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Matches 1 - 50 out of 26,695

Document Document Title
WO/2017/220888A1
The invention relates to sintered abrasive particles of which the chemical composition comprises the weight concentration ranges indicated in the table, to give a total of 100%.  
WO/2017/222999A1
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The...  
WO/2017/221660A1
The present invention addresses the problem of providing a polishing liquid with which it is possible to give an object to be polished excellent in-plane uniformity. The present invention also addresses the problem of providing a chemica...  
WO/2017/217278A1
The present invention provides a polishing pad which is a cured foam of a urethane resin composition containing (i) a base material that contains a urethane prepolymer (A) having an isocyanate group, said urethane prepolymer (A) being a ...  
WO/2017/218921A1
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...  
WO/2017/212971A1
This polishing liquid contains permanganate ions, a weak acid and a soluble salt of the weak acid. It is preferable that the pH of this polishing liquid before polishing is started is from 0.5 to 6.0 (inclusive) at 25°C. It is also pref...  
WO/2017/213255A1
The present invention is a CMP polishing solution for polishing a substrate including at least a barrier metal, a metal film, and a silicon dioxide film, or a substrate including at least a barrier metal, a metal film, a silicon dioxide ...  
WO/2017/212874A1
The present invention addresses the problem of providing: a polishing liquid that, when used for CMP, is not likely to cause flaws in a polished object; and a chemical mechanical polishing method. This polishing liquid is for use in chem...  
WO/2017/213294A1
The present invention relates to an auxiliary apparatus, for a polishing device, comprising: an attaching/detaching means; a specimen grinding means; and a connecting means. Therefore, effects of an automatic polishing device can be obta...  
WO/2017/208667A1
The present invention addresses the issue of providing a polishing liquid whereby abrasive grains in the polishing liquid are unlikely to agglomerate and, even when used in CMP, defects are less likely to occur in a polished surface. The...  
WO/2017/209050A1
Provided is a polishing pad having a knit fabric configured from a warp and a weft, and a resin with which the knit fabric is impregnated, the polishing pad having a cross-section cut along the direction of the surface of the knit fabric...  
WO/2017/204035A1
The invention provides a polishing solution that can obtain an excellent polishing rate when applied to CMP and is less likely to cause dishing of the surface to be polished, a method for producing a polishing solution, a polishing solut...  
WO/2017/195460A1
The present invention is a template assembly sorting method comprising: a step for preparing template assemblies in which a template with a back pad for holding the back surface of a workpiece and a retainer ring located on the back pad ...  
WO/2017/191671A1
Provided is a polishing composition capable of polishing a sapphire wafer at an excellent polishing rate. The polishing composition contains silica particles, a glycol ether compound, and water. The content of glycol ether compound in th...  
WO/2017/187749A1
[Problem] To provide a means for improving the dispersibility of abrasive grains while maintaining the polishing performance, and to provide a means for improving the redispersibility of abrasive grains while maintaining the polishing pe...  
WO/2017/187689A1
An abrasive material, a polishing composition, and a polishing method are provided with which it is possible to polish a surface of an alloy or metal oxide at a sufficient speed and to obtain a high-grade mirror surface. The abrasive mat...  
WO/2017/183290A1
The present invention is a polishing material for synthetic quarts glass substrates which comprises abrasive grains and water, characterized in that the abrasive grains comprise ceria particles as base particles and, fixed to the surface...  
WO/2017/183452A1
The present invention addresses the problem of providing a silica-based composite fine particle dispersion with which a silica film, a Si-wafer, or even a difficult to machine material can be polished at high speed while achieving high p...  
WO/2017/175894A1
According to the present invention, a method for manufacturing a polishing pad comprises the steps of: mixing a plurality of polymers so as to generate a urethane prepolymer having a viscosity of 20,000 cps (25°C) to 40,000 cps (25°C);...  
WO/2017/177072A1
A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or "standing proud" of the rest of the surface, and uniformly distributed ...  
WO/2017/169154A1
Provided is a set of compositions for polishing with which it is possible to achieve a high-quality polished surface by reducing haze. This set of compositions for polishing is provided with: a finish polishing composition to be used in ...  
WO/2017/171262A1
The present invention relates to a carrier head for a chemical-mechanical polishing apparatus comprising a substrate receiving member. The carrier head according to the present invention comprises: a base; a substrate receiving member ha...  
WO/2017/170179A1
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a...  
WO/2017/169055A1
Provided is a polishing pad with which it is possible, when polishing an object to be polished that has a convex part and/or a concave part on the surface thereof, to adequately polish the portion near the convex part and/or the inner su...  
WO/2017/169995A1
The polishing composition for alloy materials according to the present invention is for polishing alloy materials and comprises aluminum oxide particles and water, the aluminum oxide particles having a volume-based cumulative particle di...  
