Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 10,187

Document Document Title
WO/2019/155707A1
A dicing device 10 in which a work table 12 and a blade 18 that is made to rotate by a spindle 20 are moved relative to each other and dicing is performed in a state in which a workpiece W is held on the work table 12 with a dicing tape ...  
WO/2019/138595A1
A polishing device (1) includes a polishing brush (3) and a polishing brush holder (4) that holds the polishing brush (3). The polishing brush holder (4) includes a shank (6), a support mechanism (21) that has a sleeve (7) and supports t...  
WO/2019/138471A1
A polishing device (1) includes a polishing brush (3) and a polishing brush holder (4) that holds the polishing brush (3). The polishing brush holder (4) includes a shank (6), a support mechanism (21) that has a sleeve (7) and supports t...  
WO/2019/140220A1
An automated hand tool sharpening and cleaning system for sharpening the two opposed cutting edges of a blade is provided by the invention. The apparatus comprises a six-axis robotic arm, a pneumatic gripper, a vision sensor camera, a ro...  
WO/2019/138315A1
Sanding machine, in particular for processing wood surfaces, comprising: a support and transport plane (120) for the forwarding of the workpieces (118; 218) to be processed; and a belt sanding unit (201) with a transverse abrasive belt (...  
WO/2019/135498A1
The present invention relates to a method for designing and manufacturing a double-sided aspherical surface of a customized progressive multifocal lens, and provided are: a design method comprising at least one of a step of providing a c...  
WO/2019/127776A1
Disclosed is a grinding device for grinding a glass substrate (10), the grinding device comprising a fixedly disposed grinding wheel (20), a cooling tube (30) and a movable carrying table (40), wherein the glass substrate (10) is dispose...  
WO/2019/133210A1
Systems and methods of buffing tire casings are provided. A tire buffing machine includes a tire hub assembly selectively rotating a mounted casing, a buffer configured to buff the casing, a tire belt detection apparatus having two or mo...  
WO/2019/130764A1
Provided is a method for two-sided polishing of a wafer that makes it possible to curb variance between batches in GBIR values of polished wafers. This method for two-sided polishing of a wafer is characterized by comprising: a step (S10...  
WO/2019/127024A1
A method for robotic machining is disclosed. The method includes determining a first designed machining path based on a modeled surface for a target surface to be machined (210). The method also includes causing a robot to machine the ta...  
WO/2019/130757A1
Provided are a double-side polishing device and a double-side polishing method with which it is possible to end double-side polishing when a workpiece has obtained an intended shape in the middle of double-side polishing. An arithmetic u...  
WO/2019/124032A1
A substrate processing system that machines a machining face of a substrate on which a protective material is provided on a non-machining face has: a grinding unit that grinds the machining face of the substrate in a plurality of steps; ...  
WO/2019/102629A1
Provided are a device that can efficiently perform corner chamfer machining of a column member and that can efficiently perform machining of a column member including the corner chamfer machining, and a machining method. A machining devi...  
WO/2019/097747A1
Provided are: a strip end detection device that is capable of accurately detecting a strip end and reducing maintenance work burden; and a brushing device comprising the strip end detection device. This end detection device 7 moves back ...  
WO/2019/099541A1
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...  
WO/2019/097059A1
The invention relates to an attachment (100) for the abrading or smoothing of walls or ceilings for a mobile handling device (10), wherein the attachment (100) has a mounting unit (104) to be received at an attachment interface (38) of t...  
WO/2019/091820A1
The method for machining a glass pane (1'), wherein the edge (1a') of the glass pane is machined using at least one grinding tool (10), in that the glass pane and the grinding tool, which is set in rotation by means of a motor (11), are ...  
WO/2019/091823A1
The invention relates to an abrasive disk (2) comprising at least one layer (17, 16, 18) in which abrasive centre punches are embedded. A sensor (22) for detecting an original periphery (20) of the abrasive disk (2), which has been modif...  
WO/2019/094227A1
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...  
WO/2019/089089A1
A device is disclosed for measuring Barkhausen noise of a crankshaft to identify defects in the crankshaft while the crankshaft is installed on an engine, comprising: a housing configured to attach to a connecting rod; at least one senso...  
WO/2019/053128A3
The invention relates to a device (1) for machining a workpiece using a belt (2), comprising a belt reel holder (4) for holding a reel (3) through which the belt (2) is supplied, a housing (5) which delimits a machining chamber (10), a w...  
WO/2019/089156A1
One variation of a method for automatically re-sharpening a knife includes: receiving a knife at a vice; during a scan cycle, scanning the grind head along a blade of the knife from an initial longitudinal position proximal the vice towa...  
WO/2019/080597A1
A ceramic tile polishing apparatus having a multiple-row arrangement of polishing abrasive heads and a technique, the polishing apparatus comprising a horizontal beam system and an abrasive head system, the horizontal beam system compris...  
WO/2019/081120A1
The invention relates to a method for the surface machining of at least one object, in particular for the purpose of producing a mold, to a device for the surface machining of at least one object, and to a method for producing a molded c...  
