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Matches 1 - 50 out of 9,973

Document Document Title
WO/2019/025542A1
By means of the present invention, a suctioning device (1) for a grinding device (100) and a method for suctioning particles produced at a grinding device (100) are provided. The suctioning device (1) has at least one suctioning channel ...  
WO/2019/025480A1
An apparatus for checking the diameter of crankpins (15) of a crankshaft in orbital motion about a geometrical axis in a numerical control machine tool includes a V-shaped reference device (10), a measuring device (6) and a support devic...  
WO/2019/022961A1
Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In on...  
WO/2019/016667A1
The grinding unit (29) comprises at least one grinding wheel (47) adapted to rotate around a respective rotation axis (C-C), and a thrust actuator (37) adapted to push the grinding wheel (47) against a cutting edge (18) of the disc-shape...  
WO/2019/013042A1
This substrate processing system is for processing a bonded substrate formed by bonding a to-be-processed substrate and a support substrate in such a manner as to reduce the thickness of a non-bonded surface of the to-be-processed substr...  
WO/2019/013037A1
This grinding device for grinding a substrate comprises substrate holding units which hold the substrate, and annular grinding units which contact at least the center and the periphery of the substrate held by the substrate holding units...  
WO/2019/000159A1
A polisher, and polisher system. The polisher comprises: a main body (201) configured to polish an object to be polished; a switch (202) connected to the main body (201) and configured to control a rotational speed of the polisher by mea...  
WO/2018/235328A1
An automatic grinding apparatus for grinding an object using a grinder, in which the load current increases or decreases according to the magnitude of the amount of grinding per unit time, is provided with: an electric current-detecting ...  
WO/2018/234030A2
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2018/235430A1
The purpose of the invention is to effectively improve processing efficiency of a polishing process on a face to be polished and the finish quality of the polishing process. A polishing tool (4) scours each portion of a face to be polish...  
WO/2018/235619A1
This substrate processing method for thinning a substrate that has a surface to which a protective tape is bonded comprises: a tape thickness measurement step for measuring the thickness of the protective tape; and a grinding step for su...  
WO/2018/211736A1
The present invention relates to a polishing apparatus and a polishing method, for pressing a polishing tool against the peripheral edge part of a substrate and polishing the peripheral edge part. The polishing apparatus is provided with...  
WO/2018/210607A1
The invention relates to a machine for the precision machining of toothed workpieces, which machine comprises a tool spindle (30) for mounting a precision machining tool (31). The tool spindle can be driven to rotate about a tool spindle...  
WO/2018/207977A1
Provided are a method for analyzing polishing behavior and a device for same. This method is a method for analyzing polishing behavior of a polishing behavior analyzing device which is operated by at least one processor, the method compr...  
WO/2018/206455A1
The invention relates to a grinding and/or eroding machine (10) and to a method for measuring and referencing the assembly (11) of multiple machine axes (12), each of which can be formed by a rotational or translational machine axis. For...  
WO/2018/198997A1
Provided is a CMP polishing device for flattening a quadrilateral substrate. Provided is a polishing device for polishing a quadrilateral substrate, the polishing device having a substrate retaining part for retaining a quadrilateral sub...  
WO/2018/192871A1
The invention relates to a method for removing a flaw on a treated, in particular finally painted surface by grinding, wherein, after the flaw has been detected, a flexible abrasive sheet is moved to the surface and is pressed against th...  
WO/2018/193758A1
The present invention provides a double-sided wafer polishing method for placing multiple double-sided polishing carriers in a double-sided polishing apparatus and performing double-sided polishing of wafers, wherein, when readying a car...  
WO/2018/193762A1
The present invention provides an evaluation method for a semiconductor wafer fabricated by: chamfering and grinding an edge of a semiconductor wafer sliced from a semiconductor ingot and comprising major surfaces including a major front...  
WO/2018/192596A1
The invention relates to a method and to a device for the monitored control of the machining process of systems machining the surface of a workpiece, in particular wide-band grinding machines, whilst taking safety-relevant long-term effe...  
WO/2018/189155A1
The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) an...  
WO/2018/179685A1
A substrate processing device having a substrate polishing unit 40 provided with a polishing pad for polishing a wafer W, and a top ring 41 for holding the wafer and pushing the wafer toward the polishing pad. An elastic film 80 that hol...  
WO/2018/180170A1
In this polishing method, heights of at least three points on a substrate holding surface (2a) are measured by at least three sensors (30), an inclination of the substrate holding surface (2a) is calculated on the basis of output signals...  
