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Matches 951 - 1,000 out of 9,082

Document Document Title
JP6576801B2  
JP6578386B2  
JP2019150899A
To prevent each strip-like piece of a plate-like material from falling during cutting processing even if the material is a composite material including a soft layer.In a processing method for forming strip-like work-pieces (W) from an ex...  
JP2019150929A
To provide a chuck table, a cutting device, and a method for correcting a chuck table of a cutting device, which can suppress occurrence of crack of a rear side and corner crack of a work-piece during cutting.A chuck table 20 comprises a...  
JP2019153724A
To provide a processing device capable of making uniform the contact pressure of a processing tool for processing the wafer surface and the wafer surface to be processed.A polishing device comprises a chuck table 71 including a suction h...  
JP2019150947A
To further reduce the weight of each part such as a connection rod constituting a connection mechanism of an oscillation device incorporated into a superfinishing device and shorten a processing time, and to enhance production efficiency...  
JP6573168B2  
JP6574373B2  
JP2019149461A
To provide a processing device capable of forming a wafer in a desired thickness.A processing device 1 for processing a surface of a wafer W, includes at least: a chuck table 71 comprising a vacuum holding part 75 having a holding surfac...  
JP2019149451A
To cause a resin not to be left on a plate when a sheet is removed from the plate.A processing method for a plate W includes an external stimulus imparting step for imparting an external stimulus to a region Ta to which at least a resin ...  
JP2019147210A
To provide a machine tool having a rotatable table which can automate accurate centering of a workpiece, and a processing method by the machine tool.A machine tool 10 having a rotatable table 30, includes: a table 20 or a wheel spindle s...  
JP2019147203A
To provide a frame for a package substrate capable of reducing the cost of grinding processing by performing grinding processing of a package substrate without executing a large scale of alteration of a grinding device.A frame for a pack...  
JP6571379B2  
JP6572166B2  
JP2019141946A
To provide a grinding device that can efficiently perform grinding processing and measures a shape of a wafer with a simple structure having a small number of components.A grinding device 1 comprises: a stationary type thickness measurin...  
JP2019145643A
To prevent thermal distortion from occurring in a spindle unit in order to perform high-precision processing on a workpiece such as a semiconductor wafer.In a water temperature setting method in a processing apparatus 1 for processing a ...  
JP2019141924A
To provide a machining device capable of realizing an appropriate movement with respect to a flat processed surface such as a vertical surface and performing the teaching efficiently.A machining device is a device for performing machinin...  
JP2019136849A
To process a workpiece without adhering an adhesive to the workpiece.A processing method of a workpiece (W) includes: a step of annularly coating an outer peripheral part of an insulating sheet (10) with a tacky sealing agent (11); a ste...  
JP2019136810A
To provide a cutting device that can keep strong holding force onto a table even after an object to be cut is cut off.The cutting device includes a table 10, an air pressure maintaining mechanism and a cutting mechanism 30. An object 20 ...  
JP2019136806A
To allow a wafer already ground to be held on a holding table so that a center of the wafer does not become thinner.In the holding surface grinding method, a grindstone 14 to be used is a vitrified grindstone in which vitrified bond 15 a...  
JP2019140172A
To improve the processing efficiency of a workpiece.A processing device that processes a workpiece with a peelable tape attached to the bottom surface by applying external stimulus includes a load table that supports the workpiece before...  
JP2019130607A
To provide a grinding/polishing device, which can solve the problem that formation of a water seal and cooling of a holding table are performed by separate mechanisms, so that the configuration of the device is greatly complicated.The gr...  
JP2019130637A
To make it possible to hold a wafer with a holding table such that the center of the wafer does not become thinner after the wafer is ground.A method of grinding a holding surface according to the present invention includes: a first grin...  
JP2019133979A
To ensure that a holding claw enters between the lower surface of a wafer and a holding surface in a transport mechanism that holds the outer periphery of the wafer by causing the holding claw to enter between the lower surface of the wa...  
JP2019130636A
To make it possible to hold a wafer with a holding table such that the center of the wafer does not become thinner after the wafer is ground.In a method of grinding a holding surface: a resin bond grinding stone made by mixing and solidi...  
