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Matches 1 - 50 out of 27,518

Document Document Title
WO/2019/029605A1
An adaptive polishing head (100), comprising: a pivot component (10), a base body (30) and a clip component (20); the pivot component (10) is composed of a shaft body (11) and a disc body (12), the base body (30) is provided with a shaft...  
WO/2019/025142A1
A device manufacturing method comprising: forming a layer on a substrate by a layer-forming process; determining a value of a metric at a plurality of positions across the substrate, wherein variation of the values across the substrate i...  
WO/2019/026021A1
An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surf...  
WO/2019/028324A1
Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming...  
WO/2019/026478A1
Provided are: a composition for treating a semiconductor, the composition being capable of suppressing damage by corrosion on tungsten-containing wires or the like of an object to be treated and efficiently removing contamination from th...  
WO/2019/019941A1
The invention discloses a polishing head (100) capable of preventing water accumulation. The polishing head (100) comprises a base body (30), a clamping sheet assembly (10), and a cap body (20), and further comprising a gland (50), which...  
WO/2019/023221A1
Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such ...  
WO/2019/021897A1
The present invention is a polishing cloth provided with, as forming materials: a nonwoven fabric; and a resin impregnating the nonwoven fabric, wherein the existence rate of the forming materials in an area from the center portion in th...  
WO/2019/022961A1
Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In on...  
WO/2019/017407A1
Provided is a method for polishing a substrate, the method being capable of efficiently achieving a surface having high flatness and few defects. This method for polishing a substrate comprises a plurality of pre-polishing steps in which...  
WO/2019/012388A1
The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a ceramic body having an abrad...  
WO/2019/013523A1
An embodiment relates to a polishing pad comprising a window similar in hardness to a polishing layer. The polishing pad comprises a window similar in hardness and polishing rate to a polishing layer has the effect of preventing surface ...  
WO/2019/014213A1
A method of CMP includes providing a slurry solution including ≥1 per-compound oxidizer in a concentration between 0.01 M and 2 M with a pH from 1 to 5 or 8 to 11, and ≥1 buffering agent which provides a buffering ratio ≥1.5 that c...  
WO/2019/012391A1
The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a body having an abrading surf...  
WO/2019/012389A1
The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic ex...  
WO/2019/012949A1
The present invention pertains to a polishing method for performing polishing by sliding, with respect to an abrasive cloth attached to a surface plate, a semiconductor silicon wafer held by a polishing head while an abrading agent is be...  
WO/2019/012763A1
The lens manufacturing method according to one aspect of the present invention comprises a polishing step for polishing a to-be-processed lens made of Al2O3. The polishing step comprises a first polishing step for polishing the Al2O3 len...  
WO/2019/009035A1
A displacement magnifying mechanism is provided with: a base portion as a substrate; a first attachment portion and a second attachment portion which are provided on a surface on one side of the base portion; a first piezoelectric elemen...  
WO/2019/003959A1
An aspect of the present invention provides a polishing liquid composition capable of enhancing polishing speed and reducing short-wavelength undulation after polishing. An aspect of the present invention relates to a polishing liquid co...  
WO/2019/004161A1
One embodiment of the present invention is a silica slurry for a polishing-liquid composition, said slurry comprising silica particles, a redispersion aid and water, the redispersion aid being an alkali thickening polymer emulsion, and t...  
WO/2018/234030A2
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2018/225658A1
The present invention pertains to a method for polishing using a polishing pad provided with a prescribed adsorption layer. The polishing pad is provided with an adsorption layer that comprises, inter alia, silicone comprising a linear p...  
WO/2018/221357A1
The present invention addresses the problem of providing a ceria-based composite particle dispersion which is capable of performing polishing at high speed, even for silica films, Si wafers, and difficult to process materials, and which ...  
WO/2018/221304A1
The present invention addresses the problem of providing a nanobubble-containing inorganic oxide fine particle dispersion exhibiting excellent concentration stability in the process of being used as a polishing agent. The present inventi...  
WO/2018/222857A1
Embodiments of a polishing film are provided. The polishing film includes a substrate having a surface. Abrasive particles are attached to the surface of the substrate, and microcapsules are attached to the surface of the substrate at lo...  
WO/2018/216445A1
The present invention planarizes a substrate that has recesses and projections. The present invention provides a method for chemically mechanically polishing a substrate; and this method comprises a step for polishing a substrate with us...  
WO/2018/216593A1
A polishing pad which is provided with a base material and a resin part that is arranged on the base material, and which is configured such that: the resin part constitutes a recessed and projected pattern by itself or together with the ...  
WO/2018/216733A1
The present invention provides a polishing composition which is thickened, while maintaining properties such as dispersibility of abrasive grains, polishing rate and reduced haze. The present invention is a polishing composition which co...  
