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JP6888396B2 |
To provide a grinder which can obtain desired surface roughness while grinding efficiently.A grinder 1 includes a grinding wheel 50 which grinds a workpiece W, a sensor 100 which detects surface roughness of the workpiece W ground by the...
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JP6887260B2 |
A processing device is provided and enables an operator to easily and reliably confirm the setting of operating conditions. The processing device processes a workpiece in a fully automatic operation by using a plurality of components for...
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JP6825935B2 |
To make it possible to confirm that a spinner table is mounted to a grinding apparatus.In this grinding apparatus, a height position Z1 of a robot hand 40, which is recognized by lifting means in the case that a height position of an ads...
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JP6794275B2 |
To provide a polishing method by which the whole surface of a substrate including an edge part can be flattened.According to this polishing method, any one of a chemical mechanical polishing process, in which the whole surface of a first...
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JP6765926B2 |
Disclosed herein is a processing apparatus including a wafer testing unit for testing whether or not a wafer carried from a cassette mount unit is a wafer corresponding to a processing condition. The wafer testing unit measures character...
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JP6723055B2 |
A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer W is held by the transport mechanisms 121a to 127a, a sensor controller 82 for controlling the sensor 40, a position i...
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JP2020069599A |
To provide a support device of a machine tool and a machine tool system that can output a machining control element of the machine tool without using a state quantity of the machine tool.A support device 6 of a machine tool 2 comprises: ...
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JP6598668B2 |
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JP6518449B2 |
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JP6466131B2 |
Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The su...
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JP2018158402A |
To provide a machining apparatus that enables quick change of the operating condition of a cooling device for cooling hydraulic fluid used for a fluid bearing.A machining apparatus (grinder 1) comprises: a rotatable shaft (grinding wheel...
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JP6378437B2 |
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JP6370084B2 |
The CMP apparatus is provided with a polishing unit 3; a cleaning unit 4; a load/unload unit for transferring substrates to the polishing unit 3 and receiving substrates from the cleaning unit 4; a wafer transporting unit; and a control ...
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JP6334775B2 |
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JP6334040B1 |
To provide a shaving apparatus and a shaving method capable of suppressing a machining load on a tool and a workpiece, reducing machining defects and improving machining efficiency. A shaving apparatus 1 has a jig 5 for holding a work pi...
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JP6322021B2 |
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JP6282817B2 |
A deep hole drill head support pad (50) whose edge chamfers (36, 38, 40) are formed in a continuous grinding operation so that there are no discontinuities in the angled side surface leading up to the outer surface (34) of the support pa...
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JP6262593B2 |
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JP2018001326A |
To provide a grinding method which can further shorten a time until chattering vibration becomes sufficiently small by smoothly finishing a surface of a workpiece by spark-out by setting proper values adapted to the number of laps of the...
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JP6256069B2 |
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JP6225430B2 |
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JP5972759B2 |
There is provided a lens edging system including: a plurality of edgers configured to perform edging to a spectacle lens; and an edging size management device used in connection with the plurality of edgers, the edging size management de...
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JP5962242B2 |
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JP2015179304A |
To accurately detect a tip position of a tool and efficiently control a tool tip position during work.A work process control method generates position information of a tool tip on the basis of position information S6 and posture informat...
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JP5729178B2 |
With the center position (CP) of a support shaft (6) that supports the grindstone (4) as a reference, a tentative grinding start position (SO') for the initial workpiece is computed from the pre-grinding diameter (ID) of the initial work...
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JP5568167B1 |
To efficiently and accurately perform deburring. The deburring device 100 has a setting value input unit 105 for inputting a setting value of a plurality of stages as at least a height from a reference plane of a grinder 102 and a distan...
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JP2014133275A |
To provide a machining device sufficiently ensuring the safety of work of a worker during maintenance work.A machining device in which the action of a structure element is comprehensively controlled, includes: a moving mechanism 52 for m...
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JP5515816B2 |
A polishing estimation/evaluation device includes a dividing unit, an overpolished area extracting unit, and a dummy modifying unit. The dividing unit divides a layout of an integrated circuit into a plurality of partial areas. The overp...
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JP5473736B2 |
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JP5399331B2 |
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JP5348530B2 |
To provide a machining apparatus and a machining method which eliminate the need to set machining conditions and obtain workpiece information during machining on a real-time basis. The machining method is carried out using the machining ...
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JP5305729B2 |
A polishing method includes: a pre-polishing film thickness measurement step of taking a substrate before polishing out of a cassette and measuring a thickness of a polishing film of the substrate with a film thickness measurement device...
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JP2013176828A |
To provide a remote monitoring system that can remotely monitor and control a plurality of polishing end point detection devices.A remote monitoring system includes: a plurality of polishing end point detection devices 10; and a host com...
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JP5182653B2 |
According to an aspect of the present invention, there is provided a dicing apparatus in which: in a case where a control device detects, during an image pickup of a workpiece set onto a second worktable by a first image pickup device an...
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JP2013035079A |
To provide a chamfering method capable of shortening a chamfering time of four round corner faces of a square pole-like silicon ingot.The method includes the steps of spacing a height between a pair of longitudinally movable grinding whe...
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JP2013018063A |
To provide a polishing device for a full automatic micro drill and a polishing method therefor which reduce installation cost for facilities and effectively improve efficiency and quality during polishing of a micro drill.As the polishin...
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JP2012250297A |
To increase the thickness of a lens that can be flat finished without the need for increasing the width of a processing tool.The eyeglass lens processing apparatus includes: a finishing tool having a bevel groove for beveling and a flat-...
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JP5037974B2 |
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JP5023146B2 |
A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object...
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JP4986083B2 |
To establish a machining method of performing high-precision machining without causing burning deterioration or the like to each part of a turbine blade material and provide a new machining device which can achieve totally automatic mach...
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JP4963908B2 |
A method of forming a window (30) in a polishing pad (18) for use in a chemical mechanical polishing system (10). The method comprising replacing a portion of the polishing pad (18) with a solid element which is transmissive to light (34...
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JP4940904B2 |
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JP4905196B2 |
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JP4880512B2 |
A system and method for controlling the manufacture of semiconductor wafers using model predictive control is provided. In accordance with one embodiment, a tool output of the manufacturing tool is determined based on a first wafer run. ...
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JP2012030322A |
To provide a grinding device capable of carrying out grinding work from mill scale grinding to finish grinding to a material to be worked at a lower cost without replacing a grindstone, and also to provide a grinding method.The grinding ...
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JP2012030311A |
To provide a spherical surface grinding method and a spherical surface grinding device capable of shortening a processing time in following processes and further reducing the number of processes by improving a quality requirement, specif...
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JP4876345B2 |
The preparation apparatus 4 determines the target distribution of the amount of polishing on the basis of the film thickness of the wafer 2 measured by the measuring apparatus 3 . The preparation apparatus 4 assumes a control program for...
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JP4860083B2 |
An apparatus for checking diametral dimensions of crankpins and main journals in the course of grinding is provided. The apparatus includes a head with a Vee-shaped reference device and an axially movable feeler that contacts the surface...
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JP4831910B2 |
A system and method for polishing semiconductor wafers includes a rotatable polishing pad movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer. A pad dressing assembly position...
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JP4825388B2 |
A pre-cutter or edger machine for processing the periphery of an optic is provided. The pre-cutter or edger machine of the present invention is advantageous in that it provides a machine that eliminates the need to mount the optic on a b...
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