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WO/2005/018876A1 |
The invention relates to a control unit (23) for a grinding device, which winds and unwinds the grinding means carrier (16) by means of a contact apparatus (12). Said control unit (23) continuously detects the position of one or more of ...
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WO/2005/009682A1 |
A rotating belt (10) is used to finish the edges (23) of glass sheets (11), such as, the thin sheets (e.g., 0.7 mm) used as substrates for liquid crystal displays (LCDs). The edge (23) of the sheet (11) engages the working zone (15) of t...
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WO/2005/000523A2 |
A non-glazing dressing wheel (10) suitable for dressing a grinding wheel surface to be used for maintaining a certain tolerance to assure reliability and quality control of ground parts during the grinding operation. The dressing wheel i...
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WO/2004/103639A1 |
A sanding method carried out by means of a sanding machine comprising a conveyor and a sanding unit provided with an abrasive tape and having a plurality of pressing units positioned side by side and independent of one another that rest ...
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WO/2004/100133A1 |
A system and method are disclosed for edge blending hard drive head sliders by oscillating abrasive lapping tape across the edges of multiple sliders simultaneously.
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WO/2004/091855A2 |
A system for replacement of abrasive (152) in machinery which uses the abrasive to finish the surfaces of workpieces that pass through the machinery on a belt, such as so-called widebelt sanders. One preferred embodiment of the system em...
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WO/2004/042529A2 |
A system and method are described for processing a slider (e.g., one to be used in a disk drive apparatus). Corners of the sliders are abraded while still a part of a row of sliders in a part-off operation. By abrading the corners of the...
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WO/2004/039536A1 |
A device for machining a strip-shaped or plate-shaped metal workpiece, especially for removing the oxide layer of the cut surfaces and/or edges of the workpiece, comprising at least one rotating conveyor device provided with at least one...
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WO/2004/030865A1 |
A linear chemical mechanical planarization (CMP) system includes a belt pad (102), a slurry bar (120) having a plurality of nozzles, and a heating module (130) for heating slurry. The heating module (130) has a plurality of heating eleme...
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WO/2004/025717A1 |
A device and a method for polishing the edges of a semiconductor wafer capable of continuously removing sagging with a same polishing tape irrespective of the type of a material forming the sagging formed at the edges of the semiconducto...
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WO/2004/024391A1 |
A polishing pad (for example, polishing pad (305)) for use in planarization of a semiconductor wafer (for example, semiconductor wafer (420)), the polishing pad (305) featuring a plurality of different polishing surfaces, depending upon ...
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WO/2004/009290A1 |
The invention relates to devices comprising a combination of strip sanding units, arranged at an angle to the direction of progress, with drives or devices for low sanding strip speeds and/or with standard electronic segment sanding bloc...
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WO/2004/002676A1 |
A carrier head that includes a metal plate (402) having an opening (406) formed in a central location. The metal plate has a wafer side, which faces the backside of a wafer (502) during a CMP operation, and a non-wafer side. Positioned a...
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WO/2003/099461A1 |
Apparatus (10) and method for painting objects (11) equipped with a painting head (35) to paint the objects (11), and a movement member (12) to move the objects (11) through the painting head (35). The apparatus (10) comprises working me...
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WO/2003/099395A1 |
The invention provides for a powered hand held apparatus for sharpening ice skate blades having an elongated frame with a drive pulley located at one end, and a driven pulley located at the other end. An abrasive grinding belt loops over...
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WO2001074535A9 |
A belt (402) for polishing a workpiece such as a semiconductor wafer in a linear chemical mechanical polishing system includes a fixed abrasive material (401) attached to a polymeric layer (405) forming an endless loop. The belt is made ...
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WO/2003/085595A1 |
The invention provides an abrasive article (22, 122), and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface (224); and a performance index associated with the abrasive article, the...
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WO/2003/082521A1 |
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt (102), a carrier (108) capable of applying a substrate (104) over a preparation location over the linear polishin...
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WO/2003/079428A1 |
A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer such as copper using a polishing solution on a first portion of polishing pad and polishing another layer as a barrier lay...
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WO/2003/074228A1 |
An apparatus for polishing a workpiece includes a workpiece holder (104) configured to hold the workpiece, a polishing member (102) configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face wit...
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WO/2003/070426A1 |
The invention relates to a device and a method for width-sanding sheet-type floor coverings and rubber printing bands that are uncoiled from cylinders and recoiled onto cylinders upon sanding. The material is repeatedly guided across a d...
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WO/2003/067299A1 |
To provide a process for finish−abrading an optical−fiber−connector end−surface without generating abrasion scratch on an abraded surface of optical fiber, nor generating an adherent substance. A process for finish−abrading an ...
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WO/2003/059571A1 |
A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wher...
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WO/2003/058691A1 |
Methods and apparatus for controlling the temperature of a process surface and for conditioning of a process surface are provided. In one example, a temperature controller is described within a CMP system (140). The CMP system has a firs...
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WO/2003/057405A1 |
In a linear chemical mechanical planarization (CMP) systems (114), a surface of each roller (160a), (160b) of a pair of rollers is disclosed which includes a first set of grooves (150a) covering a first portion of the surface of the roll...
