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Matches 1 - 50 out of 9,563

Document Document Title
WO/2018/002123A1
Machining apparatus (2), in particular wide-belt sander for machining preferably board-type workpieces (W) preferably made at least in part of wood, engineered wood and/or plastic, comprising at least one light signal display device (10)...  
WO/2018/003765A1
A polishing device (10) is provided with a first arm (13) which has a polishing member (30) at the tip end of the arm for polishing a work (40) and which linearly reciprocates the polishing member (30), and a second arm (13) which has a ...  
WO/2017/215943A1
This document provides a method of operating a floor grinding machine 100. The method comprises providing a grinding machine 100 comprising a frame 101, a motor 102 and at least one grinding element 1, causing the motor to drive the grin...  
WO/2017/218921A1
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...  
WO/2017/201059A1
A method includes: sensing a defect on a cast strip surface, the cast strip being cast from molten metal or alloy by a casting system, determining an adjustment amount and/or direction of a casting system component based on the identifie...  
WO/2017/188239A1
The present invention addresses the problem of providing a machine tool system capable of suitably measuring the shape of a workpiece, providing a machine tool system for suitably calculating the surface roughness of the workpiece and a ...  
WO/2017/160127A1
The present invention relates to a method and a device for polishing a laminated sheet and, more particularly, to a method and device for laminating to-be-polished sheets and polishing the same. The present invention provides a laminated...  
WO/2017/158955A1
According to the present invention, whether wafer polishing is completed is determined with high accuracy for each wafer. A wafer processing method according to the present invention comprises: a first step for acquiring the initial stat...  
WO/2017/160344A1
Systems and methods of in-situ calibration of semiconductor material layer deposition and removal processes are disclosed. Sets of test structures including one or more calibration vias or posts are used to precisely monitor processes su...  
WO/2017/154056A1
Provided is a gear grinding machine for grinding a gear by causing a gear that is to be ground and a grindstone to rotate in a meshed state, wherein the gear grinding machine makes it possible to suppress the generation of waviness durin...  
WO/2017/139663A1
Method and apparatus for sharpening a cutting tool ( 130, 160, 230). In some embodiments, a sharpener (100, 300) has a guide assembly (1 18) adjacent a moveable abrasive medium ( 1 12, 308). The medium is advanced at a first speed relati...  
WO/2017/138511A1
The respective diameters of a sphere to be measured that is partway through processing and of a reference sphere of the same material as the sphere being measured and having the target diameter for the sphere being measured are measured ...  
WO/2017/139079A1
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...  
WO/2017/122580A1
To provide a polishing device capable of performing polishing by selecting a suitable polishing recipe on the basis of a state prior to the polishing, even in a situation where bevel portions have various shapes. A polishing device 100 h...  
WO/2017/123834A1
A chemical mechanical planarization (CMP) pad conditioner, a CMP pad conditioning system and a CMP pad conditioning method are provided. The CMP pad conditioner includes an adaptor configured to receive an abrasive member and a sensing c...  
WO/2017/108851A1
The invention relates to a grinding device for grinding a cutting contour (7) of a knife (1), comprising a base frame (5), a knife holder (6), and one or more driven grinding means (2), wherein the knife holder (6) is rigid and the grind...  
WO/2017/098696A1
The present invention is a polishing method with a polishing step for polishing the surface of a wafer, which is held by a polishing head, by rubbing the wafer on the surface of a polishing fabric that is bonded to a surface plate while ...  
WO/2017/094462A1
A plate glass manufacturing method comprises a transportation step of transporting plate glass (G) in a prescribed transport direction. In the transportation step, a portion of a transport belt (6) is raised by a lifting and lowering dev...  
WO/2017/080535A1
The method of machining of rotary components (3), especially hard ceramic, metaloceramic or metallic coatings on the rotary component (3) with the length greater than 2 meters, whose essence consists in the fact that the equipment is def...  
WO/2017/077691A1
A wafer polishing method of the present invention is characterized by having: a measuring step for measuring the depth PDt of a recessed section of a template after taking out a polishing-completed wafer, said measuring step being to be ...  
WO/2017/073265A1
A method for polishing both sides of a semiconductor wafer according to the present invention comprises: detecting a load current value of a sun gear or a load current value of an internal gear when both sides of the semiconductor wafer ...  
WO/2017/067884A1
An apparatus (1) for dressing a grinding wheel (2) mounted thereon by creating structures (12) on the surface of a, in particular cylindrical, grinding surface (3) of the grinding wheel (2), the apparatus (1) comprising: - a dressing too...  
WO/2017/058769A1
A method and apparatus for evaluating performance of a bonded abrasive article during a cutoff grinding operation including an abrasive assembly holding a bonded abrasive article, a workpiece assembly holding a workpiece and a measuring ...  
WO/2017/056636A1
The present invention relates to a method and a device for polishing the surface of a substrate having film thickness unevenness in the circumferential direction of the substrate. Disclosed is a polishing method whereby: film thickness d...  
WO/2017/053502A1
Systems and methods for conditioning blades are provided. A method may include, for example, obtaining a cutting device, measuring various characteristics of the cutting edge of the cutting device, creating a current edge profile based o...  
