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Patent Searching and Data


Matches 1 - 50 out of 10,327

Document Document Title
WO/2019/153771A1
Disclosed is a method for grinding an iron-chromium-aluminum ternary alloy ingot profile, the method comprising the following steps: (1) carrying out rough grinding on a surface; (2) carrying out rough grinding on a weld joint; (3) carry...  
WO/2019/154460A1
Rather than machine tools, nowadays robots are used to some extent for the machining of workpieces. The robot holds the tool and machines the workpiece directly. On account of the stiffness of the robot arm, this is currently possible on...  
WO/2019/155707A1
A dicing device 10 in which a work table 12 and a blade 18 that is made to rotate by a spindle 20 are moved relative to each other and dicing is performed in a state in which a workpiece W is held on the work table 12 with a dicing tape ...  
WO/2019/146287A1
The present invention is a workpiece cutting method that uses a wire saw (1) for cutting a workpiece (W) simultaneously in a plurality of locations aligned in the axial direction by way of forming a wire row (12) by winding a fixed abras...  
WO/2019/142494A1
The present invention is a method for cutting a workpiece with a wire saw to cut a workpiece simultaneously in a plurality of locations aligned in the axial direction by way of: forming a wire row by winding a fixed abrasive grain wire, ...  
WO/2019/141855A1
A method for grinding and/or polishing a defect (1) in the surface coating of a workpiece, wherein a grinding or polishing disc held on a tool is guided with pressure over the defect (1) with orbital, rotating and/or vibrating movements,...  
WO/2019/138315A1
Sanding machine, in particular for processing wood surfaces, comprising: a support and transport plane (120) for the forwarding of the workpieces (118; 218) to be processed; and a belt sanding unit (201) with a transverse abrasive belt (...  
WO/2019/130806A1
This wire saw device comprises: a plurality of wire guides; a wire row that is formed by a wire wound onto the plurality of wire guides and travels reciprocally in the axial direction; a nozzle that supplies coolant or slurry to the wire...  
WO/2019/123310A1
An apparatus (1) for carrying out the replacement of an abrasive element (20) in a machine (100) for finishing surfaces, comprises a support body (10) configured to reversibly engage the abrasive element (20). The support body (10) and t...  
WO/2019/121977A1
The invention relates to a device for loading a sanding tool with a preferably flexible sanding sheet (11), formed by a table (1) having multiple receptacles (2) in which a respective dispenser (3) accommodating a plurality of stacked sa...  
WO/2019/121975A1
The invention relates to a device for exchanging a polishing disc (8) which, during operation, is coated with a polishing agent, said disc being made in particular from a foam material, foam rubber, felt or lambskin and being fastened by...  
WO/2019/109593A1
Provided is an intelligent grinding machine tool, comprising a base (1), a vertical column (2), a combined power head (3), a workpiece rotating device (4), a workpiece exchange device (5), a flexible clamping device (6), a sliding table ...  
WO/2019/113195A1
A skin treatment device comprising a skin polishing head to remove skin from a treatment area, a collection bin disposed within the housing and positioned to collect the skin removed by skin polishing head, a conduit disposed adjacent to...  
WO/2019/111632A1
The present invention provides a stationary sawing machine for metal work that does not require an operator to follow special cautions even should usability be improved and that can protect a rechargeable battery from sparks generated wh...  
WO/2019/104791A1
Provided are a film removal process for a film solar cell and the film solar cell. Corresponding positions of molybdenum (2), CIGS (3) and TCO (4) layers are removed in the same station, and edging is carried out on a substrate glass (1)...  
WO/2019/102629A1
Provided are a device that can efficiently perform corner chamfer machining of a column member and that can efficiently perform machining of a column member including the corner chamfer machining, and a machining method. A machining devi...  
WO/2019/097059A1
The invention relates to an attachment (100) for the abrading or smoothing of walls or ceilings for a mobile handling device (10), wherein the attachment (100) has a mounting unit (104) to be received at an attachment interface (38) of t...  
WO/2019/093133A1
Provided is a dicing method with which it is possible to obtain a high yield even when a chip is cut with a narrow width. Provided is a method of dividing a substrate having a device formed thereon into individual chips. The methods incl...  
WO/2019/080597A1
A ceramic tile polishing apparatus having a multiple-row arrangement of polishing abrasive heads and a technique, the polishing apparatus comprising a horizontal beam system and an abrasive head system, the horizontal beam system compris...  
WO/2019/080598A1
A ceramic tile polishing device and method, said device comprising a control system, a ceramic tile feeding system and a ceramic tile polishing system, the ceramic tile polishing system comprising polishing group units, cross beam swing ...  
WO/2019/077007A1
The invention relates to an extraction device for a robot-assisted machine tool for surface processing. According to an exemplary embodiment, the extraction device comprises a housing with a vacuum nozzle and an outlet for connection of ...  
WO/2019/077790A1
[Problem] To provide a multi-wire saw device that is capable of reducing kerf loss while suppressing breakage of a slicing wire material. [Solution] A multi-wire saw device 10 includes a wire saw 30 that is repeatedly laid between groove...  
WO/2018/234030A3
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2019/068040A1
An abrasive article comprising a substrate having an elongated body and abrasive particles attached to the elongated body, the content of the abrasive particles oscillates along the length of the body between a minimum and maximum value,...  
WO/2019/011363A3
