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JP7374657B2 |
A wafer processing method includes sticking an adhesive tape to the front surface of a wafer, disposing a thermocompression bonding sheet on the adhesive tape stuck to the front surface of the wafer. The thermocompression bonding sheet i...
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JP7374591B2 |
To provide a stock detection device for wafer, capable of completely detecting the stock of wafers even when they are transparent without having any influence of water droplets.The stock detection device for wafer, used for detecting whe...
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JP7373938B2 |
To enable a grinding liquid to be supplied to a center in a thickness direction of a grinding stone during processing.A grinding stone 101 comprises: a circular base 110 in which a penetration hole 115 into which a spindle is penetrated ...
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JP2023160762A |
To provide a method and device of grinding a semiconductor strip capable of shortening the time required for a grinding step.Provided is a method and device of grinding a semiconductor strip. The method of grinding a semiconductor strip ...
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JP2023159511A |
To provide a holding unit capable of inspecting whether or not an object can be appropriately held by a holding table.A holding unit that holds an object with a holding surface of a holding table, comprises: a fixing mechanism for fixing...
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JP7372097B2 |
To provide a wire saw which enables improvement of productivity.A wire saw 1 is a cutting device which cuts a workpiece W with a wire 53. The wire saw 1 includes: temporary placing tables 11, 12 for supporting the workpiece W; a transfer...
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JP7372098B2 |
To provide a wire saw which enables improvement of productivity.A wire saw 1 is a cutting device which cuts a workpiece W with a wire 53. The wire saw 1 includes: a transfer device 4 which includes a slider 48 for supporting the workpiec...
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JP7372107B2 |
Provided is a wafer polishing head which can increase productivity of a wafer polishing device and can enhance efficiency of a polishing process. The wafer polishing device (1) includes a chuck mechanism having a rubber chuck (10) formed...
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JP2023158281A |
To provide a protective member forming device, which is capable of determining whether a desired protective member can be formed and is capable of forming a wafer with a desired protective member formed thereon.A protective member formin...
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JP7370235B2 |
To provide a jig for fixation of work-piece which can easily fix a cylindrical work-piece even if a diameter of the work-piece changes.A jig 10 for fixation of work-piece includes: a base part 2 on a top face 21 of which a plurality of p...
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JP2023157088A |
To provide a spindle device that can easily switch whether or not to transmit rotation output generated by the rotation of a second motor to a spindle.A spindle device is provided with: a spindle having a mounting part on which a tool is...
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JP2023157377A |
To provide a carrier pad that can stably transport a fragile wafer by preventing a problem due to wafer sagging or wafer breakage.A carrier pad (40, 70) that sucks and holds the top surface (92) of a fragile wafer (90) and transports it ...
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JP7369067B2 |
To provide a polishing device which can simplify control when a polished workpiece and an unpolished workpiece are exchanged by moving a storage table between a polishing position and a standby position.A control part 9 switches a positi...
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JP7367439B2 |
To provide a spectacle lens peripheral machining system and a spectacle lens peripheral machining program capable of more appropriately performing a plurality of steps for machining a spectacle lens by a plurality of types of devices tha...
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JP7367438B2 |
To provide a spectacle lens peripheral machining system capable of more appropriately performing a plurality of steps for machining a spectacle lens by a plurality of types of devices that perform different steps.A spectacle lens periphe...
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JP3244267U |
An object of the present invention is to provide a turbine valve stem bush polishing device that makes polishing more uniform, improves the effect, and avoids affecting product quality due to non-uniform polishing. A turbine valve stem b...
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JP2023155641A |
To provide a cutting device that causes neither decrease in quality of a chip nor decrease in transverse intensity, and maintains adhesive power of a pressure-sensitive tape for a chip.A cutting device includes: holding means 3 which com...
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JP7366504B2 |
To provide a new division method of a workpiece that reduces the possibility of device contamination when the workpiece is divided.A division method of a workpiece used to divide a workpiece including a recess in which a device is formed...
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JP7365441B2 |
Disclosed is a workplate for Y-axis compensation of an ingot and a Y-axis compensation method of the ingot using the same, which is configured to facilitate Y-axis compensation of the ingot in a state in which the ingot is attached to th...
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JP7365248B2 |
To provide a polishing jig and a polishing method that form an inclined surface common to a plurality of components.A polishing jig is fixed to a polishing device according to the actual arrangement when a plurality of components are att...
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JP7364338B2 |
To prevent grinding dust from remaining on and re-adhering to a holding surface and prevent reduction of flatness of the holding surface in a holding surface cleaner which cleans a holding surface of a chuck table.A holding surface clean...
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JP7363393B2 |
To provide a grinding device that can be suppressed from deterioration in processing accuracy, even when wear and deformation occur in a contact maker of a rest device.A grinding device 1 comprises: a grinding wheel head 3 which is mount...
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JP7362212B2 |
To provide a method for grinding a rectangular workpiece that is able to easily reduce variation in thickness of the rectangular workpiece.A grinding method for a rectangular workpiece, by which the rectangular workpiece is ground by a g...
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JP2023152339A |
To provide a manufacturing apparatus and a manufacturing method, which enable a surface of a disk-shaped material-to-be-cut such as a semiconductor wafer to be ground so that variations in thickness can be reduced.A manufacturing apparat...
