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WO/2024/076421A1 |
A polishing system includes a pressure system, a substrate carrier including a membrane, a first sensor, and a control system. A first compartment of the membrane is fluidly coupled to the pressure system. The first sensor is configured ...
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WO/2024/066957A1 |
A grinding machine and a control method therefor. The control method comprises: making a cross beam (41) of a cross beam and slider assembly (4) to slide relative to a fixing base (1); and/or making a slider (42) to slide relative to the...
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WO/2024/047149A1 |
The invention relates to a glazed assembly comprising a monolithic or laminated glazing (300) and a finishing joint and/or seal (50), the glass sheet of the monolithic glazing, or, respectively, an external sheet (320) of the laminated g...
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WO/2024/041451A1 |
The present invention relates to the field of optical cold working equipment. Disclosed is a down swing polishing machine, comprising a seat and a base connected to the seat by means of three bearing units; a pressure unit is provided on...
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WO/2024/042559A1 |
Holding unit (10) for holding a sheet (200) comprising a stabilizer device (11) provided with gripping members (12, 13) of which at least one is mobile with respect to the other along an axis of grip and release (Z) to hold said sheet (2...
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WO/2024/041619A1 |
The present application relates to the technical field of grinding machines, and specifically provides a chuck assembly, a grinding machine and a control method therefor. The grinding machine comprises a feeding device, the chuck assembl...
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WO/2024/041159A1 |
An ultrasonic thinning device for a wafer, comprising an adsorption unit and a grinding unit. The adsorption unit comprises vacuum suction cups (20) each having a cup body (201); air flow channels (202) and adsorption holes (203) are eve...
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WO/2024/036653A1 |
The present invention relates to the technical field of automated production, and specifically relates to an automatic material-preparation system. The automatic material-preparation system comprises a rack, a transfer manipulator, a mat...
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WO/2024/022445A1 |
A mechanism having a bidirectional rotation function, comprising a driver (1), and an inner shaft (3) and an outer shaft (4) which are in driven connection to the driver (1), the outer shaft (4) being sleeved on the inner shaft (3). A sp...
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WO/2024/018495A1 |
Method for holding and performing work on a sheet (200) which has a first lateral surface (210), an opposing second lateral surface (211) and a perimeter edge (212), comprising: a step of holding said sheet (200), a step of working said ...
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WO/2024/016558A1 |
A brick-pushing device, comprising a first brick-pushing component (1), which is equipped with an adjusting electric motor (31) and an adjusting seat (32), wherein a limiting block (33) is provided on the adjusting seat (32), the adjusti...
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WO/2024/007231A1 |
The present application relates to the technical field of turret machining, and discloses end face tooth polishing equipment for a turret. The equipment comprises a frame; the frame is provided with a workbench; a mounting base for mount...
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WO/2024/007725A1 |
A sharpening machine for a linear probe, comprising a sharpening positioning module (400), a clamping module (200) and a grinding machine (900); the sharpening positioning module (400) comprises two semicircular pipes (480), and the two ...
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WO/2024/007519A1 |
A brick pushing device, comprising two independent brick pushing mechanisms arranged oppositely. Each brick pushing mechanism comprises a support base (1), a brick pushing support (2) slidably arranged on the support base (1), a brick pu...
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WO/2024/009775A1 |
This substrate processing device comprises: a substrate clamping unit that clamps a substrate; a supply unit the supplies a fluid to the inside of the substrate clamping unit; a suction unit that suctions the fluid from the inside of the...
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WO/2024/001048A1 |
A polishing head driving device and a polishing machine. The polishing head driving device comprises: a main shaft (6), which is used for connecting to a polishing head (1); a bearing seat (5), which is sleeved outside the main shaft (6)...
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WO/2024/004552A1 |
An eyeglass lens processing system that retrieves and transports, using a transport robot, an eyeglass lens processed by an eyeglass lens processing device, wherein: the transport robot is configured to hold, using a holding part, either...
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WO/2024/001389A1 |
A reciprocating abrasive flow polishing device based on a cavitation effect. A lower sealing plate (3) is hermetically connected to an opening at an upper end of a lower box body (1), and the lower sealing plate (3) can move up and down ...
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WO/2023/248033A1 |
Described is a polishing head (1) comprising a first flange (2) for connection to a drive shaft, a protective casing (3), comprising an engaging element (31) operatively connectable to said drive shaft for transmitting a rotary motion to...
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WO/2023/248860A1 |
A device for treating a substrate which comprises: a treatment part in which an aqueous solution containing hydrofluoric acid, nitric acid, and phosphoric acid is fed to the substrate; a collecting part which collects the aqueous solutio...
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WO/2023/250444A2 |
A tool handle having a grip portion with two parallel attachment legs projecting perpendicular to the grip portion; the grip portion having a threaded hole for mounting a threaded extension pole; the threaded hole located on top of the g...
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WO/2023/249572A1 |
This invention relates to a system (1) that determines whether the level of looseness and grain structure of leather cut pieces used in products produced using 100 % natural leather is in accordance with the customer standards and VDA st...