WO/2019/077949A1
Provided is a grinding machining device with which it is possible to know the amount of impact during grinding machining of an item to be ground. This grinding machining device comprises: a grinding tool; a rotational driving part that r...  
WO/2019/071053A1
An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one ...  
WO/2018/234030A3
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2019/066208A1
Discloses are a glasses lens processing apparatus and method for determining whether lens processing is completed by using a hall sensor during the processing of glasses lens. The glasses lens processing apparatus comprises: a grinding w...  
WO/2019/055279A1
A method of controlling polishing includes sweeping a sensor of an in-situ monitoring system across a substrate as a layer of the substrate undergoes polishing, generating from the in-situ monitoring system a sequence of signal values th...  
WO/2019/052724A1
The invention relates to a method for fine machining a cylindrical workpiece surface (16) of a workpiece blank (14) by means of a fine machining tool (26). Said method comprising the following steps: generating a relative rotational move...  
WO/2019/054133A1
This production method for a sheet glass comprises an end surface processing step for processing an end surface ES of a sheet glass G using at least one processing tool 2. The processing tool 2 includes a constant-pressure processing too...  
WO/2019/053128A2
The invention relates to a device (1) for machining a workpiece using a belt (2), comprising a belt reel holder (4) for holding a reel (3) through which the belt (2) is supplied, a housing (5) which delimits a machining chamber (10), a w...  
WO/2019/051998A1
Disclosed are a method, apparatus and system for detecting a spectrum end point in chemo-mechanical polishing. The method comprises: according to spectrum detection data of a polished thin film on a surface of a wafer, determining smooth...  
WO/2019/049659A1
A polishing end-point position is detected in order to end polishing at an appropriate position. According to one embodiment of the present invention, a method for chemically and mechanically polishing a substrate provided with a functio...  
WO/2019/047683A1
A smart polishing method, comprising the following steps: a robot moving according to a predetermined trajectory, so as to enable a polishing tool, which is connected to a floating part of a floating polishing structure or a front portio...  
WO/2019/041393A1
A lapping and polishing mechanism comprises an indexing plate (10), a bushing (20), an eccentric sleeve (330), an eccentric adjustment piece (320), a spring (340), a position-limiting column (310), and a connecting shaft (360). The eccen...  
WO/2019/042850A1
Method for controlling the polishing of a gemstone, comprising: obtaining a three-dimensional model of the gemstone; fixing the gemstone in a dop, wherein an initial facet to be polished is aligned; obtaining at least one image of the in...  
WO/2019/041391A1
A lapping and polishing machine and an auxiliary mechanism thereof. The auxiliary mechanism comprises an indexing plate (10), a bushing (20), and an eccentric assembly (30). One end of the bushing (20) is provided with a rotating shaft (...  
WO/2019/041392A1
A polishing machine and a rotation positioning mechanism thereof. The rotation positioning mechanism comprises a positioning ball (410), a fixing base (420), an elastic member (430), and an adjustment pin (440). The fixing base (420) is ...  
WO/2019/032234A1
Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to ...  
WO/2019/025542A1
By means of the present invention, a suctioning device (1) for a grinding device (100) and a method for suctioning particles produced at a grinding device (100) are provided. The suctioning device (1) has at least one suctioning channel ...  
WO/2019/025480A1
An apparatus for checking the diameter of crankpins (15) of a crankshaft in orbital motion about a geometrical axis in a numerical control machine tool includes a V-shaped reference device (10), a measuring device (6) and a support devic...  
WO/2019/022961A1
Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In on...  
WO/2019/016667A1
The grinding unit (29) comprises at least one grinding wheel (47) adapted to rotate around a respective rotation axis (C-C), and a thrust actuator (37) adapted to push the grinding wheel (47) against a cutting edge (18) of the disc-shape...  
WO/2019/013042A1
This substrate processing system is for processing a bonded substrate formed by bonding a to-be-processed substrate and a support substrate in such a manner as to reduce the thickness of a non-bonded surface of the to-be-processed substr...  
WO/2019/013037A1
This grinding device for grinding a substrate comprises substrate holding units which hold the substrate, and annular grinding units which contact at least the center and the periphery of the substrate held by the substrate holding units...  
WO/2019/000159A1
A polisher, and polisher system. The polisher comprises: a main body (201) configured to polish an object to be polished; a switch (202) connected to the main body (201) and configured to control a rotational speed of the polisher by mea...  
WO/2018/235328A1
An automatic grinding apparatus for grinding an object using a grinder, in which the load current increases or decreases according to the magnitude of the amount of grinding per unit time, is provided with: an electric current-detecting ...  
WO/2018/234030A2
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2018/235430A1
The purpose of the invention is to effectively improve processing efficiency of a polishing process on a face to be polished and the finish quality of the polishing process. A polishing tool (4) scours each portion of a face to be polish...  

Matches 1 - 50 out of 10,187