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Patent Searching and Data


Matches 1 - 50 out of 10,214

Document Document Title
WO/2018/234030A3
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2019/068040A1
An abrasive article comprising a substrate having an elongated body and abrasive particles attached to the elongated body, the content of the abrasive particles oscillates along the length of the body between a minimum and maximum value,...  
WO/2019/011363A3
The invention relates to a deburring tool (10) for deburring at least one through-hole (24) in a workpiece, wherein the surface (38) of the through-hole (24) to be deburred is located on the side away from the deburring tool (10), the to...  
WO/2019/037512A1
An automatic grinding system, comprising: a mechanical arm (10) comprising a wrist (14), the wrist (14) comprising a first end, a second end, and a third end; a clamp (11) provided on the first end and configured to clamp a workpiece (10...  
WO/2019/027000A1
A grinding tool mounted on a robot comprises a roller group, an endless grinding belt, and a drive roller. The roller group comprises a plurality of rollers. The endless grinding belt is disposed so as to double back at a portion of the ...  
WO/2019/026999A1
A grinding tool mounted on a robot comprises a roller group, an endless grinding belt, and a drive roller. The roller group comprises a plurality of rollers. The grinding belt is disposed so as to double back at a portion of the roller g...  
WO/2019/012419A1
Method of abrading the surface state of a test track with a bituminous surface for vehicles, comprising the following steps: - provision of a processing machine (1) comprising a rotary head (2) with at least one friction element (3) to m...  
WO/2019/003677A1
A grinding apparatus (100) of the present invention has: a susceptor (101) for a film-forming substrate arranged inside a film formation chamber (11); a grinding member (102) configured by a flat plate-shaped base (102A) and a protruding...  
WO/2018/235328A1
An automatic grinding apparatus for grinding an object using a grinder, in which the load current increases or decreases according to the magnitude of the amount of grinding per unit time, is provided with: an electric current-detecting ...  
WO/2018/234030A2
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2018/235430A1
The purpose of the invention is to effectively improve processing efficiency of a polishing process on a face to be polished and the finish quality of the polishing process. A polishing tool (4) scours each portion of a face to be polish...  
WO/2018/230297A1
Provided is a method for manufacturing a semiconductor device including a substrate (20) having a front surface (20a) and a rear surface (20b) and a film (30) attached to the rear surface (20b), the method comprising the steps for: attac...  
WO/2018/219587A1
The invention relates to a method for cleaning a receiving groove (4) formed on a rotor (2) of an axial flow machine, said receiving groove serving to receive a blade root of a rotor blade. In said method, an elongate base body (6) of a ...  
WO/2018/219166A1
An automatic rust removal device for the inside of an oil drill pipe. The device comprises a drill pipe (1); a drilling fluid channel (2) is formed in the drill pipe (1); a double shaft extension drive motor (3) is provided in the drilli...  
WO/2018/219423A1
The invention shows and describes a grinding method for machining the surface of workpieces (6) with a plurality of inner grinding spindles, comprising the following steps: a) providing a grinding machine (1, 1') with at least two grindi...  
WO/2018/210181A1
An intelligent grinding device for casting parts. A first linear module disposed in a Z direction is mounted on a base; a second linear module disposed in an X direction is mounted on a sliding table of the first linear module; an uprigh...  
WO/2018/205498A1
Disclosed is a chopping board grinding machine, comprising a chamfering mechanism (10), a coarse grinding mechanism (20), a finish grinding mechanism (30), a transport mechanism (40) and a rack (50), wherein the chamfering mechanism comp...  
WO/2018/203448A1
The present invention is a wire-saw-based workpiece cutting method in which a fixed abrasive particle wire, to the surface of which are bonded abrasive particles, is wrapped around a plurality of grooved rollers to form a wire array, and...  
WO/2018/203292A1
The present disclosure discloses a lug brushing machine for cleaning/brushing of lugs of tubular plates of lead acid storage batteries. The lug brushing machine incorporates feeder conveyor 210, a main conveyor 220 and a rotary table 230...  
WO/2018/200913A1
Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using two grinding wheels mounted on spindles so that the edge of the grinding wheels chamfer the edge of the glass sheet...  
WO/2018/192871A1
The invention relates to a method for removing a flaw on a treated, in particular finally painted surface by grinding, wherein, after the flaw has been detected, a flexible abrasive sheet is moved to the surface and is pressed against th...  
WO/2018/193040A1
The invention relates to a grinding machine, which is suitable for a robot-supported grinding process. According to one embodiment, the grinding machine has a housing, a motor arranged in the interior of the housing, a fan wheel arranged...  
WO/2018/192869A3
The invention relates to a dust cover (100) which comprises: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circu...  
WO/2018/192869A2
The invention relates to a dust cover (100) which comprises: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circu...  
WO/2018/192823A1
The invention relates to an angle grinder (200) having a gear neck (210) for connecting a dust hood (100, 100') provided with a flange (90), the angle grinder (200) having a sensor unit (20) by means of which the type of dust hood (100, ...  
WO/2018/187885A1
An easy-to-use mechanical part polishing device, comprising a bottom plate (1). Vertical plates (2) are fixedly connected to two sides of the upper surface of the bottom plate, and sliding rails (3) are fixedly connected to the opposite ...  