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/242729A1 |
A finishing station (1) configured for carrying out chamfers and/or slots on a block (5) of friction material of a brake pad (2) including a robotized articulated arm (8) provided with a head (11) rotating around a first axis (A) and car...
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WO/2023/239393A1 |
Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an elect...
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WO/2023/238452A1 |
[Problem] To provide a grinding system in which the main body of a glass plate can be firmly fixed and which, when the peripheral edges of the main body of the glass plate are ground by pressing the lateral surface (cylindrical portion) ...
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WO/2023/230846A1 |
A dovetail grinding fixture for a machine tool comprises a bottom plate and a workpiece, one end of the bottom plate is provided with a baffle, the other end of the bottom plate is provided with a second clamping piece, and three fixing ...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/228787A1 |
The present invention provides a method for producing a ground wafer, wherein a ground wafer is produced by grinding a starting material wafer that has a first main surface and a second main surface, the method comprising: a first resin ...
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WO/2023/228591A1 |
The present invention pertains to a cylinder grinding machine that comprises: first and second detection means for detecting, in a non-contact manner, proximity between one end or the other end of a crystal rod and a spindle or a counter...
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WO/2023/223959A1 |
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions.　Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a ...
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WO/2023/224477A1 |
A polishing and/or sanding head 1 has a frame and three discs movably coupled to the frame. Of these discs, a first disc 5 forms a round inner disc and a second disc 7 is annular and surrounding the first disc. These first and second dis...
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WO/2023/210073A1 |
The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing ...
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WO/2023/203323A1 |
A workrest (50) for a centreless grinding machine, with the workrest comprising a mount (52, 56) for mounting on a grinding machine, and a shoe holder (62) for carrying a shoe (70, 72) to be engaged with an outer circumferential surface ...
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WO/2023/189716A1 |
Provided is a dicing device that can perform a maintenance task well even when a workpiece is large. This dicing device (10) comprises a housing (52) which accommodates in the interior thereof a work table (12) that holds and moves a wor...
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WO/2023/189113A1 |
A polishing device according to an embodiment comprises: a supporting unit for supporting a polishing tool; a stage for holding an object to be polished; a first drive unit for causing the support unit and the stage to move relative to o...
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WO/2023/185202A1 |
Disclosed in the present invention is a wafer polishing system, comprising: a wafer transfer apparatus that comprises a fixing base and a carrying table, the fixing base being capable of driving the carrying table to move in a wafer tran...
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WO/2023/176611A1 |
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the...
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WO/2023/175799A1 |
A grinding machine (1, 101, 201) comprises: a grinding wheel (T) for grinding a workpiece (W); moving bodies (12, 15) that move the grinding wheel relative to the workpiece; movement motors (12a, 15a) that move the moving bodies; manual ...
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WO/2023/175981A1 |
[Problem] To provide a machine tool equipped with a workpiece changer capable of reducing machining cycle time by reducing non-machining time, and also provide a corresponding machining system. [Solution] A workpiece changer 4 comprises:...
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WO/2023/169834A1 |
This disclosure presents a grinding angle setting device (100) for cooperative use with a grinding machine (200). The grinding machine (200) comprises a grinding means (210) and a support means (220) for supporting a grinding jig (1) hol...
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WO/2023/165200A1 |
An edge grinding head, comprising a support base (200), an edge grinding wheel (600), a feeding device (300), a main shaft working system (400), and a positioning device (500). The feeding device (300) drives the main shaft working syste...
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WO/2023/162296A1 |
Provided is a machining tool which is smooth to operate, is accurate and highly precise, can cope with small to heavy loads, has a tilting direction that can be fixed, has improved centering performance of a shaft after tilting, and is c...
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WO/2023/158481A1 |
An optical fiber polishing arm assembly comprises a base, at least one side support, an overarm, and a lock shaft. The at least one side support is operatively connected to the base and has a first radial edge with at least one notch. Th...
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WO/2023/152779A1 |
Work cell (100) comprising at least one automatic operating device (12) and feed means (18) configured to feed at least one tool (11, 40), characterized in that it comprises a fixed support (150) and at least one tool holder device (10) ...
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WO/2023/149161A1 |
This information processing device (5) comprises: an information acquisition unit (500) which acquires operation state information including an operation state when a substrate processing device (2) including a substrate holding unit (24...
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WO/2023/142579A1 |
A chemical-mechanical combined machining method for a silicon carbide surface, comprising the following steps: first mounting a grinding and polishing tool (1) and silicon carbide (2) on a machine table of grinding and polishing equipmen...
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WO/2023/146483A1 |
The present invention is a water tank (6) structure positioned under the counter in corrosion and polishing machines and relates to transition of dense puddle coming from a multi-processed area between the gradual labyrinths by coming to...
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WO/2023/146808A1 |
Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an elec...
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WO/2023/146486A1 |
The subject of the invention is an irrigation system in corrosion and polishing machines (8) and relates to cooling of the discs by preventing the heating, burning and corrosion problems of the process-induced discs by ensuring that the ...
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