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Patent Searching and Data


Matches 1,001 - 1,050 out of 9,089

Document Document Title
JP2019121630A
To allow for efficient processing of a workpiece, without increasing the number of grinding steps.A processing method of workpiece includes a resin coating step of coating the surface Wa of a workpiece W with resin 100, a resin hardening...  
JP2019115962A
To provide a chuck table correction method capable of heightening sufficiently accuracy of notch of a cutting blade to a workpiece.In a chuck table correction method, a lower end of a cutting blade is positioned at a prescribed height fo...  
JP6545311B1
[Subject] A workpiece is ground in a polish device for a short time. [Means for Solution] Polish device 1 is provided with the following. Holder 10 which holds a periphery of optical element W (workpiece) and rotates the optic-axis (cent...  
JP6546303B2  
JP2019111628A
To carry a work-piece without using an independent carrying mechanism.The cutting device comprises: a cutting unit that cuts a work-piece with a cutting blade; a processing/feeding unit that moves a chuck table between a processing area ...  
JP2019111594A
To provide a chuck table that can suppress flapping of an outer edge part of a work-piece being processed.A chuck table 10 comprises a disk-shape porous adsorption part 13 that adsorbs and holds a placed work-piece 100 and a frame body 1...  
JP2019111634A
To provide a method for grinding a work-piece, in which a thickness of the work-piece subjected to grinding processing can be made more uniform by preventing the work-piece from being locally thinned through grinding.A method for grindin...  
JP6543281B2  
JP6540198B2  
JP6543525B2  
JP6543477B2  
JP6542863B2  
JP6543558B2  
JP2019107736A
To provide a blade, a work rest and a centerless grinder which make it possible to process even small-diameter to large-diameter work-pieces with high efficiency by through feed grinding.A blade 20 according to the present invention incl...  
JP6538375B2  
JP6539199B2  
JP2019104075A
To prevent a cutting liquid from reaching an absorption face of a chuck table mechanism.A cutting device comprises: a chuck table mechanism for holding a frame unit; and a cutting unit for cutting a workpiece by a cutting blade while sup...  
JP2019106518A
To provide an ingot clamp capable of preventing wafer quality deterioration by supporting an ingot in a balanced and stable manner and a wire sawing apparatus for slicing an ingot including the same.According to the present invention, th...  
JP6534861B2  
JP2019098420A
To improve flatness of a substrate in grinding processing, by restraining the occurrence of a dimple caused by executing the grinding processing in a state of nipping foreign matter between the substrate and a vacuum suction part in the ...  
JP2019098437A
To provide a double-ended grinder which, eve if areas of both end surfaces of a work-piece are different from each other, can uniformly grind the both end surfaces.A pair of turntables 13 are so located on a same axis as to be respective...  
JP2019093518A
To provide a method for processing a work-piece that can prevent a grinding trace appearing in the work-piece from getting conspicuous.The method for processing a work-piece comprises: a thinning step ST1 of holding the work-piece on a c...  
JP2019093517A
To provide a method for processing a work-piece and a grinding/polishing device which can make a shape of a surface to be polished flat by suppressing variation in thickness of the work-piece subjected to polishing processing, in perform...  
JP2019096865A
To provide a breaking device of semiconductor material, for breaking a semiconductor strip into individual semiconductor packages.When picking up a semiconductor strip from a loading part by using a strip picker, or when putting it down ...  
JP2019096907A
To allow a worker to easily replace only a suction member without touching a vacuum seal member while preventing a decrease in pressure of a suction member for sucking an object.A base plate 30 in a vacuum chuck stage includes: a first h...  
JP6532339B2  
JP2019091766A
To provide a device and a method for positioning a substrate accurately on a stage by a simple method, by using the power of a movement mechanism included in a movable stage.A substrate holding device for holding a substrate has a substr...  
JP2019089182A
To provide a cutting device that can reduce mon-hours for implementing correction of an end face and easily implement the correction of the end face.The cutting device comprises: a chuck table 10; a cutting unit 20 that fixes a cutting b...  
JP2019089194A
To provide means that can suppress occurrence of shoe wound on an outer peripheral surface of a work-piece regardless of materials of the shoe.A work-piece support device (6) comprises: a base (10); a shoe (11), arranged in at least one ...  
