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JP7328932B2 |
The invention relates to a centerless cylindrical grinding machine (100) for throughfeed and plunge grinding of arbitrary workpieces comprising a first drivable positioning axis XS for a grinding headstock (10) with a grinding wheel (11)...
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JP2023114126A |
To provide an information processing device and method, for properly predicting the state of a substrate holding mechanism part depending on the operation state of a substrate processing device.In a substrate processing system, an inform...
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JP2023114225A |
To provide a polishing device which resolves a problem of corrosion of the interior of a through hole of a rotary shaft caused by a polishing liquid.A polishing device 1 includes: a chuck table 3 which holds a workpiece 10; polishing mea...
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JP7328104B2 |
To enable a pad to suction and hold a wafer even after self-grinding or the like.A height of an arm 51 at the time when an optical axis L is cut off by a dog 54 when a lower surface 50b of a pad 50 is pushed down onto a holding surface 2...
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JP7326405B2 |
A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive ...
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JP2023111940A |
To provide a substrate processing device for flattering a non-circular substrate into a desired thickness.A substrate processing device 1 includes: a chuck table 21 including an adsorbent 23 capable of adsorbing and holding a substrate W...
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JP3243232U |
An object of the present invention is to provide a cushioning sheet for a vacuum suction device capable of suppressing breakage of a workpiece. A buffer sheet for a vacuum suction device (10) having a holding surface (20) for holding a w...
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JP2023111109A |
To provide a substrate processing device capable of determining whether a wafer is damaged.The substrate processing device includes a control device 5 that controls a light projection operation of an optical sensor 302 and a rotation ope...
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JP2023110283A |
To provide a chuck table capable of making a holding face of the chuck table and a grinding face of a wafer parallel at high precision.A chuck table 3 for holding a wafer 10 comprises: a holding plate 31 having a holding face 31a for suc...
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JP2023110631A |
To suppress peeling of an electrode.A semiconductor wafer comprises a semiconductor substrate, a plurality of circuit parts formed on a surface of the semiconductor substrate, and a plurality of electrodes formed corresponding to the plu...
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JP7323341B2 |
To urge an operator to execute an origin position recognition operation.In a griding device, when an origin position recognition operation is to be executed, an origin position recognition operation start button 51 is made conspicuous by...
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JP2023109276A |
To provide a processing device which prevents a function stop of a proximity sensor during processing of a workpiece by monitoring a state of the proximity sensor used for detecting a frame unit, and to provide an abnormality detection m...
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JP2023109359A |
To suppress deviation from a target position in a thickness direction in separation of an aluminum nitride single crystal body.A fixing jig used for separating an aluminum nitride single crystal body from a laminate includes a placing su...
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JP2023534268A |
Embodiments of the present disclosure generally relate to chemical-mechanical polishing systems (CMP) systems and processes used in the manufacture of electronic devices. In particular, embodiments herein relate to methods of detecting n...
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JP7323342B2 |
To make dirt less likely to adhere to a holding surface of transporting means of a robot etc.If a robot 155 is located in a stand-by position, a holding surface 156 of the robot 155 is oriented in parallel with airflow S1 of a cleaned ga...
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JP2023108972A |
To provide a pipe surface polishing device which can suppress defective conveyance regardless of any diameter of a stainless steel pipe to improve yielding percentage.Transport means includes: a forced drive roller which contacts with a ...
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JP7321893B2 |
A method for manufacturing a substrate includes processing a side face of a laminate that includes substrates and a sheet-shaped spacer disposed between adjacent substrates. The processing of the side face includes bringing the laminate ...
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JP3243160U |
A multi-station adjustable polishing robot is provided. A polishing robot includes a box 1 having a polishing area in which a feeding mechanism 2, a carrier mechanism 3, a polishing mechanism 4 and a supply mechanism 5 are installed. The...
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JP2023108931A |
To provide a chuck table which can resolve a problem of contamination of a suction pad caused by the suction pad of transport means suctioning contaminants and a problem of clogging occurring at a porous plate, and to provide a grinding ...
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JP7321649B2 |
To reduce warpage of a work-piece subjected to grinding.A grinding method, which grinds a convex first surface and a concave second surface of a tabular work-piece causing warpage using a grinding unit, comprises: a first adhering step o...
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JP7320358B2 |
To provide a processing device of cleaning a work-piece underside by cleaning means which is reduced in space and is not unusable due to dirty of a sponge in the cleaning means.A processing device comprises means 16 of holding a work-pic...
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JP2023107998A |
To polish a convex spherical surface of an end of a rod-like member by composite operation of rotation around a central axis of the rod-like member, continuous or intermittent transfer of a polishing tape, and pressure-contact of the pol...
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JP7320428B2 |
To position a frame lower than a workpiece held on a holding surface by extending a hard tape stuck on a ring frame, in a machining device.A machining device 1 is equipped with work set holding means 3, workpiece machining means, and car...
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JP2023106877A |
To provide a plate-like object support device which can suppress positional deviation of a plate-like object.A plate-like object support device 80 includes a support unit 81 for supporting a plate-like object, and a destaticizing unit fo...
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JP2023105996A |
To reduce occurrence of defective machining caused by surface burning in creep feed grinding.A grinding method includes: a first tilt adjustment step of rotating a table base around a machining feed direction to incline the table base at...