WO/2017/170135A1
Provided are: a composition for abrasive finishing use, which rarely undergoes the oxidation of magnetic particles contained therein; and a magnetic abrasive finishing method. The composition for abrasive finishing use (1) comprises: mag...  
WO/2017/170062A1
Provided is a polishing composition for polishing materials to be polished having a Vickers hardness of at least 1500 Hv. This polishing composition contains alumina abrasive and water. The isoelectric point of the alumina abrasive is le...  
WO/2017/169743A1
[Problem] To provide a polishing composition which is used for polishing of a polishing object having a layer that contains a metal, and which is capable of achieving sufficient planarization. [Solution] A polishing composition which is ...  
WO/2017/171052A1
[Problem] To provide a carrier which makes it possible to obtain a high-quality substrate at a higher yield than conventional ones and a substrate manufacturing method using this carrier. [Solution] A carrier 104 according to the present...  
WO/2017/169808A1
[Problem] The purpose of the present invention is to provide a technique which, when polishing an object to be polished that contains (a) a material having a silicon-nitrogen bond and (b) another material, can improve the ratio of the po...  
WO/2017/170061A1
Provided is a polishing composition for polishing a material to be polished. This polishing composition contains diamond abrasive and non-diamond abrasive, and in terms of weight, the ratio (B/A) of the content of non-diamond abrasive (B...  
WO/2017/169124A1
Provided are a substrate polishing device, a method of cleaning the same, and a device for supplying liquid to a substrate polishing device, with which it is possible to suppress agglomeration of a polishing liquid in a pipe. Provided is...  
WO/2017/163847A1
The present invention provides a polishing composition suitable for polishing a polishing subject having a layer that includes a group III-V compound, and with which it is possible to suppress etching of the group III-V compound and poli...  
WO/2017/163910A1
[Problem] To provide a polishing composition that can adequately remove defects remaining on the surface of a polished object, and that can make the polishing speed of different materials approximately the same when polishing an object t...  
WO/2017/163942A1
The present invention provides a polishing composition for objects to be polished that have a metal-containing layer, the composition being capable of achieving sufficient planarization. The present invention is a polishing composition u...  
WO/2017/165216A1
A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive ...  
WO/2017/158955A1
According to the present invention, whether wafer polishing is completed is determined with high accuracy for each wafer. A wafer processing method according to the present invention comprises: a first step for acquiring the initial stat...  
WO/2017/159213A1
The present invention provides a method for manufacturing a carrier for dual-surface polishing devices, the method characterized by comprising: a preparing step for preparing a carrier base material and an insertion material having a lar...  
WO/2017/160344A1
Systems and methods of in-situ calibration of semiconductor material layer deposition and removal processes are disclosed. Sets of test structures including one or more calibration vias or posts are used to precisely monitor processes su...  
WO/2017/155081A1
[Problem] To enable precise planarizing with a compact device without causing damage to a workpiece while also effectively suppressing the occurrence of vibrations during device activation. [Solution] This planarizing device is provided ...  
WO/2017/150118A1
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of...  
WO/2017/150157A1
Provided are: a silicon substrate polishing method which is capable of reducing PID; and a polishing composition set which is used in this polishing method. A silicon substrate polishing method according to the present invention comprise...  
WO/2017/150158A1
Provided are: a polishing method which is applicable in common to a plurality of silicon substrates that have resistivities different from each other; and a polishing composition set which is used in this polishing method. A silicon subs...  
WO/2017/150114A1
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The presen...  
WO/2017/146006A1
In this polishing method, a disc-shaped polishing pad (1) is used. In the axial direction of the polishing pad (1) disc, a peripheral surface (111) on a polishing surface (10) side is a tapered surface whose diameter decreases towards th...  
WO/2017/141812A1
This surface plate for finish polishing, on which a polishing film is to be mounted, is provided with: a plate body having a planar surface; and a plurality of island-like projections formed on the surface of the plate body, wherein a co...  
WO/2017/138308A1
This polishing slurry contains abrasive grains formed of a metal oxide, a permanganate salt and an inorganic compound other than the permanganate salt. With respect to the inorganic compound, the redox potential of a solution that is obt...  
WO/2017/138564A1
The present invention is a polymer body or the like containing a polyurethane resin that is provided with first constituent units derived from a compound containing a hydroxyl group, and with second constituent units derived from a compo...  
WO/2017/139079A1
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...  
WO/2017/134914A1
This method for polishing both surfaces of a wafer includes: clamping a wafer (16) with a donut-shaped upper platen (12) and a lower platen (13) each having a center hole in a central portion thereof and each having a polishing cloth (11...  

Matches 1 - 50 out of 26,695