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WO/2022/143526A1 |
A linear polishing machine, comprising: a polishing disc (200) for fixing a member (100) to be polished, a power mechanism located above the polishing disc (200), and a grinding pad (330) in transmission connection with the power mechani...
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WO/2022/142158A1 |
A machining apparatus for integrated grinding and polishing of diamond, comprising a rack, a base device (1) and a grinding and polishing device (2); the base device (1) comprises a slide base capable of being fed along a Y-axis with res...
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WO/2022/145117A1 |
The present invention aims to reduce the frequency of retainer replacements. A retainer disposed so as to surround a holding region 39 for a polygonal substrate WF, in a top ring for holding the polygonal substrate WF in a state in whi...
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WO/2022/139185A1 |
A retainer ring according to an embodiment of the present invention, which is a retainer ring used in a CMP apparatus, comprises: a frame layer which is coupled to the bottom of a carrier of the CMP apparatus and includes a thermosetting...
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WO/2022/137897A1 |
The present invention provides a polishing composition which is capable of reducing micro defects of a semiconductor wafer after polishing. This polishing composition contains abrasive grains, a basic compound, a wetting agent and a noni...
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WO/2022/138687A1 |
The present invention suppresses breakage starting from a notch. A glass substrate (10) has a notch (16) formed in an outer circumferential surface (12), the arithmetic average roughness Ra, as defined in JIS B 0601:2001, between the not...
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WO/2022/134866A1 |
An ultrasonic conduction grinding module, comprising a vibration source (1), which comprises a plurality of piezoelectric plates (11), and a conductive plate group (12) having at least one first conductive plate (121) and at least one se...
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WO/2022/140345A1 |
A subpad for a chemical-mechanical polishing pad, the subpad having porogens with polymeric shells. Methods of fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer are also described.
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WO/2022/138958A1 |
The present invention provides, for example, a polishing pad which is capable of providing favorable flatness to a polishing target article, and which has excellent affinity to a slurry. Provided is, for example, a polishing pad comprisi...
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WO/2022/138103A1 |
The present invention provides a means capable of achieving a high polishing speed when polishing a silicon wafer. The present invention relates to a polishing composition used to polish a silicon wafer, the polishing composition compr...
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WO/2022/138579A1 |
This ceramic ball material, according to an embodiment of the present invention, comprises: a spherical part; and a band-shaped part formed over the circumference of the surface of the spherical part. The width of the band-shaped part is...
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WO/2022/132314A1 |
Embodiments herein include carrier loading stations and methods related thereto which may be used to beneficially remove nano-scale and/or micron-scale particles adhered to a bevel edge of a substrate before polishing of the substrate. B...
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WO/2022/130800A1 |
A wafer polishing method according to the present invention comprises: a step for obtaining a first correlation, which is a correlation between alkali concentration and chemical polishing rate, using a plurality of polishing solutions ha...
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WO/2022/130839A1 |
The present invention provides a means for decreasing a surface roughness (Ra) while keeping a high polishing speed in the polishing of an object comprising a resin and a filler. A polishing composition according to the present invention...
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WO/2022/132310A1 |
A horizontal pre-clean module includes a chamber including a basin and a lid which collectively define a processing area, a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a substrate receivin...
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WO/2022/132371A1 |
A polishing station for polishing a substrate using a polishing slurry is disclosed. The polishing station includes a substrate carrier having a substrate receiving surface and a rotatable platen having a polishing pad disposed on a plat...
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WO/2022/133273A1 |
Provided herein are advanced substrate polishing methods that use a machine learning artificial intelligence (Al) algorithm, or a software application generated using the Al, to control one or more aspects of the polishing process, The A...
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WO/2022/130696A1 |
The silicon wafer polishing method according to the present invention comprises performing, as a final polishing step, a prior stage polishing step and a subsequent finishing polishing step. In the final polishing step, the finishing pol...
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WO/2022/130783A1 |
The present invention achieves a polishing head with which it is possible to evenly polish the height of a wiring pattern for each of a plurality of wiring units formed on a substrate. This polishing head 302 for retaining a substrate ...
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WO/2022/130813A1 |
The present invention addresses the problem of providing a polishing agent composition for fluorophosphate glasses, which has a high polishing speed and can polish a fluorophosphate glass as an alternative for a cerium oxide-based polish...
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WO/2022/121027A1 |
A high-precision steel-ball single-machine three-water-tank fine grinding production process in the field of 5G communications, in which a 3M4680 steel ball grinder (1) is used to grind steel balls; the steel ball grinder (1) is provided...
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WO/2022/123820A1 |
This method for producing an irregularly-shaped silica-based fine particle dispersion comprises the following steps (a) through (f). Step (a): a step for adjusting the ionic strength to 0.4 or higher in an alkali silicate aqueous solutio...
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WO/2022/121428A1 |
A polishing device, comprising a base (101), the base (101) being provided with polishing head seats (104); the polishing head seats (104) are provided with two polishing heads (200) for fixing wafers and a linear driving mechanism which...
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WO/2022/116553A1 |
A pressure measurement system and a pressure measurement method. The pressure measurement system comprises: a grinding arm (21) and a stress device (23), wherein the stress device (23) is unilaterally fixed, and the stress device (23) is...
