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WO/2006/101014A1 |
[PROBLEMS] To provide a working tool with a rotary tip tool capable of effectively maintaining the synchronous rotation of a drive side rotating member and a driven side rotating member in an integrated state. [MEANS FOR SOLVING PROBLEMS...
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WO/2006/061910A1 |
A method for setting the initial position of a whetstone before starting grinding in a vertical duplex surface grinding machine for surface grinding the upper and lower grinding surfaces of a work simultaneously by rotation-driving a pai...
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WO/2006/053981A1 |
The invention concerns a method implemented in a grinding machine comprising a lens support (19) provided with means driving the lens (15) in rotation along a first axis (A-A') and a scoring grinder (51) inclined relative to the first ax...
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WO/2006/045965A1 |
The invention relates to a method for finishing or correction of the profile of the periphery of an ophthalmic lens (L) following an edge profile, comprising at least one finishing or correction machining step of a part (B2) of the profi...
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WO/2006/043928A1 |
A conditioner disk (200) for use on a polishing pad (32) in chemical mechanical polishing process includes a base structure (210), a plurality of blades (220) supported by the base structure (210). The blades (220) radiate radially and t...
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WO/2005/123339A2 |
The invention relates to a grinding machine comprising a displacement drive for a column saddle (25), said drive being provided with two guiding rails extending in recesses with the slideway linings (23, 24) of the column saddle (25). Tw...
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WO/2005/123340A1 |
The invention relates to a method of grooving or counter-bevelling the periphery of an ophthalmic lens. The inventive method is carried out in a grinding machine comprising a lens support which is equipped with means for rotating the len...
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WO/2005/105356A2 |
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Appli...
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WO/2005/070597A2 |
The invention relates to a device (10) for machining workpieces (36), particularly peripheral areas of disc-shaped workpieces such as circular saw blades, comprising: a clamping device (38) for fixing the workpiece (36) to be machined in...
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WO/2005/049267A1 |
The invention relates to a machine tool, in particular, a hand-held machine tool, comprising a tool (18) which can be displaced by a drive, in particular, a motor (20). The aim of the invention is to increase efficiency, reduce energy co...
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WO/2005/018876A1 |
The invention relates to a control unit (23) for a grinding device, which winds and unwinds the grinding means carrier (16) by means of a contact apparatus (12). Said control unit (23) continuously detects the position of one or more of ...
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WO/2004/103639A1 |
A sanding method carried out by means of a sanding machine comprising a conveyor and a sanding unit provided with an abrasive tape and having a plurality of pressing units positioned side by side and independent of one another that rest ...
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WO/2004/102290A1 |
A numeric controller capable of performing chopping control machining without providing an additional axis dedicated to chopping and provided, at the interpolating section (12) and the axis controlling section (13), with a movement data ...
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WO/2004/087373A1 |
The invention relates to a method for carrying out the precise trimming of a lens (1), whereby the lens is held between two clamping plates (2, 3) in a given position and the grinding of the periphery of the lens (1) is controlled along ...
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WO/2004/085114A1 |
A work tool comprising: a principle drive shaft (1) with a sun gear (2) attached thereto; at least two planetary gears (3) distributed about the circumference of the sun gear (2) at substantially equal angular separations; and a carriage...
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WO/2004/082889A1 |
The invention relates to a method for estimating the angular offset between a rotating radial axis linked to a glass which is to be ground and a reference rotating radial axis which can be applied to a grinding machine for ophthalmic gla...
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WO/2004/056531A1 |
Disclosed is a finishing machine tool, and more particularly, to a head unit structure in a finishing machine tool in which a grinding bit can perform a finishing work at a uniform pressure by an automated static pressure unit and an ope...
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WO/2004/053942A2 |
An apparatus for electropolishing and/or electroplating metal layers on a semiconductor wafer includes a receptacle having a plurality of section walls (figure 1). The apparatus includes a wafer chuck configured to hold the semiconductor...
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WO/2004/048030A1 |
The invention concerns a measuring method applicable to a machine-tool (M) which consists in causing the tool (O) to contact a point selected as reference in the machining station by controlling said actuating means (200) which, through ...
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WO/2004/041479A1 |
A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainerring...
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WO/2004/033151A1 |
The aim of the invention is to provide a retaining ring (10) for holding semiconductor wafers in a chemical-mechanical polishing device, which is more economically produced and is especially more economically provided with a new plastic ...
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WO/2003/101695A2 |
A machining spindle comprising an inner shaft (110a) arranged for carrying a first tool (5a) for machining a workpiece and an outer shaft (110b) arranged for carrying a second tool (5b) for machining the workpiece, wherein the shafts are...
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WO/2003/095862A1 |
A balancing method and apparatus is used for dynamically balancing an out of balance condition in a rotating body caused by resistance forces acting tangentially to the body. A device having a rotatable component and automatic or dynamic...
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WO/2003/080289A2 |
The polishing machine processes a workpiece put on table of body by four-directional control and is provided with a pair of columns. It comprises: first carrying unit having both ends fixed to pair of columns and having carrying part mou...
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WO/2003/078098A1 |
The device (1) is used for machining the flanks (91, 92) of cutting tools (9), especially saw blades. The saw blade (9) is clamped in clamping jaws (2). The flank (91) of the saw blade is surface-grinded with the aid of a grinding disk w...