JP2019515806A
The present invention related to a hand-held machine tool, especially a grinder, and the hand-held machine tool is provided with a working bead (11) which uses a junction assembly (13) and with which it is equipped movable on a cylindric...  
JP2019087596A
To allow for division of a board while holding the convex side thereof well.A semiconductor package board (W) has multiple bumps (W5) on the reverse side, and multiple division schedule lines (W2) formed on the front side, and is held by...  
JP2019084612A
To provide a cutting device, which allows a transmission type sensor to efficiently detect a tip of a cutting blade while preventing the device from being elongated in a width direction of a spindle to grow in size.A cutting device 1 com...  
JP2019085185A
To enable a roller to be fed to a predetermined position without causing defects such as scratches on the roller while a configuration is simple.A roller feeding device 1 is provided with a roller feeding mechanism 4 which repeatedly per...  
JP2019084600A
To reduce the tool cost and improve the processing quality and yield of an inner peripheral surface processing device for processing an inner peripheral surface of each cylinder part of a workpiece having a plurality of cylinder parts ar...  
JP2019081210A
To improve workability toward the inside of a pneumatic tire by easily inserting a processing means in between a pair of bead parts, and to prevent the bead part from contacting with the processing means.A tire processing apparatus 1 pro...  
JP2019081219A
To provide a new processing method for a protective member that can appropriately process a protective member made of resin.A processing method for a protective member includes: a protective member attachment step of attaching an adhesiv...  
JP2019081217A
To provide a new processing method for a protective member that can appropriately process the protective member made of resin.A processing method for a protective member, which processes the protective member attached to a wafer using a ...  
JP2019081218A
To provide a new processing method for a protective member that can appropriately process a protective member made of resin.A processing method for a protective member includes: a protective member attachment step of attaching an adhesiv...  
JP2019081216A
To provide a new processing method for a protective member that can appropriately process the protective member made of resin.A processing method for a protective member 21, which processes the protective member 21 attached to a wafer 11...  
JP6520500B2  
JP6519227B2  
JP2019077003A
To provide a polishing device that can efficiently polish the whole of a back side of a substrate including an outermost part with the back side of the substrate pointed downward.The polishing device comprises a substrate holding part 10...  
JP2019075477A
To provide a chuck table mechanism capable of holding a warped plate.A chuck table mechanism 1 is a composite chuck table mechanism including a chuck table 2, an electrostatic attraction part 3, and a vacuum suction part 4. The chuck tab...  
JP2019072788A
To provide a processing method capable of grinding and chamfering an outer diameter of an object to be processed in a short processing time.The processing method has: an outer diameter grinding step for grinding an outer diameter of an o...  
JP2019072776A
To more securely suck and hold a warped plate-like object by use of holding means.A holding method comprises: a liquid supply step in which a liquid L is supplied onto a holding surface 700a of holding means 70 having: the holding surfac...  
JP2019075406A
To make a processing device compact by reducing an area where means for loading a wafer to a table is disposed.A processing device 1 includes a cassette 4, cassette mounting means 5, and means 6 for carrying a wafer into a table 30. The ...  
JP2019075408A
To prevent formation of scratch for the reverse face or occurrence of crack in a workpiece due to entrainment of exfoliated abrasive grains while grinding, in a grinding method for forming a ring-shaped reinforcement part on the reverse ...  
JP2019075494A
To prevent unintended grinding of a surface protective member stuck to a surface side of a workpiece by a grind stone in a grinding device.A grinding method for a workpiece includes a step of covering a workpiece surface with a protectiv...  
JP6514542B2  
JP2019069506A
To provide a spindle device which is used in a numerical control machine tool and can avoid a problem that significant deviations and/or fluctuations occur in part of measurement data of a measurement device used in the spindle device.A ...  

Matches 1,001 - 1,050 out of 9,089