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Patent Searching and Data


Matches 1 - 50 out of 10,038

Document Document Title
WO/2019/071053A1
An abrasive article includes an abrasive body having a bond material, abrasive particles contained within the bond material, and an electronic assembly coupled to the abrasive body, wherein the electronic assembly comprises at least one ...  
WO/2018/234030A3
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2019/066208A1
Discloses are a glasses lens processing apparatus and method for determining whether lens processing is completed by using a hall sensor during the processing of glasses lens. The glasses lens processing apparatus comprises: a grinding w...  
WO/2019/055279A1
A method of controlling polishing includes sweeping a sensor of an in-situ monitoring system across a substrate as a layer of the substrate undergoes polishing, generating from the in-situ monitoring system a sequence of signal values th...  
WO/2019/052724A1
The invention relates to a method for fine machining a cylindrical workpiece surface (16) of a workpiece blank (14) by means of a fine machining tool (26). Said method comprising the following steps: generating a relative rotational move...  
WO/2019/054133A1
This production method for a sheet glass comprises an end surface processing step for processing an end surface ES of a sheet glass G using at least one processing tool 2. The processing tool 2 includes a constant-pressure processing too...  
WO/2019/053128A2
The invention relates to a device (1) for machining a workpiece using a belt (2), comprising a belt reel holder (4) for holding a reel (3) through which the belt (2) is supplied, a housing (5) which delimits a machining chamber (10), a w...  
WO/2019/051998A1
Disclosed are a method, apparatus and system for detecting a spectrum end point in chemo-mechanical polishing. The method comprises: according to spectrum detection data of a polished thin film on a surface of a wafer, determining smooth...  
WO/2019/049659A1
A polishing end-point position is detected in order to end polishing at an appropriate position. According to one embodiment of the present invention, a method for chemically and mechanically polishing a substrate provided with a functio...  
WO/2019/047683A1
A smart polishing method, comprising the following steps: a robot moving according to a predetermined trajectory, so as to enable a polishing tool, which is connected to a floating part of a floating polishing structure or a front portio...  
WO/2019/041393A1
A lapping and polishing mechanism comprises an indexing plate (10), a bushing (20), an eccentric sleeve (330), an eccentric adjustment piece (320), a spring (340), a position-limiting column (310), and a connecting shaft (360). The eccen...  
WO/2019/042850A1
Method for controlling the polishing of a gemstone, comprising: obtaining a three-dimensional model of the gemstone; fixing the gemstone in a dop, wherein an initial facet to be polished is aligned; obtaining at least one image of the in...  
WO/2019/041391A1
A lapping and polishing machine and an auxiliary mechanism thereof. The auxiliary mechanism comprises an indexing plate (10), a bushing (20), and an eccentric assembly (30). One end of the bushing (20) is provided with a rotating shaft (...  
WO/2019/041392A1
A polishing machine and a rotation positioning mechanism thereof. The rotation positioning mechanism comprises a positioning ball (410), a fixing base (420), an elastic member (430), and an adjustment pin (440). The fixing base (420) is ...  
WO/2019/032234A1
Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to ...  
WO/2019/025542A1
By means of the present invention, a suctioning device (1) for a grinding device (100) and a method for suctioning particles produced at a grinding device (100) are provided. The suctioning device (1) has at least one suctioning channel ...  
WO/2019/025480A1
An apparatus for checking the diameter of crankpins (15) of a crankshaft in orbital motion about a geometrical axis in a numerical control machine tool includes a V-shaped reference device (10), a measuring device (6) and a support devic...  
WO/2019/022961A1
Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In on...  
WO/2019/016667A1
The grinding unit (29) comprises at least one grinding wheel (47) adapted to rotate around a respective rotation axis (C-C), and a thrust actuator (37) adapted to push the grinding wheel (47) against a cutting edge (18) of the disc-shape...  
WO/2019/013042A1
This substrate processing system is for processing a bonded substrate formed by bonding a to-be-processed substrate and a support substrate in such a manner as to reduce the thickness of a non-bonded surface of the to-be-processed substr...  
WO/2019/013037A1
This grinding device for grinding a substrate comprises substrate holding units which hold the substrate, and annular grinding units which contact at least the center and the periphery of the substrate held by the substrate holding units...  
WO/2019/000159A1
A polisher, and polisher system. The polisher comprises: a main body (201) configured to polish an object to be polished; a switch (202) connected to the main body (201) and configured to control a rotational speed of the polisher by mea...  
WO/2018/235328A1
An automatic grinding apparatus for grinding an object using a grinder, in which the load current increases or decreases according to the magnitude of the amount of grinding per unit time, is provided with: an electric current-detecting ...  
WO/2018/234030A2
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishi...  
WO/2018/235430A1
