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JP2024047465A |
An object of the present invention is to simplify the work process in cutting and removing a rod-shaped member in a recumbent position, and to improve work safety related to cutting and removal. A cutting device for cutting a rod-shaped ...
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JP7460461B2 |
The present invention aims to provide a processing apparatus which is able to easily return cassettes of various sizes in accordance with the size of a plate-shaped work. In the processing apparatus (1), in a cassette stage (40) and a st...
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JP7460475B2 |
To dry a work-piece.A processing device comprises: separating means 18 that separates a work-piece 14 from a holding surface 210 by jetting water, air and mixed liquid from the holding surface 210; carrying-out means 6 that comprises a c...
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JP2024043781A |
An object of the present invention is to suppress adhesion of polishing debris to the outer peripheral portion of a chuck table. In a polishing process, an outer peripheral portion of a wafer 100 is pressed against a polishing pad 77 by ...
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JP7460711B2 |
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding st...
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JP7460386B2 |
A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step ...
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JP7458760B2 |
A processing apparatus includes a chuck table that holds a workpiece, a cutting unit that processes the workpiece held by the chuck table, a cassette placing region where a cassette is placed, a carrying unit that carries the workpiece b...
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JP2024043556A |
The present invention proposes a new technique for detecting abnormalities such as scratches or the presence of foreign objects on the holding surface of a holding table that may occur due to damage to a cutting blade, and for avoiding f...
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JP7457913B2 |
To provide a polishing device keeping a polishing rate stable to enable high quality polishing, and to provide a polishing method.A polishing device continuously polishes a member on the film-like substrate surface of which an object to ...
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JP7457637B2 |
To provide a tailstock device capable of inhibiting the formation of rust, and a machine tool.A tailstock device 30 comprises: a tailstock shaft part 32 that has a tailstock center 31 for supporting a workpiece W between itself and a spi...
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JP2024042336A |
[assignment]To provide a processing device capable of quickly centering a disc workpiece with a simple mechanism. [Solution] A control unit 100 of a processing device 1 carries out a wafer (disc workpiece) W by a robot hand 51 from a cas...
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JP7456209B2 |
To provide a machine tool with a static pressure fluid support device that suppresses vibration of a movable body in two axial directions by adjusting the flow rate of a fluid supplied to a static pressure pocket according to a disturban...
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JP2024040887A |
An object of the present invention is to automatically adjust the position of a suction cup on a conveyance pad, thereby eliminating the need for an operator to manually change the position of the suction cup. [Solution] A control unit 1...
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JP2024040570A |
An object of the present invention is to attach an adhesive tape to a warped workpiece while suppressing adhesion defects. [Solution] A method of attaching an adhesive tape to a workpiece that has a metal film on the surface and is warpe...
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JP7455470B2 |
To provide a method that can grind a wafer in a manner that protective tape glue does not remain in gaps caused by protruding electrodes while keeping low the possibility of breakage of the wafer.A processing method of a wafer is used wh...
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JP7455463B2 |
To provide a cutting device comprising a chuck table which can appropriately and easily hold a wafer having a concave part.A cutting device cutting a wafer having: a concave part formed at a center part; and an annular outer peripheral p...
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JP2024039395A |
The present invention provides a machine tool capable of correcting a center hole without removing a workpiece from the machine tool. [Solution] A machine tool 1 includes a center member 20 that can rotate integrally with a workpiece W, ...
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JP2024513125A |
The present invention relates to a method for activating and releasing a spindle lock of a power tool, and the spindle lock can be activated, for example, by an intuitive action by a user. In particular, actuation of the spindle lock can...
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JP7453784B2 |
To reduce a contact area between a substrate and a pusher and improve safety and reliability of receipt of a substrate.A pusher 230 includes: support pillars 272 each having a support surface 272a for supporting a substrate WF at one end...
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JP7452960B2 |
To provide a processing device equipped with a cleaning unit, which can sufficiently clean dirt adhering to a lower surface of a work-piece.Carrying-out means 5 comprises a carrying pad 50 that can move in horizontal and vertical directi...
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JP7451241B2 |
To provide a processing device that can reduce variation in thickness of a processed work-piece, for example, an upstream side in a rotation direction of a grinding stone thinner than a downstream side thereof in a surface of the work-pi...
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JP2024511775A |
A method and apparatus for polishing a substrate are disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing a substrate. A CMP system includes a polishing station configured to polish a subst...
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JP7449709B2 |
To provide a new prism mechanism that enables an object to be photographed to be photographed from a position deviated at 90 degrees from the object by using a prism.A prism mechanism P, which changes an advancing direction of light, com...
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JP2024035441A |
The present invention provides a chuck table repair method capable of regenerating the holding surface of a chuck table without removing the chuck table from a cutting device. [Solution] A grinding blade 83 is attached to the cutting mea...
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JP2024033486A |
The present invention provides a workpiece stocker jig and a grinding device that can efficiently arrange a plurality of workpieces to be processed by the grinding device on the workpiece stocker. A pallet jig 74 for collectively arrangi...
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JP7446714B2 |
There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatu...
