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Patent Searching and Data


Matches 751 - 800 out of 9,083

Document Document Title
WO/2000/006339A1
The invention relates to a sanding device (10) comprising a rotor device which drives an eccentrically mounted carrier device. A shaft (16) is mounted in said carrier device. A head (15) is provided on one end of the shaft. A supporting ...  
WO/2000/005033A1
The invention concerns a drive for a grinding disc of a cam grinding machine, wherein an electrical motor with a drive wheel (3) is provided, said drive wheel (3) being fitted with evenly spaced annular recesses (30) and the annular rece...  
WO/2000/003838A1
The invention relates to a device of a spectacle lens edge machining tool for the non-rotational and immobile holding of an uncut glass (2) between the two halves (12, 14) of a spectacle lens holding shaft, which can be displaced in rela...  
WO/2000/002708A1
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capill...  
WO/2000/002705A1
An abrasive machine (10) comprises a rotatably driven tool (35), chucking equipment (27) for holding the work piece and feeding means (20, 21) for effecting relative displacement between the work piece (28) and the rotatably driven tool ...  
WO/2000/001291A1
The specification discloses a mobile surfacing machine having a planetary head (3) and several satellite heads (6). The satellite heads are adapted to grind a surface and the planetary head is adapted to move the surfacing machine around...  
WO/2000/000325A1
The present invention relates to a fixture and a grinding machine for grinding buttons of a rock drill bit. The fixture (18) comprises means (20, 25, 26) for holding the drill bit in a horizontal plane in a correct position relative to a...  
WO/1999/067055A1
A grinding machine has a wheelhead (30) movable under computer control perpendicular to the axis of a composite workpiece, mounted between a headstock (16) and a tailstock (20), and workrests (36 to 42) slidable along front and rear rail...  
WO/1999/062671A1
An apparatus for polishing a silicon wafer comprises a polishing turntable mounted for rotation and adapted to receive a polishing pad. The apparatus further comprises a mounting fixture for rotating the wafer relative to the polishing p...  
WO/1999/060429A1
A precision optical element (62) is described, such as is used in thermal imaging systems in the infrared, manufactured by means of single point machining, with both of its surfaces having an aspheric form, with or without the addition o...  
WO1999048645B1
A carrier (100) for semiconductor wafers (106) to be polished comprises a backing pad (110) vulcanized to a pressure plate (108). The backing pad (110) is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive f...  
WO/1999/056024A1
A threaded fasterner (10) includes a locking nut (12) arranged to engage with a threaded shaft (22), with nut (12) having a first surface (28) arranged to be screwed down against contact surface (15). First surface (28) is arranged such ...  
WO1999039872A9
A motorized spindle asembly for a grinding wheel is fabricated with an opening extending through the spindle casing, and stator and so as to extend in the direction of the spindle axis of rotation at least the length of the stator. The o...  
WO/1999/052673A1
An installation for forming the edges of spectacle glasses, comprising a machining device (1) for forming a left spectacle glass, a machining device (2) for forming a right spectacle glass, a conveyor device (8) for untreated and finishe...  
WO/1999/051394A1
A working device characterized by comprising a transfer path for guiding magnet members to be ground in one direction, a transfer means for energizing a plurality of magnet members on the transfer path in the transfer direction so as to ...  
WO/1999/050023A1
The invention concerns a polishing machine comprising at least a base unit (10) in the form of a parallelepiped cell (12), with a first loading and unloading surface (14), a second opposite parallel surface (16) for access to the working...  
WO/1999/050025A1
A technique for integrating a film thickness monitoring sensor within a load and unload unit of a cluster tool (30) for performing chemical-mechanical polishing (CMP). In order to determine CMP performance, a sensor (60) (or sensors) for...  
WO/1999/048645A1
A carrier (100) for semiconductor wafers (106) to be polished comprises a backing pad (110) vulcanized to a pressure plate (108). The backing pad (110) is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive f...  
WO1999013498A8
An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot ...  
WO/1999/044787A1
A planer, wherein a saddle (51) with a spindle (50) mounted thereon is brought in contact directly or indirectly with the side surfaces of three columns (10, 20, and 30) erectedly installed generally in an equilateral triangle so that th...  
WO/1999/041022A1
A load station (18) is used in a planarizing machine to perform several useful functions related to handling of a water (12). By centering the wafer with respect to a spindle carrier (20) the load station interrupts the accumulation of p...  
WO/1999/039868A1
A device for grinding a rotary mower blade (16), the device comprising an adjustable support for receiving a rotary mower blade, means for fixing the blade relative to the support, means for feeding the support and blade both axially and...  
WO/1999/039872A1
A motorized spindle asembly for a grinding wheel is fabricated with an opening extending through the spindle casing, and stator and so as to extend in the direction of the spindle axis of rotation at least the length of the stator. The o...  
WO/1999/039873A1
The invention relates to a grinding spindle, comprising a spindle housing and two coaxial shafts which are driven by a drive motor. A concentric grinding disk is fixed to each of said shafts. The shafts can be moved in an axial direction...  
WO/1999/038649A1
