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Matches 1 - 50 out of 28,571

Document Document Title
WO/2020/100985A1
In one embodiment, there is provided a polishing liquid composition capable of reducing scratching of a substrate surface after polishing while ensuring polishing speed. The present disclosure, in one embodiment, pertains to a polishin...  
WO/2020/100563A1
Provided is a silicon wafer pre-polishing composition that has an exceptional ability to eliminate bulging of an HLM margin and is capable of preventing or suppressing polishing vibration. The polishing composition provided by the presen...  
WO/2020/096010A1
The present invention relates to a curable composition comprising: (A) a rotaxane monomer which has a composite molecular structure comprising cyclic molecules and an axial molecule extending through the rings of the cyclic molecules, th...  
WO/2020/095883A1
Provided are: a semiconductor wafer polishing auxiliary sheet that can be prevented from being polished away along with a semiconductor wafer and that is capable of preventing a semiconductor wafer from being contaminated or damaged due ...  
WO/2020/095832A1
The present invention uses a polyurethane for polishing layers, which has a carboxylic acid ester group, and preferably uses a polyurethane which has a carboxylic acid ester group in at least one of a side chain, an end of the main chain...  
WO/2020/089129A1
The invention pertains to compositions comprising at least one polymer or precursors thereof, at least one liquid medium and a plurality of microcapsules having a cross-linked polymeric shell and a core containing at least one (per)fuoro...  
WO/2020/091000A1
[Problem] To provide a polish composition having a high polishing rate and capable of suppressing the occurrence of defects, when used for CMP polishing for a device wafer. [Solution] This polishing composition includes silica particles,...  
WO/2020/082259A1
An apparatus and method for chemical mechanical polishing (CMP), the apparatus includes a platen (301), a slurry supply (306), and at least one scraping fixture (320). The platen is configured to rotate a pad (302) thereon about a centra...  
WO/2020/077849A1
The present application relates to the technical field of crystalline material processing. Disclosed are a high-flatness, low-damage and large-diameter monocrystalline silicon carbide substrate, and a manufacturing method therefor. The s...  
WO/2020/081906A1
An abrasive tool comprises an arbor having a body formed with an internal bore, a mounting plate disposed on the arbor, a cover plate, an abrasive article disposed between the mounting plate and the cover plate, and at least one internal...  
WO/2020/078729A1
Described herein is a method for facilitating chemical mechanical polishing. The method comprises determining contact mechanics information indicative of contact pressures and friction forces between a wafer and a pad during the chemical...  
WO/2020/074634A1
The present invention provides an apparatus for working oppositely arranged first and second surfaces of a pressing section. The apparatus comprises an upper working unit forming a top wall and an upper sidewall extending downwardly from...  
WO/2020/075654A1
The present invention addresses the problem of providing a silica-based particle dispersion which contains a silica-based particle group and with which a high polishing rate and high surface precision can be achieved with respect to a si...  
WO/2020/066786A1
In an embodiment, provided is a polishing liquid composition capable of improving the abrasion rate of a silicon oxide film. In an embodiment, the present disclosure pertains to a polishing liquid composition that is for a silicon oxide ...  
WO/2020/068629A1
A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or cerami...  
WO/2020/067401A1
The purpose of the present invention is to provide: a polishing pad which is capable of reducing the occurrence of scratches; and a method for producing a polished article. A polishing pad which is provided with a polyurethane sheet as a...  
WO/2020/066671A1
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...  
WO/2020/066873A1
Provided is a method that is for polishing a silicon wafer by a polishing device using a carrier holding the silicon wafer, and that can reduce wear on the carrier. In this polishing method, a polishing liquid used in the polishing devic...  
WO/2020/065723A1
A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, wherein the abrasive grains contain a first particle and a second particle in contact with the first particle, the secon...  
WO/2020/064282A1
The invention relates to a method for polishing a semiconductor wafer in that at least one side of the semiconductor wafer is pressed against a polishing pad secured to a rotating polishing disc in the presence of a polishing agent. The ...  
WO/2020/068345A1
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least...  
WO/2020/066998A1
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...  
WO/2020/067057A1
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...  
WO/2020/057330A1
A polishing and loading/unloading component module, comprising a loading/unloading module and two polishing modules; the loading/unloading module is at the middle, and the two polishing modules are located at two sides thereof, the loadi...  
WO/2020/056818A1
Disclosed is a polishing loading and unloading component module containing a movable loading and unloading module. The polishing loading and unloading component module comprises one loading and unloading module and two polishing modules,...  
WO/2020/054823A1
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...  
WO/2020/055571A1
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.  
WO/2020/051729A1
A ceramic sphere abrasive, a preparation method therefor, and use thereof. The ceramic sphere abrasive comprises the following components in mass percentages: 6-30% of grinding agent; 0.5-5% of dispersant; 15-40% of suspending agent; 10-...  
