In a wafer W thinned to a desired thickness by back gri...
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JP7407908B2 |
This cylinder device of the present aspect includes: a cylinder having a bottomed tubular shape; a seal member provided at an opening of the cylinder; and a piston rod that is provided to protrude from the opening of the cylinder and sli...
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JP7406943B2 |
The present invention relates to a polishing device and a polishing method for polishing the back side of a substrate such as a wafer. The present invention further relates to a substrate processing device provided with the polishing dev...
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JP2023178927A |
To suppress cracking and chipping in a workpiece and accomplish polishing of high quality.A polishing tape is arranged so that tension is applied thereto, between a polishing tape supply pulley and a polishing tape winding pulley. Then, ...
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JP2023174706A |
To provide a cylinder device which is excellent in wear resistance, has minimal secular changes in slide characteristics, and facilitates more smooth transition from a dry to a stationary state, and a manufacturing method of a piston rod...
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JP7381633B2 |
To enable polishing an outer circumferential surface of a rotor having high concentricity with the outer circumferential surface of the rotor and the outer circumferential surface of the shaft, enable suppressing vibration of the rotor w...
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JP7373861B2 |
Cleaning water CW is supplied to the outer surface of a draining roll 10 from a pipe 70 arranged above the draining roll 10 that is in pressure contact with a contact roll 8 via a polishing belt PB. Accordingly, the cleaning water CW adh...
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JP2023141507A |
To provide a polishing method in which, by polishing a peripheral edge of a substrate by using a plurality of polishing heads, warpage of the substrate can be suppressed while the overall polishing processing time is reduced.In a polishi...
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JP7355670B2 |
The present invention relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing a substrate with such a polishing head. A...
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JP2023137069A |
To suppress causing harm on a pattern formation surface, when polishing the circumference of a polishing object.A polishing device for polishing the circumference of a polishing object includes a stage having a placement surface for the ...
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JP2023133958A |
To provide a substrate having high accuracy by efficient processing by a substrate polishing device.A substrate polishing device for polishing a processed surface of a substrate includes: a grinding module where a first grinding member a...
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JP7351871B2 |
To provide a device that can move a polishing table and a work-piece relatively, with a central pressing part pressing a polishing surface against a rotation center part of a surface to be polished.A polishing device comprises a work-pie...
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JP7350544B2 |
To provide a polishing apparatus and a polishing method that can remove foreign matters adhering to a substrate during polishing of a peripheral edge portion of the substrate and prevent reverse contamination of the substrate during poli...
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JP7350675B2 |
To provide a groove polishing apparatus capable of obtaining good flatness on both surfaces in an axial direction of a cylindrical workpiece.A groove polishing apparatus comprises a workpiece holding unit for holding a workpiece, a polis...
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JP2023130650A |
To provide a substrate polishing device which can polish a whole surface to be polished of a substrate at uniformed polishing rate.A method for polishing a substrate includes rotating about the axis while moving the substrate W and a pol...
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JP2023127050A |
To provide a polishing head which enables a polishing tape to be pressed uniformly against a substrate, such as a wafer, with a pressing member.A polishing head 10 for polishing a substrate W includes: a pressing member 12 which presses ...
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JP2023127044A |
To provide a polishing head which enables a polishing tape to be pressed against a substrate, such as a wafer, with a uniform force.A polishing head 10 includes: a pressing member 12 which presses a polishing tape 2 against a substrate W...
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JP7341101B2 |
The present invention relates to a grinding mechanism for making flatness constant in rough grinding and finish grinding on a grinding object. According to the present invention, the grinding mechanism comprises: a plurality of tables (2...
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JP2023124321A |
To provide a tire polishing device that can achieve a target polishing level with high accuracy.A tire polishing device 10 as one example of embodiments comprises a driving unit 15 that rotates a tire 1, and a polishing unit 20 that poli...
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JP2023124308A |
To provide a tire polishing device than can measure polishing amounts of a tire accurately.A tire polishing device 10 as one example of embodiments comprises a driving device 15 that rotates a tire 1, a polishing device 20 that polishes ...
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JP2023124820A |
To provide a substrate polishing apparatus that can reduce overall processing time when performing multiple types of polishing.A substrate polishing apparatus comprises a first polishing module, a second polishing module, and a third pol...
