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Matches 1 - 50 out of 26,981

Document Document Title
WO/2018/105306A1
The present invention provides a double-side polishing device carrier for a double-side polishing device which performs double-side polishing of a semiconductor silicon wafer, wherein the double-side polishing device carrier is disposed ...  
WO/2018/096991A1
Provided is a polishing composition containing a cellulose derivative, the polishing composition being effective in giving polished surfaces having few defects. This application provides a polishing composition comprising abrasive grains...  
WO/2018/092630A1
The present invention addresses the problem of providing: a polishing pad that is long-lasting, has a high polish rate, and is capable of producing a high degree of flatness on polished articles; and a method for manufacturing the polish...  
WO/2018/088088A1
The present invention addresses the problem of providing a silica composite particle dispersion capable of polishing silica films, Si wafers, or difficult-to-machine materials at high speed and of achieving high surface precision at the ...  
WO/2018/086912A1
The invention relates to a method for two-sided polishing of a semiconductor wafer, wherein polishing cloths having a hardness at room temperature of at least 80° according to Shore A and having a compressibility at room temperature of ...  
WO/2018/088370A1
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. These abrasive particles have ...  
WO/2018/088371A1
Provided are a polishing composition and a silicon wafer polishing method that are capable of providing a high degree of flatness. The polishing composition contains abrasive particles and a basic compound. The product of the abrasive pa...  
WO/2018/083931A1
The present invention provides a double side polishing method for semiconductor wafers, said method making it possible to suppress variance in polishing quality by corresponding to a polishing environmental change that occurred when perf...  
WO/2018/080797A1
The present invention relates to a retainer ring for chemical mechanical polishing (CMP). A method of manufacturing a retainer ring for CMP comprising steps of: preparing two or more of arc-shaped polishing parts comprising a non-thermop...  
WO/2018/079334A1
Provided is a fumed silica for chemical-mechanical polishing with which post-polishing scratches occurring on a surface of an object to be polished can be significantly reduced, and which is important for miniaturization and multi-layeri...  
WO/2018/080765A1
A structured abrasive article comprises a plurality of shaped abrasive composites disposed on and secured to a major surface of a backing. The shaped abrasive composites comprise magnetizable abrasive particles retained in an organic bin...  
WO/2018/079766A1
The purpose of the present invention is to provide a polishing roll capable of achieving, for example, three-dimensional polishing of a hard material such as sapphire glass at a high polishing rate. The present invention provides a cylin...  
WO/2018/074041A1
This surface property measuring device for a polishing pad measures surface properties, such as surface shape and surface state, of a polishing pad to be used for the purpose of polishing substrates, such as a semiconductor wafer. The su...  
WO/2018/075409A2
The invention provides a chemical-mechanical polishing composition containing abrasive, a polyhydroxy aromatic carboxylic acid, an ionic polymer of formula (I) wherein X1 and X2, Z1 and Z2, R1, R2, R3, and R4, and n are as defined herein...  
WO/2018/074091A1
A local polishing system is provided with: a particle estimation unit (30) which estimates a film thickness distribution of a wafer; a local polishing region setting unit (11) which sets a local polishing region of the wafer on the basis...  
WO/2018/075260A1
An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by th...  
WO/2018/061656A1
The purpose of the present invention is to provide, in a method for producing a cationically modified silica which includes modifying a silica raw material using a silane coupling agent, a means for enabling suppression of the occurrence...  
WO/2018/062470A1
The present invention provides: a method for producing a semiconductor chip excellent in production yield; and a kit. The method for producing a semiconductor chip according to the present invention comprises: step 1 for forming an insul...  
WO/2018/059144A1
A CMP equipment polishing head wafer falling detection method and system. The method comprises: monitoring, in a vacuum wafer grabbing process and a wafer carrying and conveying process of a polishing head, the vacuum adsorption pressure...  
WO/2018/063242A1
A multi-step conditioning process includes an initial step of preparation (i.e., pre-conditioning) and a subsequent step of restoration (i.e., conditioning and polishing intermittently, in situ conditioning, or combinations thereof). An ...  
WO/2018/062401A1
A polishing liquid composition is provided which can improve polishing selectivity and suppress uneven polishing while securing high polishing speeds. This invention relates to a polishing liquid composition which contains cerium oxide p...  
WO/2018/064162A1
An apparatus for fabricating a polishing pad includes a conveyor belt, a casting station to form a layer of the polishing pad and to deliver the layer of the polishing pad onto the conveyor belt, a printing station including one or more ...  
WO/2018/062403A1
A polishing liquid composition is provided which can improve polishing selectivity and suppress uneven polishing while securing high polishing speeds. This invention relates to a polishing liquid composition which contains cerium oxide p...  
WO/2018/055985A1
[Problem] To provide a polishing composition with which it is possible to effectively improve the polishing rate of an object to be polished. [Solution] A polishing composition containing abrasive grains, a polishing accelerator having a...  