WO/2020/047942A1
Disclosed is a chemical mechanical planarization apparatus, comprising a polishing module, a cleaning unit (200) and a wafer transmission module, wherein the polishing module includes two columns of polishing unit arrays (100), and each ...  
WO/2020/050932A1
Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor for...  
WO/2020/045087A1
Provided are alumina abrasive grains for chemical mechanical polishing that: suppress the occurrence of polishing scratches during chemical mechanical polishing when wiring semiconductor devices, while providing high-speed polishing of a...  
WO/2020/045088A1
Provided is an aqueous dispersion for chemical mechanical polishing that: suppresses the occurrence of polishing scratches during chemical mechanical polishing performed during wiring of semiconductor devices, while providing high-speed ...  
WO/2020/036038A1
Use is made of a polyurethane for polishing layers that is a thermoplastic polyurethane which is for use as the material of the polishing layers of polishing pads and which is a product of reaction of raw polyurethane materials comprisin...  
WO/2020/035764A1
A structured abrasive article comprises a backing having first and second opposed major surfaces and an abrasive layer securely bonded to the first major surface of the backing. The abrasive layer comprises shaped abrasive composites. Ea...  
WO/2020/036953A1
Apparatus and systems are disclosed of a splash guard for a grinder/polisher having a base, a bowl, and a platen having an outer edge to prevent splashing during the grinding/polishing operation. The splash guard includes an inner sidewa...  
WO/2020/032106A1
[Problem] To provide a local polishing technique that stabilizes the volume of processing by means of local polishing, that can achieve a high level of corrective space resolution, and that is preferable for corrective polishing. [Soluti...  
WO/2020/032056A1
The present invention relates to a curable composition comprising: (A) a polypseudorotaxane monomer that has a composite molecular structure composed of a ring-shaped molecule having a polymerizable functional group and an axle molecule ...  
WO/2020/024879A1
A grinding disk kit for use in convex roller rolling surface finishing, comprising a coaxial pair of first and second grinding disks (21/22), first and second grinding disk front surfaces (211/221) being arranged opposite. The first grin...  
WO/2020/024878A1
A grinding disk kit for finishing rolling surfaces of a bearing roller, comprising a pair of first and second grinding disks (21/22) that are coaxial, a front face (211) of the first grinding disk comprising a set of radially distributed...  
WO/2020/027260A1
Provided is a polishing composition capable of quickly removing an oxide film even at a low abrasive grain concentration. This polishing composition contains a silica having a silanol group density of 2.0 OH/nm2 or more, and an organic s...  
WO/2020/022415A1
In this SiC wafer (40) manufacturing method, a SiC wafer (40) is manufactured wherein a work-affected layer removal step for removing a work-affected layer generated on the surface and interior of the SiC wafer (40) has been performed an...  
WO/2020/020568A1
A tool (1) for modifying substrate support elements (21) of a substrate holder (20), the substrate support elements having support surfaces (22) for supporting a substrate, said tool comprising a main body (2) having a main body surface ...  
WO/2020/021774A1
The purpose of the present invention is to provide a uniform polishing pad which can be manufactured in an improved work environment and has a hardness suitable for chemical mechanical polishing. Provided is a polishing pad comprising a ...  
WO/2020/021871A1
Provided are a workpiece double-side polishing device and workpiece double-side polishing method by which, during double-side polishing, double-side polishing can be finished at a time when the shape of the workpiece becomes a target sha...  
WO/2020/013151A1
According to one embodiment for supplying an automated device that conveys a rectangular substrate, a substrate-conveying device is provided for conveying the rectangular substrate, the substrate-conveying device having: a plurality of c...  
WO/2020/013332A1
The present invention provides: a chemical mechanical polishing composition which contains a polishing agent, a basic component, a polyoxyalkylene alkyl ether represented by formula (i) RO-(AO)n-H (wherein R represents a linear or branch...  
WO/2020/013508A1
A retainer ring according to an embodiment of the present invention is used in a CMP device and comprises: a frame layer which is coupled to the lower end of a carrier of the CMP device and includes a thermosetting resin; a synthetic res...  
WO/2020/007015A1
A diamond composite material comprising a honeycomb core material and water-soluble gypsum foam filled in pores of the honeycomb core material. The water-soluble gypsum foam comprises the following components in percentage by weight: ino...  
WO/2020/009055A1
Provided is a polishing procedure with which it is possible to improve the flatness of a substrate without a significant reduction in polishing speed. More specifically, provided is a polishing composition containing inorganic particles,...  
WO/2020/009054A1
The present invention provides a polishing means which is capable of improving the flatness of a substrate without significantly reducing the polishing rate. The present invention specifically provides a polishing composition which conta...  

Matches 1 - 50 out of 28,571