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Matches 1 - 50 out of 27,403

Document Document Title
WO/2018/225658A1
The present invention pertains to a method for polishing using a polishing pad provided with a prescribed adsorption layer. The polishing pad is provided with an adsorption layer that comprises, inter alia, silicone comprising a linear p...  
WO/2018/221357A1
The present invention addresses the problem of providing a ceria-based composite particle dispersion which is capable of performing polishing at high speed, even for silica films, Si wafers, and difficult to process materials, and which ...  
WO/2018/221304A1
The present invention addresses the problem of providing a nanobubble-containing inorganic oxide fine particle dispersion exhibiting excellent concentration stability in the process of being used as a polishing agent. The present inventi...  
WO/2018/222857A1
Embodiments of a polishing film are provided. The polishing film includes a substrate having a surface. Abrasive particles are attached to the surface of the substrate, and microcapsules are attached to the surface of the substrate at lo...  
WO/2018/216445A1
The present invention planarizes a substrate that has recesses and projections. The present invention provides a method for chemically mechanically polishing a substrate; and this method comprises a step for polishing a substrate with us...  
WO/2018/216593A1
A polishing pad which is provided with a base material and a resin part that is arranged on the base material, and which is configured such that: the resin part constitutes a recessed and projected pattern by itself or together with the ...  
WO/2018/216733A1
The present invention provides a polishing composition which is thickened, while maintaining properties such as dispersibility of abrasive grains, polishing rate and reduced haze. The present invention is a polishing composition which co...  
WO/2018/216433A1
Provided are a method for producing a treated member on which treatment such as smoothing can be stably performed on both surfaces thereof even in the case of a brittle substrate, and a laminate. The method for producing the treated memb...  
WO/2018/216720A1
Provided is an ultrasonic machining apparatus that is capable of improving microfabrication machining precision with respect to a workpiece. This ultrasonic machining apparatus 10 comprises: a base 12; an ultrasonic unit 18 that has a st...  
WO/2018/216218A1
The present invention addresses the problem of providing a production method for a nano-bubble-containing liquid dispersion of inorganic oxide fine particles which has excellent concentration stability in a process of using the liquid di...  
WO/2018/211903A1
The present invention provides a silicon wafer polishing method of polishing a silicon wafer with a polishing slurry interposed between the silicon wafer and a polishing pad, the silicon wafer polishing method being characterized in that...  
WO/2018/207670A1
A Schiff-base-containing chain extender which is a Schiff-base-containing diol or a derivative thereof; a polyurethane produced using the chain extender; a method for modifying the polyurethane; a polishing layer including a polyurethane...  
WO/2018/198997A1
Provided is a CMP polishing device for flattening a quadrilateral substrate. Provided is a polishing device for polishing a quadrilateral substrate, the polishing device having a substrate retaining part for retaining a quadrilateral sub...  
WO/2018/198583A1
The present invention is a silicon wafer polishing method, comprising: a first polishing step for bringing the surface of a silicon wafer held by a polishing head into sliding contact with a polishing cloth attached to a surface plate an...  
WO/2018/200165A1
An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first...  
WO/2018/198707A1
The present invention relates to a method for diminishing the peak power of a substrate processing device. In addition, the present invention relates to a substrate processing device operating method for processing a substrate such as a ...  
WO/2018/193916A1
[Problem] To provide: a polishing composition which, when used in a wafer polishing step, gives a flat polished surface having a small difference in surface level between the central part and peripheral part (laser mark part) of the wafe...  
WO/2018/193758A1
The present invention provides a double-sided wafer polishing method for placing multiple double-sided polishing carriers in a double-sided polishing apparatus and performing double-sided polishing of wafers, wherein, when readying a car...  
WO/2018/190077A1
The present invention provides a synthetic quartz glass substrate polishing agent comprising polishing particles and water, and is characterized in that the polishing particles comprise silica particles as base particles, on the surface ...  
WO/2018/190079A1
A wafer-retaining elastic film (10) of a CMP device, having: a film body (11) formed from an elastic material; and a coating layer (12) provided so as to cover the wafer-retaining-side surface of the film body (11). The coating layer (12...  
WO/2018/179685A1
A substrate processing device having a substrate polishing unit 40 provided with a polishing pad for polishing a wafer W, and a top ring 41 for holding the wafer and pushing the wafer toward the polishing pad. An elastic film 80 that hol...  
WO/2018/181713A1
[Problem] To efficiently produce silica particles by inhibiting production of unreacted materials. [Solution] This silica particle liquid dispersion production method comprises simultaneously adding, to liquid I containing silica seed pa...  
WO/2018/181347A1
The objective of the present invention is to provide a polishing pad having excellent polishing performance and excellent polishing slurry discharging characteristics. This polishing pad has a polishing portion and a groove portion in a ...  
WO/2018/182945A1
Embodiments of the disclosure relate to a system, apparatus and method for polishing thin substrates with high planarity. The apparatus comprises a chemical mechanical polishing head and a plate. The polishing head comprises a bottom sur...  
