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WO/2010/105839A1 |
The invention relates to a method for grinding a continuous casting product (1), in particular a slab, wherein the continuous casting product has in cross-section a rectangular contour with two opposing long sides (2, 3) and two opposing...
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WO/2010/054502A1 |
A method of removing backing adhesive from a carpet includes the following steps: 1) removing the substrate (22) from the classified carpet (24); 2) feeding the backing adhesive (23) face of the carpet to a grinder through an active feed...
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WO/2010/032308A1 |
When marking on a material to be worked, both an operation of grinding and cleaning and an operation of marking are carried out at a time. A marker for grinding and cleaning for forming marks on a ground and cleaned part while grinding a...
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WO/2010/010657A1 |
Disclosed is a method for resuming the operation of a wire saw characterized in that a work is cut while the axial displacement of a grooved roller and the temperature of the work during cutting are measured and recorded, the axial displ...
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WO/2010/010656A1 |
Provided are a work cutting method and a wire saw, wherein the work cutting method gives reciprocating motion in the axial direction to a wire wound on a plurality of grooved rollers, places a backing plate in contact with the work to be...
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WO/2010/006148A2 |
A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques ...
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WO/2010/001529A1 |
Provided is a method for cutting a work into the shape of a wafer by pressing a cylindrical work held by a work holder against a wire array formed of wires wound spirally between a plurality of wire guides and then running the wires whil...
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WO/2009/153084A1 |
The invention relates to a power tool, comprising a protective cover (1), and a tensioning belt (6) to be positioned about a tensioning neck (2) for attaching a protective cover (1) to the tensioning neck (2) of the power tool, said tens...
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WO/2009/153877A1 |
[PROBLEMS] In cutting an ingot by using a multi-wire saw, to improve material use efficiency by reducing variations in thickness among wafers to be obtained to thereby reduce material loss in cutting and improve working efficiency by sho...
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WO/2009/153887A1 |
[PROBLEMS] In cutting an ingot by using a multi-wire saw, to improve material use efficiency by reducing variations in thickness among wafers to be obtained to thereby reduce material loss in cutting and improve working efficiency by sho...
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WO/2009/148786A2 |
A pipe processing apparatus containing a gripping mechanism (2) with bracing rollers (4, 5, 6, 7), further a drive wheel (18) which is rotationally supported on the pipe processing apparatus and axially parallel to the bracing rollers (4...
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WO/2009/144346A1 |
The invention is of particular application in the preparation of the surfaces of two parts of a material composed of fibre and resin needing to be joined through adhesive bonding, establishing perfect mutual contact therebetween. Activat...
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WO/2009/125780A1 |
An electrodeposited wire tool (10) having a longitudinally extending core wire (4), a plated layer (3) on the outer peripheral surface (41) of the core wire (4), super-grinding particles (1) retained by the plated layer (3), and a coveri...
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WO/2009/107324A1 |
Chips produced from an object being cut are prevented from adhering to the pieces that are already cut. A suction jig (6) for applying suction to a resin-sealed body (1) to be cut includes, on an upper surface thereof, a plurality of gro...
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WO/2009/104222A1 |
Provided is a wire saw comprising a wire wound on a plurality of grooved rollers, for reciprocating in the axial direction, a nozzle for feeding a slurry, a patch, and a work feeding device for feeding a work being held, to the wire thro...
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WO/2009/101339A2 |
Abrasive grain powder, especially for machining silicon ingots, such that the D40‑D60 particle size fraction comprises more than 15% and less than 80%, by volume per cent, of grains having a circularity of less than 0.85.
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WO/2009/087723A1 |
Disclosed is an ingot cutting apparatus characterized by comprising at least an ingot supporting pad for supporting the cut ending portion of an ingot from below at the position of a clearance of a cutting table for cutting the ingot wit...