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JP2023106084A |
To provide a chuck device capable of stably performing wafer flattening (that is, polishing or grinding) with the help of anodization.A chuck device (2) is configured to hold a wafer during the wafer (W) flattening with the help of anodi...
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JP7318216B2 |
To suppress the dropping of a wafer during and after cutting a crystalline ingot, and the occurrence of cracking during the cutting by means of low-cost and easy means.In a fixation method of a crystalline ingot, as the fixation method o...
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JP2023106083A |
To provide a technique for suppressing penetration of an electrolytic solution into the back surface of a flat workpiece such as a semiconductor wafer.A chuck (2) that holds a workpiece while exposing a workpiece surface (W1) by sucking ...
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JP2023105587A |
To improve accuracy of seating detection of a substrate.A pusher for holding a substrate includes a pusher body and a plurality of seating members 630 which are attached to the pusher body and on which the substrate is seated. Each of th...
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JP7317483B2 |
Provided is a method for processing a wafer to prevent quality of a device from deteriorating even when a rear surface of the wafer is processed. According to the present invention, the wafer processing method, which is configured to pro...
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JP7317441B2 |
To provide a chamfering device that can prevent a work-piece from being damaged and polluted by dust and the like generated during truing.A chamfering device 2, which chamfers an outer periphery part of a disk-like work-piece 11 having a...
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JP7317482B2 |
Provided is a method of processing a wafer, which does not degrade the quality of a device even when the wafer is supported by a substrate to process a rear surface of the wafer. According to the present invention, the method of processi...
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JP2023104215A |
To provide a grinding device, which is configured so that ground chips are ejected from a holding surface and porous members constituting the holding surface, without being enlarged in size.Ground chips intruding from a holding surface 2...
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JP7315973B2 |
To provide a roller holding method in a device which performs polishing and so on of a work-piece surface with a circular cross section by a centerless polishing device or the like, and a roller holding device (roller support).A holding ...
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JP7315820B2 |
To provide a workpiece transfer device capable of directly holding and transferring a warped workpiece.A workpiece transfer device 10 that directly holds and transfers a workpiece W includes a suction unit 62 that directly holds the work...
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JP2023102926A |
To restore a wafer ID in a grinding apparatus without inviting an increase in the size of the apparatus.A grinding apparatus 1 includes an ID formation unit 110 which executes reading and restoration processing of a wafer ID. The grindin...
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JP2023102458A |
To prevent an adhesion of dust adhered to a spinner table to a wafer.A processing device comprises: a spinner cleaning unit 80 of cleaning a wafer held by a spinner table 81; a robot that conveys the wafer to a cassette by approaching a ...
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JP7313766B2 |
To provide a carrying mechanism that is able to inhibit decreases in the quality and yielding percentage of chips, etc., obtained by processing of work pieces.A carrying mechanism 12 for carrying a work piece 11, comprises: a carrying ar...
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JP7313204B2 |
Provided is a processing device which suppresses a chuck table from being accidentally mounted. The processing device (1) comprises a chuck table (10), a table base (20), a processing unit (30), and a table determination unit (40). The c...
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JP7312587B2 |
To provide a substrate processing device which flattens a non-circular substrate in a desired thickness.A substrate processing device 1 includes: a chuck table 21 having an absorber 23 which can suck and hold a substrate W, and a dense b...
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JP7312371B2 |
To provide a processing method for a crank shaft that can secure processing accuracy while shortening a cycle time for grinding the crank shaft at a single grinding station, without requiring conveyance of the crank shaft to the other gr...
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JP2023101208A |
To provide a technology which enables downsizing of an electric work machine with respect to a rotation axis direction of an output shaft.An electric work machine disclosed by the specification includes: a rotary blade; an output shaft t...
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JP7312077B2 |
The present invention relates to a grinding method of a plate-shaped workpiece, which is able to reduce the thickness difference in an angular-plate-shaped workpiece after grinding. In an escape process after a grinding process, the pres...
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JP7311171B2 |
Disclosed is a grinding disk kit for finishing rolling surfaces of bearing rollers, including a pair of coaxial first and second grinding disks; a front face of the first grinding disk includes a group of radially distributed linear groo...
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JP7311383B2 |
To provide a work-piece processing device that can more surely suppress a tool such as a grindstone from being broken, in processing a work-piece such as shaped steel.A work-piece processing device 1 comprises a roller 28 and a tool hold...
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JP7308621B2 |
To enable a low cost and suppression of duration required for completion.A division device 1 at least comprises: a cutting unit that divides a processed material 200 held by a holding table into a plurality of device chips; a cleaning un...
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JP7308547B2 |
The present disclosure provides an automatic processing apparatus including a main body, a receiving portion, a working assembly, a workpiece magazine, a setting mechanism, a passivation bucket assembly, and a rotation driving assembly. ...
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JP7308394B2 |
To provide an assisting method and an assisting device of alignment for highly accurately performing alignment between a rotational axis and an imaging optical axis.An assisting method for assisting the alignment work of aligning a rotat...
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JP7306859B2 |
Provided are a support sheet a method for processing a transparent plate. The support sheet for supporting a workpiece at least comprises a transparent sheet with a front surface for supporting the workpiece and a reflection film stacked...
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JP2023098764A |
To provide a processing method for suppressing elongation of burrs generated when cutting an electrode portion in processing for dividing a package substrate by cutting.In a processing method of a package substrate 10, a plurality of int...
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