The purpose of the invention is to effectively improve processing efficiency of a polishing process on a face to be polished and the finish quality of the polishing process. A polishing tool (4) scours each portion of a face to be polish...  
WO/2018/235619A1
This substrate processing method for thinning a substrate that has a surface to which a protective tape is bonded comprises: a tape thickness measurement step for measuring the thickness of the protective tape; and a grinding step for su...  
WO/2018/211736A1
The present invention relates to a polishing apparatus and a polishing method, for pressing a polishing tool against the peripheral edge part of a substrate and polishing the peripheral edge part. The polishing apparatus is provided with...  
WO/2018/210607A1
The invention relates to a machine for the precision machining of toothed workpieces, which machine comprises a tool spindle (30) for mounting a precision machining tool (31). The tool spindle can be driven to rotate about a tool spindle...  
WO/2018/207977A1
Provided are a method for analyzing polishing behavior and a device for same. This method is a method for analyzing polishing behavior of a polishing behavior analyzing device which is operated by at least one processor, the method compr...  
WO/2018/206455A1
The invention relates to a grinding and/or eroding machine (10) and to a method for measuring and referencing the assembly (11) of multiple machine axes (12), each of which can be formed by a rotational or translational machine axis. For...  
WO/2018/198997A1
Provided is a CMP polishing device for flattening a quadrilateral substrate. Provided is a polishing device for polishing a quadrilateral substrate, the polishing device having a substrate retaining part for retaining a quadrilateral sub...  
WO/2018/192871A1
The invention relates to a method for removing a flaw on a treated, in particular finally painted surface by grinding, wherein, after the flaw has been detected, a flexible abrasive sheet is moved to the surface and is pressed against th...  
WO/2018/193758A1
The present invention provides a double-sided wafer polishing method for placing multiple double-sided polishing carriers in a double-sided polishing apparatus and performing double-sided polishing of wafers, wherein, when readying a car...  
WO/2018/193762A1
The present invention provides an evaluation method for a semiconductor wafer fabricated by: chamfering and grinding an edge of a semiconductor wafer sliced from a semiconductor ingot and comprising major surfaces including a major front...  
WO/2018/192596A1
The invention relates to a method and to a device for the monitored control of the machining process of systems machining the surface of a workpiece, in particular wide-band grinding machines, whilst taking safety-relevant long-term effe...  
WO/2018/189155A1
The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) an...  
WO/2018/179685A1
A substrate processing device having a substrate polishing unit 40 provided with a polishing pad for polishing a wafer W, and a top ring 41 for holding the wafer and pushing the wafer toward the polishing pad. An elastic film 80 that hol...  
WO/2018/180170A1
In this polishing method, heights of at least three points on a substrate holding surface (2a) are measured by at least three sensors (30), an inclination of the substrate holding surface (2a) is calculated on the basis of output signals...  
WO/2018/163390A1
[Problem] To enable determination of whether a grinding wheel and a grinding material have come into contact to be accurately performed without being affected by the mechanical characteristics of a grinding machine or by interference fro...  
WO/2018/160663A3
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/160658A3
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/160658A2
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/160663A2
A computing system may send and receive data from a variety of other devices, such as abrading tools and consumable abrasive products. The computing system may use this data for various purposes, such as tracking worker vibration dosage,...  
WO/2018/147011A1
Provided is a grinding operation assistance device comprising: a shape acquisition unit which acquires the shape of an actual grinding subject as a first shape; a shape difference computation unit which computes the difference between th...  
WO/2018/133984A1
The invention relates to a grinding robot for grinding an electrically conductive workpiece (6), comprising a grinding wheel (5), a unit for actuating the grinding wheel (5), and a controller, wherein the grinding wheel (5) has an undula...  
WO/2018/131399A1
Provided are a grinding apparatus, etc. with which the grinding pressure acting on a workpiece from a grinding stone can be appropriately controlled. A roughly cylindrical workpiece (W) is fixed on a workpiece support (104). A grindstone...  
WO/2018/120865A1
A specialized A-grade door frame surface polisher, comprising a base (1). The base (1) is provided with a door frame positioning jig (2), a robot (3), and a control box (11). The robot (3) and the control box (11) are positioned next to ...  
WO/2018/122119A1
The subject of the disclosure is a machine tool (10), in particular a grinding machine, comprising a measuring device (38) which is received on the machine tool (10), said measuring device (38) having at least one structure-borne sound s...  
WO/2018/108112A1
A grinding wheel positioning system and method. The grinding wheel positioning system comprises: a driving device (1) and a sliding device (2) connected thereto and driven by the driving device (1) to move, wherein the sliding device (2)...  
WO/2018/109501A3
Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine...  

Matches 1 - 50 out of 10,038