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WO/2020/256932A1 |
Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substra...
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WO/2020/255603A1 |
The present invention provides a polishing liquid that, when applied to chemical-mechanical polishing (CMP) of an item to be polished, said item having a cobalt-including film, can produce semiconductor products that have superior reliab...
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WO/2020/255744A1 |
A polishing pad that includes a polishing layer having a polishing surface, the polishing pad being such that: the polishing surface comprises a deep-groove region having a first pattern formed from deep grooves or holes having a depth o...
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WO/2020/255581A1 |
The present invention addresses the problem of providing a polishing fluid which, when applied to chemical mechanical polishing (CMP) of a work having a cobalt-containing film, is less apt to make the polished surface of said work have e...
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WO/2020/254916A1 |
Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle enc...
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WO/2020/255862A1 |
Provided are: a chemical-mechanical polishing composition containing an aqueous carrier and at least one compound selected from the group consisting of an abrasive, a basic component, a quaternary polyammonium salt, a quaternary ammonium...
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WO/2020/255602A1 |
The present invention provides a polishing solution that, when employed for CMP of an article to be polished that has a cobalt-containing film, hinders the occurrence of dishing on the surface to be polished of the polished article and a...
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WO/2020/255921A1 |
A polishing composition is provided with which a work can be polished with reduced force of friction therewith at a satisfactory polishing rate. The polishing composition provided by the present invention comprises water, abrasive grains...
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WO/2020/253869A1 |
The present application provides an air film for a chemical mechanical polishing head, the chemical mechanical polishing head, and a polishing device. The air film is configured to comprises: a bottom plate for receiving a substrate; an ...
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WO/2020/250878A1 |
To supply a sufficient amount of liquid to a substrate without use of a rotary joint in a face-up-type polishing device. The present application discloses, as one embodiment, a polishing head 200 for a polishing device 1000 that holds ...
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WO/2020/249360A1 |
The invention relates to an apparatus comprising: at least two polishing machines for simultaneously polishing both sides of semiconductor wafers; one or more rotor discs which lie on a polishing cloth of a lower polishing plate of the p...
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WO/2020/241408A1 |
The present invention relates to a temperature adjustment device for adjusting the temperature of a polishing surface of a polishing pad that is used for polishing a substrate, such as a wafer. The present invention also relates to a pol...
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WO/2020/243305A1 |
A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of...
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WO/2020/241850A1 |
The present invention relates to a method and a system for automatically calibrating a radiation thermometer disposed on a polishing device. A method according to the present invention comprises: placing a heating device (61) having a me...
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WO/2020/243196A1 |
Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing in...
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WO/2020/243313A1 |
An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or suppl...
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WO/2020/242172A1 |
The present invention relates to a chemical mechanical polishing pad having a pattern structure and, more specifically, to a chemical mechanical polishing pad having a pattern structure for allowing the polishing pad to have uniform poli...
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WO/2020/242110A1 |
Provided are a polishing pad having an improved removal rate, a polishing device including same so as to have an improved removal rate, and a method for manufacturing the polishing pad having an improved removal rate. The polishing pad c...
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WO/2020/235581A1 |
The objective of the present invention is to enable a reduction in labor, energy, and/or cost pertaining to a substrate processing device. This substrate processing system is provided with a sensor which is installed in a substrate pro...
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WO/2020/227472A1 |
A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical p...
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WO/2020/227498A1 |
A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polis...
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WO/2020/225973A1 |
The present invention is a single surface polishing method using a polishing pad to polish a wafer surface, the single surface polishing method being characterized by comprising: monitoring a change in the polishing pad temperature; poli...
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WO/2020/223029A1 |
Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems are used to polish low-k or ultra-low-k films with reasonable high removal rates while to polish oxide and nitride films with relative low removal rates....
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WO/2020/223455A1 |
A chemical-mechanical polishing pad comprising a removable platen adhesive comprising a textured surface. A method of using the polishing pad to eliminate or reduce the occurrence of spot balding on the surface of the polishing pad.
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WO/2020/218089A1 |
The present invention addresses the problem of providing colloidal silica for metal polishing, whereby a high polishing rate can be achieved. The aforementioned problem can be solved by this colloidal silica for metal polishing, containi...
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WO/2020/211260A1 |
Disclosed are a wafer loading support, a wafer loading system and a wafer mounting method. The wafer loading support, which can lift, and a polishing head (6) including a plurality of pressure medium cavities (61, 62, 63) are used. In a ...
