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JP2015225902A |
To provide a sapphire substrate which inhibits cracks from being caused by temperature gradient in the sapphire substrate.A sapphire substrate includes: a main surface; a rear surface facing the main surface; and an end surface. Chamfere...
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JP5827976B2 |
A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the ...
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JP5826898B2 |
The invention discloses an abrasive belt polishing finisher in the field of mechanical technology, which addresses inconvenient operation of the existing polishing finishers. The abrasive belt polishing finisher includes a motor and a co...
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JP2015199148A |
To provide a glass plate polishing device and a glass plate polishing method capable of polishing of the whole edge part of a glass plate in a short time.An insertion recess 15a where an end edge part 10 of a glass plate 10 together with...
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JP5794210B2 |
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JP5788484B2 |
A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate ...
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JP5758680B2 |
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JP5756365B2 |
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JP5756378B2 |
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JP2015107547A |
To provide a method for shortening the rotor blade of a turbo machine by removing material at the leading end of a blade, which is more excellent in cost-effectiveness than grinding or milling work by a direct acting type grinding disc, ...
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JP2015100861A |
To provide a diamond surface polishing method that can be adapted easily for the polishing of an uneven three-dimensional surface with a long lifetime of a polishing member and an ease in control and enables simple means to effectively r...
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JP5717145B2 |
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JP5717142B2 |
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JP5700264B2 |
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JP5695890B2 |
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JP5683921B2 |
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JP5678382B2 |
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JP5680636B2 |
A method for manufacturing a part by forging, including producing a semifinished part by precision forging and polishing the part by an abrasive strip, compliant geometric characteristics of the part to be obtained being predetermined in...
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JP5663295B2 |
A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to ...
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JP5650357B2 |
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JP5649417B2 |
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JP2015000451A |
To provide an apparatus for processing a substrate surface that can improve processing quality.The apparatus for processing a substrate surface includes: a supply reel 13 around which tape 12 is wound, and a take-up reel 14 for taking up...
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JP2014233804A |
To improve an availability and a productivity of the apparatus by enabling a tape replacement where a used tape is replaced by a new tape to be performed in a short time.This invention comprises a tape cassette 10 that keeps the cassette...
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JP2014223685A |
To complete polishing in a short time even if a measurement error due to inclination of a substrate occurs, and to precisely correct the error.A Z-axial table 13 can be moved vertically by a servomotor 14 and is brought under the full cl...
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JP2014205233A |
To polish with high accuracy and good efficiency in a processing method of components for polishing a polishing object component by a polishing material.In a processing method, polishing is performed by relatively moving a polishing shee...
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JP5615079B2 |
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JP5600266B2 |
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JP5593265B2 |
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JP5586854B2 |
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JP5585833B2 |
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JP5582297B2 |
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JP5569149B2 |
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JP2014140939A |
To provide a polishing device and a polishing method capable of accurately polishing side edges of a workpiece by a polishing unit since the workpiece can be transported without damaging front and rear sides of the workpiece and it is po...
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JP2014143247A |
To provide a polishing device capable of efficiently polishing a peripheral edge part and a rear face outer peripheral part of a semiconductor wafer.A polishing device comprises: a first polishing mechanism for polishing a rear face oute...
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JP5567280B2 |
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JP5558706B2 |
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JP5555865B2 |
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JP5552497B2 |
A polishing apparatus is provided for polishing an optical fiber connector. The optical fiber connector includes a connector housing and a ferrule. The polishing apparatus includes a mount to receive and hold the optical connector and a ...
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JP5550971B2 |
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JP2014120583A |
To provide a method of manufacturing a semiconductor device that prevents contamination due to an adhesive to the semiconductor device.A method of manufacturing a semiconductor device includes the steps of; laminating a primary surface o...
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JP5530556B2 |
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JP5533299B2 |
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JP5533376B2 |
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JP5522318B2 |
This Al alloy-plated steel material has a hairline appearance in which a hairline is formed on the surface of the plating layer composed of Si with the remainder being Al and impurities, wherein the deposition amount of the plating layer...
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JP5525590B2 |
A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer (W). The polishing apparatus includes a holding section (20) configured to hold the workpi...
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JP5521473B2 |
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JP5519943B2 |
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JP5519256B2 |
A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate ...
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JP5510151B2 |
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JP5508979B2 |
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