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WO/2003/053633A1 |
An air platen assembly is described and includes a platen(140) that has a plurality of concentric rings(164). Each of the rings has a plurality of openings(144) in order to provide a cushion of air to a CMP belt(102). At least one of the...
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WO/2003/041126A2 |
The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution...
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WO/2003/037566A1 |
A method and apparatus for pre-conditioning a polishing pad (12) for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method incl...
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WO/2003/028079A1 |
A semiconductor wafer end face polishing machine capable of polishing the end face of a semiconductor wafer easily in a short time and also changing a polishing tool in a short time, comprising a polishing head having a drive roller (33)...
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WO/2003/022522A1 |
A polishing device for polishing the flat surface part of a polished material (W) by a polishing tape (T), comprising a polishing device body having a tubular rotary drum (3) having a precisely finished outer peripheral surface, a tape r...
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WO/2003/018255A1 |
An apparatus (10) adapted for edge grinding of plates (1), preferably for preparatory machining before a welding operation, is disclosed. The apparatus (10) comprises a frame construction (2) having at least one grinding set (11, 12) and...
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WO/2003/016070A2 |
Generally, a method and apparatus for supporting a web of polishing material (102). In one embodiment, the apparatus includes a platen (230) and a blocker valve (314). The platen includes a support surface adapted to support the polishin...
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WO/2003/013788A1 |
An apparatus for improving performance of a wafer polishing apparatus (10) is described. The apparatus includes a platen in a support assembly (28) having a plurality of fluid channels (34) and at least one region of altered topography (...
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WO/2003/002301A1 |
Chemical mechanical polishing systems and methods are disclosed. The system includes a polishing pad (304) that is configured to move from a first point to a second point. A carrier (308) is also included and is configured to hold a subs...
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WO/2002/102919A1 |
A novel polishing slurry for use in texturing the surface of a glass substrate, which comprises agglomerated polycrystalline diamond particles having an agglomerated particle diameter of 0.5 μm or less comprised of polycrystalline diamo...
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WO2001074537A9 |
Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) ...
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WO/2002/100594A1 |
A chemical mechanical polishing apparatus and method uses a portion of a polishing pad (130) that is disposed under tension between a supply spool (160) and a receive spool (162) such that it will not degrade, a single drive system that ...
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WO/2002/100592A1 |
A machining apparatus (10) comprises a material removing tool (12) movably mounted for removing material from a workpiece (14); means for illuminating (42, 54) a sample area upon a tool surface (34) with excitation radiation; means for r...
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WO/2002/100595A1 |
A polishing sheet (10) not deforming with elapse of time in use and capable of uniformly flattening a polished surface at a high polishing rate and a method of manufacturing the sheet&semi the polishing sheet (10), comprising a fabric sh...
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WO/2002/090048A2 |
The invention concerns a device comprising a sheet (10) having a rough surface (10A), means (14, 16) for maintaining said sheet opposite the surface to be ground (12A) of the workpiece (12) and spaced apart from said surface. At least a ...
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WO/2002/083362A1 |
The invention relates to a method for improving wear and tear on support bodies (54) for plates or grinding belts in large-scale grinders (1). The support body (54) has a base body (18), onto which an abrasion-resistant primary layer of ...
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WO/2002/078901A1 |
An adjustable platen is provided. The adjustable platen (122) includes a platen body having a top region and a bottom region. The platen body is oriented under a linear polishing pad (18) of a CMP system (100). An air bearing is integrat...
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WO/2002/078904A1 |
An invention is provided for a platen (110) for use in a CMP system. The platen (110) is arranged below a linear polishing pad (102) and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen (...
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WO/2002/078905A1 |
An invention is disclosed for end point triggering in a chemical mechanical polishing process. A sensor array (322) is positioned beneath a polishing belt (304) having an end point detection section, wherein the end point detection secti...
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WO/2002/070196A1 |
A method and an apparatus for machining the joint face of a work in which a joint face exhibiting high airtightness is provided by eliminating leakage due to streaks caused by abrasive grains. At the time of machining the joint face (15)...
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WO/2002/051585A2 |
The invention relates to a device (1) for grinding an external sleeve surface (3) on a rotationally symmetrical body (2), in particular for grinding a roller on a paper machine, comprising a support frame (11), displaceable along the ext...
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WO/2002/049806A1 |
An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposied above a wafer, where the wafer (402) head includes a first active retaining ring...
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WO/2002/049805A1 |
An invention is disclosed for impoved performance in a CMP process using a pressurized membrane (312) and piezoelectric elements (702) as replacements for a platen (308) air bearing. In one embodiment, a platen form impoving performance ...
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WO/2002/049802A1 |
A polishing device (100), comprising a drum (120), a chuck table (131) rotatingly holding a semiconductor wafer (100), and a pressing cylinder (170) moving the chuck table (131) so that the edge part (11) of the semiconductor wafer (10) ...
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WO/2002/043925A1 |
A process for planarizing, polishing, or providing other modification of a wafer surface (22) or other workpiece. The process includes using an abrasive article (140) having a textured abrasive coating affixed (146) to a backing. The abr...
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