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WO/2020/214481A1 |
A flexible sanding apparatus that utilizes a hook-and-loop fastener for attaching sandpaper to an elastomeric body is described. The sanding apparatus may include an elastomeric body with a thin, relatively flat spring member attached to...
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WO/2020/214662A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface coated with an anionic polymer, and (b) water. The...
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WO/2020/214605A1 |
Methods, apparatus and systems for polishing an optical component having an aspheric or freeform surface are described. In one example aspect, a polishing device includes a solid plate and a container coupled to the solid plate. The cont...
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WO/2020/214712A1 |
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polish...
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WO/2020/214706A1 |
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature m...
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WO/2020/208967A1 |
The present invention is a two-side polishing method for polishing the two sides of a wafer that is disposed between a polishing pad which is affixed to an upper surface of a lower platen and a polishing pad which is affixed to a lower s...
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WO/2020/208968A1 |
The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is pr...
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WO/2020/209965A1 |
Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable...
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WO/2020/203568A1 |
Provided are: a method for production of a polishing composition that is capable of improving post-polishing surface quality; and a polishing method. The polishing composition production method according to the present invention is used ...
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WO/2020/202682A1 |
Provided are a polishing head, a polishing apparatus including the polishing head, and a method for manufacturing a semiconductor wafer using the polishing apparatus. The polishing head comprises: a first ring-shaped member having an ope...
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WO/2020/203140A1 |
An abrasive supply device is provided with: a slurry supply passage 40 having a plurality of slurry drop holes 400; an upper surface plate 10 having a plurality of slurry supply holes 100; and a slurry guide unit 50 having a plurality of...
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WO/2020/203639A1 |
On the polishing surface, this polishing pad has nh grooves (nh is an integer greater than or equal to 4) having a first groove pitch x1 (mm) to an nh^th groove pitch xh (mm), wherein the absolute value of the skewness (S) represented by...
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WO/2020/203219A1 |
A method for manufacturing a hypoid gear (10) comprises a gear cutting step (S1) for processing the shape of the teeth of the hypoid gear, a surface treatment step for shaping a third intermediate gear (10c) having a hardened layer forme...
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WO/2020/194944A1 |
A method for producing a gallium oxide substrate which involves polishing the gallium oxide substrate by using a polishing slurry, wherein the polishing slurry contains water and manganese dioxide particles.
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WO/2020/197877A1 |
Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle m...
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WO/2020/196162A1 |
The present invention provides a composition for polishing semiconductor wiring, the composition having exceptional polishing speed and being such that the occurrence of dishing is suppressed. This composition for polishing semiconduct...
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WO/2020/196645A1 |
Provided is a polishing composition having excellent ability to reduce haze on a surface of a polished subject. The polishing composition according to the present invention contains abrasive grains, a basic compound, a water-soluble poly...
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WO/2020/196542A1 |
[Problem] The purpose of the present invention is to provide a polishing composition which enables the speed-of-removal of a metal material to be the same as, or similar to, the speed-of-removal of a resin material in a chemical mechanic...
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WO/2020/196369A1 |
A polishing composition provided by the present invention comprises abrasive grains, a poly(vinyl alcohol)-based polymer as a water-soluble polymer, a basic compound, and water and further contains a polyvalent organic acid (salt) having...
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WO/2020/194971A1 |
This double-sided polishing method for a workpiece comprises: a pre-polishing index calculation step for, after performing double-sided polishing of a previous batch, calculating an index Xp for the workpiece on which the double-sided po...
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WO/2020/196370A1 |
The polishing composition provided by the present invention comprises abrasive grains, water-soluble polymers, a basic compound, and water, wherein the water-soluble polymers comprise a poly(vinyl alcohol)-based polymer and a polymer con...
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WO/2020/198761A1 |
During polishing of main surfaces of a substrate, an opening of a through hole through which a polishing liquid is supplied does not constitute an obstacle, and precision polishing of the substrate is realized. A method for producing a s...
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WO/2020/195149A1 |
The present invention provides a method for polishing a to-be-polished object including a material having a silicon-silicon bond, the method comprising a means for achieving reduction in both the number of defects and haze to a great ext...
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WO/2020/198102A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt.% to about 10 wt.% of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C2-C10 alkylenediol; and (c) water, where...
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