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Matches 1 - 50 out of 27,980

Document Document Title
WO/2019/159603A1
The present invention is a double-sided polishing method for a wafer, for holding the wafer in a work piece holding hole formed in a carrier in a double-sided polishing device, sandwiching the wafer between an upper surface plate and a l...  
WO/2019/154630A1
An improved treatment tool (100) for reconditioning the top surfaces of a plurality of projections (20) of a substrate support (60) in a lithographic tool. The improved treatment tool includes a reconditioning surface which is rough rela...  
WO/2019/154790A1
The invention relates to a method for polishing a semiconductor wafer, which is polished simultaneously on both sides on the front side and on the reverse side between an upper polishing plate (11) and a lower polishing plate (12), which...  
WO/2019/151185A1
In the present invention, when a glass blank is being cut out from a glass plate, first laser light is moved relative to the glass plate such that a focal position of the laser light is located in the interior of a plate thickness direct...  
WO/2019/151145A1
Provided are: a chemical mechanical polishing composition which can polish a semiconductor substrate (particularly, a ruthenium film-containing substrate) at high speed and reduce polishing scratches on a surface to be polished while sup...  
WO/2019/151144A1
Provided are: a chemical mechanical polishing composition which can polish a semiconductor substrate (particularly, a ruthenium film-containing substrate) at high speed and reduce polishing scratches on a surface to be polished while sup...  
WO/2019/151041A1
A substrate processing system for processing a substrate, which comprises: a carry in/out unit for carrying a substrate between the system and the outside; a processing unit for processing a surface of the substrate; a cleaning unit whic...  
WO/2019/151584A1
The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower par...  
WO/2019/139586A1
Disclosed herein are chemical mechanical polishing (CMP) polishing pad and platen structures, and related systems and techniques. For example, in some embodiments, a CMP conditioning system may include a CMP polishing pad structure and a...  
WO/2019/138846A1
The present invention provides a polishing composition with which polishing rates can be effectively improved and which is for polishing works to be polished. The polishing composition comprises water, abrasive grains, an oxidant, and a ...  
WO/2019/139117A1
This polishing pad is capable of polishing an article to be polished while rotating as a polishing slurry is supplied, wherein: the polishing pad is provided with a polishing layer having a polishing surface that is capable of polishing ...  
WO/2019/131761A1
This abrasive composition for abrading a resin and copper or a copper alloy, comprises alumina abrasive grains, glycine, an anionic surfactant, and water.  
WO/2019/130740A1
This suction chuck is provided with: a suction chuck stage having a circular suction surface; and a suction pad that is provided on the suction surface. The suction chuck is also provided with, at an outer peripheral portion of the sucti...  
WO/2019/131174A1
The present invention relates to a device for partially removing material constituting the surface of a substrate. In one embodiment, the substrate processing device comprises a holding mechanism unit (5) for holding the substrate (W), a...  
WO/2019/131885A1
Provided is a slurry for polishing, which is used for polishing of an interlayer insulating film, and which contains silica abrasive grains and organic ammonium cations that have a molecular weight of 155 or less.  
WO/2019/130764A1
Provided is a method for two-sided polishing of a wafer that makes it possible to curb variance between batches in GBIR values of polished wafers. This method for two-sided polishing of a wafer is characterized by comprising: a step (S10...  
WO/2019/131887A1
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyur...  
WO/2019/131450A1
Provided is a polishing composition capable of reducing device vibrations. This polishing composition comprises colloidal silica, a water-soluble polymer, a basic compound, water, and a vibration suppression agent which is a polymer havi...  
WO/2019/130757A1
Provided are a double-side polishing device and a double-side polishing method with which it is possible to end double-side polishing when a workpiece has obtained an intended shape in the middle of double-side polishing. An arithmetic u...  
WO/2019/131762A1
This abrasive composition for abrading a resin and copper or a copper alloy, comprises alumina abrasive grains, glycine, hydrogen peroxide water, and water.  
WO/2019/131886A1
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyur...  
WO/2019/131874A1
Provided is a method for producing a chain-like silica particle dispersion. The production method has: a dispersion preparation step for hydrolyzing an alkoxysilane in the presence of ammonia to produce a silica particle dispersion; an a...  
WO/2019/131448A1
Provided is a polishing composition which can further reduce minute defects and haze in a polished semiconductor wafer. The polishing composition comprises abrasive grains, a basic compound and a vinyl alcohol-based resin having a 1,2-di...  
WO/2019/131545A1
A polishing solution composition for silicon oxide films according to the present invention contains cerium oxide particles, a water-soluble polymeric compound and a water-based medium, wherein the water-soluble polymeric compound is a w...  