WO/2018/163390A1
[Problem] To enable determination of whether a grinding wheel and a grinding material have come into contact to be accurately performed without being affected by the mechanical characteristics of a grinding machine or by interference fro...  
WO/2018/160663A3
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/160658A3
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/160658A2
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/160663A2
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/147011A1
Provided is a grinding operation assistance device comprising: a shape acquisition unit which acquires the shape of an actual grinding subject as a first shape; a shape difference computation unit which computes the difference between th...  
WO/2018/133984A1
The invention relates to a grinding robot for grinding an electrically conductive workpiece (6), comprising a grinding wheel (5), a unit for actuating the grinding wheel (5), and a controller, wherein the grinding wheel (5) has an undula...  
WO/2018/131399A1
Provided are a grinding apparatus, etc. with which the grinding pressure acting on a workpiece from a grinding stone can be appropriately controlled. A roughly cylindrical workpiece (W) is fixed on a workpiece support (104). A grindstone...  
WO/2018/120865A1
A specialized A-grade door frame surface polisher, comprising a base (1). The base (1) is provided with a door frame positioning jig (2), a robot (3), and a control box (11). The robot (3) and the control box (11) are positioned next to ...  
WO/2018/122119A1
The subject of the disclosure is a machine tool (10), in particular a grinding machine, comprising a measuring device (38) which is received on the machine tool (10), said measuring device (38) having at least one structure-borne sound s...  
WO/2018/108112A1
A grinding wheel positioning system and method. The grinding wheel positioning system comprises: a driving device (1) and a sliding device (2) connected thereto and driven by the driving device (1) to move, wherein the sliding device (2)...  
WO/2018/109501A3
Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine...  
WO/2018/109501A2
Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine...  
WO/2018/104577A1
The application relates to a power tool, like a grinder, a sander or a polisher, comprising two working modes. According to an embodiment a dual mode power tool comprises a motor (400) operable in two operational directions, wherein an o...  
WO/2018/102374A1
A process for automated sanding of a vehicle component surface is provided and includes providing a sanding mechanism having a sanding head engaged with a housing, a rotary motor contained within the housing, the rotary motor having a dr...  
WO/2018/101109A1
A cutting device (1) cuts a workpiece (W) on the basis of a target value for dimensions of the workpiece (W) determined according to a design value for the dimensions of the workpiece (W) and a corrected value for the design value. A gri...  
WO/2018/091989A1
Disclosed is a method for detection, control and automatic compensation of pressure during polishing, comprising the following steps: detecting the pressure between a polishing wheel (10) and a polished workpiece (11) by means of a detec...  
WO/2018/077327A1
The invention relates to a method for producing bearing components for forming a roller or slide bearing (40), wherein at least two production lines (1, 1a, 1b, 1c, 1d) are used and operated synchronously. A dimension of a first bearing ...  
WO/2018/079319A1
Provided is a grinder that facilitates manual grinding work requiring careful operation. A grinder 1 has: a grindstone 4 that grinds a workpiece; a nozzle 71 through which a cooling liquid is jetted out to the workpiece; hand-feed handle...  
WO/2018/074041A1
This surface property measuring device for a polishing pad measures surface properties, such as surface shape and surface state, of a polishing pad to be used for the purpose of polishing substrates, such as a semiconductor wafer. The su...  
WO/2018/074091A1
A local polishing system is provided with: a particle estimation unit (30) which estimates a film thickness distribution of a wafer; a local polishing region setting unit (11) which sets a local polishing region of the wafer on the basis...  
WO/2018/075260A1
An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by th...  
WO/2018/059144A1
A CMP equipment polishing head wafer falling detection method and system. The method comprises: monitoring, in a vacuum wafer grabbing process and a wafer carrying and conveying process of a polishing head, the vacuum adsorption pressure...  
WO/2018/058238A1
An apparatus for positioning a feed finger of a saw sharpening machine with a saw blade mounted in the saw sharpening machine includes a tooth detection unit which is used to detect the position of a tooth of the saw blade relative to th...  
WO/2018/052816A1
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, a...  
WO/2018/053023A1
During polishing of a substrate a first signal is received from a first in-situ monitoring system and a second signal is received from a second in-situ monitoring system. A clearance time at which a conductive layer is cleared and a top ...  
WO/2018/049790A1
Disclosed is a multi-angle two-dimensional ultrasonic vibration assisted grinding device of a nano-fluid minimum quantity lubrication type, comprising components, such as a workpiece clamp (I-9) for clamping a workpiece (I-12), a grindin...  

Matches 1 - 50 out of 9,973