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JP2024030018A |
An object of the present invention is to easily and reliably diagnose the deterioration (normal or abnormal) of a suction cup in a conveyance mechanism and accurately determine the appropriate time to replace the suction cup. In a cuttin...
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JP2024031191A |
An object of the present invention is to provide a grinding apparatus that forms a wafer in which the corner of the contact point between a circular concave portion of the wafer and an inclined surface does not form a rounded surface. [S...
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JP7444582B2 |
To reduce costs by improving the versatility of holding means of an angular bearing, to shorten replacement time of a machined workpiece and an unmachined workpiece, and to prevent rolling during carrying.A grinding device 1 for grinding...
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JP7444633B2 |
To quickly wash the upper surface of a wafer.A processing device 1 includes a chuck table 2 that holds a workpiece 15 on a holding surface 200, processing means 3 that processes the workpiece 15 held on the holding surface 200, and a fir...
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JP2024029658A |
[Problem] A method for processing a workpiece comprising a substrate and a protective member affixed to the front side of the substrate, which can prevent the back side of the substrate from becoming uneven due to grinding of the back si...
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JP7442999B2 |
To provide a grinding unit that can rotate a grinding grindstone around a unique rotation axis different from a rotation axis of a tool spindle and a complex machining machine equipped with the same.The complex machining machine comprise...
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JP2024029210A |
The present invention is to automatically, quickly, repeatably, and accurately move a workpiece between tools without any manual intervention, such as grinding the inner diameter, outer diameter, and ribs of tapered roller bearing cones....
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JP2024027743A |
An object of the present invention is to provide a chuck device that can efficiently form an ultra-thin water film that holds a workpiece suitably with high precision, and can easily separate a workpiece that has been joined by the water...
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JP2024027259A |
The present invention provides a method for manufacturing a chuck table that improves the productivity of the chuck table without individually manufacturing porous plates having desired shapes. [Solution] A method for manufacturing a chu...
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JP2024027610A |
An object of the present invention is to provide a grinding device that can perform grinding according to the conditions of a grinding wheel. [Solution] A grinding device for grinding a workpiece, which includes a chuck table that holds ...
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JP7441779B2 |
To provide a method of cutting a workpiece that restrains the occurrence of fragments, chipping and cracks in a slice plate made by cutting of a workpiece.A workpiece 1 is cut by a multi-wire saw 14 toward one surface from the other surf...
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JP2024024923A |
[Problem] To make the thickness of a circular concave portion of a wafer uniform in the radial direction. [Solution] A chuck table grinding step for grinding the holding surface 10a on the radius portion of the holding surface 10a of the...
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JP2024025017A |
An object of the present invention is to provide an insulator manufacturing apparatus and an insulator manufacturing method that can reduce grinding defects. An index table 2 on which a plurality of insertion pins 21, 22, 23, and 24 that...
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JP2024025394A |
An object of the present invention is to automatically adjust the interval between frame guides to eliminate manual positioning and adjustment work of a frame unit by an operator. [Solution] A cutting device that includes a cassette stag...
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JP2024024360A |
An object of the present invention is to provide a method for recording the height of a transport pad that can reduce errors in recording operations and the time required for recording operations. A conveyance pad height recording method...
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JP2024024197A |
An object of the present invention is to provide a clogging determination method specialized for determining the state of clogging in the outer peripheral portion of a porous plate of a chuck table. [Solution] A shielding member is arran...
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JP7435519B2 |
To provide a grinding device which efficiently suppresses single-sided grinding, and consequently, enables efficient grinding, a ground product manufacturing method with use of the same.A grinding device 1 has: a grinding component 4 inc...
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JP2024022744A |
An object of the present invention is to detect a workpiece remaining on a pair of guide rails and prevent the workpiece from falling from the guide rails. [Solution] A processing device includes a carry-out unit for carrying out a workp...
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JP2024022944A |
An object of the present invention is to provide a processing device that allows an operator to easily identify an item field selected even when a plurality of item fields are displayed at once on a touch screen. A processing device incl...
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JP2024022745A |
An object of the present invention is to quickly detect a failure in an operation performed by a carry-in/out unit. [Solution] A holder that includes a cassette table on which a storage cassette is placed, a carry-in/out unit that carrie...
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JP7436250B2 |
To provide a holding table newly configured in consideration of a problem caused in a holding table due to deterioration of an adhesive for fastening a porous plate.A holding table 50, which holds a work-piece (a wafer 10), comprises: a ...
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JP2024022857A |
[Problem] To suction and hold all chips and transport them. A holding table 10 that holds a package substrate W divided into a plurality of chips C, a transport unit 20 that carries out a plurality of chips C from the holding table 10, a...
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JP2024021225A |
An object of the present invention is to suppress drying of the upper surface of a wafer. A work set 110 is carried out from a chuck table 20 while the entire top surface of a wafer 100 is wet due to water flowing through a net 98. That ...
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JP2024021801A |
[Problem] A chip manufacturing method capable of reducing the polishing time when polishing the back side of the chip after dividing a workpiece into chips using a pre-dicing method and suppressing contamination on the side surface of th...
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