WO/2019/131431A1
This disk-shaped glass substrate manufacturing method is for manufacturing a disk-shaped glass substrate from which one or more sheet glass substrates are to be cut out. The disk-shaped glass substrate manufacturing method comprises: pre...  
WO/2019/125572A1
A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin ...  
WO/2019/124442A1
[Problem] To provide a composition for polishing that eliminates a protrusion in the periphery of a laser mark in a wafer polishing process, and a polishing method in which the same is used. [Solution] A composition for polishing for eli...  
WO/2019/125571A1
A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element t...  
WO/2019/116833A1
The present invention provides a polishing composition whereby, when a silicon wafer is roughly polished, it becomes possible to prevent the elevation of the periphery of a hard laser mark, it also becomes possible to reduce the surface ...  
WO/2019/111686A1
A polishing composition containing a cellulose derivative and water is provided. Prior to being mixed with water, the cellulose derivative has the form of a hydrophobized cellulose derivative having an aldehyde added to the surface of sa...  
WO/2019/110385A1
The invention relates to a rotor disk for guiding semiconductor wafers during material-removing machining of the semiconductor wafers on both sides. The rotor disk is coated with a layer of diamond-like carbon. The layer contains hydroge...  
WO/2019/100461A1
A multi-chip thickness compensation device for single-sided polishing, a grinding device, and a grinding method. The device comprises a carrier (1). Multiple chip accommodation grooves (7) are formed in the carrier (1). Chip carrying cus...  
WO/2019/099541A1
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...  
WO/2019/097945A1
The present invention relates to a polishing agent for a synthetic quartz glass substrate, the polishing agent being characterized by comprising wet ceria particles and non-spherical silica particles, wherein the average primary particle...  
WO/2019/094227A1
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...  
WO/2019/087818A1
Provided is a polishing composition which contains a water-soluble polymer compound and which is suitable for reducing LPD. The polishing composition according to the present invention contains abrasive grains, a water-soluble polymer co...  
WO/2019/088600A1
The present invention relates to a polishing apparatus which is disposed below a polishing wheel so as to polish the surface of a workpiece, the polishing apparatus comprising: a frame which has a central shaft disposed collinearly to on...  
WO/2019/089467A1
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in...  
WO/2019/088209A1
According to the present invention, in a particle size distribution for a cerium oxide contained in a polishing liquid as obtained by a laser diffraction/scattering method, D5 is 1 μm or less, and the difference between D95 and D5 is 3 ...  
WO/2019/077687A1
This silicon wafer polishing method includes a final polishing step comprising a preliminary stage polishing step, and, thereafter, a finishing polishing step. The preliminary stage polishing step comprises first supplying, as the polish...  
WO/2019/078009A1
A device (2) for affixing a wafer (W) to a single-side polishing device (1), wherein the device (2) affixes the wafer to the single-side polishing device by means of surface tension of water, is provided with: a temporary cradle (21) whi...  
WO/2019/078202A1
This polishing jig for holding and polishing a plate-like body comprises a metal plate including a through-hole for holding the plate-like body, and a gear portion which engages with an outer circumference of the metal plate, wherein the...  
WO/2019/074098A1
The objective of the present invention is to provide a polishing pad with which it is possible to reduce the occurrence of scratches while maintaining a high polishing rate, and a method for manufacturing the same. This polishing pad is ...  
WO/2019/073956A1
A holding pad comprising a resin sheet which has a holding surface for holding an object to be polished, wherein the penetration speed, expressed in formula (1), of ethanol into the holding surface is 1.0 to 2.0 deg/s. (1): penetration s...  
WO/2019/070757A1
Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surfa...  
WO/2018/234030A3
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2019/064121A1
Polymeric foam layer having a thickness up to 25,700 micrometers, having first and second opposed major surfaces, and comprising foam features extending from or into the first major surface by at least 100 micrometers, and having a Tg in...  
WO/2019/066014A1
Provided is a polishing composition which exhibits excellent polishing performance with respect to the surfaces of materials such as alloys, resins, metals, semimetals, and oxides of metals or semimetals, and which is reduced in scatteri...  
WO/2019/065994A1
Provided is a polishing composition which is capable of achieving a good balance between high polishing rate and good surface quality. The present invention provides a polishing composition for polishing a polishing object material. This...  
WO/2019/065357A1
Provided is a polishing composition having excellent capability for removing protrusions at the hard laser mark periphery. This polishing composition contains abrasive grains, a basic compound, and water. The basic compound includes a co...  

Matches 1 - 50 out of 27,980