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WO/2009/081524A1 |
Disclosed are a band-saw cutting apparatus, in which an endless-belt blade constituted of a blade abrasive-grain portion and a blade base is tensed between pulleys and in which a pair of static pressure pads having coolant injection port...
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WO/2009/078130A1 |
A wire saw for cutting a work into a wafer shape by winding a wire around a plurality of grooved rollers and applying the work to the wire while supplying slurry to the grooved rollers and running the wire, characterized in that the wire...
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WO/2009/075062A1 |
A wire saw for cutting a work at a plurality of points arranged in the axial direction simultaneously by winding a cutting wire around a plurality of rollers to form a wire line, driving the cutting wire reciprocatingly in the axial dire...
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WO/2009/072176A1 |
In a multiwire saw, a wire string formed by winding a wire between a plurality of rollers having a plurality of wire grooves is traveled, a work is press-fitted to the wire while working fluid comprising grains is supplied to the wire st...
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WO/2009/066312A1 |
The present invention provides a polishing mill comprising a spindle having a scaife for polishing gemstones and a motor having a hollow shaft wherein said spindle passes through or in the said hollow shaft coaxially.
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WO/2009/060562A1 |
Provided is a wire saw apparatus comprising a wire made to run on a plurality of grooved rollers for running reciprocally in an axial direction, a nozzle for feeding slurry, and a work feeding mechanism for feeding a work to the wire whi...
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WO/2009/059846A1 |
The invention relates to a hand-held power tool, particularly and angle grinder (10), having a housing (12), having a flange neck (14), and having a protection device (16) that can be accommodated on the flange neck (14), which forms a r...
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WO/2009/041443A1 |
A water-soluble processing oil for free-abrasive-grain wire saws which, when used in cutting a high-hardness brittle material such as silicon, attains high accuracy of processing and high processing efficiency and causes no problems, e.g...
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WO/2009/041266A1 |
Provided is a solar cell wafer manufacturing method wherein groove processing is performed to a surface of a solar cell wafer by slicing a silicon ingot by reciprocating a wire, at the time of manufacturing the wafer by slicing the ingot...
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WO/2009/036944A1 |
The invention relates to a device for fine machining workpieces, preferably for honing and/or fineboring cylinder bores in crankcases of internal combustion engines, wherein inside a module (1) one or two horizontally displaceable machin...
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WO/2009/033485A2 |
Disclosed is a polishing device (1) comprising a tool holder (3) on which a polishing tool is disposed and which cooperates with a workpiece holder (5). The workpiece holder (5) and the tool holder (3) can be moved relative to one anothe...
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WO/2009/033315A1 |
An automatic adjusting device for brush washing for copper strip, which can efficiently enhance washing quality, is disclosed wherein an elastic member is mounted within a sliding cylinder, the elastic member within the sliding cylinder ...
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WO/2009/031515A1 |
The invention provides a water-soluble cutting fluid for loose abrasive type wire saw slicing machines which is free from the problem that during or after the slicing of an ingot into silicon wafers with a loose abrasive type wire saw sl...
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WO/2009/028365A1 |
Provided is a dicing apparatus (1) comprising a plurality of worktables (12 and 14), a plurality of alignment devices (5 and 5) and a plurality of working devices (10 and 10). The alignment devices (5 and 5) are made so movable by themse...
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WO/2009/028364A1 |
Provided is a dicing apparatus, which arranges an oil pan (20) just below X-tables (16 and 18) thereby to retain the capacity of the oil pan (20) sufficiently and to improve the drainage. In the dicing apparatus (1), guide rails (22 and ...
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WO/2009/028710A1 |
A water-soluble working oil for fixed-abrasive wire saws which imparts excellent cutting properties in the cutting of a hard work made of, e.g., glass, sapphire, ceramic, silicon, or neodymium with a fixed-abrasive wire saw. The oil can ...
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WO/2009/014511A1 |
A floor finishing machine includes a base frame, a movable frame movably mounted to the base frame, and a plurality of floor finishing units carried by the movable frame, and being pivotable about a generally longitudinal pivot axis and ...
