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Patent Searching and Data


Matches 1 - 50 out of 4,028

Document Document Title
WO/2024/025429A1
The present invention is an accessory for installation on grinding machines. The accessory is the support body, or skate holder in industrial language, for receiving the skate, over which the grinding belt will slide. It is comprised of ...  
WO/2024/025816A1
Low-friction sanding assemblies and machines for sanding and/or grinding one or more portions of a part are provided. The low-friction sanding assemblies comprise a sanding pad, an abrasive device, and a constant-force assembly that main...  
WO/2023/181756A1
The present invention pertains to a polishing method and a polishing device for polishing a peripheral portion of a substrate such as a wafer. The polishing method includes: holding a substrate (W) and rotating the substrate (W) by means...  
WO/2023/176611A1
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the...  
WO/2023/171312A1
The present invention relates to a method for polishing a substrate such as a wafer. This method for polishing a substrate involves rotating a substrate (W) about the axis while moving the substrate(W) and a polishing head (10C) in a rel...  
WO/2023/166986A1
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. A poli...  
WO/2023/167001A1
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The po...  
WO/2023/162714A1
The present invention pertains to a substrate polishing device for polishing a substrate such as a wafer, and particularly to a substrate polishing device for polishing a notch section of the substrate, a bevel section of the substrate, ...  
WO/2023/153243A1
The present invention pertains to a polishing head for pressing a polishing tape against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate using such a polishing head. The po...  
WO/2023/134788A2
The present invention relates to the field of polishing apparatuses, and relates in particular to a surface smart polishing apparatus. A clamping apparatus clamps a plurality of workpieces to be polished, and drives the workpieces to rot...  
WO/2023/112548A1
The present invention relates to a method for polishing a substrate by pressing an abrasive tape against a substrate such as a wafer. This method for polishing a substrate: stores in a database (21a) an actual polishing condition for a s...  
WO/2023/112680A1
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the s...  
WO/2023/106905A1
The present invention relates to machining devices, especially to the devices for grinding, polishing and cleaning tube like members. A machining device (1) comprises a support (2) with a motor; a split support disc (10) fixed to the sup...  
WO/2023/090052A1
The present invention pertains to a substrate processing device for processing substrates such as a wafer, and particularly to a substrate processing method and a substrate processing device which polish a bevel section of a substrate an...  
WO/2023/085207A1
This load adjustment system comprises: a bevel polishing device having a polishing head that polishes a bevel portion of a substrate; and a control device. The control device acquires, from a load measuring device that measures a pressin...  
WO/2023/070710A1
Disclosed in the present disclosure is a polishing device for bearing production, comprising a bottom plate and a double shaft motor. An inner polishing assembly is mounted at one end of an output shaft of the double shaft motor, and the...  
WO/2023/074231A1
The present invention relates to a polishing device and a polishing method. This polishing device comprises a holding stage (4), a polishing head (14), and a control device (1). The control device (1) comprises a determination unit (1d) ...  
WO/2023/068164A1
Problem: To provide a method for manufacturing a sliding member, a method for manufacturing a damper, a sliding member, a damper, and a method for adjusting ride comfort that improve retention of lubricant oil between sliding members whi...  
WO/2023/068124A1
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holdi...  
WO/2023/023784A1
An axle buffer for buffing vehicle axles, the axle buffer comprising a buffer, a buffer rotating means and a buffer locating means, wherein buffer locating means comprises means to radially move the buffer relative to the axle surface an...  
WO/2023/280363A1
For polishing a workpiece (7), such as a pipe elbow, in a polishing machine (100), the workpiece (7) is automatically swivelled through a central polishing area (6) of a rota-tional polishing station (1) after adjustment of the radius of...  
WO/2022/237701A1
A welding seam polishing apparatus, used for performing continuous welding seam polishing on a continuous welding material (w), and comprising: a polishing belt (1), a power roller (2), a tensioning roller (3), and pressing rollers (4). ...  
WO/2022/211085A1
A belt processing device (10) moves a processing belt (34) relative to a workpiece (W) to process the workpiece. The belt processing device comprises a first roller (40) that is a processing roller, a second roller (32) that is a driven ...  
WO/2022/210216A1
Provided is an adhesive tape processing method capable of easily separating a base material and an adhesive constituting an adhesive tape, at low cost. Also provided is an adhesive tape processing device for use with such an adhesive tap...  
WO/2022/201213A1
Abrasive module (10) made of composite material comprising a base membrane (11) from which a plurality of abrasive heads (12) project.  
WO/2022/175630A1
The invention relates to a correction device (1) for machining a surface to be corrected (2A) of a part (2) rotating about a main central axis (X2) mounted to rotate on a frame (3), the device comprising a base (5) to be fixed on the fra...  
WO/2022/175322A1
The invention relates to a grinding device having at least one endless abrasive belt (210, 310), which is guided in at least one circulating direction (P3) via deflecting elements (212, 214, 216, 312, 314, 316), and a pressing assembly (...  
