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Patent Searching and Data


Matches 651 - 700 out of 9,077

Document Document Title
WO2002016078A3
CMP systems and methods implement instructions for moving a polishing pad (202) relative to a wafer (206) and a retainer ring (282) and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with dete...  
WO2002016080A3
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) ada...  
WO/2002/047870A1
Applying heat and pressure to a backing film (3) comprising an adhesive layer (4) during the procedure of mounting it to a polish head (1) for use in chemical mechanical polishing (CMP), inhomogeneities inside the adhesive layer (4), e.g...  
WO2002008636A3
Automatic balancer (300) for balancing a mass rotating at high speed reduces the impact of unbalanced rotary tools and other devices. The automatic balancer provides a housing (301) within which is defined a race (309). The race is acces...  
WO/2002/042033A1
A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is ad...  
WO/2002/036306A2
An apparatus for eliminating the differences in the curvatures of a facing lens blank and an abrasive pad mounted on a formable lap (20) includes a drivable track portion (14), a compensation pl ate (12) disposed on the drivable track po...  
WO/2002/036305A1
A centreless cylindrical grinding machine, for through-feed and in-feed grinding of various workpieces (8), has a first driven positioning axis X¿S? for a grinding spindle head (2) with a grinding wheel (1) and a second driven positioni...  
WO2001064391A3
A chemical mechanical planarization system and method for planarizing wafers is provided. The system generally includes a transfer corridor (104), at least one corridor robot (138,140), one or more polishing modules (106a,106b) and at le...  
WO2002011198A3
A method for controlling wafer uniformity in a polishing tool (20) includes providing a plurality of carrier heads (40), determining a signature for each of the carrier heads (40), and installing carrier heads (40) with similar signature...  
WO2000066903A9
A fixture (80) for selectively locating and retaining hydraulic gerotor rotors (30) in position in respect to a grinding wheel (20), the fixture clamping the rotor between two oversized positioning rolls (84) located in rotor lobe valley...  
WO/2002/026443A1
A polish head (3) for Chemical Mechanical Polishing comprises a backing film (5) made of silicone on a rigid support element (6, 7), preferably consisting of amorphous ceramic. The silicone backing film (5) is fabricated by molding, ther...  
WO/2002/024409A1
The CMP apparatus (1) is equipped with an attitude-maintaining means (50) which maintains a polishing member (40) in a fixed attitude with respect to a wafer (W) by applying a corrective moment to the polishing member during the polishin...  
WO/2002/024410A1
A CMP system make repeatable measurements of eccentric forces applied to carriers for wafer or conditioning pucks. Force applied to the carrier may be accurately measured even though such force is eccentrically applied to such carrier. A...  
WO/2002/016078A2
CMP systems and methods implement instructions for moving a polishing pad (202) relative to a wafer (206) and a retainer ring (282) and for applying pressure for CMP operations. Feedback of polishing pad position is coordinated with dete...  
WO/2002/016076A1
A sheet peripheral edge grinder, comprising a grinding wheel axis tilting mechanism (1) capable of varying the tilt angle of the rotating axis of a grinding wheel (3) relative to the rotating axis of a sheet (2) and also varying the dire...  
WO/2002/016080A2
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) ada...  
WO/2002/011198A2
A method for controlling wafer uniformity in a polishing tool (20) includes providing a plurality of carrier heads (40), determining a signature for each of the carrier heads (40), and installing carrier heads (40) with similar signature...  
WO/2002/007920A1
Known headstocks are relatively long since clamping chucks, the rotationally mounted spindle and the clamping cylinder etc are situated axially behind each other. The invention provides for a shortening of the headstock by accommodating ...  
WO/2002/007931A2
A carrier head (100) that has a base assembly (104) and a flexible membrane (140). The flexible membrane has a generally circular main portion (142) with a lower surface (144) that provides a substrate-mounting surface and a plurality of...  
WO/2002/008636A2
Automatic balancer (300) for balancing a mass rotating at high speed reduces the impact of unbalanced rotary tools and other devices. The automatic balancer provides a housing (301) within which is defined a race (309). The race is acces...  
WO/2002/006005A1
A method and apparatus for substantially nullifying vibration and deflection in a single point lens turning lathe (100) having a rapidly reciprocating lens cutting tool (114) and shuttle assembly. The apparatus includes three or more too...  
WO2001056743B1
An interfaced carrier assembly including an interface circuit (150) having printed contacts (152) to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material (154) on the...  
WO/2002/002276A2
A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle (412) capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a waf...  
WO/2002/000392A1
The invention relates to a device for loading and unloading optical workpieces, for an optical machine. Said device comprises a loading arm (24) which is pivotally driven about an axis (A) and is pivoted in controlled movement sequences ...  
WO2001038045A8
An assembly (10) for holding a cylindrical workpiece (12) for grinding. A support frame (11) includes a support arm (17) to initially hold the workpiece, a tailstock (20) mounted on the support frame to engage the proximal end (13) of th...  
WO/2001/098025A1
A ferrule holder assembly for an optical fiber end face polishing machine capable of solving a problem of a variation in length of a ferrule, comprising a ferrule holder panel (1) supported on the polishing panel of the optical fiber end...  
WO/2001/098026A1