In a polishing machine for simultaneous double-sided polishing of workpieces (26) between upper polish plate (210) and lower polish table (20), the upper polish table (16) has a hollow center telescopically receiving in a drive hub (180)...  
WO/1999/038650A1
The invention pertains to an improved method, a lapping tool head (82) and a lens polishing apparatus for carrying out the method, for polishing ophthalmic lenses (26). The apparatus has a lapping tool head (82), a flexible membrane (134...  
WO/1999/036224A1
A method and apparatus (10) for grinding a knife blade (66) to form a sharpened edge. The blade (66) is held in a fixture (56) including a self-centering clamp (57) with a pair of jaws (96, 98) gripping the knife blade (66) by engaging o...  
WO/1999/028085A1
The invention relates to a roll grinding machine (2) for grinding contours of rollers which comprises a structurally simple device provided for very precise corrections of a grinding wheel (4) tangential to the roller contour. Said grind...  
WO/1999/028081A1
A grinding machine, in particular a face grinder for grinding the faces of silicon wafers, has a grinding wheel spindle (20) and a work spindle (22) which are mounted so as to be pivotal about axes (A and B) respectively, each axis being...  
WO1999013498A3
An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot ...  
WO1999012706A3
A sharpening apparatus for sharpening blades of implements such as spatulas (12) and grill scrapers (14). The apparatus includes a base (44) supporting a sharpening stone (120). A slidable blade guide member (130) which is slidably conne...  
WO/1999/024219A1
A rotary joint for a fluid capable of fluidizing under a seal state a polishing solution between relative rotary members and supplying power to a polishing surface detector, wherein a series of polishing solution passages (7) communicati...  
WO/1999/024218A1
Method of manufacturing a memory disk or a semiconductor device using a polishing apparatus (100) having a substrate and a fixed abrasive pad (6), the fixed abrasive pad (6) having a three-dimensional fixed abrasive polishing layer havin...  
WO1999008835A3
The invention relates to a grinding spindle for grinding machines. Said grinding spindle can be used in universal grinding of seats and elements, especially sliders and valves, and comprises a mount (2, 4;50) and a rotationally driven, d...  
WO/1999/022908A1
A linear drive mechanism for chemical mechanical polishing includes a substrate carrier and support system which employs at least one linear motor to drive the substrate carrier through polishing motions. An additional driver for driving...  
WO/1999/016580A1
Wafer processing apparatus for batch processing of wafers comprises a turntable, having a polishing surface thereon, capable of rotation about a turntable rotation axis. A pressure plate is constructed for simultaneously holding mulitple...  
WO/1999/015314A1
A carrier head assembly including a drive shaft and a system flange connectable to the drive shaft where the system flange includes a number of magnetic plates. The carrier head assembly also includes a carrier head flange. The carrier h...  
WO/1999/015312A1
A polishing machine includes a platform assembly (60) slidably mounted on three support columns (32-36). The assembly (60) includes first and second platforms (64, 66) joined together and slidably movable toward and away from each other....  
WO/1999/015313A1
The invention relates to a grinding machine on a frame (11), comprising a supporting table which is horizontally mobile and can be retracted vertically, a pair of stops (18, 19) which, when not in use, are nested in a closed shelter unde...  
WO/1999/012706A2
A sharpening apparatus for sharpening blades of implements such as spatulas (12) and grill scrapers (14). The apparatus includes a base (44) supporting a sharpening stone (120). A slidable blade guide member (130) which is slidably conne...  
WO/1999/013498A2
An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot ...  
WO/1999/011429A1
The invention relates to a device for machining the edges of spectacle glasses, comprising a spectacle glass holder for a rough glass held on at least one side and a machining device for full machining of said glass by means of a separat...  
WO/1999/010128A1
The invention pertains to a machine for processing spectacle lenses, comprising a housing, a processing station therein, a two-piece rotating shaft for holding the piece of glass, said shaft consisting of one axially movable shaft half a...  
WO/1999/008835A2
The invention relates to a grinding spindle for grinding machines. Said grinding spindle can be used in universal grinding of seats and elements, especially sliders and valves, and comprises a mount (2, 4;50) and a rotationally driven, d...  
WO/1999/006181A1
The diamond roller for ceramics, having abrasive with sloped side, comprises the abrasive diamond material disposed on the surface of the roller (9), and it is characterised in that it presents for a brief length (10) and on one end, at ...  
WO1998047030A3  
WO/1999/002306A1
A machine tool, particularly for grinding workpieces, has a single rotatable spindle (2) carrying a fixed cup-shaped inner grinding wheel (8) and an axially slidable cup-shaped outer grinding wheel (22). A T-shaped annular piston (14) en...  
WO/1999/001255A1
A double face abrading machine for simultaneous removal of material from two plane-parallel surfaces of a work piece, and incorporating a first and a second tool (1, 2) forming between them a machining gap (3), the first tool (1) being a...  
WO/1999/001254A1
An internal abrasive machine for inner surfaces of annular work pieces, and comprising a rotated driven spindle (16) carrying a tool (18), chucking equipment (14) for a work piece (15) to be machined, and feeding means (10, 11) for relat...  
WO/1999/001253A1
An external abrasive machine, in particular an external grinder for removal of material from the outer envelope surface of annular work pieces, and/or from flanges associated therewith, and particularly bearing race rings, and of the typ...  

Matches 751 - 800 out of 9,083