WO/2022/172683A1
The present invention relates to a polishing device and a polishing method for polishing a planar section of a substrate such as a wafer. This polishing device (100) comprises a substrate-holding part that holds a substrate (W) and that ...  
WO/2022/156862A1
The invention relates to a pressing element (1) for a grinding belt (30), in particular for wide-belt grinding machines, consisting at least of a substrate (10) with padding (3) and an anti-friction layer (4). In order to significantly i...  
WO/2022/143526A1
A linear polishing machine, comprising: a polishing disc (200) for fixing a member (100) to be polished, a power mechanism located above the polishing disc (200), and a grinding pad (330) in transmission connection with the power mechani...  
WO/2022/129233A2
The present invention relates to a scarfing machine, including a base a pair of platens adjustably positioned on the base. The pair of platens are configured as an upper platen and a lower platen such that the upper platen is fixed to th...  
WO/2022/077788A1
A belt and disc sander. The belt and disc sander is provided with a base assembly (1), a motor assembly (2), an abrasive disc device (3), and an abrasive belt support assembly (4); the motor assembly (2) is provided with a motor (21); th...  
WO/2022/075251A1
The present invention provides a polishing system that is able to polish just a portion of a region forming one flat surface of the surface of an object to be polished, and that can polish a small quantity of objects to be polished. A po...  
WO/2022/069534A1
The invention relates to a device (100) and a method for coating a surface, in particular a surface of a plate-shaped workpiece (W). The device and the method can be used, for example, in the field of the furniture and component industry.  
WO/2022/052155A1
Disclosed is a grinding machine with an abrasive belt, wherein a mounting beam is horizontally and fixedly connected to a frame, the mounting beam is provided with a plurality of parallel threaded holes, a mounting plate and a limiting p...  
WO/2022/052173A1
An abrasive belt guiding adjustment structure in an abrasive belt grinder, comprisng a mounting beam (12), a mounting plate (31), rollers (32), and a limiting plate (41). The mounting beam (12) is provided with a plurality of parallel th...  
WO/2022/041719A1
An automatic elbow polishing device, comprising several elbow polishing apparatuses (1) provided side by side, wherein the numbers of meshes of polishing abrasive belts (20) of the elbow polishing apparatuses (1) from left to right incre...  
WO/2022/034026A1
A workpiece (10) passes through a belt grinder (100) for grinding and structuring a flat workpiece (10) in a predefined direction of passage (P1) past at least one machining region of a structuring device (200). The structuring device (2...  
WO/2022/008455A1
The grinding head serves for the machining of workpieces, in order to grind grinding paths in the same. It consists of a supporting part (1) and a top part (2) with guiding means (3) for guiding a grinding belt (4) upstream and downstrea...  
WO/2021/258132A1
An apparatus for installation to a base structure and for use in finishing a workpiece, the apparatus comprising a main body which includes a mounting section, and an idler wheel support having an idler wheel operatively mounted thereon,...  
WO/2021/251242A1
According to the present invention, it is possible to autonomously replace a polishing tape. The present invention comprises: a stage on which a workpiece is mounted; a polishing head unit provided above the stage in the plumb vertical...  
WO/2021/238164A1
A manual polishing device for a package design, comprising a grip (4). A cylindrical mounting chamber (10) is provided on the inner wall of one end of the grip (4). A horizontally arranged recess is provided in the middle of the grip (4)...  
WO/2021/217321A1
Disclosed is an automobile steering wheel machining device, belonging to the field of automobile component machining. The automobile steering wheel machining device comprises a support (1) and machining mechanisms (2). The front side and...  
WO/2021/209097A1
The invention relates to a grinding device for grinding cutting units, in particular grinding units from a sugar beet cutting machine, wherein the grinding device has a grinding belt with a grinding surface and a grinding hand-width, and...  
WO/2021/196642A1
An intelligent and efficient belt and disc sander for wood finish machining. The belt and disc sander consists of a belt sanding assembly and a disc sanding assembly that is used in cooperation with the belt sanding assembly. The belt an...  
WO/2021/193107A1
This cylinder device comprises a bottomed tubular cylinder, a seal member provided at an opening of the cylinder, and a piston rod that is provided so as to project from the opening of the cylinder and slides with respect to the seal mem...  
WO/2021/172859A1
The present invention relates to an apparatus for grinding a surface of a steel sheet, the apparatus comprising: a conveyor for transferring a steel sheet; and a grinding means, which is coupled above the conveyor such that the grinding ...  
WO/2021/157276A1
The present invention pertains to a polishing head for pressing a polishing tool against a substrate such as a wafer. The present invention also pertains to a polishing device for polishing a substrate with such a polishing head. A polis...  
WO/2021/137823A1
The present invention relates to a sliding gear unit (A) that allows for the rotation of the abrasive group that performs the deburring process of the metallic workpieces and that is able to rotate in a horizontal axis by providing the o...  
WO/2021/137117A1
The present invention relates to a machine for finishing a three-dimensional surface (8) of a workpiece (5), preferably of a turbine or compressor blade. The machine comprises a first device (10) for supporting the workpiece and a second...  

Matches 1 - 50 out of 4,028