JP2019133990A
To provide a wafer processing method by which the depth of a cut groove can be maintained highly accurately.A wafer processing method comprises: a processing device preparation step in which a processing device is prepared, comprising at...  
JP2019133991A
To provide a wafer processing method by which the depth of a cut groove can be maintained highly accurately.A wafer processing method comprises: a processing device preparation step in which a processing device is prepared, comprising at...  
JP2019130612A
To further efficiently and accurately grind a workpiece which is composed of a complex material of hard grains and a metal base material by using a pair of grinding stones.When plane-grinding a workpiece 6 composed of a complex material ...  
JP2019130661A
To provide a polishing device.A polishing device includes: a first transfer unit including a first rail extending in a first direction, a second rail extending in a second direction intersecting with the first direction, and a first grip...  
JP6556066B2  
JP6555587B2  
JP6556067B2  
JP2019129268A
To provide a two-fluid type non-contact pad holding a wafer at a constant position in non-contact by ejecting an air to the wafer, and flowing an abrasive grain by ejecting a liquid and occurred by polishing in an end surface polishing s...  
JP2019123047A
To allow a plate-like work-piece to be surely suctioned and held on a holding surface of a holding table while being kept flat by eliminating warpage, in grinding the plate-like work-piece having the warpage.A plate-like jig 4 is used in...  
JP2019125755A
To cause a table holding surface to be automatically switched to an area corresponding to a wafer size.A holding device 3 includes a suction source 39 communicating with a central suction area of a table 30 through a pipe 31; and a valve...  
JP2019123059A
To provide a manufacturing method of a carrier capable of manufacturing the carrier for a double-sided polishing device less in warping.In a method for manufacturing a carrier forming a holding hole for holding a wafer arranged between u...  
JP2019123028A
To provide a work-piece processing device that can use a plurality of processing tools and perform processing by contacting the tools with a work-piece at various angles and reduce time required in processing the work-piece.A work-piece ...  
JP2019123035A
To provide a holding table that can hold a plate-like work-piece while preventing an exposed part of a base material having an alignment mark formed therein from being ground.A holding table 10 according to the invention comprises a resi...  
JP6548561B2  
JP2019118982A
To provide a work-piece cutting method by which occurrence of breakage and corner crack of a rear face of a work-piece can be suppressed with a simple configuration even for a thin work-piece and a work-piece of a small chip size, and a ...  
JP2019119002A
To provide a chuck table loading jig which can load plural chuck tables in a saved space.A chuck table loading jig for loading a chuck table (20) which comprises a suction part (21) for sucking and holding a work-piece (W), and an outer ...  
JP2019121630A
To allow for efficient processing of a workpiece, without increasing the number of grinding steps.A processing method of workpiece includes a resin coating step of coating the surface Wa of a workpiece W with resin 100, a resin hardening...  
JP2019115962A
To provide a chuck table correction method capable of heightening sufficiently accuracy of notch of a cutting blade to a workpiece.In a chuck table correction method, a lower end of a cutting blade is positioned at a prescribed height fo...  
JP6545311B1
[Subject] A workpiece is ground in a polish device for a short time. [Means for Solution] Polish device 1 is provided with the following. Holder 10 which holds a periphery of optical element W (workpiece) and rotates the optic-axis (cent...  
JP6546303B2  
JP2019111628A
To carry a work-piece without using an independent carrying mechanism.The cutting device comprises: a cutting unit that cuts a work-piece with a cutting blade; a processing/feeding unit that moves a chuck table between a processing area ...  
JP2019111594A
To provide a chuck table that can suppress flapping of an outer edge part of a work-piece being processed.A chuck table 10 comprises a disk-shape porous adsorption part 13 that adsorbs and holds a placed work-piece 100 and a frame body 1...  
JP2019111634A
To provide a method for grinding a work-piece, in which a thickness of the work-piece subjected to grinding processing can be made more uniform by preventing the work-piece from being locally thinned through grinding.A method for grindin...  
JP6543281B2  
JP6540198B2  

Matches 951 - 1,000 out of 9,082