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Patent Searching and Data


Matches 1 - 50 out of 10,283

Document Document Title
WO/2019/210911A1
The invention relates to a method and a device for a time-resolved analysis (optimally with real-time capability) of transfer films during the contacting of two different surfaces. To provide a method that allows the imaging of the entir...  
WO/2019/210997A1
The present invention provides an in-situ boroblending tool (1) for the computer-assisted (automated) blend repair of an airfoil of a turbomachine. The tool (1) comprises a flexible borescope line (2) which is connected to a robotic head...  
WO/2019/208712A1
The present invention relates to a polishing device provided with a surface property measuring device for measuring a surface property of a polishing pad used to polish a substrate such as a semiconductor wafer, and a polishing system in...  
WO/2019/205632A1
A polishing line having upper and lower grooves and an automatic measurement function comprises: a material loading and unloading mechanism (2); an upper and lower groove polishing machine (6) adjoining one side of the material loading a...  
WO/2019/198313A1
Provided is an automatic polishing system such that a polishing controller (6) controls a polishing robot (2) and a polishing tool (4) so that the polishing tool (4) performs polishing operation on a surface A to be polished, wherein a c...  
WO/2019/197931A1
The invention concerns a method and a grinding machine (4) for machining a workpiece (1) comprising a desired helical groove. The method comprises a step of grinding a calibration groove (12) on the surface (10) of the workpiece accordin...  
WO/2019/197719A1
A method for producing a groove pattern (PAT1) on a cylinder surface (SRF1) comprises: - providing an abrasive module (100), which comprises an abrasive mesh article (110) and a collector block (BLC1), the abrasive mesh article (110) bei...  
WO/2019/198343A1
Provided is a double-sided polishing device for a workpiece that can perform double-sided polishing of the workpiece while maintaining accuracy, for a longer period of time than conventional devices, in measuring the thickness of the wor...  
WO/2019/195087A1
Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data ...  
WO/2019/191443A1
A tool is provided and includes a tool frame. The tool frame includes a spindle and an abrasive article is mounted to the spindle. Further, a spark-invariant sensor is coupled to the frame and is configured to measure the rotation rate o...  
WO/2019/187873A1
The end-face processing step of this method comprises a position control step for controlling, by means of a control device 5, the position of a processing tool 2. The position control step includes: a preparation step S1 for placing the...  
WO/2019/174780A1
The present invention relates to a manufacturing method for the diamond dressing process to be performed on items used, in particular, as gold, silver and costume jewellery, as well as eyeglasses and clothing accessories, which consists ...  
WO/2019/175251A1
The invention relates to a method for the automated grinding of surfaces and to a corresponding device. According to one exemplary embodiment, the method comprises the robot-assisted positioning of a grinding machine with a grinding tool...  
WO/2019/177840A1
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...  
WO/2019/175759A1
A machine (1) for machining elements (A), such as ceramic products or natural stones and the like, which are provided with two edges (B) to be machined, comprises a support structure (4) for at least one conveyor belt (5) for transferrin...  
WO/2019/177842A1
A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, filtering a signal from the monitoring system to generate a filtered signal, and determining a...  
WO/2019/178194A1
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic ...  
WO/2019/163799A1
When an initial value h and a target value L for a differential width HD satisfy h>L, a control device places an outer ring (11) on a rotary table (20) so that the front side end face is the face to be ground and places an inner ring (12...  
WO/2019/159735A1
A processing device for processing a substrate, said processing device having: a substrate holding unit for holding a substrate; a processing unit for processing a processing surface of a substrate held in the substrate holding unit; and...  
WO/2019/155707A1
A dicing device 10 in which a work table 12 and a blade 18 that is made to rotate by a spindle 20 are moved relative to each other and dicing is performed in a state in which a workpiece W is held on the work table 12 with a dicing tape ...  
WO/2019/138595A1
A polishing device (1) includes a polishing brush (3) and a polishing brush holder (4) that holds the polishing brush (3). The polishing brush holder (4) includes a shank (6), a support mechanism (21) that has a sleeve (7) and supports t...  
WO/2019/138471A1
A polishing device (1) includes a polishing brush (3) and a polishing brush holder (4) that holds the polishing brush (3). The polishing brush holder (4) includes a shank (6), a support mechanism (21) that has a sleeve (7) and supports t...  
WO/2019/140220A1
An automated hand tool sharpening and cleaning system for sharpening the two opposed cutting edges of a blade is provided by the invention. The apparatus comprises a six-axis robotic arm, a pneumatic gripper, a vision sensor camera, a ro...  
WO/2019/138315A1
Sanding machine, in particular for processing wood surfaces, comprising: a support and transport plane (120) for the forwarding of the workpieces (118; 218) to be processed; and a belt sanding unit (201) with a transverse abrasive belt (...  
WO/2019/135498A1
The present invention relates to a method for designing and manufacturing a double-sided aspherical surface of a customized progressive multifocal lens, and provided are: a design method comprising at least one of a step of providing a c...  