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JP7338443B2 |
Provided is a magnetic paste including: magnetic powder (A); an epoxy resin (B); a reactive diluent (C); and a curing agent (D), in which the reactive diluent (C) contains a tri- or higher functional reactive diluent.
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JP2023537084A |
A polishing system is presented. The system includes a first vibrating structure with a first plurality of protrusions. The system also includes a second vibrating structure with a second plurality of protrusions. The system also include...
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JP3243412U |
A polishing device for brushes is provided, which improves work efficiency, reduces labor intensity, has a simple device structure, and is convenient to operate. A brush polishing device includes a bottom plate (1), the bottom plate is f...
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JP2023115968A |
To provide a polishing head capable of controlling a substrate polishing rate by preventing an edge of a polishing tape from unintentionally coming into contact with a substrate such as a wafer.A polishing head 10 comprises a pressing me...
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JP2023107998A |
To polish a convex spherical surface of an end of a rod-like member by composite operation of rotation around a central axis of the rod-like member, continuous or intermittent transfer of a polishing tape, and pressure-contact of the pol...
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JP7319322B2 |
To provide a method of polishing rotary shaft of rotor capable of polishing an immersed outer circumferential surface by means of an approximately triangular immersed polishing part formed on an intermediate detour portion of a polishing...
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JP2023101164A |
To provide a film lap processing device which enables improvement of surface roughness of a processing surface located at the back side of a workpiece.A film lap processing device 100 polishes a processing surface 104 with a tape-like po...
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JP2023097533A |
To provide a polishing device which, even when using a substrate holding device causing the substrate to rotate about its axial center, can effectively discharge cleaning fluid supplied to the surface of the substrate, from the substrate...
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JP2023089533A |
To provide a substrate processing device that can prevent a substrate from warping and further prevent the substrate from being contaminated due to removed chips, when making a processing head press an outer periphery part of the substra...
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JP7299203B2 |
To polish a convex spherical surface of an end of a rod-like member and improve the polishing accuracy and surface roughness of the convex spherical surface, by rotation around the central axis of the rod-like member, continuous or inter...
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JP2023087740A |
To provide a substrate polishing method which can exactly predict an amount of a polishing tape used in actually polishing.In a substrate polishing method, an actual polishing condition of a substrate which was polished in the past and a...
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JP7296864B2 |
To provide a polishing device capable of making a polishing rate of the entire notch portion uniform.A polishing device 1 is equipped with a holding stage 14 that has a stage surface 14a holding a substrate W, a swing mechanism 20 that s...
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JP2023081458A |
To provide a film lapping processing device and a film lapping processing method that are capable of polishing a screw groove in a work of a screw shape with high accuracy.A film lapping processing device 100 is a film lapping processing...
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JP7284852B2 |
To enable continuous or intermittent transfer of a polishing tape through rotary-control of a single winding motor, simplification and weight reduction of the entire structure of a tape transfer mechanism and reduction of device cost, en...
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JP2023074598A |
To provide a substrate treatment method which enables efficient processing without having to adjust CMP processing conditions according to a shape of a bevel part of each substrate, in applying CMP processing to a plane part of a substra...
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JP2023073493A |
To make a polishing head reciprocate in an X-axis direction and a Y-axis direction by an X-Y movement guide mechanism and an eccentric wheel mechanism, polish a polished surface of a plate-like member through cooperation of transfer of a...
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JP2023070852A |
To perform load adjustment of a polishing device with good efficiency.A load adjustment system comprises a bevel polishing device including a polishing head for polishing a bevel part of a base plate, and a control device. From a load me...
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JP2023064467A |
To provide a substrate polishing device which prevents a polishing tape from being displaced relative to a pressing member to polish an edge part of a substrate accurately.A substrate polishing device includes: a substrate holding part 1...
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JP2023063830A |
To provide a polishing device which can prevent insufficient polishing and excessive polishing.A polishing device includes a holding stage 4, a polishing head 14, and a control device 1. The control device 1 includes a determination part...
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JP2023062822A |
To provide a manufacturing method of a slide member which enables improvement of retention of a lubrication oil between slide members while improving operability and can keep smooth sliding of the slide member, and to provide a manufactu...
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JP2023061469A |
To provide a substrate treatment apparatus that can treat a substrate, while reducing deflection of the substrate caused by loads of treatment applied to the substrate such as a wafer.A substrate treatment apparatus comprises: a pluralit...
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