WO/2018/180153A1
The present invention provides a polishing composition whereby it becomes possible to provide a silicon wafer that is reduced in the occurrence of edge roll off and is improved in the overall flatness when the silicon wafer is roughly po...  
WO/2018/180479A1
Provided is a polishing composition capable of effectively reducing an edge roll-off amount. A polishing composition provided by the present invention contains abrasive grains, a basic compound, a nitrogen-containing water-soluble polyme...  
WO/2018/173421A1
The present invention addresses the problem of providing a polishing device capable of maintaining a polishing member in an excellent state while polishing is performed. Provided is a polishing device for locally polishing a substrate. T...  
WO/2018/173814A1
The present invention provides a polishing composition that is capable of attaining adequate planarization and has a low etching speed while having a high polishing speed. The present invention is a polishing composition including abrasi...  
WO/2018/169536A1
Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, and related systems and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support; a first pedestal extending from the suppor...  
WO/2018/168534A1
A polishing agent containing abrasive grains and water, wherein the abrasive grains include silica particles, the average grain size Rave of the abrasive grains is 50 nm or higher, the ratio Rave/Rmin of the average grain size Rave with ...  
WO/2018/168206A1
The present invention provides a polishing composition which can be used to reduce an unintended height difference occurring between different materials or an unintended height difference occurring between sparse and dense portions of a ...  
WO/2018/169041A1
Provided is a polishing pad that polishes a curved surface to be polished of an object to be polished, by a polishing surface which follows curved surfaces having various curvatures, whereby the waviness of the curved surface to be polis...  
WO/2018/168426A1
The present invention provides a method for manufacturing a product wafer, the method comprising the steps for a wafer peripheral portion chamfering process, a major surface lapping or double-side grinding process, an etching process, a ...  
WO/2018/161787A1
Disclosed are an apparatus for repairing poor appearance and a repairing method, wherein the apparatus comprises: a mobile platform (110) and at least one repairing mechanism (111) located above the mobile platform (110), wherein each of...  
WO/2018/164804A1
A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction pro...  
WO/2018/163721A1
The present invention relates to a carrier for a double-sided polishing device, the carrier having: a carrier base material in which a holding hole for holding a wafer during polishing is formed; and an insert material disposed along the...  
WO/2018/159530A1
One objective of the present invention is to provide a polishing solution which is not likely to cause dishing and defects on a polished surface when applied to CMP of an object to be polished, said object containing a cobalt-containing ...  
WO/2018/155168A1
[Problem] To provide a method for polishing a silicon carbide substrate, with which it is possible to increase polishing speed even when using a polishing pad which normally cannot contribute to an increase in polishing speed. [Solution]...  
WO/2018/150856A1
[Problem] To provide a polishing composition having excellent performance of eliminating protrusions formed on the periphery of a hard laser mark. [Solution] A polishing composition comprising abrasive grains, a water-soluble polymer, a ...  
WO/2018/150945A1
Provided is a polishing composition which is used in a step upstream of a final polishing step for a silicon substrate, and which makes it possible to obtain a high-quality surface effectively after the final polishing step. According to...  
WO/2018/147074A1
Provided is a polishing liquid which is used to polish a surface-to-be-polished that contains a tungsten material, wherein: the polishing liquid contains abrasive grains, a polymer having cationic groups at terminals, an oxidizing agent,...  
WO/2018/147148A1
Provided are: a polishing composition which can achieve both of a high polishing rate and a reduced edge roll-off amount while reducing an abrasive grain content; and a polishing composition which can produce a polished surface having go...  
WO/2018/142516A1
Provided is a polishing fluid that contains: abrasive grains containing the hydroxide of a tetravalent metal element; a polyalkylene glycol; a polymer compound; a cationic polymer; and a liquid medium. The polymer compound has a first mo...  
WO/2018/142623A1
[Problem] To provide a high-quality polishing pad that satisfies a user's demand regarding recesses. [Solution] First, a tool (6) that has a projected shape conforming to the shape of a recess to be formed on the front surface of a polis...  
WO/2018/143530A1
The present invention relates to a carrier head for a chemical mechanical polishing device, including a contact flap. According to the present invention, the carrier head comprises: a base; a substrate accommodation member connected to t...  
WO/2018/139492A1
Provided are a processing medium which combines rust-preventive performance with metal-contamination-preventing performance, a processing composition, and a processing method. The processing medium according to the present invention cont...  
WO/2018/135878A1
Disclosed is a method for producing a polishing pad, the method comprising the steps of: providing a polishing layer; forming a first through-hole penetrating the polishing layer; providing a support layer facing the polishing layer; int...  
WO/2018/136694A1
A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more ...  
WO/2018/135585A1
[Problem] Provided is a method for efficiently producing a liquid dispersion containing irregular-shaped silica particles by inhibiting generation of unreacted materials such as oligomers which do not grow into desired silica particles. ...  
WO/2018/131868A1
An embodiment relates to a porous polyurethane polishing pad used in chemical mechanical planarization (CMP) of a semiconductor and a method for manufacturing same, wherein the polishing performance (polishing rate) of the porous polyure...  

Matches 1 - 50 out of 27,403