The invention relates to a deburring tool (10) for deburring at least one through-hole (24) in a workpiece, wherein the surface (38) of the through-hole (24) to be deburred is located on the side away from the deburring tool (10), the to...  
WO/2019/037512A1
An automatic grinding system, comprising: a mechanical arm (10) comprising a wrist (14), the wrist (14) comprising a first end, a second end, and a third end; a clamp (11) provided on the first end and configured to clamp a workpiece (10...  
WO/2019/027000A1
A grinding tool mounted on a robot comprises a roller group, an endless grinding belt, and a drive roller. The roller group comprises a plurality of rollers. The endless grinding belt is disposed so as to double back at a portion of the ...  
WO/2019/026999A1
A grinding tool mounted on a robot comprises a roller group, an endless grinding belt, and a drive roller. The roller group comprises a plurality of rollers. The grinding belt is disposed so as to double back at a portion of the roller g...  
WO/2019/012419A1
Method of abrading the surface state of a test track with a bituminous surface for vehicles, comprising the following steps: - provision of a processing machine (1) comprising a rotary head (2) with at least one friction element (3) to m...  
WO/2019/003677A1
A grinding apparatus (100) of the present invention has: a susceptor (101) for a film-forming substrate arranged inside a film formation chamber (11); a grinding member (102) configured by a flat plate-shaped base (102A) and a protruding...  
WO/2018/235328A1
An automatic grinding apparatus for grinding an object using a grinder, in which the load current increases or decreases according to the magnitude of the amount of grinding per unit time, is provided with: an electric current-detecting ...  
WO/2018/234030A2
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2018/235430A1
The purpose of the invention is to effectively improve processing efficiency of a polishing process on a face to be polished and the finish quality of the polishing process. A polishing tool (4) scours each portion of a face to be polish...  
WO/2018/230297A1
Provided is a method for manufacturing a semiconductor device including a substrate (20) having a front surface (20a) and a rear surface (20b) and a film (30) attached to the rear surface (20b), the method comprising the steps for: attac...  
WO/2018/219587A1
The invention relates to a method for cleaning a receiving groove (4) formed on a rotor (2) of an axial flow machine, said receiving groove serving to receive a blade root of a rotor blade. In said method, an elongate base body (6) of a ...  
WO/2018/219166A1
An automatic rust removal device for the inside of an oil drill pipe. The device comprises a drill pipe (1); a drilling fluid channel (2) is formed in the drill pipe (1); a double shaft extension drive motor (3) is provided in the drilli...  
WO/2018/219423A1
The invention shows and describes a grinding method for machining the surface of workpieces (6) with a plurality of inner grinding spindles, comprising the following steps: a) providing a grinding machine (1, 1') with at least two grindi...  
WO/2018/210181A1
An intelligent grinding device for casting parts. A first linear module disposed in a Z direction is mounted on a base; a second linear module disposed in an X direction is mounted on a sliding table of the first linear module; an uprigh...  
WO/2018/205498A1
Disclosed is a chopping board grinding machine, comprising a chamfering mechanism (10), a coarse grinding mechanism (20), a finish grinding mechanism (30), a transport mechanism (40) and a rack (50), wherein the chamfering mechanism comp...  
WO/2018/203448A1
The present invention is a wire-saw-based workpiece cutting method in which a fixed abrasive particle wire, to the surface of which are bonded abrasive particles, is wrapped around a plurality of grooved rollers to form a wire array, and...  
WO/2018/203292A1
The present disclosure discloses a lug brushing machine for cleaning/brushing of lugs of tubular plates of lead acid storage batteries. The lug brushing machine incorporates feeder conveyor 210, a main conveyor 220 and a rotary table 230...  
WO/2018/200913A1
Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using two grinding wheels mounted on spindles so that the edge of the grinding wheels chamfer the edge of the glass sheet...  
WO/2018/192871A1
The invention relates to a method for removing a flaw on a treated, in particular finally painted surface by grinding, wherein, after the flaw has been detected, a flexible abrasive sheet is moved to the surface and is pressed against th...  
WO/2018/193040A1
The invention relates to a grinding machine, which is suitable for a robot-supported grinding process. According to one embodiment, the grinding machine has a housing, a motor arranged in the interior of the housing, a fan wheel arranged...  
WO/2018/192869A3
The invention relates to a dust cover (100) which comprises: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circu...  
WO/2018/192869A2
The invention relates to a dust cover (100) which comprises: a flange (90) for attaching the dust cover (100) to a transmission extension housing (210) of a cutting grinder (200); a cover body (10) for at least partially covering a circu...  
WO/2018/192823A1
The invention relates to an angle grinder (200) having a gear neck (210) for connecting a dust hood (100, 100') provided with a flange (90), the angle grinder (200) having a sensor unit (20) by means of which the type of dust hood (100, ...  
WO/2018/187885A1
An easy-to-use mechanical part polishing device, comprising a bottom plate (1). Vertical plates (2) are fixedly connected to two sides of the upper surface of the bottom plate, and sliding rails (3) are fixedly connected to the opposite ...  
WO/2018/186087A1
The present invention is a workpiece cutting method that uses a wire saw in which a fixed abrasive-grain wire, which is sent out by one side of a set of wire reels and taken up by a wire reel on the other side and has abrasive grains fix...  
WO/2018/173693A1
The present invention provides an ingot cutting method using a wire saw, the method comprising forming a wire column from a wire wound spirally between a plurality of wire guides and travelling in an axial direction, cut-feeding the ingo...  

Matches 1 - 50 out of 10,327