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JP7362207B2 |
A method of grinding a substrate includes grinding the substrate to a larger depth at an outer circumferential portion of the substrate than at a central portion of the substrate by keeping an annular grindstone assembly of a grinding un...
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JP2023151168A |
To provide a manufacturing method of a semiconductor device, capable of suppressing a cut dust generated at the time of cutting of an adhesive tape for a semiconductor processing.A method includes in this order, following steps S1, S2. T...
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JP7361595B2 |
An objective of the present invention is to provide a holding table that enables automatic exchange by an apparatus with a simple structure. The holding table includes a holding plate having a holding surface for holding a target object,...
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JP2023151593A |
To provide a polishing device and a polishing method which can reduce the time needed for polishing process to stabilize the quality of a seal surface, and to provide a machine component in which the quality of the seal surface is stabil...
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JP2023150190A |
To reduce grinding time in a creep-feed grinding process.In a creep-feed grinding process, a creep-feed grinding control part 12 turns off an air bearing, and thereby a chuck table 20 including a spindle 25 and a casing 27 come in surfac...
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JP2023148574A |
To provide a dicing device that can appropriately perform work for maintaining even a large-sized work-piece.A dicing device is provided with a housing 52 housing a work table 12 that moves while holding a work-piece W and a spindle 18 t...
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JP2023149596A |
To provide a long-life and low-cost abrasion-resistant member having excellent abrasion resistance.An abrasion-resistant member 100 has a base metal 10, and an abrasion-resistant layer 20 formed on the base metal 10, which has a flat fri...
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JP2023543349A |
The present invention relates to a polishing device for spheres, and includes a base including a cylindrical member for supporting a spherical object to be polished, and a fluid that communicates with the inside of the cylindrical member...
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JP2023149737A |
To provide a coin polishing device capable of satisfactorily removing smudges adhering to both the surfaces of a coin by using a rotary brush.In a coin polishing device, coins are conveyed in a horizontal state by a coin guide that a U-s...
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JP2023145135A |
To provide a work table and an edge trimming device which can reduce a labor of replacement and can be operated at a low cost.A work table 100 for edge trimming comprises: an annular workpiece support ring 110 which has an annular contac...
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JP2023144719A |
To improve dimensional accuracy of grinding by increasing the positioning accuracy of a workpiece during grinding.A grinding apparatus includes: a grinding wheel supported so as to be rotatable about a central axis; and a support table h...
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JP2023145215A |
To provide a wafer processing device with a structure which inhibits thermal expansion of a fixing screw fixing a chuck to a chuck base to reduce change of axial force and thereby enable high precision processing.A wafer processing devic...
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JP7358560B2 |
To provide a processing device capable of being installed in a space-saving manner, and continuously performing grinding of wafers with a simple structure.A processing device includes: a plurality of zippers 22 absorbing and holding wafe...
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JP7358014B2 |
To provide a highly efficient processing apparatus capable of irradiating an adhesive tape included in a frame unit with ultraviolet rays in a transport path.A processing apparatus includes a cassette mount table for mounting thereon a c...
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JP2023143278A |
To provide a dicing device that can accurately detect elastic wave generated from a blade.A dicing device is equipped with a machining table, a spindle 24, a blade 26 installed to a blade installing portion 60 of the spindle 24, and an e...
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JP2023141309A |
To provide a low-price plane polishing device which can provide a high plane smoothness of a polishing plane.Because an adhering disc 20 remains fitted in an eccentric hole 34 formed in an adhering disc eccentric jig 30 rotationally driv...
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JP2023140438A |
To provide a holding pad which is excellent in retainability for a workpiece having irregularities on an upper surface and a workpiece having a small thickness, and to provide a transport device.A holding pad (40) suctions and holds an u...
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JP2023140906A |
To provide an edge trimming device which can prevent smudges on a rear surface of a wafer.An edge trimming device 10 includes: a processing part 14 which uses a blade 56 to perform edge trimming to a wafer W held by a first table 100; an...
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JP2023140628A |
To provide a processing method for a work-piece, which when positions of center lines which have to be matched with each other on both surfaces of a work-piece deviate in a predetermined plane, corrects a processing position so that the ...
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JP2023141577A |
To provide a processing device that reduces an influence of rough grinding, performs fine grinding, and accurately processes a workpiece.A processing device 1 comprises: an index table 2 including a plurality of chucks 22 that adsorbs an...
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JP2023140627A |
To provide a processing device which can clean a holding surface for holding a work-piece without relying on a dedicated cleaning mechanism.A processing device comprises: a holding unit including a chuck table which has a first holding s...
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JP7356996B2 |
A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a cons...
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JP7356289B2 |
To provide an ultraviolet irradiation device and an annular convex removal device that can reduce power consumption and cost by using a UV LED light source.An ultraviolet irradiation device 5 irradiates an ultraviolet curable adhesive ta...
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JP2023139675A |
To transfer a wafer to a cleaning unit while maintaining a state where a water layer is formed onto the upper surface.A processing device 1 comprises: a chuck table 10; a processing unit 20; a first transfer unit 61 and a second transfer...
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JP2023138881A |
To provide a contact dynamic stiffness calculation system that is capable of calculating contact dynamic stiffness with high accuracy by taking into account contact states between a workpiece and workpiece support members.A contact dynam...
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JP7355670B2 |
The present invention relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing a substrate with such a polishing head. A...
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