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WO/2009/001453A1 |
Provided is a multi-wire saw that can prevent wires from being displaced in guide roller grooves due to the lifting of the wires when the cutting of an ingot is started. Wires (11) are wound around wire guide rollers (14a, 14b, 41), and ...
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WO/2008/151586A1 |
The invention relates to a method and a device for grinding cams of a camshaft (7) in a clamp with two grinding spindles (10, 11), wherein the cams or cam pairs are each arranged in a mirror image relative to the workpiece rotation axis ...
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WO/2008/149490A1 |
A method for cutting an ingot into a wafer by entraining a wire about a roller with a plurality of groove and, while supplying cutting slurry to the grooved roller, pressing the reciprocating wire against the ingot. A wire saw device cut...
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WO/2008/146891A1 |
A method of trimming a surface layer portion of hot slab, comprising the step of cutting a thickness region of 1 mm or more from the skin of a slab just after casting over an area or the whole area of a surface layer portion of any one o...
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WO/2008/131748A2 |
The invention relates to a portable grinder comprising a grinding head (5) that can be placed against a workpiece (7) in a grinding contact zone (26). According to the invention, a stop (18-21) is disposed at a distance from the grinding...
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WO/2008/108051A1 |
Provided is a cutting method for cutting an ingot into wafer shapes by wrapping a wire on a roller having grooves, and by pushing the wire being run onto the ingot, while feeding the grooved roller with cutting slurry. The cutting method...
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WO/2008/109530A1 |
Disclosed are a computer numerically controlled machine and methods for forming, grinding, or dressing cutting tools in a computer numerically controlled machine. In some embodiments, the computer numerically controlled machine is provid...
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WO/2008/106677A1 |
Disclosed are a machine with a grinding wheel (202) and a dressing surface (200B) and related method. The dressing surface is movable in at least two axes of translation relative to the grinding wheel. The rotational speed of the grindin...
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WO/2008/043910A1 |
The invention relates to a device (1) for machining an ophthalmic lens, comprising means (11, 12) for supporting and rotating the ophthalmic lens about an axis (A1) of immobilization of this lens, a machining module (35) which is orienta...
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WO/2008/035529A1 |
In a cutting method, a wire is wound and hooked on a roller having a plurality of grooves, the wire is permitted to run to press an ingot while the roller is being supplied with a cutting slurry, and the ingot is cut into wafers. In the ...
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WO/2008/035530A1 |
In a cutting method, a wire is wound and hooked on a roller having a plurality of grooves, the wire is permitted to run to press an ingot while the roller is being supplied with a cutting slurry, and the ingot is cut into wafers. A test ...
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WO/2008/035513A1 |
A method for cutting an ingot into wafers by winding a wire around a plurality of grooved rollers and pressing the traveling wire against the ingot while supplying cutting slurry to the grooved rollers. Only during a period after the cut...
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WO/2008/030147A1 |
A cutting trolley (2) includes a frame structure (12) and at least two rear wheels (30, 31) on a rear shaft (32) and at least one front wheel (20), for a cutter (31) of the type including a circular cutting blade (5) in a front end of th...
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WO/2008/015895A1 |
A fine wire (24) tensed and having fixed abrasive grains is run in one direction at a high speed. Moreover, a resin-sealed object (17) fixed on a left-hand stage (21) and a right-hand stage (22) and the fine wire (24) are moved relative ...
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WO/2008/010353A1 |
A wire washing apparatus for wire saw that in a wire saw, is capable of washing off any slurry having stuck to the wire during good-maintenance machining. The wire washing apparatus for wire saw comprises a washing tank equipped with a s...
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WO/2008/001816A1 |
A cutting method and cutting device using a wire saw, capable of cutting a workpiece having a complicated curve, where the cutting is precise and performed with a high aspect ratio irrespective of the material of the workpiece. In this c...
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