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WO/2012/053165 |
The present invention includes: a detection step for detecting foreign material (100) on the surface of a work (W) and acquiring information regarding the position and size of the detected foreign material (100); an initial setting step ...
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WO/2012/044683 |
Polishing pads for polishing semiconductor substrates using eddy current end- point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also des...
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WO/2012/039075 |
A glass plate processing device (1) is provided with a cutting part (2) for forming a cut line in an unprocessed glass plate (5), a folding and splitting part (4) for folding and splitting the glass plate along the cut line to obtain the...
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WO/2012/039007 |
A glass plate processing device (1) is provided with a cutting part (2) for forming a cut line in an unprocessed glass plate (5), a folding and splitting part (4) for folding and splitting the glass plate along the cut line to obtain the...
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WO/2012/035018 |
Digitally controlled grinder (1), particularly for glass sheets with straight sides, comprising at least one first conveyance guide (8) which defines a loading surface (9) for at least one glass sheet (10) to be ground and is adapted to ...
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WO/2012/037343 |
A fabrication system comprises one of a substrate and work piece having at least one working surface, a tool coupled to a tool holder, at least one measurement system, and a control system. The at least one working surface comprises one ...
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WO/2012/028007 |
A thickness measuring method for a wafer marginal membrane is provided. The method involves the following steps: measuring, via the four-point probe method, the real thickness of a measured point on the wafer in the off-line mode, and me...
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WO/2012/016611 |
A protection device for a grinding wheel, comprising a containment structure equipped with an operating opening (22) for a grinding wheel (16), wherein said containment structure comprises a fixed portion (11) and a movable portion (12) ...
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WO/2012/016628 |
A calibration device for gauges for the measurement of the geometrical characteristics of cylinders, such as the diameter, profile, rotundity and eccentricity errors, wherein said gauges comprise a pair of movable opposing arms (49) equi...
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WO/2012/018215 |
According to the present invention, it is possible to minimize the difference of the polished amount of the center and the edge of a large substrate in a method for polishing a large substrate.
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WO/2012/018215 |
According to the present invention, it is possible to minimize the difference of the polished amount of the center and the edge of a large substrate in a method for polishing a large substrate.
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WO/2012/012052 |
Embodiments described herein relate to methods of detecting an endpoint for a target substrate during chemical mechanical polishing process. In one embodiment, the method includes polishing one or more target substrates at a first film r...
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WO/2012/012052 |
Embodiments described herein relate to methods of detecting an endpoint for a target substrate during chemical mechanical polishing process. In one embodiment, the method includes polishing one or more target substrates at a first film r...
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WO/2012/008380 |
Provided are a magnesium alloy coiled material which is a coiled material formed by winding a long plate material composed of magnesium alloy, and the thickness unevenness of which is small throughout the length thereof, and a grinding m...
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WO/2012/003828 |
An abrasion arrangement is disclosed to abrade a surface of an item, the arrangement comprising a multiple axis robotic arm having at least five axes, an abrading cylinder mounted on the robotic arm and comprising abrasive means which co...
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WO/2011/144624 |
Methods and apparatuses are used for optically measuring by interferometry the thickness (T) of an object (2) such as a slice of semiconductor material. Readings of the object thickness by optical interferometry are carried out, rough th...
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WO/2011/133386 |
Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to...
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WO/2011/131394 |
The invention relates to an angle grinder (10), comprising a housing (22), a drive unit (12) for driving a usage tool (14) having a sensor device (16) for providing a rotation parameter and a control unit (18) for evaluating the rotation...
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WO/2011/133386 |
Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to...
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WO/2011/121835 |
Provided is a disturbance suppression load control device capable of causing a measured load value output from a linear motor-combined cylinder to better approach an objective load value to heighten responsiveness to a disturbance, and s...
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WO/2011/117050 |
The invention concerns a process for measuring and/or controlling a polishing process of an ophthalmic element (1) comprising the steps of -manufacturing at least two cavities (2, 3) on the surface of the element to be polished, the dept...
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WO/2011/114399 |
A grinding head is lowered. Subsequently, with a large foreign object (A) (defect) being ground, the grinding head is moved, without being raised, along the large foreign object (A), in a state where a grinding tape feeding direction (d2...
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WO/2011/114658 |
Sensors, a memory which stores detected information obtained by the sensors, and a communication instrument which, by being driven by a power supply section, performs communication with the outside in a non-contact manner, are installed ...
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WO/2011/112591 |
A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicati...
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WO/2011/111136 |
The disclosed foreign body polishing method involves creating information for capturing and correcting defects in the (work) surface of an array substrate (W), selecting a large foreign body (A) larger than a prescribed size from said in...
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WO/2011/112591 |
A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicati...
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WO/2011/107598 |
The invention relates to a method for calibrating a milling, cutting or grinding tool of a spectacle lens frame machining unit, for which a) in a first machining step, prior to shaping an edge or surface shape RF by means of the milling,...