WO/2018/056122A1
Provided is a slurry containing abrasive particles, glycol, and water, wherein the average particle size of the abrasive particles is 120 nm or less, and the pH of the slurry is at least 4.0 and less than 8.0. Also provided is a polishin...  
WO/2018/052816A1
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, a...  
WO/2018/052133A1
The present invention is a polishing pad or the like, which comprises a pad main body that is formed of a polymer body containing a polyurethane resin and cerium oxide particles. The pad main body is a part that constitutes a polishing s...  
WO/2018/050068A1
Disclosed is a pressure loading film (100). The pressure loading film (100) comprises: a film body (10), the film body (10) comprising a plurality of mutually isolated sub-cavities (30), the sub-cavities (30) being used for injecting a p...  
WO/2018/053023A1
During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top ...  
WO/2018/050069A1
A chemical mechanical polishing system comprises: a front-end module (101), used to store and/or test a wafer; a plurality of polishing units (102, 103, 104, 105), disposed side by side and at least one thereof being adjacent to the fron...  
WO/2018/046480A3
The invention relates to a vibration polishing device comprising: a vibration drive (1) for generating an oscillating vibration for polishing samples, a polishing disc (2) which is connected to the vibration drive (1) and can be driven t...  
WO/2018/046479A3
The invention relates to a vibration polishing device comprising: a vibration drive (1) for generating an oscillating vibration for polishing samples, a polishing disc (2) which is connected to the vibration drive (1) and can be driven t...  
WO/2018/043504A1
Provided is a polishing composition which is effective for reducing surface defects. A polishing composition according to the present invention contains abrasive grains, a water-soluble polymer and a basic compound. The water-soluble pol...  
WO/2018/045039A1
A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is...  
WO/2018/042761A1
Provided is a semiconductor wafer lapping method with which the occurrence of a ring-shaped pattern in a nanotopography map can be suppressed. The semiconductor wafer lapping method according to the present invention is characterized by ...  
WO/2018/039537A1
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner including a conductive b...  
WO/2018/037878A1
The present invention is a polishing apparatus comprising: a surface plate to which a polishing cloth for polishing a wafer is attached; and a plurality of polishing heads that are rotatable while holding the wafer and are capable of pre...  
WO/2018/034308A1
The present invention relates to a polishing method for polishing a substrate such as a wafer. The polishing method comprises: polishing a substrate (W) by pressing the substrate (W) against the surface of a polishing pad (3); changing t...  
WO/2018/030254A1
Disclosed is a method for washing a substrate using a washing liquid containing at least any one of the following (A), (B) and (C) after chemical-mechanical planarization of the substrate: (A) a reducing agent having the ability to donat...  
WO/2018/028846A1
The invention relates to a grinding disc for processing material surfaces, comprising a disc-shaped base body (3) which has a tool side (13) that can face towards a tool and a workpiece side (12) that can face towards a workpiece, and wh...  
WO/2018/028849A1
The invention relates to a roughing disc for machining material surfaces, comprising a disc-like main body (3) with a tool side (13) that is able to face towards a tool and a workpiece side (12) that is able to face towards a workpiece, ...  
WO/2018/029612A1
The present disclosure relates to lapping pads which include an abrading layer, wherein the abrading layer includes a working surface and a second surface opposite the working surface having a projected area Ap, and at least one cavity h...  
WO/2018/025655A1
Provided is a liquid concentrate of a composition for rough-polishing silicon wafers, which, when being diluted, is able to deliver preferable polishing performance, and which exhibits excellent stability. The liquid concentrate of a com...  
WO/2018/025656A1
The present invention provides a production method for a silicon wafer rough-polishing composition, said method being capable of simultaneously providing excellent stability and the advantage of a concentrated liquid, and enabling improv...  
WO/2018/026075A1
The present embodiments provides a mechanism in which the thickness of a scanned wafer shape is calculated to determine a profile, and a calculated PV value and a set predictive PV value for each profile are used such that a delta correc...  
WO/2018/025915A1
This polishing tool comprises a laminate plate that has a thermosetting resin layer and a thermoplastic resin layer, wherein the thermosetting resin layer includes an organic fiber aggregate, the thermoplastic resin layer does not includ...  
WO/2018/020798A1
The present invention limits roll-off of the outer edge of wafers in double-sided polishing and reduces variation in flatness. Provided is a method for double-sided wafer polishing in which the wafers, which have been set inside the wafe...  
WO/2018/020931A1
Abrasive grains according to the present invention are abrasive grains in which the surfaces thereof are coated with an additive and that are formed of inorganic abrasive particles having a positive zeta potential at pH 8 or lower. Also,...  
WO/2018/022520A2
A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plura...  
WO/2018/021428A1
Provided is a polishing pad having a polishing surface which has a zeta potential of +0.1 mV or higher at pH 10.0. Preferably, also provided is a polishing pad that comprises a polyurethane including a tertiary amine. More preferably, th...  

Matches 1 - 50 out of 26,981