Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 701 - 750 out of 9,053

Document Document Title
WO/2001/036152A1
A machine tool for polishing flat articles comprises a bed (1) with two vertical columns (C2) and a table (3) arranged between (C2) has a rotating faceplate (P4) that is provided with a plate (5) with vacuum holders (6). The machine tool...  
WO/2001/034346A1
Components of chemical, mechanical, polishing apparatus with components resistant to chemical attack by chemical slurries used in the polishing of semiconductor wafers. Among the components that are improved to enhance resistance to chem...  
WO/2001/032361A1
A lapping assembly (10) for lapping a group of workpieces (14) including a pair of lapping discs and a cassette (12) for positioning the workpieces between the lapping discs (16, 18). The lapping discs are provided with two-component tra...  
WO/2001/028740A1
An apparatus (10) for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit. The apparatus comprises a housing having a ...  
WO/2001/017724A2
The present invention is an ultrasonic transducer slurry dispensing device (110) and method for efficiently distributing slurry. The present invention utilizes ultrasonic energy to facilitate efficient slurry application in a IC wafer fa...  
WO/2001/015862A1
A spindle assembly (10) for force controlled operation in applications such as the chemical mechanical planarization of semiconductor wafers includes an axially and rotatably moveable spindle (14) driven by a force producing device (14)....  
WO2000054933B1
In one aspect the invention provides a polishing apparatus (101) including a housing (120) a carrier (160) for mounting a substrate (113) to be polished, a retaining ring (134) circumscribing the carrier (113) for retaining the substrate...  
WO/2001/010597A1
The invention describes a wheel head (10) for a grinding machine, the wheel head having a base (15) which is displaceable, in the conventional manner, toward the machine axis (13) on which is mounted a rotating work piece to be ground. T...  
WO1999048645A8
A carrier (100) for semiconductor wafers (106) to be polished comprises a backing pad (110) vulcanized to a pressure plate (108). The backing pad (110) is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive f...  
WO2000069595A3
A method and apparatus is provided for holding a workpiece (111) in a carrier (100) parallel to a polishing pad (112) while pressing the workpiece (111) against the polishing pad (112) during a planarization process. The carrier's pressu...  
WO2000054933A3
In one aspect the invention provides a polishing apparatus (101) including a housing (120) a carrier (160) for mounting a substrate (113) to be polished, a retaining ring (134) circumscribing the carrier (113) for retaining the substrate...  
WO/2000/076723A1
A table for a wafer polisher is capable of resisting heat, thermal shocks and abrasion and suited to larger semiconductor wafers of high quality. A table (2) includes a plurality of laminates (11) consisting of silicide-base ceramic or c...  
WO/2000/069595A2
A method and apparatus is provided for holding a workpiece (111) in a carrier (100) parallel to a polishing pad (112) while pressing the workpiece (111) against the polishing pad (112) during a planarization process. The carrier's pressu...  
WO/2000/069597A1
A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carrie...  
WO/2000/067958A1
The present invention relates to a grinding workbench that can be subjected to suction. Said workbench is provided with one or more vacuum tensioning device/s, a supporting grid (13), an integrated connection (9) for external suction, a ...  
WO/2000/066903A2
A fixture (80) for selectively locating and retaining hydraulic gerotor rotors (30) in position in respect to a grinding wheel (20), the fixture clamping the rotor between two oversized positioning rolls (84) located in rotor lobe valley...  
WO/2000/066323A1
The present invention relates to a method for grinding a centrally clamped crankshaft (1). The invention also relates to a grinding machine (43) for crankshafts for carrying out said method and a crankshaft (1) consisting of high-alloy s...  
WO/2000/064632A1
A multiwheel grinding machine for grinding the journal regions of a crankshaft (63) which is mounted between a headstock and a tailstock, comprises a single radially adjustable workrest (60) engageable with a central journal region, left...  
WO/2000/062975A1
The invention concerns a device for flat deburring by brushing characterised in that it comprises a plurality of brushes (4A to 4H) diametrically opposed in pairs, mounted on a rotary drive head (2A) and driven in rotation on themselves ...  
WO/2000/062978A1
The invention relates to a machining carriage (1) for a machine tool. The machining carriage comprises a receiver for a work spindle (3) having a cylindrical housing. In order to simplify attaching and detaching of the work spindle (3), ...  
WO/2000/054933A2
In one aspect the invention provides a polishing apparatus (101) including a housing (120) a carrier (160) for mounting a substrate (113) to be polished, a retaining ring (134) circumscribing the carrier (113) for retaining the substrate...  
WO/2000/051782A1
A resilient pneumatic annular sealing bladder (550) is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone (556) and is attached to a first surface (562) of the wafer stop plate (554) a...  
WO/2000/050223A1
A workpiece support includes a set of grooved members (100, 200) for supporting a series of workpieces (10). An outer perimeter of each workpiece may be beveled at both faces, beveled at one face, unbeveled, convex, or concave. Each groo...  
WO/2000/048787A1
Wafer polishing systems (10) include a series of polish modules (24, 26, 152) alongside a neighboring series of secondary modules (100). A conveyor travels along the series of polish modules and the series of secondary modules. When a po...  