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WO2002060643A9 |
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...
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WO2001087540A9 |
A floor-treating machine comprises a frame (2) with actuating means (10), a housing (3), which is attached to the frame in such a manner that it can rotate about a substantially vertical axis and in which at least three heads (7), which ...
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WO/2002/098676A1 |
A polishing device capable of preventing the tooth parts of carriers for a thin work from being damaged, wherein the height of the outer edge parts of the carriers (100) rotating on its axis while revolving in the state of being meshed w...
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WO/2002/076676A1 |
The invention provides a method of reducing thermal distortion in grinding machines. Such machines each comprise a machine base (60) and a grinding wheel (50) for grinding components in the machine (10). The method includes the steps of:...
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WO/2002/070197A1 |
Bilateral grinding machine for glass panes, where all drives (3) and the housing (5) for electrical cables and water pipes are located above the plane (1) of the pane to be ground.
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WO/2002/068151A1 |
An abrasion tool that is selectively configurable for spin or random-orbit without the need for a reversible motor. The tool uses two collars, each having half of the desired offset and half of the counterweight. In spin mode, the collar...
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WO/2002/057050A1 |
An initial position setting method for a grinding device that comprises a grinding stone (11), lens holding shafts (14, 14) capable of moving toward and away from each other along the normal direction of the grinding stone (11), a groove...
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WO/2002/044590A1 |
A gear and a gear mechanism usable for a gear drive system and having a high practicality, and a non-circular and asymmetric gear having a high practicality with respect to durability, the gear mechanism thereof, and a barrel finishing m...
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WO/2002/040219A1 |
A welding electrode polishing machine capable of shaping the tip part of an electrode in a final shape efficiently and accurately and capable of polishing the head part of the electrode in mirror surface with one polishing panel and one ...
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WO/2002/032604A1 |
A method and a device for machining a spectacle lens capable of easily, accurately, and reproducibly machining a variety of globe lenses to form holes and grooves for installation of parts in the outer peripheral end face of a lens, wher...
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WO/2002/028595A1 |
The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt (110) moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafe...
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WO/2002/016076A1 |
A sheet peripheral edge grinder, comprising a grinding wheel axis tilting mechanism (1) capable of varying the tilt angle of the rotating axis of a grinding wheel (3) relative to the rotating axis of a sheet (2) and also varying the dire...
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WO/2002/002276A2 |
A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle (412) capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a waf...
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WO2001041972A9 |
A hand-held oscillating sander (10) includes a pair of toothed pulleys (410, 420) associated with the output shaft (50). The first pulley (410) is attached to the output shaft (50) for rotation with the output shaft (50). The second pull...
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WO/2001/081983A1 |
Rimless spectacles capable of easily assuring a wide effective view, durability, attractiveness, and reduced weight and being manufactured easily, wherein a cut-out part is provided at the edge part of a spectacle lens, an installation m...
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WO/2001/070462A1 |
A method of polishing a surface of a substrate wafer wherein slurry is recycled back to the interface between the polishing pad and the substrate surface during the polishing and newly-formulated slurry is supplied to the interface durin...
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WO/2001/070459A1 |
The invention relates to a method for treating spectacle glasses by means of a CNC-controlled spectacle glass treatment machine. The inventive method comprises the steps: mounting the raw glass (9) on a holder (20) in the spectacle glass...
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WO/2001/068320A1 |
The polishing machine for stone materials comprises: a conveyor belt (2) for the slabs or strips to be polished, a beam (7) made to oscillate on at least two transverse, fixed frames (4, 5) above the said conveyor, at least one oscillati...
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WO/2001/060566A1 |
A roll polishing device capable of polishing a roll installed in a paper making equipment at an operating position, wherein a guide rail (10) extending in parallel with the rotating shaft of the roll is provided over the roll (R), a runn...
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WO/2001/056740A1 |
The invention relates to a polishing head for a polishing machine, especially for polishing optical surfaces. The inventive polishing head comprises a polishing plate that is linked with a rotation-driven primary shaft. Said polishing pl...
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WO/2001/045898A1 |
The present invention describes a form of blade tip grinder (5) for grinding the tips (6) of turbine or compressor rotors (7). The invention is characterised by the inclusion of a de-burring wheel (10) which is mounted and operated so as...
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WO/2001/045896A1 |
A pre-cutter or edger machine for processing the periphery of an optic is provided. The pre-cutter or edger machine of the present invention is adventageous in that it provides a machine that eliminates the need to mount the optic on a b...
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WO/2001/045901A1 |
An apparatus (200) for chemical-mechanical planarization (CMP) of semiconductor wafers (205) that allows independent micro-control of each spindle (201) for tailored CMP performance. The present invention provides, in one embodiment, a C...
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WO/2001/036152A1 |
A machine tool for polishing flat articles comprises a bed (1) with two vertical columns (C2) and a table (3) arranged between (C2) has a rotating faceplate (P4) that is provided with a plate (5) with vacuum holders (6). The machine tool...
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WO/2001/002133A2 |
A disc-like workpiece (10), such as a semi-conductor wafer, is positioned relative to a grooved grinding wheel (32) by the steps of rotating the workpiece and wheel about respective parallel axes, performing a preliminary grind, measurin...
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