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WO/2011/107872 |
The machine (1) for the mechanical machining of plate- shaped elements, particularly tiles and slabs of ceramic material, natural stones, glass or the like, comprises: a base frame (2); forward movement means (3) for at least a plate-sha...
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WO/2011/103926 |
An optical measurement apparatus, comprising a reference support (40) on which are mounted a fixed headstock (57) and a movable tailstock (60) opposed to the fixed headstock and movable along a linear axis (x) for coming near to or movin...
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WO/2011/096090 |
Since a large-sized optical element has a very long focal point distance, a worked surface and a measuring device need to be installed distantly spaced apart using an elongated frame structure in order to measure the worked surface. Howe...
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WO/2011/089870 |
Disclosed is a method for manufacturing an electronic component provided with an adhesive film, wherein cutting dusts and the like are prevented from adhering to an adhesive layer (404) at the time of dividing a wafer in a state wherein ...
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WO/2011/085950 |
The invention relates to a device (10) and method for determining the position of a working surface (16, 18) of a working disc (12, 14) of a double-sided machine tool, wherein the device comprises an optical measurement device (24) havin...
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WO/2011/085913 |
The invention relates to a cylindrical grinding machine, wherein a round rod (3) to be ground by peel-grinding is clamped in the chuck (2) of a workpiece spindle head (1) so that a rotation occurs around the common center axis (4). Accor...
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WO/2011/083605 |
Provided is a blast machining method or the like having high machining accuracy. The disclosed blast machining method is for forming a recess (9) in the surface of an object being machined (8) so as to conform with a target recess of a p...
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WO/2011/083206 |
A method for grinding a roll, in which method a roll (2; 25) in a paper or paper- board machine or a corresponding machine for processing a fibrous web is ground by a grinding device (1; 15) installed in the machine, and in which method ...
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WO/2011/077631 |
Disclosed is a dual-surface polishing device which has at least: upper and lower setting plates which have polishing cloths attached thereto; a carrier which has a holding-hole formed therein to hold a wafer between the upper and lower s...
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WO/2011/074691 |
A polishing method and a polishing apparatus particularly suitable for finishing a surface of a substrate of a compound semiconductor containing an element such as Ga or the like to a desired level of flatness, so that a surface of a sub...
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WO/2011/061884 |
A defect on the surface of a workpiece is captured, and information for correction is prepared. On the basis of this information, the height of a foreign object requiring correction is measured. If this measured height is less than the f...
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WO/2011/054481 |
The invention relates to a device (10) for the double-sided processing of flat work pieces, comprising an upper working disk (40) and a lower working disk, wherein facing each other between the working surfaces (46) thereof, the working ...
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WO/2011/052267 |
Disclosed is a low-cost polishing device provided with: a high polishing ability for eliminating microfissures that exist on the surface of a polygonal column shape comprising a hard material; and a fine polishing ability that eliminates...
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WO/2011/048014 |
The invention relates to a grinding machine for grinding a workpiece (20, 22, 48, 60), in particular cams (48, 60), comprising a machine bed (12), a grinding disk (58, 36, 36') which has a profile having a grinding area (74) extending es...
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WO/2011/048013 |
The invention relates to a grinding machine for grinding workpieces (20, 22, 48, 60), in particular for simultaneously grinding two closely adjacent workpieces (48). Said grinding machine comprises at least two first grinding spindles (2...
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WO/2011/036789 |
Provided is a method of phasing a threaded grinding stone, as well as a gear grinding machine, the aforementioned method and machine being such that the phasing of the threaded grinding stone with respect to a gear to be machined or to a...
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WO/2011/035864 |
The invention relates to a measuring device (2), in particular for in-process measurement on specimens during a machining process on a machine tool, in particular a grinding machine, comprising a main body (18) and a measuring head (12),...
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WO/2011/036790 |
Provided is a method of phasing a threaded grinding stone, as well as a device therefor, the aforementioned method and device being such that contact or non-contact of a threaded grinding stone with a disk dresser can be detected with hi...
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WO/2011/036791 |
Provided is a device for phasing a threaded grinding stone, the aforementioned device being configured in a simple manner and capable of accurately phasing the threaded grinding stone with respect to a gear to be machined or to a dresser...
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WO/2011/031506 |
A method of finishing an edge of a material to be finished is provided, comprising the steps of applying a removable sensing layer to a portion of the material to be finished, and placing the edge of the material to be finished into a ma...
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WO/2011/030866 |
A control unit (72) causes a headstock (20), a tailstock (30), and a tool (43) to make relative movements, thereby machining the peripheral surface of a workpiece (W) in the radial direction. This control unit (72) performs control in su...
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WO/2011/031506 |
A method of finishing an edge of a material to be finished is provided, comprising the steps of applying a removable sensing layer to a portion of the material to be finished, and placing the edge of the material to be finished into a ma...
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WO/2011/017266 |
A method of finishing an optical element includes mounting the optical element in an optical mount having a plurality of fiducials overlapping with the optical element and obtaining a first metrology map for the optical element and the p...
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