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WO/2022/116529A1 |
Provided in the embodiments of the present application is a pressure measuring system, comprising: a grinding arm and a stress layer, wherein the stress layer is used for bearing pressure of the grinding arm; a substrate and a plurality ...
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WO/2022/113775A1 |
A polishing liquid composition for silicon oxide films which is capable of having improved polishing selectivity in polishing silicon oxide films is provided in one aspect. This polishing liquid composition for silicon oxide films comp...
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WO/2022/110340A1 |
The present invention relates to the field of grinding equipment. Disclosed is a grinding device for a high-temperature fast-opening spherical sealing shut-off valve, comprising a base frame, a drive device, and an angle iron frame and a...
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WO/2022/115553A1 |
A textured glass-based article with multiple haze levels is provided. The textured glass-based articles are produced by utilizing a combination of etching and mechanical polishing to produce the multiple haze levels.
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WO/2022/113986A1 |
To provide a novel polishing composition suited to polishing. Provided is polishing composition for silicon wafers. The polishing composition contains a basic compound, a surfactant, and water. The surfactant is an acetylene-glycol-type ...
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WO/2022/107468A1 |
The present invention is a polishing pad comprising a polishing layer for polishing a surface of a wafer, and a double-sided tape for attaching the polishing layer to an upper surface plate of a double-side polishing device. A 90° peeli...
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WO/2022/107217A1 |
Provided is a polishing agent for use in polishing a polishing target surface including cobalt, said polishing agent comprising abrasive grains, quaternary phosphonium salt, and water, and having a pH greater than 4.0. Also provided is a...
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WO/2022/105275A1 |
Disclosed are a fixing device and a detection system. The fixing device comprises a carrier tray (10) for carrying grinding heads (20, 30), wherein the carrier tray is provided with a positioning hole (101) and a first positioning ring (...
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WO/2022/107553A1 |
The present invention pertains to a substrate holding device which holds a substrate such as a wafer, and particularly, to a substrate holding device used for a polishing device. This substrate holding device (1) comprises: a polishing h...
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WO/2022/102019A1 |
Provided is a polishing solution that contains: abrasive grains including a hydroxide of a tetravalent metal element; a monovalent acid component that does not have a carboxyl group; and a non-ionic polymer, said polishing solution havin...
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WO/2022/102020A1 |
Provided is a polishing solution that contains: abrasive grains including a hydroxide of a tetravalent metal element; and a nitrogen-containing compound having a hydrocarbon group that has at least six carbon atoms and is bonded to the n...
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WO/2022/103583A1 |
A polishing system includes a carriage arm having an actuator disposed on a lower surface thereof. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a sub...
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WO/2022/098527A1 |
A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a r...
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WO/2022/098469A1 |
The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of ene...
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WO/2022/091500A1 |
Provided is a structure that reduces the risk imposed on a retainer member mounting mechanism when a substrate hits a retainer member. One embodiment provides a head for holding a polygonal substrate. The head includes a substrate supp...
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WO/2022/093576A1 |
An example grinder/polisher system includes: a specimen holder configured to secure a specimen; a platen; an actuator configured to move at least one of the specimen holder and the platen; a sensor configured to detect objects within a f...
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WO/2022/091532A1 |
The present invention provides technology that enables accurate measuring of the polishing state of a substrate. A polishing device 100 comprises: a sensor head 40 having a light projector for projecting incident light, a light collect...
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WO/2022/085512A1 |
A problem addressed is to provide an antibacterial agent-compounded silica dispersion that has an antibacterial property, a slight decrease in polishing rate even when used as a component of an abrasive composition, and a good surface st...
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WO/2022/086830A1 |
The invention provides a UV-curable resin for forming a chemical-mechanical polishing pad comprising: (a) one or more acrylate blocked isocyanates; (b) one or more acrylate monomers; and (c) a photoinitiator. The invention also provides ...
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WO/2022/086672A1 |
An apparatus and method for sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing (CMP) systems is disclosed. A method includes transferring a first substrate to a first polishing station of ...
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WO/2022/081409A1 |
Embodiments herein generally relate to chemical mechanical polishing (CMP) systems used in the manufacturing of electronic devices. In one embodiment, a substrate carrier for polishing a surface of a substrate includes a retaining ring c...
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WO/2022/080159A1 |
A carrier measurement device (1) comprises a rotating table (23), a table drive motor (24), an upper thickness sensor (41), a lower thickness sensor (42), and a sliding part (13). The rotating table (23) includes a carrier storage part (...
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WO/2022/077924A1 |
A lapping control method, comprising the following steps: acquiring a target resistance value, set by a user, of a metal layer of a lapped object; determining a target output value of an eddy current sensor according to the target resist...
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WO/2022/081398A1 |
An apparatus for chemical mechanical polishing (CMP) of a substrate is described herein. The apparatus includes an extension disposed between a retaining ring and a chucking membrane. The extension is disposed radially outward from the e...
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WO/2022/074835A1 |
One aspect provides a method for adjusting the polishing speed of a silicon substrate and the surface quality of the polished silicon substrate. In one aspect, this method is for adjusting the polishing speed of a silicon substrate and...
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WO/2022/074831A1 |
One aspect provides a polishing liquid composition which is for a silicon substrate and with which improvements in the polishing speed and storage stability of a concentrate can both be achieved. In one aspect, the present disclosure p...
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