WO/2017/039544A1
An instrumented tool for surface finishing of a work-piece, the instrumented tool comprising: a tool configured to be spun and brought into contact with the work-piece while spinning; a spindle configured to provide a spinning torque to ...  
WO/2017/035557A1
A control system for controlling operation of a fluid delivery system that includes at least a first pump (14) for delivering a first fluid and a second pump (24) for mixing a second fluid with the first fluid. The control system include...  
WO/2017/035190A1
A measuring device includes a rotatable stage configured to receive and rotate an object long a rotational axis of the object. A housing is located adjacent to the rotatable stage and is movable along the rotational axis of the object. T...  
WO/2017/033876A1
A burr removal method and device capable of reliably removing burrs even when the amount of dross created in the form of laser burrs and the adhesion strengths of the dross vary due to different sheet thicknesses and materials of workpie...  
WO/2017/030049A1
The present invention manufactures long cylindrical members with a high degree of coaxiality with the shaft center over the entire length thereof and also a high degree of roundness of the outer circumferential surface. A grinder (1), wh...  
WO/2017/028855A1
The invention relates to a method for producing bearing components by means of a production line (1, 1', 1a, 1b) which comprises at least one grinding machine (2), at least one honing machine (3), at least one cleaning unit (4) and at le...  
WO/2017/025739A1
A machine tool, such as an orbital grinding machine, and method of operation thereof are disclosed whereby a metrology surface (60) formed on a component (50) of the machine tool is rigidly fixed relative to one of a workpiece support (1...  
WO/2017/025093A1
The invention concerns a sanding head for an abrasion arrangement, where the sanding head comprises an abrading drum with a centre axis and contact wheels at both ends of the abrading drum, where the contact wheels have the same or subst...  
WO/2017/022389A1
This plate-glass processing apparatus (1) is provided with: an arm member (3) that rotatably supports a processing tool (B) for processing the end surface of a plate glass (A); and a servo mechanism (5) that causes the arm member (3) to ...  
WO/2017/021480A1
Method for determining a parameter of an optical equipment, the method comprising: -an optical equipment positioning step, during which an optical equipment comprising a pair of optical lenses mounted on a spectacle frame is positioned i...  
WO/2017/018219A1
A substrate processing method according to one mode of the embodiment includes a grinding step, a measurement step, a condition determination step, and a damaged layer removal step. At the grinding step, the surface (W1) of a substrate (...  
WO/2017/017430A1
A tool swivel assembly for a machine tool comprises: a base (34) for mounting on a machine tool; a support shaft (6) in a fixed position and orientation relative to the base, the support shaft having a longitudinal reference axis (24); a...  
WO/2016/208101A1
The present invention provides a sizing device which is disposed in a grinding device and which measures, by laser optical interference, the thickness of a wafer being ground. The sizing device is characterized in comprising: a light sou...  
WO/2016/172751A1
The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported...  
WO/2016/170224A1
The present invention relates to a method for measuring the diameter and/or the geometry of the diameter of a cylindrical object. The cylindrical object has a longitudinal axis and a cylindrical shell. The method comprises measuring in a...  
WO/2016/166036A1
The invention relates to a method for grinding the exterior of a shaft part (10) with rotationally symmetrical sections and bases which have centering bores and which define a reference longitudinal axis and rotational axis of the shaft ...  
WO/2016/163352A1
The present invention relates to a film thickness measuring method that detects a film thickness by analyzing optical information contained in light reflected from a substrate. The film thickness measuring method includes the steps of ge...  
WO/2016/146495A1
The invention relates to a method for grinding grooves or profiles on workpieces. The grooves are ground using a correspondingly profiled grinding wheel (5), the profile (6) of the grinding wheel (5) being crushed. According to the inven...  
WO/2016/145472A1
Disclosed is a method for the automated surface processing of a workpiece (301). According to an embodiment of the invention, the method comprises the generation of a contact force (FK) between a rotating tool (202) and a workpiece (301)...  
WO/2016/131735A1
The invention relates to a honing method for machining the inner surface of a bore in a workpiece with the aid of at least one honing operation, in particular for honing cylinder running surfaces in the production of cylinder blocks, or ...  
WO/2016/131736A1
The invention relates to a honing method for machining the inner surface of a bore (110) in a workpiece (100) with the aid of at least one honing operation, wherein during a honing operation, an expandable honing tool coupled with a spin...  
WO/2016/117294A1
The present invention provides a method for cutting a workpiece into wafer shape, by winding a wire about a roller that has a plurality of grooves, and placing the wire, while driven, against the workpiece and at the same time supplying ...  
WO/2016/095939A1
The invention relates to a device and a method for machining an optical lens, in particular for machining the edges of an optical lens. The device has a measuring device, a machining device, a loading device, an unloading device, an inte...  
WO/2016/091864A1
The invention relates to a measuring steady rest which has a device for supporting central workpiece regions, in particular bearing points on shaft parts, in particular crankshafts, and a measuring device integrated into the steady rest ...  
WO/2016/091504A1
The invention relates to a method for determining a load limit of a grinding process to be set up, wherein the load limit represents a maximum possible grinding load, at which there is just about no thermal damage to the microstructure o...  

Matches 1 - 50 out of 9,563