WO2000032353A3
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO/2000/044530A1
A universal sharpening apparatus for sharpening a tool includes a grinding wheel assembly (14) and a universal clamping system (18) for clamping the tool rigidly in any of a wide range of spatial relations to the grinding wheel. The univ...  
WO/2000/043161A1
The invention relates to a method for machining plane surfaces of a disk brake (1) for motor vehicles. According to the invention, a wheel bearing unit consisting of a wheel hub (2), a roller arrangement (3) and an external bearing ring ...  
WO/2000/040369A1
Machine (10) for machining an envelope surface of a cylindrical work piece (28) including a tubular cylindrical housing (13) with longitudinal axis and having an inner space (14) extending from a first end of the housing, and with an axi...  
WO/2000/040368A1
An machine (10) for machining a flange on a work piece (28) comprises a rotated tool (35), chucking equipment (27) and feeding means (20, 21) for relative displacement between work piece and tool, a tubular cylindrical housing (13) with ...  
WO/2000/038882A2
The invention provides for a modular machine frame structure instead of the frame constructions customary to date. According to the invention the individual modules are made of non-metal castings, notably a mineral casting, produced usin...  
WO/2000/035617A1
The invention relates to a method for machining workpieces with areas which comprise form variations, whereby the workpiece (5) is fixed between the tip (13) of the tool spindle (30) of the workpiece spindle head (1) and the tip (6) of t...  
WO/2000/032353A2
A machine for abrading or polishing a workpiece (5) comprises a holding surface holding the workpiece, a head member (7) arranged along a rotation axis to rotate about the rotation axis, a working member (8) having a surface for abrading...  
WO/2000/030812A1
This modular abrasive tool with radial swing (27) for rotary heads of smoothing machines for granite, marble, ceramic, resinous stone and the like, has a shape in the form of an angular sector (36, 37) tapered with converging inclination...  
WO/2000/027588A1
An apparatus, in particular for pointing electrodes for TIG welding, is described, wherein the electrode (8) is fed toward the side of a grinding disc (3), whereby the electrode is pointed. The apparatus comprises a first element with an...  
WO/2000/024548A1
The surface of a grindstone is dressed by constant cutting depth processing, preventing the surface of the grindstone from cracking, which might cause scratches, and dressing the dresser. The planarity of the surface of the dresser can b...  
WO2000009290B1
The invention relates to a grinding machine comprising at least one bed, feed slides and a grinding table with superstructures, which further presents a turning-tool holding fixture (6) for hard machining. The invention also relates to a...  
WO/2000/023229A1
A wafer-polishing apparatus using a chemical and mechanical process comprises first and second polishing pads (14, 15); first and second wafer-holding heads (31, 32); a wafer loading section (41); a wafer unloading section (42); first an...  
WO/2000/020165A1
The invention relates to a machining system (10) for machining workpieces (12), especially for polishing workpieces (12). Said machining system (10) has at least two machining stations (14,16,26) on which carriages (18) for workpieces (1...  
WO/2000/018542A1
A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitr...  
WO/2000/015388A1
A tire grinding apparatus (10) comprising at least one support arm (30) pivotally connected to a base; and a leading and trailing of grinding wheels (40, 42) rotatably carried by the spport arm (30) to engage the outer surface (12) of a ...  
WO/2000/012261A1
The invention concerns a method for producing multifocal correction lenses from semi-finished lenses (1) having at least a first positioning marker $i(M), associated with a correction $i(A) called distant vision correction, and a second ...  
WO/2000/009290A1
The invention relates to a grinding machine comprising at least one bed, feed slides and a grinding table with superstructures, which further presents a turning-tool holding fixture (6) for hard machining. The invention also relates to a...  
WO/2000/007770A1
The invention relates to a grinding machine for the edges of spectacles lenses, comprising at least one grindstone and one driven shaft for holding the spectacles lenses, said shaft being able to move radially and axially relatively to t...  
WO/2000/007771A1
A polishing method and a polishing device that are designed such that the in-plane pressing force between a work and an abrasive cloth is substantially uniform to improve the quality of the work. A surface plate (2) is supported on the g...  
WO/2000/007230A1
Method and apparatus for chemically mechanically polishing semiconductor substrates with enhanced durability, reliability and polishing effectiveness. In the method of the present invention, the substrate and the pad respectively orbits ...  
WO/2000/006339A1
The invention relates to a sanding device (10) comprising a rotor device which drives an eccentrically mounted carrier device. A shaft (16) is mounted in said carrier device. A head (15) is provided on one end of the shaft. A supporting ...  
WO/2000/005033A1
The invention concerns a drive for a grinding disc of a cam grinding machine, wherein an electrical motor with a drive wheel (3) is provided, said drive wheel (3) being fitted with evenly spaced annular recesses (30) and the annular rece...  
WO/2000/003838A1
The invention relates to a device of a spectacle lens edge machining tool for the non-rotational and immobile holding of an uncut glass (2) between the two halves (12, 14) of a spectacle lens holding shaft, which can be displaced in rela...  
WO/2000/002708A1
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capill...  
WO/2000/002705A1
An abrasive machine (10) comprises a rotatably driven tool (35), chucking equipment (27) for holding the work piece and feeding means (20, 21) for effecting relative displacement between the work piece (28) and the rotatably driven tool ...  

Matches 701 - 750 out of 9,053