WO/2019/127776A1
Disclosed is a grinding device for grinding a glass substrate (10), the grinding device comprising a fixedly disposed grinding wheel (20), a cooling tube (30) and a movable carrying table (40), wherein the glass substrate (10) is dispose...  
WO/2019/133210A1
Systems and methods of buffing tire casings are provided. A tire buffing machine includes a tire hub assembly selectively rotating a mounted casing, a buffer configured to buff the casing, a tire belt detection apparatus having two or mo...  
WO/2019/130764A1
Provided is a method for two-sided polishing of a wafer that makes it possible to curb variance between batches in GBIR values of polished wafers. This method for two-sided polishing of a wafer is characterized by comprising: a step (S10...  
WO/2019/127024A1
A method for robotic machining is disclosed. The method includes determining a first designed machining path based on a modeled surface for a target surface to be machined (210). The method also includes causing a robot to machine the ta...  
WO/2019/130757A1
Provided are a double-side polishing device and a double-side polishing method with which it is possible to end double-side polishing when a workpiece has obtained an intended shape in the middle of double-side polishing. An arithmetic u...  
WO/2019/124032A1
A substrate processing system that machines a machining face of a substrate on which a protective material is provided on a non-machining face has: a grinding unit that grinds the machining face of the substrate in a plurality of steps; ...  
WO/2019/102629A1
Provided are a device that can efficiently perform corner chamfer machining of a column member and that can efficiently perform machining of a column member including the corner chamfer machining, and a machining method. A machining devi...  
WO/2019/097747A1
Provided are: a strip end detection device that is capable of accurately detecting a strip end and reducing maintenance work burden; and a brushing device comprising the strip end detection device. This end detection device 7 moves back ...  
WO/2019/099541A1
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...  
WO/2019/097059A1
The invention relates to an attachment (100) for the abrading or smoothing of walls or ceilings for a mobile handling device (10), wherein the attachment (100) has a mounting unit (104) to be received at an attachment interface (38) of t...  
WO/2019/091820A1
The method for machining a glass pane (1'), wherein the edge (1a') of the glass pane is machined using at least one grinding tool (10), in that the glass pane and the grinding tool, which is set in rotation by means of a motor (11), are ...  
WO/2019/091823A1
The invention relates to an abrasive disk (2) comprising at least one layer (17, 16, 18) in which abrasive centre punches are embedded. A sensor (22) for detecting an original periphery (20) of the abrasive disk (2), which has been modif...  
WO/2019/094227A1
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...  
WO/2019/089089A1
A device is disclosed for measuring Barkhausen noise of a crankshaft to identify defects in the crankshaft while the crankshaft is installed on an engine, comprising: a housing configured to attach to a connecting rod; at least one senso...  
WO/2019/053128A3
The invention relates to a device (1) for machining a workpiece using a belt (2), comprising a belt reel holder (4) for holding a reel (3) through which the belt (2) is supplied, a housing (5) which delimits a machining chamber (10), a w...  
WO/2019/089156A1
One variation of a method for automatically re-sharpening a knife includes: receiving a knife at a vice; during a scan cycle, scanning the grind head along a blade of the knife from an initial longitudinal position proximal the vice towa...  
WO/2019/080597A1
A ceramic tile polishing apparatus having a multiple-row arrangement of polishing abrasive heads and a technique, the polishing apparatus comprising a horizontal beam system and an abrasive head system, the horizontal beam system compris...  
WO/2019/081120A1
The invention relates to a method for the surface machining of at least one object, in particular for the purpose of producing a mold, to a device for the surface machining of at least one object, and to a method for producing a molded c...  
WO/2019/077949A1
Provided is a grinding machining device with which it is possible to know the amount of impact during grinding machining of an item to be ground. This grinding machining device comprises: a grinding tool; a rotational driving part that r...  
WO/2019/071053A1
An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one ...  
WO/2018/234030A3
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2019/066208A1
Discloses are a glasses lens processing apparatus and method for determining whether lens processing is completed by using a hall sensor during the processing of glasses lens. The glasses lens processing apparatus comprises: a grinding w...  
WO/2019/055279A1
A method of controlling polishing includes sweeping a sensor of an in-situ monitoring system across a substrate as a layer of the substrate undergoes polishing, generating from the in-situ monitoring system a sequence of signal values th...  
WO/2019/052724A1
The invention relates to a method for fine machining a cylindrical workpiece surface (16) of a workpiece blank (14) by means of a fine machining tool (26). Said method comprising the following steps: generating a relative rotational move...  
WO/2019/054133A1
This production method for a sheet glass comprises an end surface processing step for processing an end surface ES of a sheet glass G using at least one processing tool 2. The processing tool 2 includes a constant-pressure processing too...  

Matches 1 - 50 out of 10,283