A grinding machine uses a conical grinding wheel (10) to create a non-circularly symmetric surface (defining, for example, a re-entrant cam) on a workpiece. The machine is operable to rotate such a workpiece about a first axis (5) and th...  
WO/2001/096063A1
A grinding device capable of applying a further grinding process to a locally heavily ground ceramic bar, which process corresponds to each element on the ceramic bar, and reducing the cost required for the process without using any jig ...  
WO/2001/096066A1
In a method of chemical/mechanical polishing of a workpiece-employing a polishing apparatus, higher polishing uniformity is achieved by using a modified one-piece/one material backing film (20) to render the backing film (20) substantial...  
WO1999062671A9
An apparatus for polishing a silicon wafer comprises a polishing turntable mounted for rotation and adapted to receive a polishing pad. The apparatus further comprises a mounting fixture for rotating the wafer relative to the polishing p...  
WO/2001/094073A1
A random orbital sander (10; 150) including a housing (17), a motor (24) having a vertical axis (71) in the housing (17), a pad (14) coupled to the motor (24), a face (70) on the pad (14) extending substantially perpendicularly to the ve...  
WO/2001/091967A1
A centerless grinding machine (1) comprising a bed (108), a grinding wheel head (101), an adjusting grinding wheel head (102), and a work rest (103), wherein the grinding wheel head (101) and the adjusting grinding wheel head (102) are m...  
WO2001047665B1
The invention relates to a method and device for grinding fluted tools (10) that have an essentially circular envelope curve, in particular, for grinding spiral fluted tools. The device provided with a steady for guiding the tool to be g...  
WO/2001/083165A1
The present invention relates to an apparatus (1) for mechanically treating a surface, in particular milling, scouring, grinding and/or polishing the same, using a treatment device (3-9) which rotates about a horizontal axis, which treat...  
WO/2001/076820A1
The invention relates to a device for machining workpieces, in particular for finishing metal or ceramic mass-produced parts comprising small components and for machining, using micro-tools. Said device comprises a housing (1), a drive b...  
WO2001017724A3
The present invention is an ultrasonic transducer slurry dispensing device (110) and method for efficiently distributing slurry. The present invention utilizes ultrasonic energy to facilitate efficient slurry application in a IC wafer fa...  
WO/2001/070458A1
A machine for surface working flat ceramic products comprises an operating head comprising tool means (10) suitable for working an external surface of said products (6), cooling conduit means (38, 40, 41, 42, 44, 46) arranged for cooling...  
WO/2001/068314A2
The invention relates to a machining center provided with a workpiece machine tool. Said machine tool comprises: an essentially horizontal working plate (10) which is supported by a machine tool stand (2); a workpiece support (20) which ...  
WO/2001/066304A1
The present invention provides a grinding cup (1) having a lower grinding section (2) and an upper body section (3) integrally connected to form a grinding cup having top (4) and bottom (5) surfaces. The grinding section (2) is formed fr...  
WO/2001/064391A2
A chemical mechanical planarization system and method for planarizing wafers is provided. The system generally includes a transfer corridor (104), at least one corridor robot (138,140), one or more polishing modules (106a,106b) and at le...  
WO/2001/062438A1
A lens layout block device, comprising a device for sticking an elastic seal on a lens holder, a device for holding a lens on the lens holder having the elastic seal stuck thereon, a rotating arm (160), an arm driving device for rotating...  
WO/2001/060565A1
The invention relates to a method for the rotary grinding of a workpiece (14), whereby a rotating grinding disc (18) is brought against the surface (30) of the workpiece (14) to be ground, whilst the workpiece simultaneously turns about ...  
WO/2001/056743A1
An interfaced carrier assembly including an interface circuit (150) having printed contacts (152) to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material (154) on the...  
WO/2001/056740A1
The invention relates to a polishing head for a polishing machine, especially for polishing optical surfaces. The inventive polishing head comprises a polishing plate that is linked with a rotation-driven primary shaft. Said polishing pl...  
WO/2001/056742A1
A polishing device and a polishing method, wherein high-efficiency high-accuracy mirror finishing of work (including wafers) is made possible; a novel work holding plate for effectively holding work; and a work bonding method capable of ...  
WO/2001/054861A1
The invention relates to a receiving chuck for optical components for the purpose of precision grinding and/or polishing. The inventive receiving chuck is provided with a plurality of support elements consisting of an elastic material fo...  
WO/2001/049432A1
The invention relates to a machine, for the working of the walls which define the cavity of a continuous casting mould, with machine-cutting and/or polishing tools (12). The machine comprises a machine stand (1), with an arm (6), for mou...  
WO/2001/047665A1
The invention relates to a method and device for grinding fluted tools (10) that have an essentially circular envelope curve, in particular, for grinding spiral fluted tools. The device provided with a steady for guiding the tool to be g...  
WO/2001/047664A1
A polishing method and polishing device capable of improving the flatness of wafers. When a wafer is brought into contact with a wafer holding board and the surface to be polished of the wafer is pressed and abraded against an abrasive c...  
WO/2001/045897A1
An automatic trimmer machine (5) for finding the geometrical center of an optic having a non-round periphery, trimming the edge of the optic to a prescribed diameter for each optic, cleaning and drying the optic, and verifying the diamet...  

Matches 651 - 700 out of 9,077