WO/2018/186087A1
The present invention is a workpiece cutting method that uses a wire saw in which a fixed abrasive-grain wire, which is sent out by one side of a set of wire reels and taken up by a wire reel on the other side and has abrasive grains fix...  
WO/2018/173693A1
The present invention provides an ingot cutting method using a wire saw, the method comprising forming a wire column from a wire wound spirally between a plurality of wire guides and travelling in an axial direction, cut-feeding the ingo...  
WO/2018/174405A1
The present invention relates to a torsional severe plastic deformation method for a metal bar, to which surface polishing is applied to improve the mechanical properties of the metal bar. Provided according to an embodiment of the prese...  
WO/2018/169008A1
The present invention relates to a brittle material processing liquid which contains water, (A) one or more substances selected from the group consisting of acetylene glycols having an HLB value of from 4 to 12 (inclusive) and alkylene o...  
WO/2018/163752A1
The present invention relates to a method for manufacturing a wafer by cutting a semiconductor single crystal ingot, the method being characterized in that: wafer-shaped workpieces are obtained by slicing the semiconductor single crystal...  
WO/2018/151168A1
The purpose of the invention is to allow shot to accurately hit an object to be machined and to apply highly precise machining even when the object to be machined is undergoing deformation. A part manufacturing system comprises: a peenin...  
WO/2018/146608A1
Operative unit (1) for a disc-shaped rotary tool, which comprises two or more machining bodies (2) of substantially discoid shape placed in succession and aligned with each other along the rotation axis (X) thereof. The operative unit (1...  
WO/2018/133984A1
The invention relates to a grinding robot for grinding an electrically conductive workpiece (6), comprising a grinding wheel (5), a unit for actuating the grinding wheel (5), and a controller, wherein the grinding wheel (5) has an undula...  
WO/2018/131187A1
The polishing of a three-dimensional curved surface of buildings, structures, and the like at a constant pressure has conventionally been done manually. Provided is a hand tool that, by being mounted on an articulated robot or the like, ...  
WO/2018/125908A1
A disclosed pipe scuffing device includes a frame and a shaft coupled to the frame and configured to rotate about a central axis. The pipe scuffing device also includes a drive motor configured to drive the rotation of the shaft. The dev...  
WO/2018/120865A1
A specialized A-grade door frame surface polisher, comprising a base (1). The base (1) is provided with a door frame positioning jig (2), a robot (3), and a control box (11). The robot (3) and the control box (11) are positioned next to ...  
WO/2018/114535A1
The invention relates to a transfer device (144) for a transport vessel, having a plurality of rotation/transport devices (144a, 144b, 144c,... 144i, 144j 144k, 1441, 144Za, 144Zb,...) arranged in a matrix-like manner, wherein each of th...  
WO/2018/114386A1
The invention relates to a production system (100) for spectacle lenses made from spectacle lens blanks, comprising a left-hand outer transport track (101), multiple left-hand processing devices (121, 123, 125, 127, 129, 131, 133, 135, 1...  
WO/2018/116288A1
A manual sander includes a handle and a fixed abrasion surface to which the handle is attached. At least one foldable abrasion surface is connected to the fixed abrasion surface by a hinge. The handle is manipulable to maintain the fixed...  
WO/2018/105758A1
The present invention relates to an automatic grinding machine and, more particularly, an automatic grinding machine in which grinding can be automatically performed by the rotation of a jig part that holds and fixes a workpiece, and a p...  
WO/2018/104098A1
The invention relates to a dust hood (100) for a grinder (200) having a gearbox neck (210) for fastening the dust hood (100) and having a hood body (10) for covering one side of a predominant part of the grinding wheel (220), wherein the...  
WO/2018/104018A1
A dust cover (100) having: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circular cutting disc (220) on both sid...  
WO/2018/104057A1
A dust cover (100) for a cutting grinder (200) which is provided with a transmission extension housing (210) for attaching the dust cover (100), having a cover body (10) for at least partially covering a circular cutting disc (220) on bo...  
WO/2018/104016A1
The invention relates to a dust hood (100) for a grinding machine (200) provided with a gear neck (210) for fastening the dust hood (100), comprising a hood body (10) for one-sidedly covering a major part of the grinding disk (220), wher...  
WO/2018/092520A1
This curved plate machining device comprises: a support unit that supports one main surface of a curved plate having a curved surface on both main surfaces thereof; a machining unit that machines the outer circumference of the curved pla...  
WO/2018/088009A1
Provided are an abrasive grain whereby the quality of a wafer sliced by a wire saw can be stabilized, a method for evaluating the abrasive grain, and a method for manufacturing a wafer comprising slicing a wafer using a slurry including ...  
WO/2018/089276A1
Reciprocating tool accessories are presented including: a damping handle assembly; and a surface contact assembly coupled with the damping handle assembly along a distal end and the reciprocating tool along a proximal end. In some embodi...  
WO/2018/083571A1
Equipment (300) for the surface sanding of plate-shaped bodies (101), in particular of tiles, said equipment (300) comprising support and feeding means (100) for supporting said plate-shaped bodies (101) and feeding said plate-shaped bod...  
WO/2018/082976A1
The invention relates to a honing machine (100) for carrying out honing operations on at least one borehole in a workpiece (W), in particular for honing cylindrical boreholes in a cylinder crankcase, comprising a machine base (110), a su...  

Matches 1 - 50 out of 10,214