WO/2018/216433A1
Provided are a method for producing a treated member on which treatment such as smoothing can be stably performed on both surfaces thereof even in the case of a brittle substrate, and a laminate. The method for producing the treated memb...  
WO/2018/216720A1
Provided is an ultrasonic machining apparatus that is capable of improving microfabrication machining precision with respect to a workpiece. This ultrasonic machining apparatus 10 comprises: a base 12; an ultrasonic unit 18 that has a st...  
WO/2018/216218A1
The present invention addresses the problem of providing a production method for a nano-bubble-containing liquid dispersion of inorganic oxide fine particles which has excellent concentration stability in a process of using the liquid di...  
WO/2018/211903A1
The present invention provides a silicon wafer polishing method of polishing a silicon wafer with a polishing slurry interposed between the silicon wafer and a polishing pad, the silicon wafer polishing method being characterized in that...  
WO/2018/207670A1
A Schiff-base-containing chain extender which is a Schiff-base-containing diol or a derivative thereof; a polyurethane produced using the chain extender; a method for modifying the polyurethane; a polishing layer including a polyurethane...  
WO/2018/198997A1
Provided is a CMP polishing device for flattening a quadrilateral substrate. Provided is a polishing device for polishing a quadrilateral substrate, the polishing device having a substrate retaining part for retaining a quadrilateral sub...  
WO/2018/198583A1
The present invention is a silicon wafer polishing method, comprising: a first polishing step for bringing the surface of a silicon wafer held by a polishing head into sliding contact with a polishing cloth attached to a surface plate an...  
WO/2018/200165A1
An apparatus for performing chemical mechanical planarization is disclosed. The apparatus includes a support, wherein an axis of rotation extends through the support. The apparatus includes at least one elongated member including a first...  
WO/2018/198707A1
The present invention relates to a method for diminishing the peak power of a substrate processing device. In addition, the present invention relates to a substrate processing device operating method for processing a substrate such as a ...  
WO/2018/193916A1
[Problem] To provide: a polishing composition which, when used in a wafer polishing step, gives a flat polished surface having a small difference in surface level between the central part and peripheral part (laser mark part) of the wafe...  
WO/2018/193758A1
The present invention provides a double-sided wafer polishing method for placing multiple double-sided polishing carriers in a double-sided polishing apparatus and performing double-sided polishing of wafers, wherein, when readying a car...  
WO/2018/190077A1
The present invention provides a synthetic quartz glass substrate polishing agent comprising polishing particles and water, and is characterized in that the polishing particles comprise silica particles as base particles, on the surface ...  
WO/2018/190079A1
A wafer-retaining elastic film (10) of a CMP device, having: a film body (11) formed from an elastic material; and a coating layer (12) provided so as to cover the wafer-retaining-side surface of the film body (11). The coating layer (12...  
WO/2018/179685A1
A substrate processing device having a substrate polishing unit 40 provided with a polishing pad for polishing a wafer W, and a top ring 41 for holding the wafer and pushing the wafer toward the polishing pad. An elastic film 80 that hol...  
WO/2018/181713A1
[Problem] To efficiently produce silica particles by inhibiting production of unreacted materials. [Solution] This silica particle liquid dispersion production method comprises simultaneously adding, to liquid I containing silica seed pa...  
WO/2018/181347A1
The objective of the present invention is to provide a polishing pad having excellent polishing performance and excellent polishing slurry discharging characteristics. This polishing pad has a polishing portion and a groove portion in a ...  
WO/2018/182945A1
Embodiments of the disclosure relate to a system, apparatus and method for polishing thin substrates with high planarity. The apparatus comprises a chemical mechanical polishing head and a plate. The polishing head comprises a bottom sur...  
WO/2018/180153A1
The present invention provides a polishing composition whereby it becomes possible to provide a silicon wafer that is reduced in the occurrence of edge roll off and is improved in the overall flatness when the silicon wafer is roughly po...  
WO/2018/180479A1
Provided is a polishing composition capable of effectively reducing an edge roll-off amount. A polishing composition provided by the present invention contains abrasive grains, a basic compound, a nitrogen-containing water-soluble polyme...  
WO/2018/173421A1
The present invention addresses the problem of providing a polishing device capable of maintaining a polishing member in an excellent state while polishing is performed. Provided is a polishing device for locally polishing a substrate. T...  
WO/2018/173814A1
The present invention provides a polishing composition that is capable of attaining adequate planarization and has a low etching speed while having a high polishing speed. The present invention is a polishing composition including abrasi...  
WO/2018/169536A1
Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, and related systems and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support; a first pedestal extending from the suppor...  

Matches 1 - 50 out of 27,518